CN104137346A - 连接构件 - Google Patents
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
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- H01R12/70—Coupling devices
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
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- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
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- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
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Abstract
本发明包括用于将两个部件导电地连接于(第一)导体(7)的连接构件,所述(第一)导体(7)包括筒状壳体,所述筒状壳体具有用于减小轴向刚度的至少一个开口(8)。
Description
技术领域
本发明涉及两个部件的导电连接用的连接构件,特别地,涉及如下连接构件:射频信号通过该连接构件能够最大程度上不受损失地在两个部件,特别是两个印刷电路板之间传输。
背景技术
在这种连接构件的情况下,即使在两个印刷电路板的平行度公差和两个印刷电路板之间的距离公差的规定范围内,对连接构件来说,也必须确保射频信号最大程度上不受损失地传输。这样的连接构件还需要满足制造廉价和便于组装方面的要求。此外,连接构件的轴向尺寸和径向尺寸需要保持为尽可能小。
目前使用的主要是如下两种设计的这种连接构件。
一方面,借助于刚性地连接于印刷电路板的两个同轴插入式连接器和适配器(所谓的“插塞(bullet)”)使两个印刷电路板之间形成连接,适配器连接两个同轴插入式连接器。此适配器允许轴向公差和径向公差被补偿,并且也允许平行度公差被补偿。用于此目的的典型的同轴插入式连接器为SMP连接器、迷你型SMP连接器和FMC连接器。
可选择地,也可以借助于单导体结构和/或多导体结构的弹簧加载接触销(所谓的弹簧针)使两个印刷电路板之间形成电连接。这种弹簧加载的接触销包括套筒和部分导入套筒内的头部,以及支撑在头部和套筒之间的螺旋弹簧。螺旋弹簧需要的关于弹性力和压并高度的性能要求弹簧相对较长,这对弹簧加载接触销的总体轴向高度具有相当不利的效果。使用单导体结构的弹簧加载接触销还具有以下缺点:如果要获得满意的电气性能,单导体结构的弹簧加载的接触销必须以特别的形式布置以充当信号针和接地针。另一方面,多个导体由于它们复杂的构造易于出故障且昂贵。
发明内容
以上述现有技术作为出发点,基于本发明的目的是开发两个部件的电连接用的改善的连接构件。特别地,尽管具有补偿公差的性能,连接构件以制造廉价、构造简单且因此没有出错的风险和/或容易组装为特征。
该目的借助于独立方案1的主题的实现。根据本发明的连接构件的优选实施方式形成从属方案的主题并且从本发明的以下说明可以得出。
基于本发明的思想是借助于尽可能最简单的构造的(优选为单件的)导体在两个部件之间形成电连接,并且通过该导体的归因于其结构设计的变形对待连接的两个部件的位置公差进行补偿。
根据本发明用于此目的的是包括筒状壳体的导体,筒状壳体具有至少一个开口,以减小壳体的轴向刚度。壳体的轴向刚度在这种情况下如下地低:装配两个部件时产生的力引起壳体在轴向上的变形,特别地,由于这两个部件的位置公差,该变形是必须的。
减小筒状壳体的轴向刚度的容易、廉价且有效的可能的方法是在筒状壳体内包含沿着螺旋路径的(至少)一个开口。
根据本发明的“螺旋路径”的意思是在壳体的轴向和周向上均延伸的开口(参考开口开始和结束的点)沿着的路径。
根据本发明的这种连接构件的特别优选的实施方式可以准备在此设置至少两个沿着螺旋路径的这样的开口,该两个开口从壳体的两端开始沿着朝向彼此的路径。优选地,在这种情况下,可以设置为,该至少两个开口中的每个沿着螺旋路径而最多仅延伸为壳体的轴向长度的一半并且该至少两个开口不经过彼此。
特别优选地,多个开口可以设置为优选地沿着平行和/或螺旋路径。在这种情况下可以特别地设置为,第一组开口沿着螺旋路径和第二组开口沿着螺旋路径,开口形成从壳体的两端开始沿着朝向彼此的路径的两组。这种实施方式具有以下的额外优点:当导体具有沿着螺旋路径的开口时,导体的轴向变形将试图引起壳体的由螺旋开口分隔开的这些部分的相对转动,导体的轴向变形可以被限制于壳体的配置在沿着朝向彼此的螺旋路径的两个(组)开口之间的区域。因此,可以确保的是,壳体的将要与两个部件接触的两个端部保持基本上不受轴向变形产生的扭转应力的影响。
