CN1042376C - 用于将半导体器件安装到散热器上的装置和方法 - Google Patents

用于将半导体器件安装到散热器上的装置和方法 Download PDF

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CN1042376C
CN1042376C CN93106878A CN93106878A CN1042376C CN 1042376 C CN1042376 C CN 1042376C CN 93106878 A CN93106878 A CN 93106878A CN 93106878 A CN93106878 A CN 93106878A CN 1042376 C CN1042376 C CN 1042376C
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F·G·戈塞尔
A·M·麦康奈尔
M·L·兰廷
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Abstract

一种把半导体器件(4)安装到散热器(8)的装置和方法，这里电路板(6)上面的孔(12)是依一定尺寸加工成形以使半导体器件(4)能穿过该孔，其中散热器(8)是放在电路板(6)的一侧，负载是在电路板(6)的另一侧引入并加到半导体器件(4)上迫使它顶压散热器(8)。

Description

用于将半导体器件安装到散热器上的装置和方法
本发明涉及把半导体器件安装到散热器上的装置和方法。更具体地说，本发明涉及经由电路板通孔使用夹紧力把半导体器件安装到散热器上以保证在半导体器件和散热器之间的高度导热性的装置和方法。
许多半导体器件都会产生热，若不加以散热，会使该器件的温度上升到足以损害它致使其不能正常工作或完全损坏。因此，通常的做法是把半导体器件固定在某种形式的散热装置(通常被称为散热器)上，它有从该器件吸热并把热转移到周围大气的作用。
典型地，半导体器件配备有传热表面，能用机械紧固件(例如安装螺钉)把该表面固定到某种形式的散热器上。然后把组装的半导体器件和散热器安装到支架(例如印刷电路板)上，其中源自半导体器件的电引线通常经焊接连到位于印刷电路板上的焊接区上。一般用机械紧固件(例如螺钉)把传热表面固定在散热器上，其优点在于能在半导体器件的传热表面和散热器之间形成充分的接触压力使得它们之间能有良好的热传导。使用机械紧固件(例如螺钉)的缺点包括螺钉的成本、所需费时的组装过程以及要顺序安装几个装置时必须加以保持的严格的几何公差。
由于这些原因，人们已经提出了几种能弹性地扣住半导体器件的散热器，诸如在美国专利4509839；5065279；4933746；5019942和4462462中所揭示的那类，其说明书将引入本文供参考。这些技术不需要准确调整和费时组装的诸如螺钉之类的机械紧固件。但是，每个这类散热器和用来把半导体器件固定在其上的方法被一个或更多的缺点所妨碍，使它对其预定目的来说变得不够理想。例如，在美国专利4012769；4215361；和4235285中所说明和描述的散热器，每一个都弹性地扣住半导体器件。可是，这些散热器当中没有一个设有把散热器固定到支架(例如印刷电路板)上的装置。美国专利4509839揭示一种用弹性扣板把半导体器件固定于其上的散热器。但是，没有揭示用于把散热器固定到印刷电路板上的装置，而从半导体器件引出线到印刷电路板上的安装过程往往由于机械导致的应力而造成故障。并且，由于半导体必须和散热器电气绝缘，用来固定半导体安装抽头的螺栓也必须加以绝缘。这通常涉及有严格公差的费时组装操作和由于大量元件所造成的令人生厌的方法。
本发明的目的是要提供一种将半导体器件安装到散热器上的装置和方法，通过对半导体器件提供由一弹簧所产生的力以改善从半导体器件到散热器的热传导性，其中通过由连接到散热器的一个定位元件使所述弹簧产生最适的力。
根据本发明的一个方面，一种用于将半导体器件安装到散热器上的装置，包括：
用于收集由所述半导体器件产生的热的散热装置；
用于向所述半导体器件施加加载力由此迫使所述半导体器件顶压所述散热器件的弹簧装置；
具有使所述半导体器件能穿过其中的孔的电路板；
固定在所述散热装置上的定位单元，所述电路板夹在它们之间，所述弹簧装置一端由所述定位单元所支承，另一端接触所述半导体器件迫使所述半导体器件顶压所述散热装置，以便散失所述半导体器件所产生的热；
其特征在于：所述定位单元是用在所述定位单元中形成的卡箍部固定到所述散热装置上，所述卡箍部接合在所述散热装置中形成的凸缘部分。
根据本发明的另一方面，一种把半导体器件安装到散热器上的方法，以便散失所述半导体器件工作期间所产生的热，该方法包括以下步骤：
提供含有加工成使所述半导体器件能穿过的孔的电路板；
提供弹簧装置，用于对所述半导体器件加载，以使其顶压在所述散热器上，所述弹簧装置具有第一端和第二端；
提供定位单元，该单元含有弹簧定位装置，以固定所述弹簧装置的所述第一端；
借助于使用弹簧装置在所述定位单元和所述半导体器件之间给与一压力，迫使所述半导体器件顶着所述散热器，所述弹簧装置具有接触所述定位单元的第一端和接触所述半导体器件的第二端，其中所述弹簧装置迫使所述半导体器件顶着所述散热器；及
把所述电路板跟位于所述电路板中的所述孔内的所述半导体器件一起夹在所述散热器和所述定位单元之间。
其特征在于，所述定位单元是用许多在所述定位单元上形成的卡箍固定到所述散热器上，该卡箍接合所述散热器上形成的凸缘。
本发明揭示用由于使用弹簧或其它垂直力发生装置引起的较大夹紧力把半导体器件安装到散热器上的装置，其中电路板被夹紧在定位单元和散热器之间并具有尺寸按半导体器件能穿过其中而开的孔。通过把夹紧力引到半导体器件上使热从半导体器件到散热器的转移达到最大限度，与先有技术的把半导体的传热表面挤压到散热器的螺丝紧固件方法相比，遍布的尺寸范围很广。
本发明减少了小硬件(例如平垫圈和弹簧垫圈、绝缘子和小螺钉)的操作。并且，如果在散热器中使用螺纹孔或有螺纹的螺钉，通过使用本发明，在攻丝或螺纹成形操作中所产生的毛边就不和半导体直接接触，因为螺纹孔是重新定位于该器件外部的一个区域而不是直接在它下面，因而消除了可能发生的电气短路。
经常是多晶体管安装的必要条件的严格公差可通过使用本发明加以缓和。因此，重力进给生产(gravity feed manufactuning)可用于大量生产。可以把半导体器件放在印刷电路板上并加以焊接而不必安装散热器，它可在后面的生产工序中安装。
图1是按照本发明安装到散热器的半导体器件的一个实施例的透视图；
图2是沿直线Ⅱ-Ⅱ所取的用于本发明半导体器件的装置系统断面图；
图3是显示水平加载弹簧的本发明的另一实施例的断面图；
图4是本发明的一可选实施例的断面图，显示具有使散热片接合的末端线夹的定位单元；及
图5是显示夹紧力和热阻抗之间关系的曲线图。
现在参考图1，该图显示出半导体器件安装系统2，其中在工作时产生高温的半导体器件4安装在形成于印刷电路板6上的板孔12内部，该半导体器件的传热表面7与薄的热传导安装垫圈(未示出)直接接触，该垫圈充当电绝缘子，它同散热体(例如散热器8)接触并把热传导到散热器上，这散热器一般是由高热传导率材料(例如铝)制成并起着把过量的热分散到周围空气或冷却液中的作用。热传导电绝缘子(热垫圈)通常是填充有热传导材料(例如氧化铝)的薄硅片。
图1显示了三个半导体器件4，尽管能使用本发明的方法以类似方式顺序地安装任何数量的装置。
半导体器件4一般具有许多电连接引线10，它们是通过焊接到连接焊盘而电气地和机械地固定在印刷电路板6上。然后电气地把连接焊盘接到位于印刷电路板6上的那些装置(图中未示)。
加工形成电路板孔12，以便使半导体器件4能穿过那里并经由热垫圈同散热器8接触。定位单元14被用来保持和固定负载弹簧16以使在定位单元通过拧入散热器8的许多螺纹孔被拴接到散热器8时，负载弹簧16是被压缩的。固定螺栓18通过定位单元14中的相应数目的装配螺栓孔20延伸出去并衔接和拧入散热器8。电路板6被夹持在定位单元14和散热器8之间。
表示为螺旋式弹簧的负载弹簧16(但可以是任何类型的弹簧)在使用固定螺栓18或任何其它类型的紧固件固定定位单元时是被压缩的并导致压向每个相应半导体器件4的压力，迫使器件4顶压着散热器8，由此使最大量的热能通过传热表面7和热传导电绝缘子转入散热器8。还能使用诸如平板金属弹簧之类的其它类型弹簧。引起夹紧力以产生在半导体器件传热表面7和散热器8之间的高接触压力的任何负载发生装置都可加以使用。
图2是沿示于图1的直线Ⅱ-Ⅱ所截取的定位单元14的剖面图。图2显示许多负载弹簧16，其中弹簧腔24是成形于定位单元14内使负载弹簧16能放入其内。此外还示出装配螺栓孔20，它允许装配螺栓18穿过，然后经过板装配孔22拧入散热器8的螺纹孔。
散热器8可以有各种几何形状并可包括从装配印刷电路板的区域伸出的翼片。散热器8还可用引入的加压流动液体(例如水)加以冷却，这在本技术领域中是众所周知的。
定位单元14可以由像塑料之类易于模制和/或机械加工的材料制成，以便把弹簧腔24和装配螺栓孔20包括在内。另一方面，为增加强度和更多一些的热转移，或许能使用某种金属材料。负载弹簧16是由弹簧钢制成，并根据半导体器件4的特定几何尺寸、弹簧腔24相对于电路板6表面的深度以及负载弹簧16的总直径，选择弹簧线圈的长度和直径来选择负载弹簧16以提供经由热垫圈把半导体器件4固定到散热器8上所需的夹紧压力。
使用本发明所揭示的装配方法，能获得高夹紧力以便经由热垫圈迫使半导体器件4顶压散热器8，用于改善热转移或改善冷却。被冷却的半导体器件4一般是市场上可买到的表面安装器件，例如场效应晶体管。
图3揭示本发明的另一个可供选择的实施例，其中负载弹簧所用的线圈弹簧已由板簧26来代替，该板簧26在装配定位单元14’时被弯成U形，使其顶着半导体器件4受到压缩，从而在半导体器件4上提供经由充当散热器的热垫圈顶着散热器8把它夹紧的力。定位单元14’已被改动以便把延伸段27包括在内，它使板簧26在半导体器件4范围内保持在适当的位置上。定位单元14’被固定在适当的位置并用拧入散热器8的若干装配螺栓18加以压缩。
图4显示定位单元14”的另一个可供选择的实施例，其中定位单元14或14’在各端面上被变更以便包括端部卡箍28a和28b，该卡箍咬入散热器8上的凸缘部分30，由此以类似于图1所示方式压缩负载弹簧16。这改型实施例便于制造和简化了装配，这在许多固定螺栓18被拧入散热器8时所不能达到的。
此外，类似于图1和2，印刷电路板6所具有的供各半导体器件4用的板孔12，其形状便于半导体器件4穿过电路板6与夹紧力直接接触并经过热传导电绝缘子(热垫圈)直到散热器8，而电路板6则位于定位单元14和散热器8之间。
图5是半导体器件4的传热表面7与经过热垫圈的散热器8之间的界面的热阻抗和夹紧力之间关系的图解表示法。可以使用本发明技术，通过选择适当的弹簧刚度和总的弹簧高度来产生所需的大约25磅力(1bsf)的夹紧力(如点32所示)。如图5所示，当夹紧力由零增加到101bsf时，热阻抗(每瓦摄氏度)迅速减小，为改进半导体器件4和散热器8之间的热转移创造条件。超过301bsf的力没有显著减小热阻抗。
使用本发明，多个半导体器件4穿过电路板中相同数目的开口断面可用最少元件和放宽的几何尺寸公差的情况下，以理想的夹紧力度固定和装配到散热器8上。
本领域普通技术人员会意识到，对上述较好实施例，进行多种变化同时又保持在本发明的范围之内是可能的。因此不应认为本发明局限于这些较好实施例或对材料、结构、尺寸、用途或其中采用的参数方面的特定选择。

Claims (10)

1．一种用于将半导体器件(4)安装到散热器上的装置(2)，包括：
用于收集由所述半导体器件(4)产生的热的散热装置(8)；
用于向所述半导体器件(4)施加加载力由此迫使所述半导体器件(4)顶压所述散热装置(8)的弹簧装置(16)；
具有使所述半导体器件(4)能穿过其中的孔(12)的电路板(6)；
固定在所述散热装置(8)上的定位单元(14)，所述电路板(6)夹在它们之间，所述弹簧装置(16)一端由所述定位单元(14)所支承，另一端接触所述半导体器件(4)迫使所述半导体器件(4)顶压所述散热装置(8)，以便散失所述半导体器件(4)所产生的热；
其特征在于：所述定位单元(14)是用在所述定位单元(14)中形成的卡箍部(28a,28b)固定到所述散热装置(8)上，所述卡箍部接合在所述散热装置中形成的凸缘部分(30)。
2．如权利要求1的将半导体器件安装到散热器上的装置，其特征在于，所述弹簧装置(16)是线圈状弹簧。
3．如权利要求1的将半导体器件安装到散热器上的装置，其特征在于，所述弹簧装置(16)是板簧。
4．如权利要求1的将半导体器件安装到散热器上的装置，其特征在于，所述散热装置是用铝材制成，含有许多源自基本区段的翼片，其中所述基本区段接触所述半导体器件(4)。
5．一种把半导体器件(4)安装到散热装置(8)上的方法，以便散失所述半导体器件(4)工作期间所产生的热，该方法包括以下步骤：
提供含有加工成使所述半导体器件(4)能穿过的孔(12)的电路板(6)；
提供弹簧装置(16)，用于对所述半导体器件(4)加载，以使其顶压在所述散热装置(8)上，所述弹簧装置(16)具有第一端和第二端；
提供定位单元(14)，该单元含有弹簧定位装置(24)，以固定所述弹簧装置(16)的所述第一端；
借助于使用弹簧装置(16)在所述定位单元(14)和所述半导体器件(4)之间给与一压力，迫使所述半导体器件(4)顶着所述散热装置(8)，所述弹簧装置(16)具有接触所述定位单元(14)的第一端和接触所述半导体器件(4)的第二端，其中所述弹簧装置(16)迫使所述半导体器件(4)顶着所述散热装置(8)；及
把所述电路板(6)跟位于所述电路板(6)中的所述孔(12)内的所述半导体器件(4)一起夹在所述散热装置(8)和所述定位单元(14)之间。
其特征在于，所述定位单元(14)是用许多在所述定位单元(14)上形成的卡箍固定到所述散热装置(8)上，该卡箍接合所述散热装置(8)上形成的凸缘。
6．如权利要求5的安装半导体器件(4)的方法，其特征在于，所述弹簧装置(16)是线圈式弹簧。
7．如权利要求5的安装半导体器件(4)的方法，其特征在于，所述弹簧装置(16)具有接触所述半导体器件(4)的一端和相对于所述散热装置(8)受约束的另一端。
8．如权利要求5的安装半导体器件(4)的方法，其特征在于，所述弹簧装置(16)相对于所述散热装置(8)被安装到所述散热装置(8)上的定位单元(14)所约束。
9．如权利要求5的安装半导体器件(4)的方法，其特征在于，所述电路板(6)被夹在所述定位单元(14)和所述散热装置(8)之间。
10．如权利要求5的安装半导体器件的方法，其特征在于，所述定位单元(14)是用许多螺纹紧固件(18)安装到所述散热装置(8)。
CN93106878A 1992-06-05 1993-06-05 用于将半导体器件安装到散热器上的装置和方法 Expired - Fee Related CN1042376C (zh)

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