CN202383577U - Improved computer case - Google Patents

Improved computer case Download PDF

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Publication number
CN202383577U
CN202383577U CN201120415674XU CN201120415674U CN202383577U CN 202383577 U CN202383577 U CN 202383577U CN 201120415674X U CN201120415674X U CN 201120415674XU CN 201120415674 U CN201120415674 U CN 201120415674U CN 202383577 U CN202383577 U CN 202383577U
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installation area
installing zone
heat dissipation
power supply
motherboard
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CN201120415674XU
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黄从利
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Abstract

The utility model discloses an improved computer case, which consists of an upper cover, a front plate, a rear plate, side plates and a bottom plate, wherein the interior of the case body is divided into installation areas for respectively installing a hard disk, a display card, a CPU host board, a power supply and various hardware, the host board installation area is arranged in the middle of the case body, the display card installation area is arranged above the host board installation area, the power supply installation area is arranged below the host board installation area, the upper cover corresponding to the display card installation area is provided with heat dissipation holes, the bottom plate corresponding to the power supply installation area is provided with latticed heat dissipation holes, and the latticed heat dissipation holes on the bottom plate and the heat dissipation holes on the; the hard disk installation area is arranged in front of the mainboard installation area, the front plate corresponding to the hard disk installation area is provided with an air inlet, the rear plate corresponding to the mainboard installation area is provided with latticed heat dissipation holes, the air inlet of the front plate and the latticed heat dissipation holes on the rear plate form a horizontal heat dissipation air channel, and by the design, the heat dissipation channel is reasonable in arrangement, good in heat dissipation effect and low in operation noise.

Description

一种改进的电脑机箱An improved computer case

技术领域 technical field

本实用新型涉及电脑设备的领域,特别是电脑主机箱箱体结构的改进。The utility model relates to the field of computer equipment, in particular to the improvement of the box body structure of a main computer box.

背景技术 Background technique

台式电脑一般配有机箱,机箱箱体用于安装光驱、硬盘、CPU主机板、显卡、电源等配套部件。目前,电脑机箱主要分为传统电源下置机箱和普通ATX机箱,其中,传统下置电源机箱其布置是CPU设在显卡上方,只能使电源、显卡工作在自身发热状态,CPU主机板则集合了CPU和显卡的两部分发热量;此外,传统电源下置机箱由于CPU在上面而电源下面,这样装机时电源给CPU供电的4PIN或者8PIN线不够长,经销商要么用高端的电源(400W以上)要么买一个延长线,而且电线本身有一定抗阻,线越长抗阻越大,供电越容易不足;普通ATX机箱其布置是电源在最上方,CPU处于电源下方、显卡上方,只有显卡工作在自身发热状态,CPU则集合了CPU和显卡的两部分发热量,电源更集合了电源、CPU和显卡的三部分发热量。散热结构设计的不合理是传统电脑机箱的不足。由于目前中高端电源、显卡和CPU风扇都选用智能温控风扇,在各部件发热量很大得不到及时排放时,随着局部温度升高,风扇便会提高转速,产生很大噪音甚至嚣叫声。Desktop computers are generally equipped with a chassis, and the chassis body is used to install optical drives, hard disks, CPU motherboards, graphics cards, power supplies and other supporting components. At present, computer cases are mainly divided into traditional power supply chassis and ordinary ATX chassis. Among them, the layout of the traditional bottom power supply chassis is that the CPU is placed above the graphics card, so that the power supply and graphics card can only work in a state of self-heating, and the CPU motherboard is integrated. In addition, the traditional power supply is placed under the chassis because the CPU is on the top and the power supply is below, so the 4PIN or 8PIN cable that the power supply supplies power to the CPU is not long enough when the machine is installed, and the dealer must use a high-end power supply (above 400W ) or buy an extension cable, and the cable itself has a certain resistance, the longer the cable, the greater the resistance, and the power supply is more likely to be insufficient; the layout of the ordinary ATX case is that the power supply is at the top, the CPU is below the power supply, and the graphics card is above, and only the graphics card works In the self-heating state, the CPU combines the two parts of the heat generated by the CPU and the graphics card, and the power supply further integrates the three parts of the heat generated by the power supply, the CPU and the graphics card. The unreasonable heat dissipation structure design is the deficiency of the traditional computer case. Since the current high-end power supply, graphics card and CPU fans all use intelligent temperature-controlled fans, when the heat generated by each component is too large to be discharged in time, as the local temperature rises, the fan will increase the speed, resulting in a lot of noise and even clamor. cry.

