CN203870550U - A computer case with improved partition cooling - Google Patents

A computer case with improved partition cooling Download PDF

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CN203870550U
CN203870550U CN201420281716.9U CN201420281716U CN203870550U CN 203870550 U CN203870550 U CN 203870550U CN 201420281716 U CN201420281716 U CN 201420281716U CN 203870550 U CN203870550 U CN 203870550U
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heat dissipation
power supply
cooling
hard disk
computer case
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黄从利
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Abstract

本实用新型公开了一种改进分区散热的电脑机箱,由顶板、前板、后板、左右侧板、底板和主机板构成,整体呈长方体状,其特征在于:主机板安装于箱体中部,并将箱体内部分隔成左右两个散热区,硬盘、光驱和电源安装于左散热区,显卡和CPU安装于右散热区;右散热区对应的前板、后板上设有散热孔,形成贯通前后的水平风道;左散热区内,电源布置于靠近后板的下部,硬盘布置于电源的上方,光驱则布置于靠近前板的下方,且左散热区对应的前板、后板的上部也设有散热孔,形成贯通前后的水平风道,这样的设计,散热通道布置合理、散热效果好、运行噪音小。

The utility model discloses a computer case with improved zone heat dissipation, which is composed of a top plate, a front plate, a rear plate, left and right side plates, a bottom plate and a mainboard, and is in a rectangular parallelepiped shape as a whole. The utility model is characterized in that: the mainboard is installed in the middle of the case body, and the interior of the case body is divided into two left and right heat dissipation zones, the hard disk, the optical drive and the power supply are installed in the left heat dissipation zone, and the graphics card and the CPU are installed in the right heat dissipation zone; the front plate and the rear plate corresponding to the right heat dissipation zone are provided with heat dissipation holes to form a horizontal air duct running through the front and back; in the left heat dissipation zone, the power supply is arranged at the lower part close to the rear plate, the hard disk is arranged above the power supply, and the optical drive is arranged at the lower part close to the front plate, and the upper parts of the front plate and the rear plate corresponding to the left heat dissipation zone are also provided with heat dissipation holes to form a horizontal air duct running through the front and back. With such a design, the heat dissipation channel is reasonably arranged, the heat dissipation effect is good, and the operating noise is small.

Description

一种改进分区散热的电脑机箱A computer case with improved partition cooling

技术领域 technical field

本实用新型涉及电脑设备的领域,特别是电脑主机箱体结构的改进。 The utility model relates to the field of computer equipment, in particular to the improvement of the structure of a computer mainframe box.

背景技术 Background technique

台式电脑一般配有机箱,机箱箱体用于安装光驱、硬盘、CPU、主机板、显卡、电源等配套部件。目前,电脑机箱主要分为传统电源下置机箱、普通ATX机箱和RTX(倒置38度)机箱,其中,传统下置电源机箱其布置是CPU设在显卡上方,只能使电源、显卡工作在自身发热状态,CPU主机板则集合了CPU和显卡的两部分发热量;此外,传统电源下置机箱由于CPU在上面而电源下面,这样装机时电源给CPU供电的4PIN或者8PIN线不够长,经销商要么用高端的电源(400W以上)要么买一个延长线,而且电线本身有一定抗阻,线越长抗阻越大,供电越容易不足;普通ATX机箱其布置是电源在最上方,CPU处于电源下方、显卡上方,只有显卡工作在自身发热状态, CPU则集合了CPU和显卡的两部分发热量,电源更集合了电源、CPU和显卡的三部分发热量。RTX(倒置38度)机箱显卡位于机箱顶部,CPU位于机箱中部,电源位于机箱底部,CPU、显卡和电源均独立散热,互补干扰;但CPU、显卡和电源三个部件的余热仍然容易相互干扰,尤其是干扰到光驱和硬盘的散热,核心部件未实现绝对的分区散热;散热结构设计的不合理是传统电脑机箱的不足。由于目前中高端电源、显卡和CPU风扇都选用智能温控风扇,在各部件发热量很大得不到及时排放时,随着局部温度升高,风扇便会提高转速,产生很大噪音甚至嚣叫声。因此,现有技术有待改进和提高。 Desktop computers are generally equipped with a chassis, and the chassis body is used to install optical drives, hard disks, CPUs, motherboards, graphics cards, power supplies and other supporting components. At present, computer cases are mainly divided into traditional power supply bottom chassis, common ATX chassis and RTX (inverted 38 degree) chassis, among them, the traditional bottom power supply chassis is arranged with the CPU above the graphics card, which can only make the power supply and graphics card work on its own. In the heat-generating state, the CPU motherboard integrates the heat generated by the two parts of the CPU and the graphics card; in addition, the traditional power supply is placed under the chassis because the CPU is on the top and the power supply is below, so the 4PIN or 8PIN cable from the power supply to the CPU is not long enough when the machine is installed. Either use a high-end power supply (above 400W) or buy an extension cable, and the cable itself has a certain resistance. The longer the cable, the greater the resistance, and the power supply is more likely to be insufficient; the layout of the ordinary ATX chassis is that the power supply is at the top, and the CPU is at the power supply. Below and above the graphics card, only the graphics card works in its own heating state, while the CPU integrates the heat generated by the two parts of the CPU and the graphics card, and the power supply integrates the three parts of the heat generated by the power supply, CPU, and graphics card. The RTX (inverted 38 degrees) chassis graphics card is located at the top of the chassis, the CPU is located in the middle of the chassis, and the power supply is located at the bottom of the chassis. The CPU, graphics card, and power supply are all independently dissipated and interfere with each other. In particular, it interferes with the heat dissipation of the optical drive and hard disk, and the core components have not achieved absolute partition heat dissipation; the unreasonable design of the heat dissipation structure is the deficiency of the traditional computer case. Since the current high-end power supply, graphics card and CPU fans all use intelligent temperature-controlled fans, when the heat generated by each component is too large to be discharged in time, as the local temperature rises, the fan will increase the speed, resulting in a lot of noise and even clamor. cry. Therefore, the prior art needs to be improved and improved.