此外,在根据本发明的连接构件的实施方式中,优选地可以将壳体设置为在(至少)一个端部处具有弹性片,该弹性片沿着相对于壳体的纵向轴线(以连接给定的弹性片的开始点和结束点的线作为参考)倾斜的路径。借助于这些弹性片,能够对部件的待连接在一起的两个表面的平行度公差进行有利补偿。至少在特定的范围内,这种弹性片使关于两个部件的、沿轴向和径向(参考导体的壳体)的特定的位置补偿也成为可能。
另外,在优选的实施方式中,壳体在至少一个端部处具有支撑面,该支撑面比壳体的壁的截面面积大。这种增大的支撑面简化了与一个部件或多个部件的可靠连接。
这种增大的支撑面设计的廉价的可能方法可以使得其设置为壳体的端部折弯(优选地弯曲90°)的形式。
为了确保射频信号特别良好的传输特性,特别是通过特征为一个或多个开口的导体的射频信号特别良好的传输特性,优选地,该导体可以设置为与第二导体导电接触,该导电接触(至少相对于第一导体的一部分)也是可移动的。特别地,第一导体和第二导体之间的该接触可以设置在第一导体的一部分,在该部分内有引入第一导体的壳体内的开口。因而,第二导体帮助第一导体传输电能或信号,特别是传输射频信号,此外,利用根据本发明的目的在于补偿在两个部件的位置上的公差的第一导体的变形由至少部分可轴向移动确保。
优选地,第二导体可以设置为具有实体筒状壳体以能够进行良好的传输,特别是良好地传输射频信号。
在根据本发明的连接构件的优选实施方式中,一个或多个导体设置为同轴连接构件的外部导体的形式,其进而绕着另一个导体(中央导体)。优选地,该中央导体可以形成为弹簧加载的接触销的已知形式,由此可以包括套筒、部分引导到套筒内的柱塞和支撑在柱塞和套筒之间的弹簧构件。这种弹簧加载的接触销对于特别是射频信号的良好传输特性是显著的,并且还对于待连接在一起的部件的位置上的公差是低灵敏度的。两个部件彼此的距离公差实际上由套筒内的柱塞的位移的可能性补偿。在这种情况下,弹簧构件确保有适当的力将柱塞压抵在相邻的部件上。
优选地,绝缘构件配置在外部导体和中央导体之间。为了提供能够满意地处理的单元,优选地,该绝缘构件可以刚性地连接于中央导体和外部导体的至少一部分。也存在绝缘构件刚性地连接于整个外部导体的可能性,只要其具有相对低的弹性模量,因此,不会阻碍根据本发明设置的外部导体的轴向变形,或者不会实质上影响该轴向变形。
附图说明
以下通过参考附图中所示的实施方式将详细说明本发明。在附图中:
图1是根据本发明的连接构件的侧视的部分截面图。
图2和图3示出图1所示的连接构件与待电连接在一起的两个印刷电路板结合。
具体实施方式
图1至图3所示的连接构件包括中央导体1、外部导体2和配置在中央导体1和外部导体2之间的绝缘构件3。中央导体1为传统的弹簧加载式接触销的形式,即,中央导体1包括套筒4和柱塞,柱塞以可移动的方式部分地被引导在套筒内,柱塞具有柱塞杆5和具有球形接触面的头部6。支撑在柱塞和套筒4的底部之间的螺旋弹簧(未图示)配置在套筒4内。
外部导体2包括具有筒状壳体的第一导体7,沿着螺旋路径的多个开口8被引入筒状壳体内。这些螺旋开口8分为以下两组:一组从在图1的顶端处示出的端部开始并且延伸至壳体的(轴向的)中心前不远的点。第二组从在图1的底端处示出的端部开始并且同样地延伸至壳体的(轴向的)中心前不远的点。螺旋开口8具有沿着倾斜路径的部分和沿着轴向路径的末端部。螺旋开口8的组成一组的所有部分沿着彼此平行的路径。
壳体的在图1的底端处所示的端部折弯90°,由此,形成大于壳体的壁的截面面积的支撑表面。以沿着弯曲(90°)的路径的方式形成多个弹性片9,因而,该多个弹性片9指向径向外侧,通过该多个弹性片9限定壳体的在图1的顶端处所示的端部。弹性片9的自由端部形成支撑平面。
与第一导体7相同,外部导体2还包括同样为筒状的第二导体10,第二导体10与绝缘构件3的长度相同且刚性地连接(例如,粘结)于绝缘构件3。第二导体10的壳体为实体的,因而不具有任何开口。第一导体7和第二导体10之间的刚性连接设置在图1的底部处所示的端部和第一导体7的壳体中的开口8的开端之间的部分。因此,连接构件的所有组成部件彼此刚性地连接,但是,第一导体7的在图1的顶端处所示的部分可以相对于第二导体10产生相对运动。
为了利用根据本发明的连接构件连接用于传输射频信号的两个印刷电路板,首先通过折弯的底端(见图2)将连接构件刚性地连接于第一印刷电路板11。然后,装配第二印刷电路板12,因而第二印刷电路板12以规定的压力压抵连接构件的顶端(见图3)。由于两个印刷电路板11、12的位置存在公差,因此可以改变该压力。在一方侧将第二印刷电路板12压抵在连接构件上导致中央导体1的柱塞与来自螺旋弹簧的力相反地位移。以这种方式产生的弹簧加载确保中央导体1的头部6与印刷电路板12上接触用的对应点可靠接触。
