CN103394705B - Off-resonance three-dimensional elliptical diamond vibration cutting method and device - Google Patents
Off-resonance three-dimensional elliptical diamond vibration cutting method and device Download PDFInfo
- Publication number
- CN103394705B CN103394705B CN201310348795.0A CN201310348795A CN103394705B CN 103394705 B CN103394705 B CN 103394705B CN 201310348795 A CN201310348795 A CN 201310348795A CN 103394705 B CN103394705 B CN 103394705B
- Authority
- CN
- China
- Prior art keywords
- piezoelectric stack
- hinge
- promotion face
- diamond
- resonance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Milling Processes (AREA)
Abstract
The invention relates to an off-resonance three-dimensional elliptical diamond vibration cutting method and device and belongs to a cutting method and device. Four piezoelectric stacks which are placed in parallel are driven according to input signals, and phase angles of the input signals are different in a two-to-two mode. The piezoelectric stacks push a pushing face on a tool apron hinge base body to enable various hinges to produce micrometric displacement, therefore a diamond cutter point three-dimensional elliptical movement track capable of being adjusted can be obtained, the track can be adjusted initiatively through frequency, amplitudes and phase differences of driving signals of the piezoelectric stacks and installation positions of the piezoelectric stacks. The off-resonance three-dimensional elliptical diamond vibration cutting method and device can meet requirements for various difficult-to-machine materials and different face types through diamond cutting, and obtains the best cutting machining performance.
Description
Technical field
The invention belongs to Ultra-precision machining and the complicated optical effect correction technical field of difficult-to-machine material, particularly relate to a kind of off-resonance three-dimensional elliptical vibrocutting method and device.
Background technology
In recent years, along with the fast development of the industrial circle such as Aero-Space and national defence, the optics of Ultra-precision Turning and the demand of electronic component are also increased increasingly, but due to some high-performance but the restriction of difficult-to-machine material self-condition, traditional diamond cutting cutting method has been difficult to meet the demands because tool wear is too fast.
One dimension vibrocutting One-Dimensional Ultrasonic Vibration Cutting (1DUVC) on this basis, also traditional vibrocutting is claimed, the cutting of some difficult-to-machine materials is successfully applied to from 1966, but also there are some defects, the Ultra-precision Turning that such as surface roughness is less than 0.1 μm is difficult to realize, and the workpiece of Hardmetal materials cannot be processed.
In order to overcome the shortcoming of above-mentioned vibrocutting, international scholars propose some processes improved in succession, wherein being considered to the most rising a kind of processing method is at present exactly elliptical vibration cutting (the Elliptical Vibration Cutting proposed for 1993, hereinafter referred to as EVC), the namely vibrocutting of two dimension, EVC has suppression flutter, reduce cutting force, improve machining accuracy and surface quality, reduce tool wear, improve cutter life, realize the plurality of advantages such as fragile material Ductile Grinding, be subject to showing great attention to of international academic community and engineering circles in recent years, such as: the people such as the Sen Xiejun road professor of Japan Kobe university, the people such as this English of society two professor of Nagoya University, the people such as professor E.Brinksmeier of Bremen university of Germany, the people such as Thomas professor A.Dow of north Carolina university of the U.S., the K.F.Ehmann professor of Northwestern Univ USA, the people such as professor C.Nath of NUS.Existing result of study shows, EVC can obtain optical quality surface, can reduce wear of diamond cutter again, improves its service life.
Now widely used EVC drives and belongs to resonance type mode, be characterized in that the frequency vibrated is higher, existing document shows to can reach 60KHZ, mainly apply two distributed loads in the both sides of knife bar by piezo electrics, according to non-linear ultraharmonic resonance principle, point of a knife point is made to produce the elliptical trajectory of two dimension, but the shortcoming that seen two-dimentional EVC generally has at present is: the non-linear ultraharmonic resonance of (1) knife bar exists coupling on transverse bending vibration and extensional vibration, is easy to produce crosstalk.(2) the constant frequency of elliptical vibration that causes of the natural mode of vibration of knife bar can not adjust, and is difficult to the process requirements adapting to different rapidoprint.(3) obtain the node of knife bar clamping by analyzing the vibration shape, the design difficulty of knife bar is comparatively large, may occur deviation, affect machining accuracy in reality processing.The people such as professor ThomasA.Dow of north Carolina university study and propose non-resonant type of drive to overcome the shortcoming of resonance type type of drive.Off-resonance drive mainly based on piezoelectric stack configured in parallel or mutually arranged perpendicular directly drive structure, major advantage is: can the parameter such as frequency and amplitude of active accommodation point of a knife elliptic motion, be suitable for the different material of processing and surface, but still come with some shortcomings: the position of (1) piezoelectric actuator on device is fixed, forming oval place plane can not adjust.(2) elliptical trajectory opened loop control during actual cut is inevitably out of shape or distortion.