实用新型内容 Utility model content

本实用新型的目的是克服上述已有技术的不足,提出一种散热布置合理、散热效果好、运行噪音小的改进分区散热的电脑机箱。 The purpose of the utility model is to overcome the deficiencies of the above-mentioned prior art, and propose a computer case with improved partition heat dissipation, which has reasonable heat dissipation arrangement, good heat dissipation effect and low operating noise.

本实用新型的目的是通过如下技术方案实现的:一种改进分区散热的电脑机箱,由顶板、前板、后板、左右侧板、底板和主机板构成,整体呈长方体状,其特征在于:主机板安装于箱体中部,并将箱体内部分隔成左右两个散热区,硬盘、光驱和电源安装于左散热区,显卡和CPU安装于右散热区;右散热区对应的前板、后板上设有散热孔,形成贯通前后的水平风道;左散热区内,电源布置于靠近后板的下部,硬盘布置于电源的上方,光驱则布置于靠近前板的下方,且左散热区对应的前板、后板的上部也设有散热孔,形成贯通前后的水平风道。进一步地,所述左散热区内电源安装位的上方设有硬盘安装架。所述左散热区内、前板的下方设有光驱安装架。所述右散热区对应的前板、后板的散热孔上安装有散热风扇。所述左散热区对应的前板、后板的散热孔上安装有散热风扇。 The purpose of this utility model is achieved through the following technical solutions: a computer case with improved partition heat dissipation, which is composed of a top board, a front board, a rear board, left and right side boards, a bottom board and a main board, and is in the shape of a cuboid as a whole, and is characterized in that: The main board is installed in the middle of the cabinet, and divides the inside of the cabinet into two heat dissipation areas, the left and right heat dissipation areas. The hard disk, optical drive and power supply are installed in the left heat dissipation area, and the graphics card and CPU are installed in the right heat dissipation area; There are cooling holes on the board to form a horizontal air duct running through the front and back; in the left cooling area, the power supply is arranged at the lower part near the rear board, the hard disk is arranged above the power supply, and the optical drive is arranged at the bottom near the front board, and the left cooling area The upper parts of the corresponding front plate and rear plate are also provided with cooling holes to form a horizontal air duct running through the front and back. Further, a hard disk installation frame is arranged above the power supply installation position in the left cooling area. An optical drive installation frame is arranged in the left cooling area and below the front plate. A heat dissipation fan is installed on the heat dissipation holes of the front plate and the rear plate corresponding to the right heat dissipation area. Cooling fans are installed on the cooling holes of the front plate and the rear plate corresponding to the left cooling area.

