CN104117697B - A kind of off-resonance elliptical vibration cutting device - Google Patents
A kind of off-resonance elliptical vibration cutting device Download PDFInfo
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- CN104117697B CN104117697B CN201410341899.3A CN201410341899A CN104117697B CN 104117697 B CN104117697 B CN 104117697B CN 201410341899 A CN201410341899 A CN 201410341899A CN 104117697 B CN104117697 B CN 104117697B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 36
- 239000011159 matrix material Substances 0.000 claims abstract description 31
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 19
- 239000010432 diamond Substances 0.000 claims abstract description 19
- 230000033001 locomotion Effects 0.000 claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 5
- 239000010935 stainless steel Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 abstract description 11
- 238000006073 displacement reaction Methods 0.000 abstract description 7
- 238000003754 machining Methods 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B25/00—Accessories or auxiliary equipment for turning-machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
Abstract
The present invention relates to a kind of off-resonance elliptical vibration cutting device, belong to ultra precision cutting and cutting of hardworking material technical field.Diamond cutter is fixedly connected with by the tool rest of trip bolt with matrix front portion, X contacts to two piezoelectric stack tail ends with lower wedge, upper wedge contacts with lower wedge and forms wedge pre-tightening mechanism, wedge baffle plate is fixedly connected with by two trip bolts with matrix backplane, wedge pre-loading screw is threaded with wedge baffle plate, and with upper wedge apical grafting, the free end of each piezoelectric stack fixes a stainless steel ball-crown body respectively, and matrix underpart and wedge shape are adjusted base and be connected by four trip bolts.Advantage is: the optimized cutting performance that can obtain difficult-to-machine material, the drive part more compact structure that piezoelectric stack and flexible hinge are formed, the tool rest partial volume realizing motion is less, makes cutter still can realize larger displacement in the working angles of high frequency, ensures working (machining) efficiency.
Description
Technical field
The invention belongs to ultra precision cutting and cutting of hardworking material technical field, particularly relate to a kind of off-resonance elliptical vibration cutting device.
Background technology
The effective processing method of one that is accurate and ultraprecise part is created in single point diamond cutting processing, has many advantages being difficult to surmount.But the limitation of the method is that machinable workpiece material kind is limited, the ferrous materials such as hard brittle material, hardened steel such as optical crystal are widely used in precision component and mould, but because these materials can cause serious wear of diamond cutter in working angles, finished surface easily cracks and the defect such as pit, and existing cutting process is difficult to obtain satisfied surface quality.In order to expand the machinable material ranges of diamond cutter, Chinese scholars proposes some processes improved, as sub-zero machining, the saturated cutting of carbon, surface modification cutting etc., wherein elliptical vibration cutting has reduction cutting force, improves machining accuracy, improves surface quality, extends cutter life, realizes the plurality of advantages such as fragile material Ductile Grinding, be considered to a kind of processing method of current most development prospect, receive the extensive concern of academia and industrial quarters.
The drive form of existing elliptical vibration cutting device mainly contains resonance type and the non-co-vibration shape two kinds:
For resonance type elliptical vibration cutting device, main implementation method pastes two pairs of PZT ceramic materials in knife bar side, control often pair of PZT driver by signal generator and two pairs of distributed loads are applied to knife bar, when high order of frequency close to knife bar of the integral multiple of external drive frequency, knife bar will produce ultraharmonic resonance, thus pass through the elliptical vibration track at two oscillation crosswise or an oscillation crosswise and an extensional vibration synthesis point of a knife place.The main deficiency of resonance type elliptical vibratory apparatus has: the 1. difficult design of knife bar, is difficult to the high order mode needed for obtaining; 2. each first order mode and node location depend on the design of knife bar and actual installation way; 3. elliptical vibration difficult parameters is with from main control, lacks flexible; 4. often there is coupling in the transverse bending vibration of knife bar and extensional vibration, easily produces crosstalk.
For non-co-vibration shape elliptical vibration cutting device, by piezoelectric stack Direct driver tool rest during work, by the parameter such as amplitude, phase place of coupling input piezoelectric stack control signal, can at point of a knife place synthesis elliptical vibration track.Compared with resonance type type of drive, its advantage is: 1. the parameter such as the frequency of elliptical vibration and amplitude can initiatively continuous control, thus requires to have better adaptability for different rapidoprints and finished surface; 2. two harmonic motions forming elliptical vibration are uncoupled, can independently control.The drive part of existing non-co-vibration shape elliptical vibration cutting device is mainly divided into multiple piezoelectric stack to be arranged in parallel and is mutually arranged vertically two kinds of forms, the exemplary device that wherein piezoelectric stack is arranged in parallel has: the device of Jia Tuli university of Taegu of Korea S described in " a kind of ultrasonic elliptical vibratory cutting device for micro-V-type slot machining: dynamic analysis and micro-V-type slot machining characteristic ", and the device of North Carolina State University described in " single-point diamond cutter elliptical vibration secondary process ".The main Problems existing of above-mentioned existing apparatus comprises: 1. too small in the displacement of higher operating frequency bottom tool, can not meet the needs of highly-efficient processing; 2. use screw to piezoelectricity pretension respectively, reduce the stability of device and the accuracy of motion; Increase the workload of follow-up signal debugging.Therefore in order to obtain best cutting ability, this non-co-vibration shape elliptical vibration cutting device still needs to be further improved.