In order to meet the process requirements of different surfaces shape, two-dimentional EVC needs badly to three-dimensional development, and the people such as this English of society two professor of Japan Nagoya university propose the three-dimensional EVC of resonance type on the basis of resonance type two dimension EVC.For the three-dimensional EVC of resonance type, the generation of point of a knife elliptic motion is still based on two oscillation crosswise of knife bar and an extensional vibration ultraharmonic resonance synthesis.The advantage that three-dimensional EVC compares two-dimentional EVC is: can control the flat orientation of point of a knife point formation elliptic motion, make it to be positioned at bits plane of flow.But weak point is still: the three-dimensional EVC of existing resonance type, point of a knife point forms the demand that elliptical trajectory parameter (such as elliptic motion frequency) is still difficult to adjust, cannot adapt to process different materials.
A kind of mixing three-dimensional elliptical vibrocutting method that patent (CN102078967A) is mentioned, although the space three-dimensional elliptical trajectory of diamond cutter can be generated, but this track has some limitations, because its piezoelectric stack position cannot change, the space, three-dimensional elliptical movement locus place generated is caused to there is limitation.
The three-dimensional elliptical cutting process that patent (CN102059575A) is mentioned and device are except said method defective, piezoelectric stack is fixed in installation site in a device, parameter adjustment is limited in scope, and device does not have the height fine adjusting function function of diamond point of a knife, for can match machined lathe require higher, not there is generality.
A kind of three-dimensional elliptical vibration cutting device that patent (CN102371359A) is mentioned does not possess diamond tool cusp height fine setting part equally, the oval limitation of the space three-dimensional that piezoelectric stack three vertical distribution causes does not change, and the position of piezoelectric stack can not adjust three-dimensional elliptical.
In sum, existing elliptical vibration cutting processing method and device also also exist many deficiencies.
Summary of the invention
The invention provides a kind of off-resonance three-dimensional elliptical diamond vibrocutting method and device, thus realize the Ultra-precision machining of difficult-to-machine material.
The technical scheme that the present invention takes is:
A kind of off-resonance three-dimensional elliptical diamond vibrocutting method is as follows: the piezoelectric stack one of four parallel placements, piezoelectric stack two, piezoelectric stack three, piezoelectric stack four are driven by the drive singal inputted respectively, and this drive singal is:
these four piezoelectric stacks promote promotion face one in tool apron hinge base body, promotion face two, promotion face three, promotion face four respectively, hinge one, hinge two, hinge three, hinge four is made to produce micrometric displacement and lead, when the phase angle of these four piezoelectric stack drive singal exists phase difference between any two, obtain the point of a knife point three-dimensional elliptical movement locus of the diamond cutter that can adjust.This track initiatively can be adjusted by the frequency of piezoelectric stack drive singal, amplitude, phase difference and piezoelectric stack installation site.
A kind of off-resonance three-dimensional elliptical diamond vibration cutting device, base is fixedly connected with block under fastening seat, tool apron hinge base body is connected on base, header board is fixedly connected with tool apron hinge base body front portion, upper plate is fixedly connected with tool apron hinge base body top, diamond cutter is installed in the tool rest in tool apron hinge base body, piezoelectric stack one, piezoelectric stack two, piezoelectric stack three, piezoelectric stack four is promoting face one respectively by four piezoelectricity cushion blocks by the trip bolt pretension on rear plate, promotion face two, promotion face three, between promotion face four and rear plate, wedge is between base and rear plate, wedge there is the height for tool setting tool carry out the height fine adjusting function screw of finely tuning, detect the capacitive displacement transducer one of Piezoelectric Driving displacement, capacitive displacement transducer two, capacitive displacement transducer three, capacitive displacement transducer four is respectively by sensor holder one, sensor holder two, sensor holder three, sensor holder four is installed on rear plate.
