CN104370272A - 一种mems自对准高低梳齿及其制造方法 - Google Patents
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Abstract
本发明公开了一种MEMS自对准高低梳齿及其制造方法,属于MEMS技术领域。自对准高低梳齿包括一端固定在衬底上而另一端与活动梳齿或者固定梳齿连接的抬升结构,抬升结构在生长应力作用下产生垂直方向的位移带动其连接的活动梳齿或者固定梳齿移动。采用SOI硅片,SOI的正面单晶硅器件层即为MEMS结构的机械结构层,引入的抬升机构与梳齿对依次形成于机械结构层上,由同一步刻蚀工艺形成固定梳齿和活动梳齿,由抬升结构中的应力将固定梳齿与活动梳齿在垂直方向上产生一定位移,从而形成了自对准高低梳齿,相对于多层机构的MEMS省去了多次键合的工艺,简化了制造工艺,大大降低加工成本和加工难度,提高成品率。
Description
技术领域
本发明公开了一种MEMS自对准高低梳齿及其制造方法,属于MEMS技术领域。
背景技术
MEMS(Micro-Electro-Mechanical Systems,微机电系统)是一个制造微小器件并可同时集成多种物理场作用的新兴领域。相对于传统的机械,MEMS器件的尺寸更小,一般在微米到毫米量级。它基于半导体集成电路(IC)制作工艺,可大量利用IC生产中的成熟技术、工艺,进行大批量、低成本生产,使性价比相对于传统“机械”制造技术大幅度提高。
梳齿结构在MEMS器件中广泛应用,比如各种电容式传感器包括加速度计、陀螺仪等以及各种微驱动器。一般的MEMS梳齿结构都是平的,即梳齿的动齿和固齿在同一个平面。这种梳齿在做驱动时只能产生平面内的运动。当需要产生平面外运动时,我们就需要高低梳齿,或叫垂直梳齿,即动齿和固齿一高一低不在一个平面。高低梳齿结构可以用来制作扫描微镜,也是实现三轴加速度计、三轴MEMS电容式陀螺仪必不可少的结构。但是要制作高低梳齿,工艺上往往采用键合或者多次刻蚀方法形成高低梳齿,工艺复杂,难度高,且成品率低。
现有的高低梳齿设计中,传统的MEMES制造工艺利用键合工艺分别刻蚀高低梳齿,或者利用多次光刻分别刻蚀高低梳齿,都需要高精度对准,对工艺要求高且成品率低。SOI技术可以解决梳齿自对准的问题,但是同样存在多次刻蚀,加工复杂的缺陷。
发明内容
本发明所要解决的技术问题是针对上述背景技术的不足,提供了一种MEMS自对准高低梳齿及其制造方法。
本发明为实现上述发明目的采用如下技术方案:
MEMS自对准高低梳齿,包括活动梳齿,固定梳齿和一端固定在衬底上而另一端与活动梳齿或者固定梳齿连接的抬升结构,所述抬升结构由至少一段弯曲梁和至少一段直梁组成,所述弯曲梁与所述直梁一起构成至少一个折弯的折叠梁结构,所述弯曲梁使所述折叠梁结构在垂直方向产生位移,从而带动与其连接的活动梳齿/固定梳齿与固定梳齿/活动梳齿处于不同平面,形成高低梳齿。
MEMS自对准高低梳齿的关键部件是一个抬升结构,该抬升结构的一端固定在衬底上而另一端与活动梳齿或者固定梳齿连接,该抬升结构使与其连接的梳齿在垂直方向产生位移,从而使活动梳齿与固定梳齿不在同一个平面。该结构释放后,抬升结构产生垂直位移,将活动梳齿与固定梳齿在垂直方向错开而形成高低梳齿;而在该结构释放前,活动梳齿与固定梳齿在同一平面并在同一步工艺形成。因此,该高低梳齿叫做自对准高低梳齿。
抬升结构中至少一个弯曲梁位于所述折弯之前,且至少一个弯曲梁位于所述折弯之后。
所述抬升结构由均匀连续的第一层材料、覆盖在第一层材料上的非连续、分段的第二层材料构成,所述直梁由第一层材料单独构成,所述弯曲梁由第一层材料及其覆盖的第二层材料构成。
第一层材料是单晶硅或多晶硅。
第二层材料是单层薄膜或多层薄膜。
第二层材料是一层或多层金属薄膜,如铝、铜、金等。
第二层材料是一层或多层非金属薄膜,如二氧化硅、氮化硅、多晶硅等。
