CN104362083B - 图形化蓝宝石衬底报废外延片的蓝宝石衬底再利用方法 - Google Patents
图形化蓝宝石衬底报废外延片的蓝宝石衬底再利用方法 Download PDFInfo
- Publication number
- CN104362083B CN104362083B CN201410647442.5A CN201410647442A CN104362083B CN 104362083 B CN104362083 B CN 104362083B CN 201410647442 A CN201410647442 A CN 201410647442A CN 104362083 B CN104362083 B CN 104362083B
- Authority
- CN
- China
- Prior art keywords
- epitaxial wafer
- sapphire substrate
- gallium nitride
- scraps
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 76
- 239000010980 sapphire Substances 0.000 title claims abstract description 76
- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 29
- 229910002601 GaN Inorganic materials 0.000 claims abstract description 68
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims abstract description 62
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000005530 etching Methods 0.000 claims abstract description 16
- 238000004140 cleaning Methods 0.000 claims abstract description 15
- 238000005498 polishing Methods 0.000 claims abstract description 13
- 238000001039 wet etching Methods 0.000 claims abstract description 11
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000007797 corrosion Effects 0.000 claims abstract description 10
- 238000005260 corrosion Methods 0.000 claims abstract description 10
- 229910001882 dioxygen Inorganic materials 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000001312 dry etching Methods 0.000 claims abstract description 8
- 239000011259 mixed solution Substances 0.000 claims abstract description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 20
- 239000000243 solution Substances 0.000 claims description 11
- 125000001967 indiganyl group Chemical group [H][In]([H])[*] 0.000 claims description 3
- 238000004064 recycling Methods 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 54
- 230000006378 damage Effects 0.000 description 8
- 239000000126 substance Substances 0.000 description 4
- 241000931526 Acer campestre Species 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laser Beam Processing (AREA)
- Drying Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410647442.5A CN104362083B (zh) | 2014-11-17 | 2014-11-17 | 图形化蓝宝石衬底报废外延片的蓝宝石衬底再利用方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410647442.5A CN104362083B (zh) | 2014-11-17 | 2014-11-17 | 图形化蓝宝石衬底报废外延片的蓝宝石衬底再利用方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104362083A CN104362083A (zh) | 2015-02-18 |
CN104362083B true CN104362083B (zh) | 2017-10-31 |
Family
ID=52529335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410647442.5A Active CN104362083B (zh) | 2014-11-17 | 2014-11-17 | 图形化蓝宝石衬底报废外延片的蓝宝石衬底再利用方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104362083B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108807148A (zh) * | 2018-06-26 | 2018-11-13 | 山东浪潮华光光电子股份有限公司 | 一种物理与化学相结合恢复GaN-LED用蓝宝石图形衬底的方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104900490B (zh) * | 2015-05-04 | 2018-04-27 | 合肥彩虹蓝光科技有限公司 | 一种led报废片衬底恢复再利用的方法 |
CN109887878A (zh) * | 2019-02-28 | 2019-06-14 | 保定中创燕园半导体科技有限公司 | 一种回收图形化蓝宝石衬底的方法 |
CN113097068A (zh) * | 2021-03-31 | 2021-07-09 | 中国科学院微电子研究所 | 半导体器件的制备方法 |
CN115101636B (zh) * | 2022-08-24 | 2022-12-02 | 江苏第三代半导体研究院有限公司 | 复合微纳米半导体粉体结构、其制备方法及应用 |
CN116252188B (zh) * | 2023-05-15 | 2023-08-11 | 苏州焜原光电有限公司 | 一种锑化镓外延片去除外延层的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102593285A (zh) * | 2012-03-06 | 2012-07-18 | 华灿光电股份有限公司 | 一种回收图形化蓝宝石衬底的方法 |
CN103531685A (zh) * | 2013-10-29 | 2014-01-22 | 聚灿光电科技(苏州)有限公司 | 基于pss衬底外延片的处理方法 |
CN103730548A (zh) * | 2013-12-28 | 2014-04-16 | 福建省诺希新材料科技有限公司 | 一种利用高温氧化性气体回收图案化蓝宝石衬底的方法 |
DE102013201298A1 (de) * | 2013-01-28 | 2014-07-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Herstellung eines Halbleiterbauelements |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040040902A (ko) * | 2002-11-08 | 2004-05-13 | 엘지전자 주식회사 | 레이저를 이용한 선택적 질화갈륨층을 제거하는 방법 |
