CN104317368B - A kind of server - Google Patents
A kind of server Download PDFInfo
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- CN104317368B CN104317368B CN201410535917.1A CN201410535917A CN104317368B CN 104317368 B CN104317368 B CN 104317368B CN 201410535917 A CN201410535917 A CN 201410535917A CN 104317368 B CN104317368 B CN 104317368B
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- 238000005192 partition Methods 0.000 claims abstract description 159
- 238000009423 ventilation Methods 0.000 claims description 32
- 238000001514 detection method Methods 0.000 claims description 13
- 238000000605 extraction Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 206010010904 Convulsion Diseases 0.000 description 2
- 230000036461 convulsion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Computer Hardware Design (AREA)
Abstract
The present invention provides a kind of server, which includes：Shell, partition board is provided in shell, shell is divided at least two mutually isolated subregions by partition board, is provided in shell and is calculated base part and input and output base part, and the calculating base part and input and output base part are located at subregion different at least two subregion；Wherein, the air inlet towards each subregion is provided on shell, shell is provided with the air-out passage being respectively communicated with each subregion away from the side of air inlet, and air-out passage is provided with exhaust equipment.Beneficial effects of the present invention are：Space in the shell of server is divided by using partition board by mutually isolated multiple subregions, base part is calculated and input and output device is separately positioned in different subregions；And the air-out passage being individually connected to each subregion is set, the resistance being subject to when air flows in shell is effectively improved, exhaust equipment can be worked with lower power, reduce the noise of server.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a server.
Background
At present, 8-path rack servers mostly adopt a framework in which computing nodes (main devices comprise a CPU and an internal memory) and PCIe cards are arranged in a cascade mode, as a plurality of PCIe card panels are not provided with holes and can only ventilate through holes on the wall surface of a case between the PCIe cards, the system resistance is larger, a part of PCIe card devices take the ambient temperature as a criterion and are influenced by front high-power-consumption computing nodes, the incoming flow temperature of the PCIe cards is higher, in order to overcome the problems of high PCIe resistance and high incoming flow temperature, in the prior art, a large-size high-performance fan is used, a pressure head is increased, the system air volume is increased, but as the fan performance is higher, the noise is larger, the high-performance fan is used, the noise problem is caused, as shown in figure 1, the fan 2 is arranged behind the case 1 in the case 1, the PCIe card 3 is arranged below the fan 2, the PCIe card 3 with the structure is difficult to dissipate heat, and the support of the PCIe cards 3, and the problems of difficult speed regulation and high noise of the fan 2 exist.
Disclosure of Invention
The invention provides a server, which is used for realizing the heat dissipation effect of the server and reducing the noise of the server.
In a first aspect, a server is provided, which includes: the shell is internally provided with a partition board which divides the shell into at least two partitions which are mutually isolated, a calculation component and an input/output component are arranged in the shell, and the calculation component and the input/output component are respectively positioned in different partitions of the at least two partitions; wherein,
be provided with the air intake towards every subregion on the casing, the casing deviates from one side of air intake is provided with the air-out passageway that communicates respectively with every subregion, just the air-out passageway is provided with and is used for the at least one air extraction equipment that takes the air in the subregion out.
In combination with the above-mentioned first aspect, in a first possible implementation manner, the number of the partitions is two, and the partitions are respectively a first partition and a second partition, and a first partition board is disposed in the second partition, the first partition board divides the second partition into a first placement area and a second placement area, and a first ventilation hole communicating the first placement area and the second placement area is disposed in the first partition board.
In combination with the first possible implementation manner of the first aspect, in a second possible implementation manner, a second partition board is further disposed in the second partition, the first partition board is disposed between the partition and the second partition board, a bottom ventilation duct 70 is formed between the second partition board and the bottom plate of the casing, and the second partition board is provided with a plurality of second ventilation holes communicated with the second placement area.
With reference to the second possible implementation manner of the first aspect, in a third possible implementation manner, the number of the second ventilation holes is two, and center lines of the two second ventilation holes are respectively located in the middle of the second placement area and at an end of the second placement area away from the air inlet on the housing.
With reference to the third possible implementation manner of the first aspect, in a fourth possible implementation manner, a third partition board is arranged in the second placement area, the third partition board is connected with the partition board and the casing, and a third ventilation hole communicated with the air outlet channel is formed in the third partition board.
