CN104205236B - 抗洗脱的环氧粘合剂组合物及预胶凝粘合剂 - Google Patents
抗洗脱的环氧粘合剂组合物及预胶凝粘合剂 Download PDFInfo
- Publication number
- CN104205236B CN104205236B CN201380015055.3A CN201380015055A CN104205236B CN 104205236 B CN104205236 B CN 104205236B CN 201380015055 A CN201380015055 A CN 201380015055A CN 104205236 B CN104205236 B CN 104205236B
- Authority
- CN
- China
- Prior art keywords
- epoxy adhesive
- viscosity
- composition
- epoxy
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/007—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261613508P | 2012-03-21 | 2012-03-21 | |
US61/613,508 | 2012-03-21 | ||
PCT/US2013/021861 WO2013141955A2 (en) | 2012-03-21 | 2013-01-17 | Wash-off resistant epoxy and use thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104205236A CN104205236A (zh) | 2014-12-10 |
CN104205236B true CN104205236B (zh) | 2017-10-24 |
Family
ID=47630571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380015055.3A Active CN104205236B (zh) | 2012-03-21 | 2013-01-17 | 抗洗脱的环氧粘合剂组合物及预胶凝粘合剂 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9346984B2 (zh) |
EP (1) | EP2828860B1 (zh) |
JP (1) | JP6088635B2 (zh) |
KR (1) | KR102062414B1 (zh) |
CN (1) | CN104205236B (zh) |
WO (1) | WO2013141955A2 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102341570B1 (ko) * | 2014-04-14 | 2021-12-22 | 다우 글로벌 테크놀로지스 엘엘씨 | 프리-겔 오븐용 에폭시 수지 조성물 |
EP3218433A1 (en) * | 2014-11-11 | 2017-09-20 | Dow Global Technologies LLC | Adhesive composition with glass spheres |
WO2016130455A1 (en) * | 2015-02-11 | 2016-08-18 | Dow Global Technologies Llc | Low temperature curable adhesives and use thereof |
CN105199639B (zh) * | 2015-09-16 | 2018-05-18 | 上海回天新材料有限公司 | 一种柔性胶粘剂及其制备方法和应用 |
KR102477301B1 (ko) * | 2016-02-22 | 2022-12-13 | 한국화학연구원 | 자가 촉매 폴리우레탄 중합체 및 이를 포함하는 에폭시 접착제 조성물 |
US11739241B2 (en) | 2017-06-23 | 2023-08-29 | Ddp Specialty Electronic Material Us, Llc | High temperature epoxy adhesive formulations |
US11820922B2 (en) | 2017-10-18 | 2023-11-21 | Ddp Specialty Electronic Materials Us, Llc | Adhesive composition |
CN108712529B (zh) | 2018-05-24 | 2020-10-23 | 维沃移动通信有限公司 | 一种铰链和移动终端 |
WO2020196919A1 (ja) * | 2019-03-28 | 2020-10-01 | 株式会社カネカ | 粉粒体およびその利用 |
WO2024038816A1 (ja) * | 2022-08-17 | 2024-02-22 | 東洋紡株式会社 | 接着剤組成物 |
Citations (5)
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CN1422316A (zh) * | 2000-04-10 | 2003-06-04 | 汉高两合股份公司 | 抗冲击环氧树脂组合物 |
CN1816606A (zh) * | 2003-07-07 | 2006-08-09 | 陶氏环球技术公司 | 粘合剂环氧组合物及其施用方法 |
CN101679579A (zh) * | 2007-06-20 | 2010-03-24 | 陶氏环球技术公司 | 对温度变化的敏感性非常低的耐碰撞环氧粘合剂 |
CN102119201A (zh) * | 2008-08-11 | 2011-07-06 | 陶氏环球技术责任有限公司 | 含有用酚和羟基封端的丙烯酸酯或羟基封端的甲基丙烯酸酯封端的弹性体增韧剂的单组分结构环氧树脂粘合剂 |
CN102333837A (zh) * | 2009-02-26 | 2012-01-25 | 陶氏环球技术有限责任公司 | 包含二聚脂肪酸/环氧树脂加合物和多元醇的单组分环氧树脂结构粘合剂 |
Family Cites Families (22)
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US4507412A (en) | 1983-03-28 | 1985-03-26 | The Dow Chemical Company | High solids coatings from adducts of polyepoxides with polyamines and blocked polyisocyanates |
CA1259897A (en) | 1985-04-02 | 1989-09-26 | Madan M. Bagga | Bonding process using curable epoxide resin adhesive |
US5278257A (en) | 1987-08-26 | 1994-01-11 | Ciba-Geigy Corporation | Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin |
ES2025260B3 (es) | 1987-08-26 | 1992-03-16 | Ciba-Geigy Ag | Resinas epoxidicas modificadas |
US5567748A (en) | 1991-12-17 | 1996-10-22 | The Dow Chemical Company | Water compatible amine terminated resin useful for curing epoxy resins |
WO2001046290A1 (en) * | 1999-12-20 | 2001-06-28 | 3M Innovative Properties Company | Ambient-temperature-stable, one-part curable epoxy adhesive |
EP2258773A1 (en) | 2003-06-09 | 2010-12-08 | Kaneka Corporation | Epoxy resin |
EP1602702B2 (en) | 2004-06-01 | 2020-09-16 | Dow Global Technologies LLC | Epoxy adhesive composition |
US7642316B2 (en) | 2004-10-14 | 2010-01-05 | Dow Global Technologies, Inc. | Rubber modified monovinylidene aromatic polymers and fabricated articles prepared therefrom |