实用新型内容 Utility model content

本实用新型的目的是克服上述已有技术的不足,提出一种散热布置合理、散热效果好、运行噪音小的改进的电脑机箱。The purpose of this utility model is to overcome the shortcomings of the above-mentioned prior art, and propose an improved computer case with reasonable heat dissipation arrangement, good heat dissipation effect and low running noise.

本实用新型的目的是通过如下技术方案实现的:一种改进的电脑机箱,由上盖、前板、后板、侧板和底板构成,整体呈长方体状,箱体内分隔成分别安装硬盘、显卡、CPU主机板、电源及各种硬件的安装区,其特征在于:主机板安装区设置于箱体中部,显卡安装区设于主机板安装区上方,电源安装区设置于主机板安装区下方,对应显卡安装区的上盖上设有散热孔,对应电源安装区的底板上设有网格状散热孔,所述的底板上的网格状散热孔与所述的上盖散热孔由下而上形成垂直散热风道;硬盘安装区设置于主机板安装区的前方,对应硬盘安装区的前板上设有进风口,对应主机板安装的后板上设有网格状散热孔,所述前板的进风口与所述后板上的网格状散热孔形成水平散热风道。进一步地,所述的后板上的网格状散热孔上装后板散热风扇,所述的前板的进风口上装前板散热风扇。而主机板安装区上的CPU主机板是采用倒置安装的,与下方的电源短距离连接。The purpose of this utility model is achieved through the following technical solutions: an improved computer case, which is composed of an upper cover, a front panel, a rear panel, a side panel and a bottom panel, the whole is in the shape of a cuboid, and the box is divided into separate parts for installing hard disks and graphics cards. , CPU motherboard, power supply and various hardware installation areas, characterized in that: the motherboard installation area is set in the middle of the cabinet, the graphics card installation area is set above the main board installation area, and the power supply installation area is set below the main board installation area, The upper cover corresponding to the graphics card installation area is provided with cooling holes, and the bottom plate corresponding to the power supply installation area is provided with grid-shaped cooling holes. A vertical cooling air duct is formed on the top; the hard disk installation area is set in front of the motherboard installation area, the front panel corresponding to the hard disk installation area is provided with air inlets, and the rear panel corresponding to the motherboard installation is provided with grid-shaped cooling holes. The air inlet on the front plate and the grid-shaped cooling holes on the rear plate form a horizontal cooling air duct. Further, the grid-shaped cooling holes on the rear panel are equipped with a cooling fan of the rear panel, and the air inlets of the front panel are equipped with a cooling fan of the front panel. The CPU motherboard on the motherboard installation area is installed upside down and connected to the power supply below in a short distance.

本实用新型具有以下优点:1、由于CPU和电源设在显卡的下面,显卡散热的热量不再影响CPU和电源等部件。2、具有水平和垂直两种快速散热风道,在各部件发热量能得到及时排放,各部分热量冗余比较小。3、风扇都处于低速运转状态,特别是CPU由于不受别的热量干扰,CPU风扇基本可以保持待机状态工作,所以整机静音效果十分明显,可以让电脑的噪音维持在待机状态。The utility model has the following advantages: 1. Since the CPU and the power supply are arranged under the graphics card, the heat dissipated by the graphics card no longer affects components such as the CPU and the power supply. 2. It has two kinds of fast cooling air ducts, horizontal and vertical, and the heat generated by each component can be discharged in time, and the heat redundancy of each part is relatively small. 3. The fans are running at a low speed, especially because the CPU is not disturbed by other heat, the CPU fan can basically keep working in the standby state, so the mute effect of the whole machine is very obvious, which can keep the noise of the computer in the standby state.

附图说明 Description of drawings

图1是本实用新型箱体的立体示意图;Fig. 1 is the three-dimensional schematic diagram of the utility model casing;

图2是本实用新型安装各部件的主视示意图;Fig. 2 is a schematic diagram of the front view of the installation of each component of the utility model;

图3是图2的左视示意图。FIG. 3 is a schematic left view of FIG. 2 .

