CN104253058A - 在扇出型wlcsp上堆叠半导体小片的方法及半导体装置 - Google Patents
在扇出型wlcsp上堆叠半导体小片的方法及半导体装置 Download PDFInfo
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- CN104253058A CN104253058A CN201410299294.2A CN201410299294A CN104253058A CN 104253058 A CN104253058 A CN 104253058A CN 201410299294 A CN201410299294 A CN 201410299294A CN 104253058 A CN104253058 A CN 104253058A
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US201361841059P | 2013-06-28 | 2013-06-28 | |
US61/841059 | 2013-06-28 | ||
US14/261,252 US9478485B2 (en) | 2013-06-28 | 2014-04-24 | Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP |
US14/261252 | 2014-04-24 |
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CN104253058A true CN104253058A (zh) | 2014-12-31 |
CN104253058B CN104253058B (zh) | 2019-08-06 |
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CN201410299294.2A Active CN104253058B (zh) | 2013-06-28 | 2014-06-26 | 在扇出型wlcsp上堆叠半导体小片的方法及半导体装置 |
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US (1) | US9478485B2 (zh) |
CN (1) | CN104253058B (zh) |
SG (1) | SG10201403211QA (zh) |
TW (1) | TWI662631B (zh) |
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CN110571158A (zh) * | 2016-05-11 | 2019-12-13 | 日月光半导体制造股份有限公司 | 半导体装置封装及其制造方法 |
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Also Published As
Publication number | Publication date |
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TWI662631B (zh) | 2019-06-11 |
US9478485B2 (en) | 2016-10-25 |
SG10201403211QA (en) | 2015-01-29 |
CN104253058B (zh) | 2019-08-06 |
TW201501227A (zh) | 2015-01-01 |
US20150001709A1 (en) | 2015-01-01 |
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