With reference to the fourth possible implementation manner of the first aspect, in a fifth possible implementation manner, the air inlet channel is provided with a fourth air inlet communicated with the second partition, and the third air inlet and the fourth air inlet are arranged at different positions.
With reference to the fifth possible implementation manner of the first aspect, in a sixth possible implementation manner, a first printed circuit board and a second printed circuit board are further disposed in the casing, where the partition board includes a first partition board, a second partition board, and a first printed circuit board disposed between the first partition board and the air duct partition board and respectively connected to the first partition board and the second partition board, and the first printed circuit board extends into the second partition, a portion of the first printed circuit board located in the second partition forms the first partition board, and the first ventilation hole is disposed in a portion of the first printed circuit board located in the second partition; the second partition panel includes check baffle and with the second printed circuit board that check baffle is connected, the second through-air vent sets up second printed circuit board.
With reference to the first aspect, the first possible implementation manner of the first aspect, the second possible implementation manner of the first aspect, the third possible implementation manner of the first aspect, the fourth possible implementation manner of the first aspect, the possible implementation manner of the first aspect, and the sixth possible implementation manner of the first aspect, in a seventh possible implementation manner, the air duct system further includes an air duct partition plate disposed in the air outlet channel, the air duct partition plate divides the air outlet channel into sub-channels correspondingly communicated with each of the sub-zones, and an air extracting device is disposed in each of the sub-channels.
With reference to the seventh possible implementation manner of the first aspect, in an eighth possible implementation manner, the method further includes:
temperature detection means provided in each of the zones for detecting a temperature of the zone;
and the control device is respectively connected with each temperature detection device and the air draft equipment, and controls the air draft equipment in the sub-channel communicated with the sub-area where the temperature detection device is located to work according to the corresponding relation between the temperature detected by each temperature detection device and the set temperature threshold value.
With reference to the eighth possible implementation manner of the first aspect, in a ninth possible implementation manner, the computing component is a memory card and/or a processor, and the input/output component is: hard disk, disk array, or PCIe card.
With reference to the ninth possible implementation manner of the first aspect, in a tenth possible implementation manner, the air exhaust device is a fan.
According to the server provided by the first aspect, the space in the housing of the server is divided into a plurality of partitions isolated from each other by using the partition, and the computing components and the input/output devices are respectively arranged in different partitions; and set up the air-out passageway that communicates alone with every subregion, carry out convulsions to above-mentioned subregion through the air extraction equipment who sets up in the air-out passageway for the lower air of temperature can be contacted to the part in every subregion, has improved the effect of heat exchange, has improved its radiating effect, and owing to adopt solitary air-out passageway, the air can be unobstructed flows out in the casing, and the resistance that receives is less, and air extraction equipment can work with lower power, has reduced the noise of server.
Drawings
Fig. 1 is a perspective view of a server according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a server according to an embodiment of the present invention;
fig. 3 is another schematic structural diagram of a server according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a server according to an embodiment of the present invention;
fig. 5 is another schematic structural diagram of a server according to an embodiment of the present invention.
Reference numerals:
1-chassis 2-fan 3-PCIe card
10-shell 11-partition 111-fourth ventilation hole
112-first partition plate 113-second partition plate 12-first partition plate
121-first ventilation hole 13-second partition plate 131-second ventilation hole
132-grid baffle 14-third partition plate 141-third vent hole
15-air duct partition plate 20-first partition 30-second partition
31-first placing area 32-second placing area 40-air outlet channel
41-air draft equipment 50-calculation part 60-input and output part
70-bottom ventilation duct 80-first printed circuit substrate 90-second printed circuit substrate
Detailed Description
In order to improve the heat dissipation effect and the noise influence of the server, the embodiment of the invention provides the server. In order to make the objects, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below by way of non-limiting examples.
As shown in fig. 2, fig. 2 is a schematic structural diagram of a server according to an embodiment of the present invention.
