CN104282822B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN104282822B
CN104282822B CN201410309412.3A CN201410309412A CN104282822B CN 104282822 B CN104282822 B CN 104282822B CN 201410309412 A CN201410309412 A CN 201410309412A CN 104282822 B CN104282822 B CN 104282822B
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CN
China
Prior art keywords
light
emitting device
bonding agent
groove portion
wavelength
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CN201410309412.3A
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English (en)
Chinese (zh)
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CN104282822A (zh
Inventor
大黑弘树
山田元量
藤川康夫
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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Publication of CN104282822A publication Critical patent/CN104282822A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201410309412.3A 2013-07-01 2014-07-01 发光装置 Active CN104282822B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-137693 2013-07-01
JP2013137693A JP6255747B2 (ja) 2013-07-01 2013-07-01 発光装置

Publications (2)

Publication Number Publication Date
CN104282822A CN104282822A (zh) 2015-01-14
CN104282822B true CN104282822B (zh) 2018-09-11

Family

ID=50982843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410309412.3A Active CN104282822B (zh) 2013-07-01 2014-07-01 发光装置

Country Status (4)

Country Link
US (1) US9231177B2 (https=)
EP (1) EP2822046B1 (https=)
JP (1) JP6255747B2 (https=)
CN (1) CN104282822B (https=)

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KR20160087048A (ko) * 2015-01-12 2016-07-21 삼성전자주식회사 발광다이오드 패키지
JP6543998B2 (ja) * 2015-03-30 2019-07-17 大日本印刷株式会社 Ｌｅｄバックライト及びそれを用いたｌｅｄ表示装置
JP6558034B2 (ja) * 2015-04-03 2019-08-14 大日本印刷株式会社 Ｌｅｄ素子用のフレキシブル多層回路基板及びそれを用いたｌｅｄドットマトリックス表示装置
JP6556009B2 (ja) * 2015-09-30 2019-08-07 大日本印刷株式会社 発光素子用基板、モジュール及び発光素子用基板の製造方法
JP6572083B2 (ja) * 2015-09-30 2019-09-04 大日本印刷株式会社 発光素子用基板、モジュール及び発光素子用基板の製造方法
US10199545B2 (en) 2015-09-30 2019-02-05 Dai Nippon Printing Co., Ltd. Substrate for light emitting element and module
JP6451579B2 (ja) 2015-09-30 2019-01-16 日亜化学工業株式会社 発光装置
JP6918452B2 (ja) * 2015-09-30 2021-08-11 大日本印刷株式会社 発光素子用基板及びモジュール
WO2017061127A1 (en) 2015-10-08 2017-04-13 Nichia Corporation Light-emitting device, integrated light-emitting device, and light-emitting module
JP6524904B2 (ja) 2015-12-22 2019-06-05 日亜化学工業株式会社 発光装置
JP6776855B2 (ja) 2016-12-06 2020-10-28 日亜化学工業株式会社 発光装置
JP6868388B2 (ja) 2016-12-26 2021-05-12 日亜化学工業株式会社 発光装置および集積型発光装置
JP7277815B2 (ja) * 2017-06-13 2023-05-19 日亜化学工業株式会社 発光装置の製造方法および発光装置
KR102473399B1 (ko) * 2017-06-26 2022-12-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
KR102401826B1 (ko) * 2017-09-15 2022-05-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 이를 포함하는 조명장치
JP7064127B2 (ja) 2017-09-29 2022-05-10 日亜化学工業株式会社 発光装置およびその製造方法
US11594662B2 (en) * 2019-07-31 2023-02-28 Nichia Corporation Light-emitting device
JP7021447B2 (ja) * 2020-10-05 2022-02-17 日亜化学工業株式会社 発光装置
US20240186468A1 (en) * 2022-10-19 2024-06-06 Seoul Viosys Co., Ltd. Light emitting diode package

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JP3864862B2 (ja) * 2002-04-04 2007-01-10 セイコーエプソン株式会社 電気光学装置及び電子機器
WO2004081140A1 (ja) 2003-03-13 2004-09-23 Nichia Corporation 発光膜、発光装置、発光膜の製造方法および発光装置の製造方法
JP4505794B2 (ja) * 2004-03-10 2010-07-21 信越半導体株式会社 発光素子の製造方法
US20050247944A1 (en) * 2004-05-05 2005-11-10 Haque Ashim S Semiconductor light emitting device with flexible substrate
KR100624307B1 (ko) * 2005-02-23 2006-09-19 제일모직주식회사 표시장치용 저반사율의 휘도 향상 다층 광학필름 및 이를이용한 유기발광다이오드 표시장치
JP4049186B2 (ja) * 2006-01-26 2008-02-20 ソニー株式会社 光源装置
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US20070285740A1 (en) * 2006-05-02 2007-12-13 Rohm Co., Ltd. Image sensor module
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JP4107349B2 (ja) 2007-06-20 2008-06-25 ソニー株式会社 光源装置、表示装置
JP2010109119A (ja) 2008-10-30 2010-05-13 Sanyo Electric Co Ltd 発光モジュール及びその製造方法
KR20120123242A (ko) * 2009-06-26 2012-11-08 가부시키가이샤 아사히 러버 백색 반사재 및 그 제조방법
EP3547380B1 (en) * 2010-02-09 2023-12-20 Nichia Corporation Light emitting device
JP2011233650A (ja) * 2010-04-26 2011-11-17 Toshiba Corp 半導体発光装置
JP2012044102A (ja) * 2010-08-23 2012-03-01 Hitachi Cable Ltd 発光装置及びその製造方法並びに配線基板
JP5772007B2 (ja) * 2011-01-24 2015-09-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP5582048B2 (ja) 2011-01-28 2014-09-03 日亜化学工業株式会社 発光装置
JP5797945B2 (ja) * 2011-06-21 2015-10-21 シチズン電子株式会社 Ｌｅｄランプ
JP5985846B2 (ja) * 2011-06-29 2016-09-06 Ｆｌｅｘｃｅｅｄ株式会社 発光素子搭載用基板及びｌｅｄパッケージ
JP2013084803A (ja) 2011-10-11 2013-05-09 Hitachi Cable Ltd 発光装置、発光素子パッケージ及び発光素子搭載用配線基板
JP2013110154A (ja) * 2011-11-17 2013-06-06 Sanken Electric Co Ltd 発光装置
JP2013135069A (ja) * 2011-12-26 2013-07-08 Hitachi Cable Ltd 発光素子搭載用配線基板、発光モジュール及び発光素子搭載用配線基板の製造方法
US9627572B2 (en) * 2012-04-25 2017-04-18 Kyocera Corporation Light receiving and emitting element module and sensor device using same

Also Published As

Publication number Publication date
US9231177B2 (en) 2016-01-05
EP2822046A1 (en) 2015-01-07
JP6255747B2 (ja) 2018-01-10
JP2015012206A (ja) 2015-01-19
CN104282822A (zh) 2015-01-14
US20150001564A1 (en) 2015-01-01
EP2822046B1 (en) 2019-08-14

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