CN104319270B - Tire pressure induction apparatuss encapsulating lead - Google Patents
Tire pressure induction apparatuss encapsulating lead Download PDFInfo
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- CN104319270B CN104319270B CN201410610330.2A CN201410610330A CN104319270B CN 104319270 B CN104319270 B CN 104319270B CN 201410610330 A CN201410610330 A CN 201410610330A CN 104319270 B CN104319270 B CN 104319270B
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Abstract
A kind of tire pressure induction apparatuss encapsulating lead, for being fixedly connected tyre pressure sensor chip, main control chip and transmitting chip；Including frame body, frame body adopts NiPdAu material；Frame body includes the first Ji Dao, the second Ji Dao, the first lead-foot-line and second pin line；First Ji Dao and the second Ji Dao is located at frame body central authorities；First Ji Dao is used for installing main control chip and transmitting chip；Second base island central authorities is provided with through hole, and through hole is used for sensing ambient pressure, and the second Ji Dao is used for fixing the tyre pressure sensor；First lead-foot-line is T-shaped, and the first lead-foot-line is arranged at the opposite sides of the first Ji Dao；Second pin line extends spread configuration along the second base island side edge length direction；First lead-foot-line and second pin line are respectively used to the signal transmission of main control chip, transmitting chip and tyre pressure sensor to external equipment.Frame body is made using NiPdAu material, subsequent electroplating process is eliminated.Simultaneously using after NiPdAu so that lead frame has good electric conductivity and heat conductivity.
Description
Technical field
The present invention relates to lead frame, more particularly to a kind of make tire pressure induction apparatuss encapsulation simple, quick for installation and draw
Wire frame.
Background technology
Chip carrier of the lead frame as integrated circuit, is by means of bonding material, one kind realizes that chip internal circuits draw
Go out the electrical connection at end and outer lead, form the key structure part of electric loop, it serves the bridge with outer lead connection
Effect, is required for using lead frame in the semiconductor integrated block of the overwhelming majority, is important basic material in electronics and information industry
Material.Mainly produced with mould punching method and chemical etching method.Traditional lead frame manufacturing process is complicated, and is installing core
Complex procedures during piece, need to put into more manpower and materials, and lead frame are easily shifted, cause chip installation difficulty.
Content of the invention
It is based on this, it is necessary to provide and a kind of make tire pressure induction apparatuss encapsulating lead simple, quick for installation
A kind of tire pressure induction apparatuss encapsulating lead, for being fixedly connected tyre pressure sensor chip, main control chip and transmitting
Chip；Including frame body, the frame body adopts NiPdAu material；
The frame body includes the first Ji Dao, the second Ji Dao, the first lead-foot-line and second pin line；First Ji Dao
With second Ji Dao located at the central authorities of the frame body；First Ji Dao is used for installing the main control chip and described
Core shooting piece；The second base island central authorities are provided with through hole, and the through hole is used for sensing ambient pressure, and second Ji Dao is used for fixing
The tyre pressure sensor chip；First lead-foot-line is T-shaped, and first lead-foot-line is arranged at the relative of first Ji Dao
Both sides；The second pin line extends spread configuration along the second base island side edge length direction；First lead-foot-line and institute
State second pin line to be respectively used to the signal transmission of the main control chip, the transmitting chip and the tyre pressure sensor chip
Give external equipment.
Wherein in one embodiment, also include that the first location hole, first location hole are arranged at the frame body
Edge.
Wherein in one embodiment, first location hole be used for the tyre pressure sensor chip and with the tire pressure
When the main control chip and transmitting chip of sensor chip connection carry out core spot welding, the lead frame travel direction identification is made.
Wherein in one embodiment, also include that the second location hole, second location hole are relatively arranged on the framework
Two opposite side edge of body.
Wherein in one embodiment, second location hole is used for the tyre pressure sensor chip to be carried out a little burn-oning
During core, the lead frame is fixed on predeterminated position, and when operation is packaged, the lead frame is fixed on feeding
On frame.