An embodiment of the present invention provides a server, including: the electronic device comprises a shell 10, wherein a partition plate 11 is arranged in the shell 10, the shell 10 is divided into at least two partitions which are mutually isolated by the partition plate 11, a calculation component 50 and an input/output component 60 are arranged in the shell 10, and the calculation component 50 and the input/output component 60 are respectively positioned in different partitions of the at least two partitions; wherein,
be provided with the air intake towards every subregion on the casing 10, one side that casing 10 deviates from the air intake is provided with the air-out passageway 40 that communicates respectively with every subregion, and air-out passageway 40 is provided with at least one air extraction equipment 41 that is used for taking out the air in the subregion.
In the above embodiment, the inside of the casing 10 is divided into different spaces isolated from each other by the partition 11, the computing components 50 and the input/output components 60 are respectively disposed in different partitions, the air inlet and the air outlet channel 40 are respectively disposed on two opposite sides of the casing 10, and the air in the server is extracted by the air extracting device 41 disposed in the air outlet channel 40. During the specific operation, the cold air enters into each subarea from the air inlet and is drawn out after passing through the whole subarea under the action of the air draft equipment 41, in the whole process, because the calculation components 50 and the input and output components 60 are respectively arranged in different subareas, the cold air respectively passes through the subareas in which the calculation components 50 and the input and output components 60 are arranged in the shell, the calculation components 50 with higher heat dissipation can receive the outside air with lower temperature, when the heat exchange is carried out, the temperature difference between the calculation components 50 and the input and output components is larger, the heat exchange is obvious, the heat dissipation of the calculation components 50 is facilitated, the heat dissipation efficiency of the server is improved, meanwhile, the air after the heat exchange directly flows out of the shell 10 from the air outlet channel 40, and because the special air outlet channel 40 is arranged, the air drawn out by the air draft equipment 41 does not need to pass through the output and input components 60, the resistance is smaller, the resistance that hot-air flows out has been reduced, and air extraction equipment 41 can realize convulsions with lower power, has reduced air extraction equipment 41's noise.
A fan may be used for the air extracting device 41.
For the convenience of understanding the above embodiments, the technical solutions of the present invention will be described below with specific embodiments.
Example 1
As shown in fig. 3, in the server configuration shown in fig. 3, the number of partitions is two, and the first partition 20 and the second partition 30 are provided, the first partition 12 is provided in the second partition 30, the first partition 12 divides the second partition 30 into the first storage area 31 and the second storage area 32, and the first partition 12 is provided with the first ventilation hole 121 communicating the first storage area 31 and the second storage area 32. In addition, the number of the air outlet channels 40 is one, and the number of the air draft devices 41 is also one, and the air draft devices are arranged in the air outlet channels 40; the components placed in the first partition 20 are computation components 50, and the components placed in the second partition 30 are input/output components 60. Specifically, the computing component 50 is a memory card or a processor; the input/output component 60 is a hard disk, a disk array or a PCIe card.
Because the treater during operation heat that produces is higher, and the clearance of PCIe card and casing 10 junction is less, in order to avoid PCIe card to influence gaseous circulation, consequently, place first subregion 20 and second subregion 30 respectively with both, when air extraction equipment 41 worked, outside air entered into respectively through the air intake and goes into in first subregion 20 and the second subregion 30 and cool down treater and PCIe card, the heat exchange between air and the heat abstractor is great, thereby make air extraction equipment 41 can realize dispelling the heat to the treater with lower power. Meanwhile, when the PCIe card is set, the hard disk and the disk array are placed in the first placing area 31, the PCIe card is placed in the second placing area 32, and when outside air enters the second partition 30, the hard disk and the disk array are first cooled, and then the PCIe card is cooled. By adopting the partition arrangement, the hard disk, the disk array and the PCIe card can be conveniently arranged, and the space in the shell 10 can be reasonably utilized.
Example 2
With continued reference to fig. 3, the structure of the present embodiment is similar to that of embodiment 1, except that a second partition plate 13 is additionally provided in the second partition 30; specifically, still be provided with second partition panel 13 in the second subregion 30, first partition panel 12 sets up between baffle 11 and second partition panel 13, forms bottom air duct 70 between the bottom plate of second partition panel 13 and casing 10, and is provided with a plurality of second ventilation holes 131 that place the district 32 intercommunication with the second on the second partition panel 13.