这样的设计,将发热量较大的两个部件CPU和显卡布置在一个独立的安装空间——右散热区,通过机箱前板、后板各安装12CM风扇形成水平风道直接将发热量大的两个部件的热量排出机箱箱体外,由于有主机板的隔开,余热不会干涉到硬盘、光驱和电源。而发热量较小的电源、硬盘和光驱布置在另外一个空间——左散热区,电源和光驱在下部,硬盘在上部,电源的热量直接从侧板进、后板出,光驱的散发的热量在一个相对独立的空间,而硬盘在电源的上方,受到电源余热的影响较小,同时前板和后板均可安装8CM风扇,形成水平风道,可以加速余热的排放和为硬盘散热。 With this design, the CPU and the graphics card, which generate large amounts of heat, are arranged in an independent installation space—the right heat dissipation area, and 12CM fans are installed on the front and rear panels of the chassis to form horizontal air ducts to directly dissipate the heat-generating components. The heat of the two components is exhausted from the case body. Due to the separation of the motherboard, the residual heat will not interfere with the hard disk, optical drive and power supply. The power supply, hard disk and optical drive with less heat generation are arranged in another space - the left heat dissipation area, the power supply and optical drive are in the lower part, and the hard disk is in the upper part. In a relatively independent space, and the hard disk is above the power supply, it is less affected by the waste heat of the power supply. At the same time, 8cm fans can be installed on the front and rear panels to form a horizontal air duct, which can accelerate the discharge of waste heat and dissipate heat for the hard disk.

本实用新型具有以下优点:1、主机板将机箱分隔为两个独立的散热空间;CPU和显卡设在一个独立的空间,显卡和CPU散出的热量不再影响电源、光驱和硬盘等部件;而光驱、电源和硬盘在另一个独立的散热空间;实现了核心部件的分区散热。2、两个散热区均可实现水平散热风道,在各部件发热量能得到及时排放,各部分热量冗余比较小,尤其是对于目前各大配件均使用温控风扇(温控风扇的特点是散热好转速低,噪音小),降低了风扇的转速,减少了噪音。3、在分区散热的情况下未提高其它配件的配置要求,甚至缩短了各部件对电源输出线材长度的需求。 The utility model has the following advantages: 1. The mainboard divides the chassis into two independent heat dissipation spaces; the CPU and the graphics card are located in an independent space, and the heat emitted by the graphics card and the CPU no longer affects components such as power supply, optical drive and hard disk; The optical drive, power supply and hard disk are in another independent heat dissipation space; realizing partition heat dissipation of core components. 2. Both heat dissipation areas can realize horizontal heat dissipation air ducts, and the heat generated by each component can be discharged in time, and the heat redundancy of each part is relatively small, especially for the current major accessories that use temperature-controlled fans (the characteristics of temperature-controlled fans It is good heat dissipation, low speed and low noise), which reduces the speed of the fan and reduces the noise. 3. In the case of partitioned heat dissipation, the configuration requirements of other accessories are not increased, and even the requirements for the length of power output wires of each component are shortened.

附图说明 Description of drawings

图1是本实用新型的立体安装示意图。 Fig. 1 is a three-dimensional installation diagram of the utility model.

图2是本实用新型的立体分拆示意图。 Fig. 2 is a three-dimensional disassembly schematic diagram of the utility model.

图3是本实用新型右侧立体示意图。 Fig. 3 is a perspective view of the right side of the utility model.

图4是本实用新型左侧立体示意图。 Fig. 4 is a perspective view of the left side of the utility model.

附图标记说明:1.前板  2.后板  3.顶板  4.底板  5.主机板  6. 右散热区  7.左散热区  8.电源安装位  9.硬盘安装架  10.光驱安装架  11.散热孔(12CM风扇安装位)  12. 散热孔(8CM风扇安装位)  14.左侧板  15.右侧板  16.光驱  17.硬盘  18.硬盘  19.电源。 Explanation of reference signs: 1. Front panel 2. Rear panel 3. Top panel 4. Bottom panel 5. Motherboard 6. Right heat dissipation area 7. Left heat dissipation area 8. Power supply installation position 9. Hard disk installation frame 10. Optical drive installation frame 11. Cooling hole (12CM fan installation position) 12. Cooling hole (8CM fan installation position) 14. Left side panel 15. Right side panel 16. Optical drive 17. Hard disk 18. Hard disk 19. Power supply.

具体实施方式 Detailed ways

参见图1-图4,本实施例的电脑机箱,由前板1,后板2,底板4,顶板3、左侧板14、右侧板15和主机板5构成,箱体整体呈长方体状,箱体内分隔成两个独立的散热分区——左散热区7和右散热区6(如图3和图4所示),右散热区6容纳显卡和CPU,左散热区7容纳电源19、3.5寸硬盘17、2.5寸硬盘18和光驱16。 Referring to Fig. 1-Fig. 4, the computer case of the present embodiment is made of front plate 1, rear plate 2, base plate 4, top plate 3, left side plate 14, right side plate 15 and mainboard 5, and the box body is rectangular parallelepiped as a whole , the box is divided into two independent heat dissipation zones - left heat dissipation zone 7 and right heat dissipation zone 6 (as shown in Figure 3 and Figure 4), the right heat dissipation zone 6 accommodates the graphics card and CPU, and the left heat dissipation zone 7 accommodates the power supply 19, 17 3.5-inch hard drives, 18 2.5-inch hard drives and 16 optical drives.