第二层材料是一种复合薄膜,含有至少一层金属薄膜和一层非金属薄膜。
该自对准高低梳齿可以用来制作面外运动(垂直方向)的MEMS静电驱动器或MEMS电容式位移传感器。
下面简单描述该自对准MEMS高低梳齿的制造方法之一。加工硅片采用SOI(Silicon-On-Insulator,绝缘衬底上的硅)硅片:
a,在SOI正面单晶硅器件层上淀积薄膜层,图形化薄膜层形成抬升结构的第二层材料,所述第二层材料为薄膜层,
b,对SOI背面进行空腔刻蚀形成背腔,可采用深硅刻蚀工艺,
c,刻蚀SOI正面单晶硅器件层形成梳齿以及抬升结构的第一层材料,SOI器件层即为抬升结构的第一层材料,即单晶硅;
d,薄膜层中的内应力使折叠梁结构的局部发生弯曲,局部弯曲后的折叠梁结构组成的抬升结构带动与其连接的固定梳齿或活动梳齿在垂直方向上移动,从而形成自对准梳齿。
作为所述制造方法的进一步优化方案,控制薄膜层生长工艺中的气压长、温度、淀积速率以控制薄膜层的应力。
本发明采用上述技术方案,具有以下有益效果:采用SOI硅片加工,SOI的正面单晶硅器件层即为MEMS结构的机械结构层,引入的抬升机构与梳齿对同时形成于机械结构层上,在同一步刻蚀工艺形成固定梳齿和活动梳齿,由抬升结构中的应力将固定梳齿与活动梳齿在垂直方向上产生一定位移,从而形成了自对准高低梳齿。相对于多层机构的MEMS省去了多次键合的工艺,简化了制造工艺,大大降低加工成本和加工难度,提高成品率。
附图说明
图1(a)、图1(b)分别为2段折叠梁抬升结构的正面图和侧面图,图1(c)、图1(d)分别为3段折叠梁抬升结构的正面图和侧面图。
图2为自对准高低梳齿的结构图。
图3(a)、图3(b)分别为采用自对准高低梳齿MEMS静电驱动器、MEMS电容式位移传感器。
具体实施方式
下面结合附图对发明的技术方案进行详细说明。
2段折叠梁的抬升结构如图1所示,抬升结构的一端固定在衬底上。如图1(a)的正面图所示,抬升结构梁的两段与其余部分的材料组成不完全一样,且这两段不一样的梁一个位于折弯之前(位置A),一个位于变形之后(位置B)。该抬升结构的侧面图如图1(b)所示,抬升结构主要由一层相对较厚的材料(比如硅)构成,而在位置A和B处的结构梁比其余结构梁多一层薄膜,该薄膜层材料(比如金属材料如铝或半导体材料如多晶硅或介电质材料如氮化硅等)厚度相对较小。利用双金属(Bimorph)效应,薄膜层材料在一定条件下淀积在较厚材料层上之后整个结构会由于应力作用而发生弯曲。控制该薄膜生长工艺包括气压、温度、淀积速率等可控制位置A和B处结构梁的曲率,这两段弯曲梁是形成整体结构垂直抬升的基础。假设位置A处梁向上弯曲,紧接着的那段梁(因由单一材料M1构成而是直梁)产生向上位移;此处已形成抬升但有倾斜。所以增加一段横梁并紧跟一段往反方向的折叠梁,该折叠梁的初始段(即位置B处)也往上翘,但翘曲方向与A段相反。所以形成末端垂直位移。并利用第一层材料M1作为折叠梁放大位移。该结构完全释放后末端将得到相对于衬底面垂直的位移。
其中,这里柔性Bimorph结构连接件弯曲角度其中ρ是柔性Bimorph结构连接件的曲率半径;Δε;t1、t2分别指柔性Bimorph结构材料M1和薄膜材料M2的厚度;βb是柔性Bimorph结构连接件曲率系数,其可由下式得出:
其中,E1'、E'2分别指柔性Bimorph结构连接件材料1和材料2的双轴弹性模量,E1'、E'2的值由薄膜材料的弹性模量和泊松比决定:
其中,Ei为第i层薄膜材料的弹性模量;vi为第i层薄膜材料的泊松比。
多层叠加抬升结构达到不同抬升高度,3段折叠梁抬升结构的正面图和侧面图如图1(c)、图1(d)所示。