Wherein in one embodiment, also include that the 3rd location hole, the 3rd location hole are arranged along the frame body
Center line is arranged.
Wherein in one embodiment, the 3rd location hole is used for entering the lead frame when operation is packaged
Line direction is recognized.
Wherein in one embodiment, first Ji Dao and second Ji Dao be square, first Ji Dao with
The second base island parallel arranged.
Wherein in one embodiment, the first base island area is more than the second base island area.
Wherein in one embodiment, first Ji Dao deviates from the one of the installation main control chip and the transmitting chip
Face is provided with salient point.
Above-mentioned tire pressure induction apparatuss encapsulating lead makes frame body using NiPdAu material, eliminates follow-up galvanizer
Skill.Simultaneously using after NiPdAu so that lead frame has good electric conductivity and a heat conductivity, and with chip and plastic packaging material etc.
Other materials has good thermal matching.There is good oxidative resistance and corrosion resistance simultaneously.
Using the first location hole, the second location hole and the 3rd location hole respectively upper core spot welding and encapsulating operation when, prevent
Framework is counter to be filled, and as drawing material hole to make lead frame enter specified location, and can fixed frame, it is to avoid lead frame is shifted.
Description of the drawings
Structural representations of the Fig. 1 for tire pressure induction apparatuss encapsulating lead；
Fig. 2 is multiple tire pressure induction apparatuss encapsulating lead connection diagrams.
Specific embodiment
As shown in figure 1, the structural representation for tire pressure induction apparatuss encapsulating lead.
A kind of tire pressure induction apparatuss encapsulating lead, for being fixedly connected tyre pressure sensor chip, main control chip and transmitting
Chip；Including frame body, the frame body adopts NiPdAu material.
The frame body includes the first base island 101, the second base island 102, the first lead-foot-line 104 and second pin line 103；
The first base island 101 and the second base island 102 are located at the central authorities of the frame body；The first base island 101 is used for pacifying
Fill the main control chip and the transmitting chip；Second base island, 102 central authorities are provided with through hole, and the through hole is used for sensing the external world
Air pressure, the second base island 102 are used for fixing the tyre pressure sensor chip；First lead-foot-line 104 is T-shaped, and described
One lead-foot-line 104 is arranged at the opposite sides on the first base island 101；The second pin line 103 is along the second base island 102
Side edge length direction extends spread configuration；First lead-foot-line 104 and the second pin line 103 are respectively used to the master
The signal transmission of control chip, the transmitting chip and the tyre pressure sensor chip is to external equipment.
Tire pressure induction apparatuss encapsulating lead also includes that the first location hole 105, first location hole 105 are arranged at described
Frame body edge.
First location hole 105 is used for the master control being connected in the tyre pressure sensor chip and with the tyre pressure sensor chip
When chip and transmitting chip carry out core spot welding, the lead frame travel direction identification is made.
Preferably, the first location hole 105 be uniformly arranged on frame body two couples diagonal on, therefore, core point on product
During welder's sequence, lead frame direction discernment is carried out, framework is counter to be filled to prevent.And can connect by frame body and with frame body
Tyre pressure sensor chip, main control chip and the transmitting chip for connecing is packaged to be fixed together, it is to avoid cause lead frame because of external force
Frame is shifted, and then causes the movement of frame body, tyre pressure sensor chip, main control chip or transmitting chip so that product is encapsulated
Unqualified.
Tire pressure induction apparatuss encapsulating lead also includes that the second location hole 106, second location hole 106 are relatively arranged on
Two opposite side edge of the frame body.
Second location hole 106 is used for, when core is carried out a little burn-oning to tyre pressure sensor chip, the lead frame being fixed
In predeterminated position, and when operation is packaged, the lead frame is fixed on stock shelf.
Preferably, the second location hole 106 is oppositely arranged on the opposite side of frame body, in the first location hole 105 and framework
Position between body axis.The lead frame can be fixed on default when point welding process is carried out to lead frame
Position.