其中,在右散热区6中,主机板5上开有六个安装穿线孔,显卡位于CPU下方(图中未画出),在右散热区6对应的前板1上设有两组散热孔11,分别位于前板1的上部和下部,用于安装12CM风扇风扇和水冷;在右散热区6对应后板2靠上位置有也设有散热孔,用于安装8CM风扇,这样,右散热区6内,在前板1和后板2之间形成贯通前后的水平风道。 Among them, in the right heat dissipation area 6, there are six installation threading holes on the motherboard 5, the graphics card is located below the CPU (not shown in the figure), and two groups of heat dissipation holes are provided on the front plate 1 corresponding to the right heat dissipation area 6 11. Located on the upper and lower parts of the front panel 1 respectively, it is used to install a 12CM fan and water cooling; in the right cooling area 6 corresponding to the upper part of the rear panel 2, there are also cooling holes for installing an 8CM fan, so that the right cooling In the zone 6, a horizontal air duct passing through the front and back is formed between the front panel 1 and the rear panel 2.

在左散热区7中,电源19放置于下部的电源安装位8,其位于底板4靠近后板2下部的位置,硬盘安装架9设在电源安装位8的正上方,硬盘安装架9内可安装3.5寸硬盘17和2.5寸硬盘18,在左散热区7对应后板2的上部、与硬盘安架9对应的位置设有散热孔12,用于安装8CM风扇,光驱安装架10位于底板4和前板1的结合部位,光驱16装于光驱安装架10上,光驱安装架10上方的前板1也设有散热孔,该散热孔也用于安装一个8CM风扇,且与后板2的散热孔12形成贯通前后的水平风道。 In the left heat dissipating area 7, the power supply 19 is placed in the power supply installation position 8 of the lower part, which is located at the position of the base plate 4 close to the bottom of the rear plate 2, and the hard disk installation frame 9 is located directly above the power supply installation position 8, and the hard disk installation frame 9 can be Install a 3.5-inch hard disk 17 and a 2.5-inch hard disk 18. A heat dissipation hole 12 is provided on the left cooling area 7 corresponding to the upper part of the rear plate 2 and at a position corresponding to the hard disk mounting bracket 9 for installing an 8CM fan. The optical drive mounting bracket 10 is located on the bottom plate 4 At the junction with the front panel 1, the optical drive 16 is installed on the optical drive installation frame 10, and the front panel 1 above the optical drive installation frame 10 is also provided with cooling holes, which are also used to install an 8CM fan, and are connected to the The cooling holes 12 form a horizontal air passage running through the front and back.

这样,箱体内左右两个散热区均形成有贯通前后的水平风道。 In this way, the left and right heat dissipation areas in the box are formed with horizontal air ducts running through the front and back.

具体地,发热量较大的CPU和显卡(图中未画出)被主机板5分隔在一个独立的空间散热,可以通过前板1和后板2的散热孔及风扇,前进后出地,把显卡和CPU产生的热量快速排出机箱外,保障CPU和显卡的热量第一时间排出,从而不会形成热量堆积,不会影响其它部件。硬盘17、18和光驱16和电源19被主机板5隔开在另外一个独立的散热空间,电源19由左侧板14的通孔吸进冷风,通过后板2上部的风扇排出热风,热量直接排出。光驱16的余热,根据空气上升原理上到顶板3位置,被前板1和后板2上的两个8CM风扇形成的前进后出的贯通风道散发掉,同时前进后出的8CM风扇直接对着硬盘17、18,加速了硬盘17、18的散热。各部件由于位置比较靠近,大大缩短了电源输出线材的要求,虽然改变的安装的位置,但对各部件无特殊要求。因此将会操作起来更方便、更快捷。机箱为电源19、CPU、显卡都提供了独立分区的散热风道和空间,各部分热量冗余比较小,散热风扇都处于低速运转状态,所以整机静音效果也十分明显。 Specifically, the CPU and the graphics card (not shown in the figure) that generate a large amount of heat are separated by the main board 5 in an independent space for heat dissipation, and can pass through the cooling holes and fans of the front board 1 and the rear board 2, and then go forward and back out of the ground. The heat generated by the graphics card and CPU is quickly discharged out of the chassis, ensuring that the heat of the CPU and graphics card is discharged in the first place, so that heat accumulation will not form and other components will not be affected. Hard disks 17, 18, optical drive 16 and power supply 19 are separated in another independent heat dissipation space by motherboard 5. Power supply 19 sucks cold air through the through hole of left side plate 14, and discharges hot air through the fan on the top of rear plate 2. The heat is directly discharge. The residual heat of the optical drive 16, according to the principle of air rising, reaches the position of the top plate 3, and is dissipated by the forward-backward air duct formed by the two 8CM fans on the front plate 1 and the rear plate 2. At the same time, the forward-backward 8CM fan directly The hard disk 17,18 accelerates the heat dissipation of the hard disk 17,18. Due to the relatively close location of each component, the requirements for the output wire of the power supply are greatly shortened. Although the installation position is changed, there is no special requirement for each component. Therefore, it will be more convenient and faster to operate. The chassis provides independent cooling air ducts and spaces for the power supply 19, CPU, and graphics card. The thermal redundancy of each part is relatively small, and the cooling fans are all running at low speeds, so the mute effect of the whole machine is also very obvious.