Summary of the invention
The invention provides a kind of off-resonance elliptical vibration cutting device, in order to realize the Ultra-precision machining of difficult-to-machine material.
The technical scheme that the present invention takes is:
Diamond cutter is fixedly connected with by the tool rest of trip bolt with matrix front portion, X contacts to two piezoelectric stack tail ends with lower wedge, upper wedge contacts with lower wedge and forms wedge pre-tightening mechanism, wedge baffle plate is fixedly connected with by two trip bolts with matrix backplane, wedge pre-loading screw is threaded with wedge baffle plate, and with upper wedge apical grafting;
Two piezoelectric stacks are arranged in parallel, and the free end of each piezoelectric stack is fixed a stainless steel ball-crown body respectively and formed " ball, plane " point cantact respectively with tool rest and is connected, and matrix underpart and wedge shape are adjusted base and be connected by four trip bolts;
Matrix is one by the integrated member of linear cutter, can be divided into front portion, backboard and three, bottom part:
The front portion of described matrix comprises tool rest and hinge fraction, and tool rest outwardly, and has screwed hole with fixed diamond cutter, and tool rest and four groups of single-axle flexible hinge, for realizing the motion in X-Y plane;
The backboard of described matrix and two wedges and wedge baffle plate form the pre-tightening mechanism of piezoelectric stack jointly;
The bottom of described matrix is wedge shape, adjusts base be fixedly connected with wedge shape, the common micro-adjusting mechanism forming Y-direction.
The invention has the advantages that:
(1) by the mode of Direct driver, the parameter such as frequency, amplitude, phase place of the elliptical vibration cutting motion of ACTIVE CONTROL diamond cutter, can obtain the optimized cutting performance of difficult-to-machine material.
(2) the non-co-vibration shape elliptical vibration cutting device described in is compared with existing topping machanism of the same type, the drive part more compact structure that piezoelectric stack and flexible hinge are formed, the tool rest partial volume realizing motion is less, make cutter still can realize larger displacement in the working angles of high frequency, ensure working (machining) efficiency.
(3) two piezoelectric stacks in X-direction are by wedge pre-tightening mechanism pretension simultaneously, and can ensure that the two pretightning force is identical, pre-tension method is simple and reliable.
(4) the Y-direction micro-adjusting mechanism of bottom can realize Height Adjustment, meets the needs of different processing situation.
(5) no matter the non-co-vibration shape elliptical vibration cutting device described in is structure or control, all very simple, easy to implement.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the assembly structure schematic diagram bottom the present invention;
Fig. 3 is the assembly structure schematic diagram at top of the present invention;
Fig. 4 is the structural representation of pre-tightening apparatus of the present invention;
Fig. 5 is the structural representation of matrix of the present invention;
Fig. 6 is the side view of matrix of the present invention and wedge shape adjustment base engagement;
Fig. 7 is the fundamental diagram of the present invention in one-period.
Detailed description of the invention
Diamond cutter 2 is fixedly connected with by the tool rest of trip bolt 3 with matrix 1 front portion, X contacts with lower wedge 402 to piezoelectric stack 9 tail end with piezoelectric stack 10 tail end, upper wedge 401 contacts with lower wedge 402 and forms wedge pre-tightening mechanism 4, wedge baffle plate 6 is fixedly connected with matrix backplane 105 with trip bolt 28 by trip bolt 1, wedge pre-loading screw 7 is threaded with wedge baffle plate 6, and with upper wedge 401 apical grafting;
Piezoelectric stack 9 and piezoelectric stack 10 are parallel to each other layout, the free end of each piezoelectric stack fixes a stainless steel ball-crown body 12 respectively and respectively with the form of " ball, plane " and tool rest back plane apical grafting, matrix 1 bottom and wedge shape are adjusted base 11 and be connected by four trip bolts;
Matrix 1 is one by the integrated member of linear cutter, can be divided into front portion, backboard and three, bottom part:
The front portion of described matrix comprises tool rest 101, transmits the hinge fraction 103 of the rectilinear motion of the hinge fraction 102 of the rectilinear motion of piezoelectric stack 9 and transmission piezoelectric stack 10, this tool rest outwardly, and have screwed hole with fixed diamond cutter, tool rest and four groups of single-axle flexible hinge, thus realize the motion in X-Y plane;
Backboard 105 and upper wedge 401, lower wedge 402 and the wedge baffle plate 6 of described matrix form the pre-tightening mechanism 4 of piezoelectric stack jointly;
The bottom 104 of described matrix, in wedge shape, adjusts base 11 with wedge shape and is fixedly connected with, the common micro-adjusting mechanism forming Y-direction.
