CN104321893B - 温度受控的集成压电谐振器 - Google Patents

温度受控的集成压电谐振器 Download PDF

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Publication number
CN104321893B
CN104321893B CN201380025923.6A CN201380025923A CN104321893B CN 104321893 B CN104321893 B CN 104321893B CN 201380025923 A CN201380025923 A CN 201380025923A CN 104321893 B CN104321893 B CN 104321893B
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China
Prior art keywords
layer
resonator
temperature
piezoelectric
bragg reflector
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Chinese (zh)
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CN104321893A (zh
Inventor
B·N·伯吉斯
W·R·克莱尼克
S·M·雅各布森
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Texas Instruments Inc
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Texas Instruments Inc
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02086Means for compensation or elimination of undesirable effects
    • H03H9/02102Means for compensation or elimination of undesirable effects of temperature influence
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175Acoustic mirrors

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN201380025923.6A 2012-05-31 2013-05-31 温度受控的集成压电谐振器 Active CN104321893B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/484,961 2012-05-31
US13/484,961 US9240767B2 (en) 2012-05-31 2012-05-31 Temperature-controlled integrated piezoelectric resonator apparatus
PCT/US2013/043657 WO2013181562A1 (en) 2012-05-31 2013-05-31 Temperature-controlled integrated piezoelectric resonator

Publications (2)

Publication Number Publication Date
CN104321893A CN104321893A (zh) 2015-01-28
CN104321893B true CN104321893B (zh) 2017-09-22

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CN201380025923.6A Active CN104321893B (zh) 2012-05-31 2013-05-31 温度受控的集成压电谐振器

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US (1) US9240767B2 (https=)
JP (1) JP6419069B2 (https=)
CN (1) CN104321893B (https=)
WO (1) WO2013181562A1 (https=)

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TWI538395B (zh) * 2014-05-07 2016-06-11 國立清華大學 主動式溫度補償共振器結構
JP6256605B2 (ja) * 2014-06-12 2018-01-10 株式会社村田製作所 圧電デバイス
US10778180B2 (en) * 2015-12-10 2020-09-15 Qorvo Us, Inc. Bulk acoustic wave resonator with a modified outside stack portion
US9965930B1 (en) * 2017-03-16 2018-05-08 Apple Inc. Electronic device including piezoelectric material layer and temperature compensation circuitry and related methods
JP6781271B2 (ja) * 2017-09-22 2020-11-04 安徽安努奇科技有限公司Anhui Anuki Technologies Co., Ltd. 圧電共振器の製造方法と圧電共振器
DE102017129160B3 (de) * 2017-12-07 2019-01-31 RF360 Europe GmbH Elektroakustisches Resonatorbauelement und Verfahren zu dessen Herstellung
US11563419B1 (en) * 2018-10-18 2023-01-24 Hrl Laboratories, Llc Piezoelectric resonator with multiple electrode sections
JP7434724B2 (ja) 2019-05-23 2024-02-21 セイコーエプソン株式会社 振動デバイス、電子機器および移動体
TWI810698B (zh) * 2019-06-12 2023-08-01 美商特拉華公司 電極界定未懸掛之聲波共振器
CN111010115A (zh) * 2019-08-09 2020-04-14 天津大学 体声波谐振器、滤波器和电子设备及控制谐振器温度的方法
CN116263342B (zh) * 2021-12-14 2026-01-13 苏州汉天下电子有限公司 一种体声波传感器及其制造方法
WO2025249019A1 (ja) * 2024-05-28 2025-12-04 ローム株式会社 半導体装置、半導体装置の温度補償方法および半導体装置の検査方法

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US7042131B2 (en) * 2001-06-06 2006-05-09 Murata Manufacturing Co., Ltd. Surface acoustic wave device
US7310029B2 (en) * 2003-07-17 2007-12-18 Commissariat A L'energie Atomique Bulk acoustic resonator with matched resonance frequency and fabrication process
US7385334B1 (en) * 2006-11-20 2008-06-10 Sandia Corporation Contour mode resonators with acoustic reflectors
CN100578931C (zh) * 2002-11-07 2010-01-06 安华高科技无线Ip(新加坡)私人有限公司 块体波共振器的音声反射器

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JPS62245811A (ja) * 1986-04-18 1987-10-27 Nippon Dempa Kogyo Co Ltd 恒温型圧電振動子
US5283458A (en) * 1992-03-30 1994-02-01 Trw Inc. Temperature stable semiconductor bulk acoustic resonator
US5696423A (en) * 1995-06-29 1997-12-09 Motorola, Inc. Temperature compenated resonator and method
US6060692A (en) * 1998-09-02 2000-05-09 Cts Corporation Low power compact heater for piezoelectric device
KR100502569B1 (ko) 2003-04-15 2005-07-20 박희대 선택형 블라그 반사층을 이용한 fbar 필터
US7358831B2 (en) * 2003-10-30 2008-04-15 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator (FBAR) devices with simplified packaging
US7362198B2 (en) 2003-10-30 2008-04-22 Avago Technologies Wireless Ip (Singapore) Pte. Ltd Pass bandwidth control in decoupled stacked bulk acoustic resonator devices
DE102005043039B4 (de) * 2005-09-09 2008-10-30 Siemens Ag Vorrichtung mit piezoakustischem Resonatorelement, Verfahren zu dessen Herstellung und Verfahren zur Ausgabe eines Signals in Abhängigkeit einer Resonanzfrequenz
DE102005043037B4 (de) 2005-09-09 2009-04-09 Siemens Ag Vorrichtung mit piezoakustischem Resonatorelement, Verfahren zu dessen Herstellung und Verfahren zur Ausgabe eines Signals in Abhängigkeit einer Resonanzfrequenz
US7463118B2 (en) * 2006-06-09 2008-12-09 Texas Instruments Incorporated Piezoelectric resonator with an efficient all-dielectric Bragg reflector
US7898365B2 (en) * 2006-09-06 2011-03-01 Raytheon Company Integrated saw device heater
JP4978210B2 (ja) * 2007-01-25 2012-07-18 セイコーエプソン株式会社 バルク音響振動子の製造方法
KR101155989B1 (ko) * 2007-06-21 2012-06-18 삼성전자주식회사 잉크젯 프린트헤드의 제조방법
ATE534191T1 (de) * 2009-03-09 2011-12-15 Micro Crystal Ag Oszillatorvorrichtung, die einen wärmegesteuerten piezoeletrischen quarz umfasst
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US7042131B2 (en) * 2001-06-06 2006-05-09 Murata Manufacturing Co., Ltd. Surface acoustic wave device
CN100578931C (zh) * 2002-11-07 2010-01-06 安华高科技无线Ip(新加坡)私人有限公司 块体波共振器的音声反射器
US7310029B2 (en) * 2003-07-17 2007-12-18 Commissariat A L'energie Atomique Bulk acoustic resonator with matched resonance frequency and fabrication process
US7385334B1 (en) * 2006-11-20 2008-06-10 Sandia Corporation Contour mode resonators with acoustic reflectors

Also Published As

Publication number Publication date
JP6419069B2 (ja) 2018-11-07
CN104321893A (zh) 2015-01-28
WO2013181562A1 (en) 2013-12-05
JP2015519848A (ja) 2015-07-09
US20130321101A1 (en) 2013-12-05
US9240767B2 (en) 2016-01-19

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