具体实施方式 Detailed ways

参见图1-图3,本实施例的电脑机箱,由上盖1、前板5、后板8、侧板6和底板9构成,整体呈长方体状,箱体内分隔成分别安装硬盘、显卡、CPU主机板、电源及各种硬件的安装区。其中,硬盘安装区3设置于箱体前部、前板5后方,显卡安装区2设于箱体后部上方,主机板安装区4设置于箱体中后部、显卡安装区2的下方,并与硬盘安装区3处于同一水平方向,电源安装区7设置于主机板安装区4下方、箱体底板9上且邻近后板8。此外,箱体的各面上均设有散热孔,上盖1上对应显卡安装区2的位置设有散热孔11,底板9上对应电源安装区7的位置设有网格状散热孔91,前板5对应对应硬盘安装区的位置上设有进风口51,进风口51用于安装前板散热风扇,后板8对应主机板安装区4的位置上设有网格状散热孔81,网格状散热孔81上安装后板散热风扇,两侧的侧板6上也设有网格状散热孔。这样,所述前板的进风口51与所述后板上的网格状散热孔81形成由前往后方向的水平散热风道(如图2中横向箭头所示);所述的底板9上的网格状散热孔91与所述上盖1的散热孔11形成由下而上形成垂直散热风道(如图2中纵向箭头所示)。当然,实际安装时,显卡也可直接安装于CPU主机板上,显卡依然处于CPU主机板最上部。Referring to Fig. 1-Fig. 3, the computer case of the present embodiment is made of loam cake 1, front plate 5, rear plate 8, side plate 6 and bottom plate 9, and the whole is rectangular parallelepiped shape, is divided into and installs respectively hard disk, graphics card, The installation area for CPU motherboard, power supply and various hardware. Wherein, the hard disk installation area 3 is arranged at the front of the cabinet and behind the front panel 5, the graphics card installation area 2 is arranged at the top of the rear of the cabinet, and the motherboard installation area 4 is arranged at the middle rear of the cabinet and below the graphics card installation area 2, And in the same horizontal direction as the hard disk installation area 3 , the power supply installation area 7 is arranged below the motherboard installation area 4 , on the box bottom plate 9 and adjacent to the rear plate 8 . In addition, heat dissipation holes are provided on each surface of the box body, heat dissipation holes 11 are provided on the upper cover 1 corresponding to the graphics card installation area 2, and grid-like heat dissipation holes 91 are provided on the bottom plate 9 corresponding to the power supply installation area 7. The front board 5 is provided with an air inlet 51 corresponding to the hard disk installation area, and the air inlet 51 is used to install the front board cooling fan. A rear plate cooling fan is installed on the grid-like cooling holes 81, and grid-like cooling holes are also arranged on the side plates 6 on both sides. In this way, the air inlet 51 of the front plate and the grid-shaped heat dissipation holes 81 on the rear plate form a horizontal heat dissipation air duct (as shown by the horizontal arrow in Figure 2 ) from the front to the rear; on the bottom plate 9 The grid-shaped cooling holes 91 and the cooling holes 11 of the upper cover 1 form a vertical cooling air duct from bottom to top (as shown by the vertical arrow in FIG. 2 ). Of course, during actual installation, the graphics card can also be directly installed on the CPU motherboard, and the graphics card is still at the top of the CPU motherboard.