JP4577716B2 (ja) * | 2005-01-21 | 2010-11-10 | 日本化薬株式会社 | 加熱硬化型エポキシ樹脂組成物及びその硬化接着層を有する物品 |
DE602005020260D1 (de) | 2005-06-02 | 2010-05-12 | Dow Global Technologies Inc | Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis |
EP1741734A1 (de) | 2005-07-05 | 2007-01-10 | Sika Technology AG | Tieftemperaturschlagzähe hitze-härtbare Epoxidharzzusammensetzung mit Epoxidfestharzen |
DE102006012550A1 (de) | 2006-03-18 | 2007-09-20 | Degussa Gmbh | Verwendung einer substituierten Guanidin-Verbindung sowie deren Salze oder Hydrate als Härter für Epoxidharze |
EP1916285A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Derivatisiertes Epoxid-Festharz und dessen Verwendungen |
US8026468B2 (en) | 2007-06-28 | 2011-09-27 | Samsung Electronics Co., Ltd. | Projection display apparatus comprising a spatial-beam changing unit which changes spatial positions of beams |
EP2181156A1 (en) * | 2007-08-17 | 2010-05-05 | Dow Global Technologies Inc. | Two part crash durable epoxy adhesives |
JP2009062413A (ja) * | 2007-09-04 | 2009-03-26 | Shin Etsu Chem Co Ltd | 接着剤組成物及びダイボンドフィルム |
JP5365003B2 (ja) * | 2008-01-11 | 2013-12-11 | 横浜ゴム株式会社 | ハネムーン型接着剤組成物、実装基板の接着方法および実装基板組み立て体 |
WO2009094295A1 (en) * | 2008-01-22 | 2009-07-30 | Dow Global Technologies Inc. | Structural epoxy resin adhesives containing epoxide-functional, polyphenol-extended elastomeric tougheners |
EP2085426B1 (de) | 2008-01-30 | 2010-10-13 | Sika Technology AG | Auswaschbeständige hitzehärtende Epoxidharzklebstoffe |
WO2010030994A2 (en) | 2008-06-06 | 2010-03-18 | Providence Medical Technology, Inc. | Cervical distraction/implant delivery device |
US9000120B2 (en) | 2010-06-29 | 2015-04-07 | Dow Global Technologies Llc | Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
-
2013
- 2013-01-17 EP EP13702157.2A patent/EP2828860B1/en active Active
- 2013-01-17 US US14/379,563 patent/US9346984B2/en active Active
- 2013-01-17 JP JP2015501667A patent/JP6088635B2/ja active Active
- 2013-01-17 KR KR1020147025906A patent/KR102062414B1/ko active IP Right Grant
- 2013-01-17 CN CN201380015055.3A patent/CN104205236B/zh active Active
- 2013-01-17 WO PCT/US2013/021861 patent/WO2013141955A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1422316A (zh) * | 2000-04-10 | 2003-06-04 | 汉高两合股份公司 | 抗冲击环氧树脂组合物 |
CN1816606A (zh) * | 2003-07-07 | 2006-08-09 | 陶氏环球技术公司 | 粘合剂环氧组合物及其施用方法 |
CN101679579A (zh) * | 2007-06-20 | 2010-03-24 | 陶氏环球技术公司 | 对温度变化的敏感性非常低的耐碰撞环氧粘合剂 |
CN102119201A (zh) * | 2008-08-11 | 2011-07-06 | 陶氏环球技术责任有限公司 | 含有用酚和羟基封端的丙烯酸酯或羟基封端的甲基丙烯酸酯封端的弹性体增韧剂的单组分结构环氧树脂粘合剂 |
CN102333837A (zh) * | 2009-02-26 | 2012-01-25 | 陶氏环球技术有限责任公司 | 包含二聚脂肪酸/环氧树脂加合物和多元醇的单组分环氧树脂结构粘合剂 |
Also Published As
Publication number | Publication date |
---|---|
EP2828860B1 (en) | 2021-02-24 |
JP6088635B2 (ja) | 2017-03-01 |
KR102062414B1 (ko) | 2020-01-03 |
WO2013141955A3 (en) | 2014-01-16 |
WO2013141955A2 (en) | 2013-09-26 |
EP2828860A2 (en) | 2015-01-28 |
US20150037497A1 (en) | 2015-02-05 |
JP2015514140A (ja) | 2015-05-18 |
US9346984B2 (en) | 2016-05-24 |
KR20140135756A (ko) | 2014-11-26 |
CN104205236A (zh) | 2014-12-10 |
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SE01 | Entry into force of request for substantive examination | ||
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GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Delaware Patentee after: DDP special electronic materials USA Co.,Ltd. Address before: Delaware Patentee before: DDP special electronic materials American Co. |
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TR01 | Transfer of patent right |
Effective date of registration: 20230322 Address after: Delaware Patentee after: DDP special electronic materials American Co. Address before: Delaware Patentee before: THE DOW CHEMICAL Co. Effective date of registration: 20230322 Address after: Delaware Patentee after: THE DOW CHEMICAL Co. Address before: Michigan, USA Patentee before: Dow Global Technologies Llc |
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TR01 | Transfer of patent right |