上印刷电路板12的下压还对可弹性偏转的弹性片9的至少轻微的变形有作用。这仅仅是外部导体2的第一导体7的总长度为略大于两个印刷电路板11、12之间的、公差允许的最大距离的尺寸的结果。尽管弹性片9也允许两个印刷电路板彼此之间距离的公差被补偿,但弹性片9特别的目的是补偿待连接在一起的印刷电路板11、12的接触面的平行度公差。
特别地,根据本发明的第一导体7的壳体的设计对于补偿两个印刷电路板11、12彼此之间的距离的公差有作用。由于开口8沿着壳体中的螺旋路径,后者的轴向刚度很低,使得壳体按两个印刷电路板11、12之间的需要变形。沿着朝向彼此的路径的两组螺旋开口的实际布置在该情况下具有下述优点:第一导体7的轴向变形仅仅导致壳体的使两组开口8彼此分离(见图3)的中心区域的旋转。以这种方式可以实现的是,第一导体7连接于两个印刷电路板11、12的点实质上不受扭转力的影响。
Claims (12)
1.一种用于两个部件的导电连接的连接构件,所述连接构件具有(第一)导体(7),其特征在于,所述导体(7)包括筒状壳体,所述筒状壳体具有至少一个开口(8),以减小轴向刚度。
2.根据权利要求1所述的连接构件,其特征在于,所述开口(8)沿着螺旋路径。
3.根据权利要求2所述的连接构件,其特征在于,沿着螺旋路径的至少两个开口(8)从所述壳体的两端开始沿着朝向彼此的路径。
4.根据前述权利要求中任一项所述的连接构件,其特征在于,所述壳体形成为在至少一个端部处具有弹性片(9),所述弹性片(9)沿着相对于所述壳体的纵轴倾斜的路径。
5.根据前述权利要求中任一项所述的连接构件,其特征在于,所述壳体在至少一个端部处形成支撑面,所述支撑面比所述壳体的壁的横截面积大。
6.根据权利要求5所述的连接构件,其特征在于,所述支撑面采用所述壳体的端部折弯的形式。
7.根据前述权利要求中任一项所述的连接构件,其特征在于,所述第一导体(7)为导电的,并且与第二导体(10)可轴向运动地接触。
8.根据权利要求7所述的连接构件,其特征在于,所述第二导体(10)具有实体的筒状壳体。
9.根据前述权利要求中任一项所述的连接构件,其特征在于,所述第一导体(7)和所述第二导体(10)绕着中央导体(1)作为外部导体(2)。
10.根据权利要求9所述的连接构件,其特征在于,所述中央导体(1)采用弹簧加载的接触销的形式。
11.根据权利要求9或10所述的连接构件,其特征在于,在所述外部导体(2)和所述中央导体(1)之间配置有绝缘构件(3)。
12.根据权利要求11所述的连接构件,其特征在于,所述绝缘构件(3)刚性地连接于所述中央导体(1)并且所述绝缘构件(3)刚性地连接于所述外部导体(2)的一部分。
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EP (1) | EP2780985B1 (zh) |
JP (1) | JP5905594B2 (zh) |
KR (1) | KR101636311B1 (zh) |
CN (1) | CN104137346B (zh) |
CA (1) | CA2853710C (zh) |
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EP2780985A1 (de) | 2014-09-24 |
JP2015502005A (ja) | 2015-01-19 |
KR20140091023A (ko) | 2014-07-18 |
WO2013072011A1 (de) | 2013-05-23 |
CA2853710A1 (en) | 2013-05-23 |
US9300063B2 (en) | 2016-03-29 |
KR101636311B1 (ko) | 2016-07-05 |
CA2853710C (en) | 2016-11-29 |
JP5905594B2 (ja) | 2016-04-20 |
TWM451685U (zh) | 2013-04-21 |
EP2780985B1 (de) | 2016-12-14 |
CN104137346B (zh) | 2017-02-15 |
US20140329421A1 (en) | 2014-11-06 |
DE202011108052U1 (de) | 2011-12-06 |
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