当然,这里仅列举了一种较佳的实施方式,其它等同、类同的构造均应属于本专利的保护范畴,这里不再赘述。 Of course, only one preferred implementation mode is listed here, and other equivalent and similar structures should belong to the scope of protection of this patent, and will not be repeated here.

Claims (5)

1.一种改进分区散热的电脑机箱,由顶板、前板、后板、左右侧板、底板和主机板构成,整体呈长方体状,其特征在于:主机板安装于箱体中部,并将箱体内部分隔成左右两个散热区,硬盘、光驱和电源安装于左散热区,显卡和CPU安装于右散热区;右散热区对应的前板、后板上设有散热孔,形成贯通前后的水平风道;左散热区内,电源布置于靠近后板的下部,硬盘布置于电源的上方,光驱则布置于靠近前板的下方,且左散热区对应的前板、后板的上部也设有散热孔,形成贯通前后的水平风道。 1. A computer case with improved partition heat dissipation, which is composed of a top board, a front board, a rear board, left and right side boards, a bottom board and a main board, and is in the shape of a cuboid as a whole. The interior of the body is divided into two heat dissipation areas: the left and right heat dissipation areas. The hard disk, optical drive and power supply are installed in the left heat dissipation area, and the graphics card and CPU are installed in the right heat dissipation area; Horizontal air duct; in the left heat dissipation area, the power supply is arranged at the lower part close to the rear panel, the hard disk is arranged above the power supply, and the optical drive is arranged at the lower part of the front panel, and the left heat dissipation area corresponds to the front panel and the upper part of the rear panel. There are cooling holes to form a horizontal air duct running through the front and back. 2.根据权利要求1所述的电脑机箱,其特征是所述左散热区内电源安装位的上方设有硬盘安装架。 2. The computer case according to claim 1, wherein a hard disk installation frame is arranged above the power supply installation position in the left cooling area. 3.根据权利要求1所述的电脑机箱,其特征是所述左散热区内、前板的下方设有光驱安装架。 3 . The computer case according to claim 1 , wherein an optical drive installation frame is arranged in the left cooling area and below the front panel. 4 . 4.根据权利要求1所述的电脑机箱,其特征是所述右散热区对应的前板、后板的散热孔上安装有散热风扇。 4 . The computer case according to claim 1 , wherein cooling fans are installed on the cooling holes of the front panel and the rear panel corresponding to the right cooling zone. 5.根据权利要求2或3或4所述的电脑机箱,其特征是所述左散热区对应的前板、后板的散热孔上安装有散热风扇。 5. The computer case according to claim 2, 3 or 4, characterized in that cooling fans are installed on the cooling holes of the front panel and the rear panel corresponding to the left cooling zone.
CN201420281716.9U 2014-05-29 2014-05-29 A computer case with improved partition cooling Expired - Fee Related CN203870550U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105373198A (en) * 2015-12-01 2016-03-02 武汉御龙尊者科技有限公司 Starship concept computer host
WO2016054927A1 (en) * 2014-10-11 2016-04-14 华为技术有限公司 Server
CN106445014A (en) * 2016-10-18 2017-02-22 郑州航空工业管理学院 Cooling device of mathematical computer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016054927A1 (en) * 2014-10-11 2016-04-14 华为技术有限公司 Server
CN105373198A (en) * 2015-12-01 2016-03-02 武汉御龙尊者科技有限公司 Starship concept computer host
CN106445014A (en) * 2016-10-18 2017-02-22 郑州航空工业管理学院 Cooling device of mathematical computer

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