Tire pressure induction apparatuss encapsulating lead also includes the 3rd location hole 107, and the 3rd location hole 107 is along the framework
Body arranges center line and arranges.
3rd location hole 107 is used for making the lead frame travel direction identification when operation is packaged.Prevent lead
Framework is counter to be filled.
Preferably, the 3rd location hole 107 is arranged on frame body axis, same with the center of circle of 102 through hole of the second base island
On axis, for making the lead frame travel direction identification when operation is packaged.
First base island 101 and the second base island 102 are square, the first base island 101 and the second base island 102
Parallel arranged.
First base island, 101 area is more than 102 area of the second base island.
First base island 101 is provided with salient point away from the one side for installing the main control chip and the transmitting chip.
As shown in Fig. 2 being multiple tire pressure induction apparatuss encapsulating lead connection diagrams.
The edge designs of lead frame have location hole, and specially the first location hole 105, the second location hole 106 and the 3rd are fixed
Position hole 107, to carry out the operations such as upper core, spot welding and encapsulating, and is prevented from that lead frame is counter to be filled.Is provided with lead frame
The first larger base island 101 of one base island 101 and the second base island 102, wherein area is used for carrying main control chip (MCU) and transmitting core
Piece (RF chips), and 101 back side of the first base island is designed as the salient point of matrix distribution, for strengthening lead frame with plastic packaging material
Conjugation.The less second base island 102 of another area is used for carrying tyre pressure sensor chip.
Above-mentioned tire pressure induction apparatuss encapsulating lead makes frame body using NiPdAu material, eliminates follow-up galvanizer
Skill.Simultaneously using after NiPdAu so that lead frame has good electric conductivity and a heat conductivity, and with chip and plastic packaging material etc.
Other materials has good thermal matching.There is good oxidative resistance and corrosion resistance simultaneously.
Using the first location hole 105, the second location hole 106 and the 3rd location hole 107 respectively in upper core spot welding and encapsulating work
During sequence, prevent that framework is counter to be filled, and as drawing material hole to make lead frame enter specified location, and can fixed frame, it is to avoid lead frame
Frame is shifted.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the guarantor of the present invention
Shield scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (10)
1. a kind of tire pressure induction apparatuss encapsulating lead, for being fixedly connected tyre pressure sensor chip, main control chip and transmitting core
Piece；Characterized in that, including frame body, the frame body adopts NiPdAu material；
The frame body includes the first Ji Dao, the second Ji Dao, the first lead-foot-line and second pin line；First Ji Dao and institute
The second Ji Dao is stated located at the central authorities of the frame body；First Ji Dao is used for installing the main control chip and the transmitting core
Piece；The second base island central authorities are provided with through hole, and the through hole is used for sensing ambient pressure, and second Ji Dao is used for fixed described
Tyre pressure sensor chip；First lead-foot-line is T-shaped, and first lead-foot-line is arranged at relative the two of first Ji Dao
Side；The second pin line extends spread configuration along the second base island side edge length direction；First lead-foot-line and described
Second pin line be respectively used to by the signal transmission of the main control chip, the transmitting chip and the tyre pressure sensor chip to
External equipment.
2. tire pressure induction apparatuss encapsulating lead according to claim 1, it is characterised in that also include the first location hole,
First location hole is arranged at the frame body edge.
3. tire pressure induction apparatuss encapsulating lead according to claim 2, it is characterised in that first location hole is used for
The main control chip and transmitting chip being connected in the tyre pressure sensor chip and with the tyre pressure sensor chip carries out core point
During weldering, the lead frame travel direction identification is made.
4. tire pressure induction apparatuss encapsulating lead according to claim 1, it is characterised in that also include the second location hole,
Second location hole is relatively arranged on two opposite side edge of the frame body.