A kind of embodiment of a kind of off-resonance of the present invention three-dimensional elliptical diamond vibration cutting device is: piezoelectric stack one, piezoelectric stack two, piezoelectric stack three, the parallel placement of piezoelectric stack four, and piezoelectric stack end and tool apron hinge base body promote face one, promotion face two, promotion face three, promotion face four way of contact are point cantact.
A kind of embodiment of a kind of off-resonance of the present invention three-dimensional elliptical diamond vibration cutting device is: tool apron hinge base body is an entirety by linear cutter, comprise the installation tool rest of diamond cutter, hinge one, hinge two, hinge three, hinge four, promotion face one, promotion face two, promotion face three, promotion face four and hinge of pulling back.
Advantage of the present invention is as follows:
(1) have employed non-resonant mode, can active accommodation diamond cutter three-dimensional elliptical motion parameter (piezoelectricity and tool rest X, Y-direction distance, frequency, phase difference, amplitude etc.), thus the active accommodation of implementation space three-dimensional elliptical, better adapt to the requirement of processed complex curved surface.
(2) the space three-dimensional ellipse that the three-dimensional elliptical vibrocutting orbit generation method of the present invention's design generates can be adjusted by the parameter of adjusting device and signal, major parameter has: the amplitude and the phase angle that apply signal, and the position that piezoelectric stack is installed, thus the three-dimensional elliptical realized in arbitrary plane generates.
(3) four piezoelectric stacks 1201,1202,1203,1204 are all symmetric with flexible hinge 401,402,403,404, reduce difficulty when apparatus for establishing model and gouge free machining, more easily realize accurately controlling simultaneously.
(4) four piezoelectric stacks 1201,1202,1203,1204 are placed in the piezoelectricity groove on rear plate 6, realize the pretension of piezoelectric stack by trip bolt jack-up piezoelectricity cushion block 13 from rear plate 6, simultaneously piezoelectric stack 1201,1202,1203,1204 installation sites in rear plate 6 can adjust, and realize the adjustment of three-dimensional elliptical with this.
(5) in order to avoid overall displacement occurs the plane at tool rest and flexible hinge place, hinge 409 of pulling back is by being bolted on rear plate 6, and bolt also can regulate piezoelectric stack 1201,1202,1203, the pretightning force of 1204 to a certain extent simultaneously.
(6) in the position that tool rest contacts with submounts with flexible hinge matrix, devise a kind of tool position fine setting block, be made up of voussoir 7 and micrometer adjusting screw 8, the accurate fine setting of position of tool tip in 0-2 cm range can be realized.
(7) afterwards in plate 6 piezoelectricity groove side by sensor holder 1101,1102,1103,1104 clamp capacitance formula displacement transducers 1001,1002,1003,1004, with piezoelectric stack 1201,1202,1203,1204 parallel placements, directly measure the displacement of Piezoelectric Driving tool rest, are gathered the power output data of Piezoelectric Driving by the force snesor be placed on below piezoelectric stack, through the conversion of structural model, realize controlling the power position of device three-dimensional elliptical vibrocutting.
Accompanying drawing explanation
Fig. 1 is off-resonance three-dimensional elliptical diamond vibration cutting device of the present invention entirety assembling front isometric view;
Fig. 2 is off-resonance three-dimensional elliptical diamond vibration cutting device of the present invention entirety assembling rear isometric figure;
Fig. 3 is the axonometric drawing that off-resonance three-dimensional elliptical diamond vibration cutting device of the present invention removes header board, upper plate and base;
Fig. 4 is assembled shaft mapping on plate after off-resonance three-dimensional elliptical diamond vibration cutting device of the present invention;
Fig. 5 is off-resonance three-dimensional elliptical diamond vibration cutting device tool apron hinge axonometric drawing of the present invention;
Fig. 6 is plate axonometric drawing after off-resonance three-dimensional elliptical diamond vibration cutting device of the present invention;
Fig. 7 is off-resonance three-dimensional elliptical diamond vibration cutting device trace generator method model figure of the present invention;
Fig. 8 is off-resonance three-dimensional elliptical diamond vibration cutting device control block diagram of the present invention.
