SG10201403211QA - Semiconductor device and method of stacking semiconductordie on a fan-out wlcsp - Google Patents

Semiconductor device and method of stacking semiconductordie on a fan-out wlcsp

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Publication number
SG10201403211QA
SG10201403211QA SG10201403211QA SG10201403211QA SG10201403211QA SG 10201403211Q A SG10201403211Q A SG 10201403211QA SG 10201403211Q A SG10201403211Q A SG 10201403211QA SG 10201403211Q A SG10201403211Q A SG 10201403211QA SG 10201403211Q A SG10201403211Q A SG 10201403211QA
Authority
SG
Singapore
Prior art keywords
semiconductor die
interconnect structure
semiconductor
semiconductor device
semiconductordie
Prior art date
Application number
SG10201403211QA
Other languages
English (en)
Inventor
Xusheng Bao
Kwokkeung Szeto
Original Assignee
Stats Chippac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stats Chippac Ltd filed Critical Stats Chippac Ltd
Publication of SG10201403211QA publication Critical patent/SG10201403211QA/en

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