5. tire pressure induction apparatuss encapsulating lead according to claim 4, it is characterised in that second location hole is used for
When core is carried out a little burn-oning to the tyre pressure sensor chip, the lead frame is fixed on predeterminated position, and is being sealed
During dress operation, the lead frame is fixed on stock shelf.
6. tire pressure induction apparatuss encapsulating lead according to claim 1, it is characterised in that also include the 3rd location hole,
3rd location hole arranges center line along the frame body and arranges.
7. tire pressure induction apparatuss encapsulating lead according to claim 6, it is characterised in that the 3rd location hole is used for
The lead frame travel direction identification is made when operation is packaged.
8. tire pressure induction apparatuss encapsulating lead according to claim 1, it is characterised in that first Ji Dao and described
Second Ji Dao is square, first Ji Dao and the second base island parallel arranged.
9. tire pressure induction apparatuss encapsulating lead according to claim 1, it is characterised in that the first base island area is big
In the second base island area.
10. tire pressure induction apparatuss encapsulating lead according to claim 1, it is characterised in that first Ji Dao deviates from
The one side for installing the main control chip and the transmitting chip is provided with salient point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410610330.2A CN104319270B (en) | 2014-10-31 | 2014-10-31 | Tire pressure induction apparatuss encapsulating lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410610330.2A CN104319270B (en) | 2014-10-31 | 2014-10-31 | Tire pressure induction apparatuss encapsulating lead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104319270A CN104319270A (en) | 2015-01-28 |
| CN104319270B true CN104319270B (en) | 2017-03-15 |
Family
ID=52374480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410610330.2A Active CN104319270B (en) | 2014-10-31 | 2014-10-31 | Tire pressure induction apparatuss encapsulating lead |
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| CN (1) | CN104319270B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118893A (en) * | 2006-08-02 | 2008-02-06 | 南茂科技股份有限公司 | Semiconductor packaging structure with common type wafer holder |
| CN101313402A (en) * | 2005-11-16 | 2008-11-26 | 冲电气工业株式会社 | Double-faced electrode package, and its manufacturing method |
| CN202423268U (en) * | 2011-12-26 | 2012-09-05 | 重庆平伟实业股份有限公司 | TO-220 frame with flow guide columns |
| CN203466185U (en) * | 2013-09-30 | 2014-03-05 | 广东合科泰实业有限公司 | Novel IC molding structure |
| CN203774298U (en) * | 2014-01-24 | 2014-08-13 | 嘉兴斯达微电子有限公司 | Power semiconductor module with electrode pressure device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100586699B1 (en) * | 2004-04-29 | 2006-06-08 | 삼성전자주식회사 | Semiconductor chip package and manufacturing method therof |
-
2014
- 2014-10-31 CN CN201410610330.2A patent/CN104319270B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101313402A (en) * | 2005-11-16 | 2008-11-26 | 冲电气工业株式会社 | Double-faced electrode package, and its manufacturing method |
| CN101118893A (en) * | 2006-08-02 | 2008-02-06 | 南茂科技股份有限公司 | Semiconductor packaging structure with common type wafer holder |
| CN202423268U (en) * | 2011-12-26 | 2012-09-05 | 重庆平伟实业股份有限公司 | TO-220 frame with flow guide columns |
| CN203466185U (en) * | 2013-09-30 | 2014-03-05 | 广东合科泰实业有限公司 | Novel IC molding structure |
| CN203774298U (en) * | 2014-01-24 | 2014-08-13 | 嘉兴斯达微电子有限公司 | Power semiconductor module with electrode pressure device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104319270A (en) | 2015-01-28 |
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Effective date of registration: 20230921 Address after: 510000 Guangdong city of Guangzhou province Luogang District Science City Nanxiang Road No. 10 two Patentee after: GUANGDONG FENGHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 510000 Guangdong city of Guangzhou province Luogang District Science City Nanxiang Road No. 10 two Patentee before: GUANGDONG FENGHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Patentee before: Guangdong Fenghua Advanced Technology Holding Co.,Ltd. |