Detailed description of the invention
A kind of off-resonance three-dimensional elliptical diamond vibrocutting method is as follows:
The piezoelectric stack 1 of four parallel placements, piezoelectric stack 2 1202, piezoelectric stack 3 1203, piezoelectric stack 4 1204 are driven by the drive singal inputted respectively, and this drive singal is:
these four piezoelectric stacks promote promotion face 1 in tool apron hinge base body 4, promotion face 2 406, promotion face 3 407, promotion face 4 408 respectively, make hinge 1, hinge 2 402, hinge 3 403, hinge 4 404 produce micrometric displacement to lead, when the phase angle of these four piezoelectric stack drive singal exists phase difference between any two, obtain the point of a knife point three-dimensional elliptical movement locus of the diamond cutter 3 that can adjust.This track initiatively can be adjusted by the frequency of piezoelectric stack drive singal, amplitude, phase difference and piezoelectric stack installation site.
A kind of off-resonance three-dimensional elliptical diamond vibration cutting device, base 1 is fixedly connected with block under fastening seat 9, tool apron hinge base body 4 is connected on base 1, header board 2 is fixedly connected with tool apron hinge base body 4 front portion, upper plate 5 is fixedly connected with tool apron hinge base body 4 top, diamond cutter 3 is installed in the tool rest in tool apron hinge base body 4, piezoelectric stack 1, piezoelectric stack 2 1202, piezoelectric stack 3 1203, piezoelectric stack 4 1204 is promoting face 1 respectively by four piezoelectricity cushion blocks 13 by the trip bolt pretension on rear plate 6, promotion face 2 406, promotion face 3 407, between promotion face 4 408 and rear plate 6, wedge 7 is between base 1 and rear plate 6, wedge 7 there is the height for tool setting tool 3 carry out the height fine adjusting function screw 8 of finely tuning, detect the capacitive displacement transducer 1 of Piezoelectric Driving displacement, capacitive displacement transducer 2 1002, capacitive displacement transducer 3 1003, capacitive displacement transducer 4 1004 is respectively by sensor holder 1, sensor holder 2 1102, sensor holder 3 1103, sensor holder 4 1104 is installed on rear plate 6.
A kind of embodiment of a kind of off-resonance of the present invention three-dimensional elliptical diamond vibration cutting device is: piezoelectric stack 1, piezoelectric stack 2 1202, piezoelectric stack 3 1203, the parallel placement of piezoelectric stack 4 1204, and piezoelectric stack end and tool apron hinge base body promote face 1, promotion face 2 406, promotion face 3 407, promotion face 4 408 way of contact are point cantact.
A kind of embodiment of a kind of off-resonance of the present invention three-dimensional elliptical diamond vibration cutting device is: tool apron hinge base body 4 is an entirety by linear cutter, comprise the installation tool rest of diamond cutter 3, hinge 1, hinge 2 402, hinge 3 403, hinge 4 404, promotion face 1, promotion face 2 406, promotion face 3 407, promotion face 4 408 and hinge 409 of pulling back.
By the base 1 of fastener, this device is arranged on the guide rail of lathe, the diamond cutter on tool rest drives the three-dimensional elliptical producing high frequency to move by the piezoelectric stack of four parallel placements, and the drive singal of four piezoelectric stacks is as follows:
Through the space coordinate conversion of motion with tool rest parameter, as shown in Figure 7, the coordinates of motion generation formula of diamond tool cusp is as follows:
In formula, x
ct, y
ctand z
ctit is the cartesian coordinate of diamond tool cusp; A
1, A
2, A
3, A
4the vibration amplitude of four Piezoelectric Driving respectively;
the phase angle of four Piezoelectric Driving respectively; W is vibration frequency; T is time variable; Lx1, lx2, ly1, ly2 are the distances at Piezoelectric Driving contact point and tool rest center; Lz is the distance of diamond tool cusp and XOY plane; θ
y1y3, θ
y2y4orthogonal two groups of angles between hinge and XOY plane.
By motion synthesis, the equation of three-dimensional elliptical is:
According to formula (1)-(3), by these three piezoelectric stack drive singal y of active accommodation
1, y
2, y
3, y
4phase angle
make each phase angle different between two, then the point of a knife point of diamond cutter just can produce a three-dimensional elliptical movement locus in cartesian coordinate system.
Fig. 8 shows the control system block diagram of simplification that the present invention adopts, and wherein mainly includes: lathe, workpiece, revolution grating, interface board, diamond cutter, piezoelectric stack, power amplifier, high performance controller and capacitive displacement transducer and force snesor.
According to Fig. 1-Fig. 8, the detailed description of the invention of device of the present invention is as follows:
1. by the front-end of spindle of bar work clamping at diaxon half precise NC lathe (X-axis, Z axis and C axle), moved by main shaft gyration and realize the rotary feed campaign of workpiece, gather main shaft transient state corner by angular displacement grationg.
2. the three-dimensional elliptical vibration cutting device that the present invention designs is arranged on the guide rail of numerically controlled lathe, to four piezoelectric stacks 1201,1202,1203,1204 apply control signal, make the point of a knife point of diamond cutter 3 produce high frequency elliptical trajectory in three dimensions, generate diamond cutter principal cutting movement.
3., by regulating the trip bolt 8 on vibration cutting device base, adjustment wedge 7 enters the micrometric displacement amount below tool apron hinge base body 4, regulates the position of tool tip of diamond cutter 3 and the uniformity of the alignment of shafts.
4. by four capacitive displacement transducers, detect the transient Displacements of four flexible hinges in vibration cutting device, accurate tracking controls three-dimensional elliptical movement locus.
5. by a Circular gratings, gather angle of eccentricity data, detect the transient position of main shaft, to realize the elaborate servo of angle of eccentricity.
6., by a controller, to realize detecting angle of eccentricity, the transient Displacements of 4 driving elements detects and the tracing control of three-dimensional elliptical movement locus.
Claims (4)
1. an off-resonance three-dimensional elliptical diamond vibrocutting method, it is characterized in that: a kind of off-resonance three-dimensional elliptical diamond vibrocutting method is as follows: the piezoelectric stack one of four parallel placements, piezoelectric stack two, piezoelectric stack three, piezoelectric stack four are driven by the drive singal inputted respectively, and this drive singal is respectively:
wherein A
1, A
2, A
3, A
4the vibration amplitude of four piezoelectric drive signals respectively,
the phase angle of four piezoelectric drive signals respectively, w is vibration frequency, t is time variable, these four piezoelectric stacks promote promotion face one in tool apron hinge base body, promotion face two, promotion face three, promotion face four respectively, hinge one, hinge two, hinge three, hinge four is made to produce micrometric displacement and lead, four described hinges are orthogonal two groups, when the phase angle of these four piezoelectric stack drive singal exists phase difference between any two, obtain the point of a knife point three-dimensional elliptical movement locus of the diamond cutter that can adjust.
2. an off-resonance three-dimensional elliptical diamond vibration cutting device, it is characterized in that: base is fixedly connected with block under fastening seat, tool apron hinge base body is connected on base, header board is fixedly connected with tool apron hinge base body front portion, upper plate is fixedly connected with tool apron hinge base body top, diamond cutter is installed in the tool rest in tool apron hinge base body, piezoelectric stack one, piezoelectric stack two, piezoelectric stack three, piezoelectric stack four is promoting face one respectively by four piezoelectricity cushion blocks by the trip bolt pretension on rear plate, promotion face two, promotion face three, between promotion face four and rear plate, wedge is between base and rear plate, wedge there is the height for tool setting tool carry out the height fine adjusting function screw of finely tuning, detect the capacitive displacement transducer one of Piezoelectric Driving displacement, capacitive displacement transducer two, capacitive displacement transducer three, capacitive displacement transducer four is respectively by sensor holder one, sensor holder two, sensor holder three, sensor holder four is installed on rear plate.
3. a kind of off-resonance three-dimensional elliptical diamond vibration cutting device according to claim 2, it is characterized in that: piezoelectric stack one, piezoelectric stack two, piezoelectric stack three, the parallel placement of piezoelectric stack four, piezoelectric stack end and tool apron hinge base body promote face one, promotion face two, promotion face three, promotion face four way of contact be point cantact.