In this embodiment, because the PCIe card is disposed at the end close to the air extracting device 41, and the air extracting device 41 is disposed above the PCIe card, when the air extracting device 41 works, the flowing air may not be blown onto the whole PCIe card (as shown in fig. 2), in order to improve the heat dissipation effect of the PCIe card, the second partition board 13 is added to the embodiment, the bottom ventilation duct 70 is formed with the casing 10 through the second partition board 13, and the second partition board 13 is provided with the plurality of second ventilation holes 131, so that the bottom ventilation duct 70 is communicated with the second placement area 32. Its concrete during operation, under the effect of air extraction equipment 41, partly air flows in from bottom air duct 70 to directly enter into the second through second venthole 131 and place the district 32 in and cool down the PCIe card, simultaneously, can make the air blow the different positions of PCIe card through the position that sets up that changes second venthole 131, reduce the temperature of PCIe card more effectively. Specifically, with reference to fig. 3, the number of the second ventilation holes 131 is two, and the center lines of the two second ventilation holes 131 are respectively located in the middle of the second placing area 32 and at an end of the second placing area 32 away from the air inlet on the housing 10. It can be clearly seen from fig. 3 that the effect that air blows to whole PCIe card can be effectively improved by respectively setting the second vent holes 131 in the middle of the second placement area 32 and the end of the air inlet far away from the housing 10, and when the temperature is reduced, the air can blow to the whole PCIe card, so that the partial PCIe card is prevented from being blown, and the partial temperature of the PCIe card is higher. As can be clearly seen from the comparison between fig. 2 and fig. 3, when the bottom air duct 70 is adopted, the area of the PCIe card covered by the air flow is significantly increased, the cooling of the PCIe is effectively improved, and the heat dissipation effect is improved.
Example 3
As shown in fig. 4, the structure of the present embodiment is similar to that of embodiment 3, and the difference structure is that a third partition plate 14 is disposed in the second placement area 32, the third partition plate 14 is connected to the partition plate 11 and the casing 10, and a third ventilation hole 141 communicated with the air outlet channel 40 is disposed on the third partition plate 14;
the third partition panel 14 additionally arranged in the second storage area 32 can effectively improve the circulation condition of air in the second storage area 32, and in particular, the circulation condition of air in the second storage area 32 can be improved by changing the third ventilation holes 141 arranged on the third partition panel 14. Thereby enabling the air to cool down the PCIe card even more. Preferably, the following steps: the air inlet channel is provided with a fourth air vent 111 communicated with the second partition 30, and the third air vent 141 and the fourth air vent 111 are arranged in staggered positions. It can be seen from fig. 4 that the horizontal distance between the setting position of the fourth ventilation hole 111 and the air draft device 41 is greater than the horizontal distance between the setting position of the third ventilation hole 141 and the air draft device 41, so that when air circulates, the two ventilation holes have a bending effect, the air in the second placement area 32 can blow more air to the end of the PCIe card far away from the air inlet, and the heat dissipation effect of the PCIe card is effectively improved.
Example 4
As shown in fig. 5, in the structure of the server provided in this embodiment, the devices disposed in the casing 10 are present as a part of the partition 11, specifically, a first printed circuit board 80 and a second printed circuit board 90 are further disposed in the casing 10, wherein the partition 11 includes a first partition 112, a second partition 113, and a first printed circuit board 80 disposed between the first partition 11 and the air duct partition 15 and connected to the first partition 112 and the second partition 113, respectively, and the first printed circuit board 80 extends into the second partition 30, a portion of the first printed circuit board 80 located in the second partition 30 forms a first partition 12, and the first ventilation hole 121 is disposed in a portion of the first printed circuit board 80 located in the second partition 30; the second partition plate 13 includes a lattice baffle 132 and a second printed circuit board 90 connected to the lattice baffle 132, and the second ventilation hole 131 is provided in the second printed circuit board 90.
In the above embodiment, the first printed circuit board 80 and the second printed circuit board 90 are respectively arranged as a partition structure in the whole housing 10, which effectively reduces the number of the arranged partition boards 11 and reduces the usage of raw materials, and meanwhile, by adopting the above structure, the space utilization rate in the housing 10 is effectively improved, so that the arranged first printed circuit board 80 and the arranged second printed circuit board 90 can be reasonably arranged. As shown in fig. 5, it can be clearly seen from fig. 5 that the first partition plate 112, the second partition plate 113 and part of the first pcb 80 form the partition plate 11 to divide the housing 10 into the first sub-area 20 and the second sub-area 30, wherein the first partition plate 112, part of the first pcb 80 and the second partition plate 113 form a bent structure, thereby facilitating the installation of the heat dissipation devices in the first sub-area 20 and the second sub-area 30.