KR20080113479A (ko) * | 2007-06-25 | 2008-12-31 | 엘지이노텍 주식회사 | 웨이퍼 재활용 방법 |
KR20120040791A (ko) * | 2010-10-20 | 2012-04-30 | 삼성엘이디 주식회사 | 웨이퍼 재생 방법 |
-
2014
- 2014-11-17 CN CN201410647442.5A patent/CN104362083B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102593285A (zh) * | 2012-03-06 | 2012-07-18 | 华灿光电股份有限公司 | 一种回收图形化蓝宝石衬底的方法 |
DE102013201298A1 (de) * | 2013-01-28 | 2014-07-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Herstellung eines Halbleiterbauelements |
CN103531685A (zh) * | 2013-10-29 | 2014-01-22 | 聚灿光电科技(苏州)有限公司 | 基于pss衬底外延片的处理方法 |
CN103730548A (zh) * | 2013-12-28 | 2014-04-16 | 福建省诺希新材料科技有限公司 | 一种利用高温氧化性气体回收图案化蓝宝石衬底的方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108807148A (zh) * | 2018-06-26 | 2018-11-13 | 山东浪潮华光光电子股份有限公司 | 一种物理与化学相结合恢复GaN-LED用蓝宝石图形衬底的方法 |
CN108807148B (zh) * | 2018-06-26 | 2020-05-08 | 山东浪潮华光光电子股份有限公司 | 一种物理与化学相结合恢复GaN-LED用蓝宝石图形衬底的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104362083A (zh) | 2015-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104362083B (zh) | 图形化蓝宝石衬底报废外延片的蓝宝石衬底再利用方法 | |
CN102593285B (zh) | 一种回收图形化蓝宝石衬底的方法 | |
CN100594625C (zh) | 一种氮化镓基发光二极管芯片及其制作方法 | |
JP4142699B2 (ja) | 発光素子の製造方法 | |
Park et al. | Air-voids embedded high efficiency InGaN-light emitting diode | |
CN104868020B (zh) | 一种回收蓝宝石衬底的方法 | |
CN105826434B (zh) | 一种金刚石热沉GaN基LED的制作方法 | |
JP2010161422A (ja) | 化合物半導体素子ウェハーの製造方法 | |
KR20120051047A (ko) | 실리콘 기판의 표면을 텍스처링하는 방법 및 태양 전지용 텍스처화된 실리콘 기판 | |
JPWO2016152228A1 (ja) | 太陽電池用結晶シリコン基板の製造方法、結晶シリコン系太陽電池の製造方法および結晶シリコン系太陽電池モジュールの製造方法 | |
US7811845B2 (en) | Method for manufacturing high efficiency light-emitting diodes | |
Qi et al. | Study on the formation of dodecagonal pyramid on nitrogen polar GaN surface etched by hot H3PO4 | |
CN106653961A (zh) | 一种倒装结构micro LED芯片的制备方法 | |
JP2010114374A (ja) | 半導体素子の製造方法 | |
CN105609600A (zh) | 图形化蓝宝石衬底的回收方法 | |
CN102751397A (zh) | 一种蓝宝石图形衬底激光剥离的方法 | |
CN101471403A (zh) | Led报废片再利用方法 | |
JP2006066442A (ja) | 半導体素子用単結晶サファイア基板とその製造方法及び半導体発光素子 | |
CN109887878A (zh) | 一种回收图形化蓝宝石衬底的方法 | |
CN105914267B (zh) | 一种利用激光切割制备蓝宝石衬底led芯片的方法 | |
CN107123705A (zh) | 一种发光二极管的制备方法 | |
CN104966664A (zh) | 一种蓝宝石衬底回收方法 | |
JP2005136311A (ja) | 窒化物半導体基板及びその製造方法 | |
CN103531678A (zh) | 一种去除衬底上GaN基外延层的方法 | |
CN112447890B (zh) | 一种改善led芯片制造良率的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 261031 Shandong city of Weifang province high tech Zone Yuqing Street north of Silver Maple Road West photoelectric Park third Yuqing 12401 East West accelerator Applicant after: Shandong Au Optronics Co Address before: 261031 Shandong city of Weifang province high tech Zone Yuqing Street north of Silver Maple Road West photoelectric Park third Yuqing 12401 East West accelerator Applicant before: "SHANDONG NOVOSHINE PHOTOELECTRIC CO., LTD." |
|
COR | Change of bibliographic data | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Recycling method of sapphire substrate for patterned sapphire substrate scrap epitaxial wafer Effective date of registration: 20200909 Granted publication date: 20171031 Pledgee: Weifang Bank Co.,Ltd. Xincheng sub branch Pledgor: SHANDONG NOVOSHINE OPTOELECTRONICS Co.,Ltd. Registration number: Y2020980005848 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
CP03 | Change of name, title or address |
Address after: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee after: Yuanxu Semiconductor Technology Co.,Ltd. Address before: 261031 12401 Yuqing East Street, west of Yinfeng Road, north of Yuqing street, high tech Zone, Weifang City, Shandong Province Patentee before: SHANDONG NOVOSHINE OPTOELECTRONICS CO.,LTD. |
|
CP03 | Change of name, title or address | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220311 Granted publication date: 20171031 Pledgee: Weifang Bank Co.,Ltd. Xincheng sub branch Pledgor: SHANDONG NOVOSHINE OPTOELECTRONICS CO.,LTD. Registration number: Y2020980005848 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |