CN104212997B - Cu‑Mn合金膜和Cu‑Mn合金溅射靶材以及Cu‑Mn合金膜的成膜方法 - Google Patents
Cu‑Mn合金膜和Cu‑Mn合金溅射靶材以及Cu‑Mn合金膜的成膜方法 Download PDFInfo
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- CN104212997B CN104212997B CN201410239491.5A CN201410239491A CN104212997B CN 104212997 B CN104212997 B CN 104212997B CN 201410239491 A CN201410239491 A CN 201410239491A CN 104212997 B CN104212997 B CN 104212997B
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- alloy films
- alloy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-115232 | 2013-05-31 | ||
JP2013115232 | 2013-05-31 | ||
JP2013115232 | 2013-05-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104212997A CN104212997A (zh) | 2014-12-17 |
CN104212997B true CN104212997B (zh) | 2017-06-09 |
Family
ID=52094898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410239491.5A Active CN104212997B (zh) | 2013-05-31 | 2014-05-30 | Cu‑Mn合金膜和Cu‑Mn合金溅射靶材以及Cu‑Mn合金膜的成膜方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6376438B2 (ko) |
KR (1) | KR101609453B1 (ko) |
CN (1) | CN104212997B (ko) |
TW (1) | TWI504772B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104690266A (zh) * | 2015-03-18 | 2015-06-10 | 宁波广博纳米新材料股份有限公司 | 用于制备晶片电阻器正面、背面电极的铜锰合金粉 |
KR102467683B1 (ko) | 2015-03-20 | 2022-11-17 | 다이니폰 인사츠 가부시키가이샤 | 반사 방지 필름, 해당 반사 방지 필름을 사용한 표시 장치, 및 반사 방지 필름의 선택 방법 |
JP6190847B2 (ja) * | 2015-06-16 | 2017-08-30 | 株式会社神戸製鋼所 | 平面ディスプレイ又は曲面ディスプレイ向け低反射電極 |
JP6042520B1 (ja) * | 2015-11-05 | 2016-12-14 | デクセリアルズ株式会社 | Mn−Zn−O系スパッタリングターゲット及びその製造方法 |
CN110418855B (zh) * | 2017-03-17 | 2020-12-11 | 富士胶片株式会社 | 透明光学膜的制造方法及透明多层膜的制造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03271359A (ja) * | 1990-03-20 | 1991-12-03 | Japan Steel Works Ltd:The | 複合酸化物の合成方法 |
DE69738612T2 (de) * | 1996-11-20 | 2009-07-09 | Kabushiki Kaisha Toshiba | Sputtertarget |
KR20010079644A (ko) * | 1998-08-13 | 2001-08-22 | 리타 버어그스트롬 | 기판상에 선택된 색상의 코팅을 형성시키기 위한 조성물,장치 및 방법, 및 이것으로 제조된 물품 |
WO2006025347A1 (ja) * | 2004-08-31 | 2006-03-09 | National University Corporation Tohoku University | 銅合金及び液晶表示装置 |
JP4851740B2 (ja) * | 2005-06-30 | 2012-01-11 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP4756458B2 (ja) * | 2005-08-19 | 2011-08-24 | 三菱マテリアル株式会社 | パーティクル発生の少ないMn含有銅合金スパッタリングターゲット |
JP2008135569A (ja) * | 2006-11-28 | 2008-06-12 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
JP2010080607A (ja) * | 2008-09-25 | 2010-04-08 | Rohm Co Ltd | 半導体装置の製造方法 |
JP2012189725A (ja) * | 2011-03-09 | 2012-10-04 | Kobe Steel Ltd | Ti合金バリアメタルを用いた配線膜および電極、並びにTi合金スパッタリングターゲット |
JP5662874B2 (ja) * | 2011-05-31 | 2015-02-04 | 株式会社神戸製鋼所 | 光情報記録媒体用記録膜および光情報記録媒体、並びに上記記録膜の形成に用いられるスパッタリングターゲット |
KR101323151B1 (ko) * | 2011-09-09 | 2013-10-30 | 가부시키가이샤 에스에이치 카퍼프로덕츠 | 구리-망간합금 스퍼터링 타겟재, 그것을 사용한 박막 트랜지스터 배선 및 박막 트랜지스터 |
JP5632821B2 (ja) * | 2011-12-06 | 2014-11-26 | 株式会社神戸製鋼所 | タッチパネルセンサー用Cu合金配線膜、及びその製造方法、並びにタッチパネルセンサー |
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2014
- 2014-04-28 JP JP2014092582A patent/JP6376438B2/ja active Active
- 2014-05-09 TW TW103116460A patent/TWI504772B/zh active
- 2014-05-28 KR KR1020140064235A patent/KR101609453B1/ko active IP Right Grant
- 2014-05-30 CN CN201410239491.5A patent/CN104212997B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI504772B (zh) | 2015-10-21 |
TW201447004A (zh) | 2014-12-16 |
JP2015007280A (ja) | 2015-01-15 |
KR20140141493A (ko) | 2014-12-10 |
JP6376438B2 (ja) | 2018-08-22 |
KR101609453B1 (ko) | 2016-04-05 |
CN104212997A (zh) | 2014-12-17 |
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