Example 5
Referring to fig. 3, 4 and 5 together, the structure provided in this embodiment is an improvement of the air outlet channel 40, and in order to improve the heat dissipation effect of the heat dissipation device, the server provided in this embodiment includes, in addition to the structure of embodiment 1, embodiment 2 or embodiment 3, the following: the air duct partition plate 15 is arranged in the air outlet channel 40, the air outlet channel 40 is divided into sub-channels correspondingly communicated with the sub-zones by the air duct partition plate 15, and an air draft device 41 is arranged in each sub-channel.
For the convenience of understanding the present embodiment, the following description will also take the first partition 20 and the second partition 30 as examples. Specifically, the air duct partition plate 15 arranged in the air outlet channel 40 divides the air outlet channel 40 into a first channel and a second channel, and the first channel and the second channel are respectively provided with an air draft device 41. The air duct partition plate 15 is used for completely sealing and isolating the two partitions, so that the ventilation requirement of the first partition 20 can be completely separated from the ventilation requirement of the second partition 30, when the air duct partition plate is cooled specifically, the air draft equipment 41 corresponding to the first partition can be controlled to work respectively through different requirements of the two partitions, the utilization rate of the air draft equipment 41 is effectively improved, and the problem that the air draft equipment 41 with higher requirements needs to be met due to different requirements of the two partitions is avoided. Further, the power of the air draft device 41 can be improved, and the noise of the air draft device 41 can be reduced.
In addition, the degree of automation of the server during cooling is improved. The server provided by this embodiment further includes:
temperature detection means provided in each of the zones for detecting a temperature of the zone;
and the control device is respectively connected with each temperature detection device and the air draft equipment 41, and controls the air draft equipment 41 in the sub-channel communicated with the sub-area where the temperature detection device is located to work according to the corresponding relation between the temperature detected by each temperature detection device and the set temperature threshold value.
The automatic control of the air draft equipment 41 can be realized through the arranged temperature detection device and the control device. In specific operation, the control device can control different air extracting devices 41 to operate at different powers according to specific conditions. When the temperature rise of a certain partition is high, the air extracting device 41 of the partition can be controlled to work with high power, and when the temperature rise of a certain partition is low, the power of the air extracting device 41 of the partition can be reduced. Therefore, the power of the air draft equipment 41 is effectively utilized, the working efficiency of the air draft equipment is improved, and the temperatures of different subareas can be accurately controlled.
It should be understood that the server provided in this embodiment should not be limited to the above specific embodiments 1, 2, 3, 4 and 5; any other structure capable of realizing the division and cooling of the heat dissipation device in the housing 10 can be applied to the present embodiment, and the principle thereof is the same as that of the above embodiments, and is not described herein again.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (7)
1. A server, comprising: the shell is internally provided with a partition board which divides the shell into two mutually isolated subareas, and the shell is internally provided with a calculation part and an input/output part which are respectively positioned in different subareas of the two subareas;
the two sub-areas are respectively a first sub-area and a second sub-area, wherein a first partition board is arranged in the second sub-area, the first partition board divides the second sub-area into a first placing area and a second placing area, and a first vent hole which is communicated with the first placing area and the second placing area is formed in the first partition board;
a second partition board is further arranged in the second partition area, the first partition board is arranged between the partition board and the second partition board, a bottom air channel is formed between the second partition board and the bottom plate of the shell, and a plurality of second air holes communicated with the second placement area are formed in the second partition board;
the shell is provided with an air inlet facing each partition, one side of the shell, which is far away from the air inlet, is provided with an air outlet channel, the air outlet channel is communicated with the first partition and the second placement area in the second partition, and the air outlet channel is provided with at least one air extraction device for extracting air in the partitions;
a third partition plate is arranged in the second placement area, is connected with the partition plate and the shell, and is provided with a third air through hole communicated with the air outlet channel; and the air outlet channel is provided with a fourth ventilation hole communicated with the second partition, and the third ventilation hole and the fourth ventilation hole are arranged in staggered positions.
