SG163445A1 - Method for manufacturing a low cost three dimensional stack package and resulting structures using through silicon vias and assemblies - Google Patents

Method for manufacturing a low cost three dimensional stack package and resulting structures using through silicon vias and assemblies

Info

Publication number
SG163445A1
SG163445A1 SG200900306-2A SG2009003062A SG163445A1 SG 163445 A1 SG163445 A1 SG 163445A1 SG 2009003062 A SG2009003062 A SG 2009003062A SG 163445 A1 SG163445 A1 SG 163445A1
Authority
SG
Singapore
Prior art keywords
silicon chip
face
assemblies
manufacturing
low cost
Prior art date
Application number
SG200900306-2A
Inventor
Kolan Ravi Kanth
Original Assignee
Kolan Ravi Kanth
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolan Ravi Kanth filed Critical Kolan Ravi Kanth
Priority to SG200900306-2A priority Critical patent/SG163445A1/en
Priority to PCT/SG2009/000021 priority patent/WO2010080068A1/en
Publication of SG163445A1 publication Critical patent/SG163445A1/en

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    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
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    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
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    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip

Abstract

A Wafer level stacked package , comprising a main silicon chip having first face and second face and having plurality of dielectric and metal trace patterns on first and second faces. The silicon chip having plurality of through silicon metal filled vias linking, the metal trace patterns of first and second faces of the main silicon chip. The silicon chip having plurality of bumps at the first face. The silicon chip having a bottom encapsulant member covering the first face and the bumps, with bump connections extended outside the encapsulant surface and with bottom encapsulant extending sideways and exactly equal to the size of the main silicon chip. FIG: 7
SG200900306-2A 2009-01-12 2009-01-12 Method for manufacturing a low cost three dimensional stack package and resulting structures using through silicon vias and assemblies SG163445A1 (en)

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SG200900306-2A SG163445A1 (en) 2009-01-12 2009-01-12 Method for manufacturing a low cost three dimensional stack package and resulting structures using through silicon vias and assemblies
PCT/SG2009/000021 WO2010080068A1 (en) 2009-01-12 2009-01-12 Method for manufacturing a low cost three dimensional stack package and resulting structures using through silicon vias and assemblies

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US10373870B2 (en) 2010-02-16 2019-08-06 Deca Technologies Inc. Semiconductor device and method of packaging
US20120098114A1 (en) * 2010-10-21 2012-04-26 Nokia Corporation Device with mold cap and method thereof
US8552567B2 (en) 2011-07-27 2013-10-08 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
US8937309B2 (en) 2011-08-08 2015-01-20 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
US9831170B2 (en) 2011-12-30 2017-11-28 Deca Technologies, Inc. Fully molded miniaturized semiconductor module
US10672624B2 (en) 2011-12-30 2020-06-02 Deca Technologies Inc. Method of making fully molded peripheral package on package device
US10050004B2 (en) 2015-11-20 2018-08-14 Deca Technologies Inc. Fully molded peripheral package on package device
US9613830B2 (en) 2011-12-30 2017-04-04 Deca Technologies Inc. Fully molded peripheral package on package device
WO2013102146A1 (en) 2011-12-30 2013-07-04 Deca Technologies, Inc. Die up fully molded fan-out wafer level packaging
US8872358B2 (en) * 2012-02-07 2014-10-28 Shin-Etsu Chemical Co., Ltd. Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
US9209046B2 (en) 2013-10-02 2015-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof
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CN107240555B (en) * 2017-05-31 2020-04-07 江苏长电科技股份有限公司 Manufacturing method of packaging structure for stacking flip chip and ball bonding chip
US10741466B2 (en) 2017-11-17 2020-08-11 Infineon Technologies Ag Formation of conductive connection tracks in package mold body using electroless plating
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