In the precision or super precision lathe of a landing tee office, be arranged on by device of the present invention on the Z axis slide carriage of lathe, clamping workpiece, on main shaft, does at the uniform velocity gyration with main shaft, and diamond cutter does straight-line feed along the X-axis of lathe and Z axis and moves.By the drived control of two piezoelectric stacks, be superposed to an elliptical vibration cutting motion at the cutter location place of diamond cutter.
The drive singal of piezoelectric stack can be expressed as:
In formula, V
1and V
2drive singal u respectively
1(t) and u
2the amplitude of (t),
with
be the initial phase of drive singal respectively, f is the frequency of drive singal.Under the Direct driver of piezoelectric stack, the displacement of diamond cutter cutter location can be expressed as in rectangular coordinate system:
In formula, A
1and A
2the amplitude of cutter location displacement respectively,
with
the phase place of cutter location displacement respectively.By active accommodation and the initial phase mating piezoelectric stack drive singal, namely
with
make the two phase difference be pi/2, namely meet
substitution formula (2), the expectation displacement that can obtain cutter location is:
From formula (3), the motion of piezoelectric stack can synthesize the elliptic motion in X-Y plane at cutter location place, this elliptic motion equation is expressed as follows:
[x(t)/A
1]
2+[y(t)/A
2]
2=1(4)
It should be noted that: by controlling the initial phase of piezoelectric stack drive singal, make to keep certain phase difference therebetween, diamond cutter can do major and minor axis and become elliptic motion at any angle in X-Y plane.
Diamond cutter is arranged on the tool rest of matrix front portion, tool rest by X to four groups of flexure hinge mechanisms lead, and by X to two piezoelectric stacks of being arranged in parallel drive; The arbitrary ellipse motion in X-Y plane is realized at the cutter location place of diamond cutter.
Described off-resonance elliptical vibration cutting device, X to two piezoelectric stacks of being arranged in parallel drive by wedge pre-tightening mechanism pretension simultaneously in the axial direction, identical to ensure the pretightning force of the two.Wedge design meets not condition of self-locking.
Described off-resonance elliptical vibration cutting device, two X to the free end of piezoelectric stack respectively fix a stainless steel ball-crown body, make between piezoelectric stack with tool rest, to form " ball-plane " to contact, thus make tool rest part relatively can do small translation and swing by piezoelectric stack while with piezoelectric stack motion.
The matrix of described off-resonance elliptical vibration cutting device, be one can by the integrated member of linear cutter, front portion, backboard and three, bottom part can be divided into: the front portion of described matrix comprises tool rest and hinge fraction, tool rest outwardly, and have screwed hole with fixed diamond cutter, tool rest and four groups of single-axle flexible hinge, thus realize the motion in X-Y plane; The backboard of described matrix and wedge and wedge baffle plate form the pre-tightening mechanism of piezoelectric stack jointly, and adjustment wedge pre-loading screw can realize effective pretension to piezoelectric stack; The bottom of described matrix is wedge shape, adjusts base be fixedly connected with wedge shape, the common micro-adjusting mechanism forming Y-direction, by changing wedge shape adjustment base position in the X direction, and can the fine position of implement device in Y-direction.
Claims (5)
1. an off-resonance elliptical vibration cutting device, it is characterized in that: diamond cutter is fixedly connected with by the tool rest of trip bolt with matrix front portion, X contacts to two piezoelectric stack tail ends with lower wedge, upper wedge contacts with lower wedge and forms wedge pre-tightening mechanism, wedge baffle plate is fixedly connected with by two trip bolts with matrix backplane, wedge pre-loading screw is threaded with wedge baffle plate, and with upper wedge apical grafting;
Described X is arranged in parallel to two piezoelectric stacks, and the free end of each piezoelectric stack is fixed a stainless steel ball-crown body respectively and formed " ball, plane " point cantact respectively with tool rest and is connected, and matrix underpart and wedge shape are adjusted base and be connected by four trip bolts.
2. a kind of off-resonance elliptical vibration cutting device according to claim 1, is characterized in that: described matrix be one by the integrated member of linear cutter, be divided into front portion, backboard and three, bottom part.
3. a kind of off-resonance elliptical vibration cutting device according to claim 2, it is characterized in that: the front portion of described matrix comprises tool rest and hinge fraction, tool rest outwardly, and have screwed hole with fixed diamond cutter, tool rest and four groups of single-axle flexible hinge, for realizing the motion in X-Y plane.
4. a kind of off-resonance elliptical vibration cutting device according to claim 2, is characterized in that: the backboard of described matrix and two wedges and wedge baffle plate form the pre-tightening mechanism of piezoelectric stack jointly.
5. a kind of off-resonance elliptical vibration cutting device according to claim 2, is characterized in that: the bottom of described matrix is wedge shape, adjusts base be fixedly connected with wedge shape, the common micro-adjusting mechanism forming Y-direction.
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