2. The server according to claim 1, wherein the number of the second ventilation holes is two, and the center lines of the two second ventilation holes are respectively located in the middle of the second placement area and at one end of the second placement area away from the air inlet on the housing.
3. The server according to claim 1, wherein a first printed circuit substrate and a second printed circuit substrate are further disposed in the housing, wherein the partition includes a first partition plate, a second partition plate, and a first printed circuit substrate disposed between the first partition plate and the air duct partition plate and connected to the first partition plate and the second partition plate, respectively, and the first printed circuit substrate extends into the second partition, a portion of the first printed circuit substrate located in the second partition forms the first partition plate, and the first vent hole is disposed in a portion of the first printed circuit substrate located in the second partition; the second partition panel includes check baffle and with the second printed circuit board that check baffle is connected, the second through-air vent sets up second printed circuit board.
4. The server according to any one of claims 1 to 3, further comprising an air duct partition plate arranged in the air outlet channel, wherein the air duct partition plate divides the air outlet channel into sub-channels correspondingly communicated with the sub-zones, and an air draft device is arranged in each sub-channel.
5. The server of claim 4, further comprising:
temperature detection means provided in each of the zones for detecting a temperature of the zone;
and the control device is respectively connected with each temperature detection device and the air draft equipment, and controls the air draft equipment in the sub-channel communicated with the sub-area where the temperature detection device is located to work according to the corresponding relation between the temperature detected by each temperature detection device and the set temperature threshold value.
6. The server according to claim 4, wherein the computing component is a memory card and/or a processor, and the input and output component is: hard disk, disk array, or PCIe card.
7. The server of claim 4, wherein the air extraction device is a fan.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410535917.1A CN104317368B (en) | 2014-10-11 | 2014-10-11 | A kind of server |
| PCT/CN2015/081080 WO2016054927A1 (en) | 2014-10-11 | 2015-06-09 | Server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410535917.1A CN104317368B (en) | 2014-10-11 | 2014-10-11 | A kind of server |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104317368A CN104317368A (en) | 2015-01-28 |
| CN104317368B true CN104317368B (en) | 2018-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410535917.1A Active CN104317368B (en) | 2014-10-11 | 2014-10-11 | A kind of server |
Country Status (2)
| Country | Link |
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| CN (1) | CN104317368B (en) |
| WO (1) | WO2016054927A1 (en) |
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| CN104317368B (en) * | 2014-10-11 | 2018-11-13 | 华为技术有限公司 | A kind of server |
| CN106376210A (en) * | 2015-07-22 | 2017-02-01 | 利思电气（上海）有限公司 | Heat dissipation apparatus for pole-mounted power active filtering apparatus |
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| CN105178823B (en) | 2015-08-31 | 2017-04-19 | 杭州华为数字技术有限公司 | Noise-reduction door |
| CN106339013A (en) * | 2016-08-31 | 2017-01-18 | 浪潮电子信息产业股份有限公司 | Temperature regulation-control method and system of data center machine room |
| CN107079608B (en) * | 2016-09-26 | 2019-06-11 | 深圳市大疆创新科技有限公司 | Radiator structure and unmanned plane with the radiator structure |
| CN109710040A (en) * | 2018-12-26 | 2019-05-03 | 王佩洁 | A kind of photoelectricity handover network server of remote controlled environment temperature |
| CN112312725A (en) * | 2019-07-29 | 2021-02-02 | 中兴通讯股份有限公司 | Communication equipment |
| CN112631392A (en) * | 2020-12-29 | 2021-04-09 | 成都前锋电子仪器有限责任公司 | Air draft type case |
| CN112631403A (en) * | 2020-12-29 | 2021-04-09 | 成都前锋电子仪器有限责任公司 | Air supply type case |
| CN112732043A (en) * | 2021-02-01 | 2021-04-30 | 范衍琴 | Computer system integrated equipment |
| CN113473797B (en) * | 2021-05-31 | 2023-07-14 | 山东英信计算机技术有限公司 | Server cabinet and multipath server thereof |
| CN113609063A (en) * | 2021-07-13 | 2021-11-05 | 深圳市国鑫恒运信息安全有限公司 | Server capable of achieving efficient heat dissipation |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2016054927A1 (en) | 2016-04-14 |
| CN104317368A (en) | 2015-01-28 |
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