自对准高低梳齿如图2所示,包括活动梳齿,固定梳齿和一端固定在衬底上而另一端与活动梳齿或者固定梳齿连接的抬升结构,所述抬升结构由至少一段弯曲梁和至少一段直梁组成,所述弯曲梁与所述直梁一起构成至少一个折弯的折叠梁结构,所述弯曲梁使所述折叠梁结构在垂直方向产生位移,从而带动与其连接的活动梳齿/固定梳齿)与固定梳齿/活动梳齿处于不同平面,形成高低梳齿。加工硅片采用SOI(Silicon-On-Insulator,绝缘衬底上的硅)硅片。淀积图形化在SOI正面单晶硅器件层上的第二层材料,第二层材料的内应力使折叠梁结构的局部发生弯曲,局部弯曲后的折叠梁结构(即为图2中的Bimorph变形梁)组成的抬升结构带动与其连接的固定梳齿或活动梳齿在垂直方向上移动,从而形成自对准梳齿。
图3(a)为利用MEMS自对准高低梳齿制作能产生面外运动的MEMS静电驱动器。其机械结构层形成有:质量块(反射镜面),固定质量块的锚点,固定自对准高低梳齿的锚点,柔性连接质量块与锚点的连接梁。驱动梳齿即为上述MEMS自对准高低梳齿,附着在质量块边缘的固定梳齿,与固定梳齿相对应的活动梳齿以及与活动梳齿连接的抬升机构活动端,机械结构层上淀积有相邻折叠梁连接处的变形薄膜层,折叠梁在变形薄膜层应力作用下局部弯曲后形成Bimorph变形梁。
图3(b)为利用MEMS自对准高低梳齿制作能测量面外运动的MEMS电容式位移传感器,包括抬升结构、柔性变形梁、梳齿式电容、电连接点。利用抬升结构抬升梳齿后,可以形成高低梳齿式电容,当抬升结构高度发生变化可通过检测梳齿结构间电容的变化而检测高度的变化。并通过改变柔性梁结构,可检测高度变化、转动角度变化等物理量。
综上所述,本发明采用单次深硅刻蚀工艺可形成高低梳齿,引入的抬升机构与梳齿对依次形成于机械结构层上,在不需要多次刻蚀工艺的前提下形成了自对准高低梳齿,相对于多层机构的MEMS省去了多次键合的工艺,简化了制造工艺,大大降低加工成本和加工难度,提高成品率。
Claims (10)
1.一种MEMS自对准高低梳齿,其特征在于,包括活动梳齿,固定梳齿和一端固定在衬底上而另一端与活动梳齿或者固定梳齿连接的抬升结构,所述抬升结构由至少一段弯曲梁和至少一段直梁组成,所述弯曲梁与所述直梁一起构成至少一个折弯的折叠梁结构,所述弯曲梁使所述折叠梁结构在垂直方向产生位移,从而带动与其连接的活动梳齿/固定梳齿与固定梳齿/活动梳齿处于不同平面,形成高低梳齿。
2.根据权利要求1所述的MEMS自对准高低梳齿,其特征在于,所述抬升结构中至少一个弯曲梁位于所述折弯之前,且至少一个弯曲梁位于所述折弯之后。
3.根据权利要求1所述的MEMS的自对准高低梳齿,其特征在于,所述抬升结构由均匀连续的第一层材料、覆盖在第一层材料上的非连续、分段的第二层材料构成,所述直梁由第一层材料单独构成,所述弯曲梁由第一层材料及其覆盖的第二层材料构成。
4.根据权利要求3所述的MEMS自对准高低梳齿,其特征在于,第一层材料是单晶硅或多晶硅。
5.根据权利要求3所述的MEMS自对准高低梳齿,其特征在于,第二层材料是单层薄膜或多层薄膜。
6.根据权利要求5所述的MEMS自对准高低梳齿,其特征在于,第二层材料是一层或多层金属薄膜。
7.根据权利要求5所述的MEMS自对准高低梳齿,其特征在于,第二层材料是一层或多层非金属薄膜。
8.根据权利要求5所述的MEMS自对准高低梳齿,其特征在于,第二层材料是一种复合薄膜,含有至少一层金属薄膜和一层非金属薄膜。
9.权利要求4所述MEMS自对准高低梳齿的制造方法,采用SOI衬底,其特征在于包括如下步骤:
a,在SOI正面单晶硅器件层上淀积薄膜层,图形化薄膜层形成抬升结构的第二层材料,所述第二层材料为薄膜层;
b,对SOI背面进行深硅刻蚀,形成背腔;
c,刻蚀SOI正面单晶硅器件层形成梳齿以及抬升结构的第一层材料;
d,薄膜层中的内应力使折叠梁结构的局部发生弯曲,局部弯曲后的折叠梁结构组成的抬升结构带动与其连接的固定梳齿/活动梳齿在垂直方向上移动,从而形成自对准梳齿。
10.根据权利要求9所述MEMS自对准高低梳齿的制造方法,其特征在于,控制薄膜层生长工艺中的气压长、温度、淀积速率以控制薄膜层的应力。
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