具体地,1.显卡上置垂置风道快速散热:发热量大的显卡安装在机箱的上部,所散热发出来的热空气自然上升,通过垂直风道迅速排放到机箱上盖外面,这样能够加快显卡本身的散热,也能保障机器里的热量第一时间排出从而不形成热量堆积:另外由于CPU和电源在显卡下面,显卡散热的热量不再影响CPU和电源等部件。2.硬盘、CPU水平风道快速散热:前板散热风扇进冷风可以迅速的降低硬盘温度,硬盘、CPU所产生热量可以迅速通过后板散热风扇与侧板风扇排出,从而降低机器温度。3.主机板安装区4上的CPU主机板是采用倒置安装的,与下方的电源短距离连接,主机板的4PIN或者8PIN接头靠近电源,这样就不会因为机箱本身而去挑剔电源了,倒置安装后,主机板接口针脚被置于上部,9个背部走线孔,7mm外冲侧板,留有更大的空间,没有过多的空间限制,因此将会操作起来更方便、更快捷。4.机箱为电源、CPU、显卡都提供了独立的散热风道,各部分热量冗余比较小,散热风扇都处于低速运转状态,特别是CPU由于不受别的热量干扰,CPU风扇基本可以保持待机状态工作,所以整机静音效果十分明显。Specifically, 1. A vertical air duct is installed on the graphics card for rapid cooling: the graphics card with high heat generation is installed on the upper part of the chassis, and the hot air emitted by the heat dissipation naturally rises and is quickly discharged to the outside of the chassis cover through the vertical air duct, which can Speeding up the heat dissipation of the graphics card itself can also ensure that the heat in the machine is discharged immediately so as not to form heat accumulation: in addition, since the CPU and power supply are under the graphics card, the heat dissipated by the graphics card will no longer affect components such as the CPU and power supply. 2. Fast cooling of hard disk and CPU horizontal air duct: the cooling fan on the front panel can quickly reduce the temperature of the hard disk, and the heat generated by the hard disk and CPU can be quickly discharged through the cooling fan on the rear panel and the side panel fan, thereby reducing the temperature of the machine. 3. The CPU main board on the main board installation area 4 is installed upside down, and it is connected to the power supply below in a short distance. The 4PIN or 8PIN connector of the main board is close to the power supply, so that the power supply will not be picky because of the chassis itself. After installation, the motherboard interface pins are placed on the upper part, with 9 rear wiring holes, and 7mm outer punching side panels, leaving more space without too much space restriction, so it will be more convenient and faster to operate. 4. The chassis provides independent heat dissipation air ducts for the power supply, CPU, and graphics card. The heat redundancy of each part is relatively small, and the heat dissipation fans are all in a low-speed operating state. Especially since the CPU is not disturbed by other heat, the CPU fan can basically maintain It works in standby mode, so the mute effect of the whole machine is very obvious.

当然,这里仅列举了一种较佳的实施方式,其它等同、类同的构造均应属于本专利的保护范畴,这里不再赘述。Of course, only one preferred implementation mode is listed here, and other equivalent and similar structures should belong to the scope of protection of this patent, and will not be repeated here.

Claims (3)

1. improved computer housing; Be made up of loam cake, header board, back plate, side plate and base plate, it is rectangular-shaped that integral body is, and is separated into the installing zone that hard disk, video card, CPU motherboard, power supply and various hardware are installed respectively in the casing; It is characterized in that: the motherboard installing zone is arranged at the casing middle part; The video card installing zone is located at motherboard installing zone top, and the power supply installing zone is arranged at motherboard installing zone below, covers on the corresponding video card installing zone and is provided with louvre; The base plate of corresponding power installing zone is provided with latticed louvre, and the latticed louvre on the described base plate from bottom to top forms vertical heat dissipation wind channel with described loam cake louvre; The hard disk installing zone is arranged at the place ahead of motherboard installing zone; The header board of corresponding hard disk installing zone is provided with air inlet; The back plate of respective hosts plate installing zone is provided with latticed louvre, and the latticed louvre on the air inlet of said header board and the said back plate forms horizontal heat dissipation wind channel.
2. computer housing according to claim 1 is characterized in that dress back plate radiator fan on the latticed louvre on the plate of described back, dress header board radiator fan on the air inlet of described header board.
3. computer housing according to claim 1 and 2 is characterized in that the CPU motherboard on the motherboard installing zone is to adopt to be inverted to install, and is connected with the power supply short distance of below.
CN201120415674XU 2011-10-17 2011-10-17 Improved computer case Expired - Fee Related CN202383577U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105517414A (en) * 2015-12-09 2016-04-20 浪潮电子信息产业股份有限公司 Heat dissipation method of high-power element
CN114340326A (en) * 2021-12-17 2022-04-12 广东芬尼克兹节能设备有限公司 Electric cabinet suitable for multi-system layout installation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105517414A (en) * 2015-12-09 2016-04-20 浪潮电子信息产业股份有限公司 Heat dissipation method of high-power element
CN114340326A (en) * 2021-12-17 2022-04-12 广东芬尼克兹节能设备有限公司 Electric cabinet suitable for multi-system layout installation

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Granted publication date: 20120815

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