CN104185817B - 曝光描绘装置和曝光描绘方法 - Google Patents

曝光描绘装置和曝光描绘方法 Download PDF

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Publication number
CN104185817B
CN104185817B CN201380016100.7A CN201380016100A CN104185817B CN 104185817 B CN104185817 B CN 104185817B CN 201380016100 A CN201380016100 A CN 201380016100A CN 104185817 B CN104185817 B CN 104185817B
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CN
China
Prior art keywords
unit
mark
exposure
exposure plotting
mark forming
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Active
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CN201380016100.7A
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English (en)
Chinese (zh)
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CN104185817A (zh
Inventor
桥口昭浩
菊池浩明
鹤井弘则
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ADITECH ENGINEERING Co Ltd
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ADITECH ENGINEERING Co Ltd
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Publication of CN104185817A publication Critical patent/CN104185817A/zh
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201380016100.7A 2012-03-30 2013-01-09 曝光描绘装置和曝光描绘方法 Active CN104185817B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-082561 2012-03-30
JP2012082561A JP5961429B2 (ja) 2012-03-30 2012-03-30 露光描画装置及び露光描画方法
PCT/JP2013/050242 WO2013145798A1 (ja) 2012-03-30 2013-01-09 露光描画装置及び露光描画方法

Publications (2)

Publication Number Publication Date
CN104185817A CN104185817A (zh) 2014-12-03
CN104185817B true CN104185817B (zh) 2016-05-18

Family

ID=49259084

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380016100.7A Active CN104185817B (zh) 2012-03-30 2013-01-09 曝光描绘装置和曝光描绘方法

Country Status (5)

Country Link
JP (1) JP5961429B2 (ja)
KR (1) KR102024617B1 (ja)
CN (1) CN104185817B (ja)
TW (1) TWI570519B (ja)
WO (1) WO2013145798A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6096453B2 (ja) * 2012-09-27 2017-03-15 株式会社アドテックエンジニアリング 露光描画装置、露光描画システム、プログラム及び露光描画方法
JP6465591B2 (ja) * 2014-08-27 2019-02-06 株式会社オーク製作所 描画装置
CN105607430B (zh) * 2015-12-30 2017-07-07 深圳市鑫富宝科技有限公司 软板自动曝光机
CN109466189A (zh) * 2018-12-21 2019-03-15 昆山森特斯印刷技术有限公司 套印定位设备及具有该套印定位设备的套印定位系统
JP7386742B2 (ja) * 2020-03-24 2023-11-27 株式会社Ｓｃｒｅｅｎホールディングス 露光装置
JP7458950B2 (ja) 2020-09-23 2024-04-01 株式会社Ｓｃｒｅｅｎホールディングス 描画システム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6701197B2 (en) * 2000-11-08 2004-03-02 Orbotech Ltd. System and method for side to side registration in a printed circuit imager
SG118239A1 (en) * 2003-04-24 2006-01-27 Asml Netherlands Bv Lithographic processing method and device manufactured thereby
JP2005014012A (ja) * 2003-06-24 2005-01-20 Pentax Corp 描画装置および描画方法
US7083338B2 (en) * 2003-10-27 2006-08-01 Samsung Electronics Co., Ltd. Lithography equipment
JP4882354B2 (ja) * 2004-12-01 2012-02-22 株式会社ニコン アライメント調整方法、アライメントマークの形成方法、基材、及び透過型光学素子の製造方法
JP2006293314A (ja) * 2005-02-08 2006-10-26 Fuji Photo Film Co Ltd 画像形成装置および画像形成方法
JP2006276206A (ja) * 2005-03-28 2006-10-12 Fuji Photo Film Co Ltd 露光装置および露光方法
JP4922071B2 (ja) * 2007-05-28 2012-04-25 株式会社オーク製作所 露光描画装置
TWI373694B (en) * 2007-08-09 2012-10-01 Nanya Technology Corp Exposure methiod
JP2009099939A (ja) * 2007-09-25 2009-05-07 Dainippon Screen Mfg Co Ltd アライメントマーク形成装置
JP5452889B2 (ja) * 2008-06-04 2014-03-26 株式会社オーク製作所 描画装置
NL2004531A (nl) * 2009-05-29 2010-11-30 Asml Netherlands Bv Apparatus and method for providing resist alignment marks in a double patterning lithographic process.

Also Published As

Publication number Publication date
WO2013145798A1 (ja) 2013-10-03
CN104185817A (zh) 2014-12-03
KR20150003161A (ko) 2015-01-08
TW201339767A (zh) 2013-10-01
TWI570519B (zh) 2017-02-11
KR102024617B1 (ko) 2019-09-24
JP2013213852A (ja) 2013-10-17
JP5961429B2 (ja) 2016-08-02

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