4. a kind of off-resonance three-dimensional elliptical diamond vibration cutting device according to claim 2, it is characterized in that: tool apron hinge base body is an entirety by linear cutter, comprise the installation tool rest of diamond cutter, hinge one, hinge two, hinge three, hinge four, promotion face one, promotion face two, promotion face three, promotion face four and hinge of pulling back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310348795.0A CN103394705B (en) | 2013-08-12 | 2013-08-12 | Off-resonance three-dimensional elliptical diamond vibration cutting method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310348795.0A CN103394705B (en) | 2013-08-12 | 2013-08-12 | Off-resonance three-dimensional elliptical diamond vibration cutting method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103394705A CN103394705A (en) | 2013-11-20 |
| CN103394705B true CN103394705B (en) | 2015-07-22 |
Family
ID=49558530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310348795.0A Active CN103394705B (en) | 2013-08-12 | 2013-08-12 | Off-resonance three-dimensional elliptical diamond vibration cutting method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103394705B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817064B (en) * | 2014-02-28 | 2016-01-13 | 大连交通大学 | Two-dimensional piezoelectric shaking platform |
| CN104001943B (en) * | 2014-06-17 | 2016-04-27 | 大连交通大学 | A kind of three-dimensional elliptical vibratory turning knife rest |
| CN104117697B (en) * | 2014-07-17 | 2016-04-20 | 吉林大学 | A kind of off-resonance elliptical vibration cutting device |
| CN104942377B (en) * | 2015-07-07 | 2017-08-25 | 长春工业大学 | Elliptical vibration cutting servicing unit based on three Piezoelectric Drivings |
| CN105033290B (en) * | 2015-07-14 | 2017-06-27 | 沈阳远大科技园有限公司 | A kind of multipurpose vibrocutting cutter |
| CN105108579B (en) * | 2015-09-25 | 2017-06-16 | 哈尔滨工业大学 | A kind of three-dimensional micro-displacement adjustment platform |
| CN105127818B (en) * | 2015-10-03 | 2017-09-22 | 长春工业大学 | A kind of hinge tandem elliptical vibration cutting flexible apparatus |
| CN106312591A (en) * | 2016-11-09 | 2017-01-11 | 长春工业大学 | Three-dimensional oval micro displacement motion platform under three-piezoelectric perpendicular drive |
| CN107350558B (en) * | 2017-03-02 | 2019-07-09 | 南京航空航天大学 | Umbrella parallel-connection structure three-D ultrasonic elliptical vibration cutting device and track production method |
| CN109249546B (en) * | 2017-07-13 | 2024-10-11 | 长春工业大学 | Vibration rotary cutting device and in-situ flutter identification method thereof |
| CN111791079B (en) * | 2020-05-22 | 2021-08-31 | 浙江大学 | Electromagnetic driving type quick cutter servo system based on flexible hinge combined mechanism |
| CN116021229B (en) * | 2023-01-31 | 2024-04-09 | 清华大学 | Efficient processing device and method for columnar micro-nano texture with high aspect ratio of metal surface |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0979700A2 (en) * | 1998-08-12 | 2000-02-16 | Towa Corporation | Elliptical vibration cutting method and elliptical vibration cutting apparatus |
| CN101972856A (en) * | 2010-09-16 | 2011-02-16 | 长春工业大学 | Non-resonant three-dimensional elliptical diamond fly-cutting optical free curved surface method and special device |
| CN102059575A (en) * | 2010-11-26 | 2011-05-18 | 吉林大学 | Three-dimensional elliptic motion generating method and device for diamond cutter |
| CN102078967A (en) * | 2010-12-30 | 2011-06-01 | 吉林大学 | Hybrid frequency-driven three-dimensional ellipse turning method |
| CN102371359A (en) * | 2011-11-03 | 2012-03-14 | 吉林大学 | Three-dimensional elliptical vibration cutting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4891445B1 (en) * | 2011-03-17 | 2012-03-07 | パナソニック電工株式会社 | Ultra-precision combined machining apparatus and ultra-precise combined machining method |
-
2013
- 2013-08-12 CN CN201310348795.0A patent/CN103394705B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0979700A2 (en) * | 1998-08-12 | 2000-02-16 | Towa Corporation | Elliptical vibration cutting method and elliptical vibration cutting apparatus |
| CN101972856A (en) * | 2010-09-16 | 2011-02-16 | 长春工业大学 | Non-resonant three-dimensional elliptical diamond fly-cutting optical free curved surface method and special device |
| CN102059575A (en) * | 2010-11-26 | 2011-05-18 | 吉林大学 | Three-dimensional elliptic motion generating method and device for diamond cutter |
| CN102078967A (en) * | 2010-12-30 | 2011-06-01 | 吉林大学 | Hybrid frequency-driven three-dimensional ellipse turning method |
| CN102371359A (en) * | 2011-11-03 | 2012-03-14 | 吉林大学 | Three-dimensional elliptical vibration cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103394705A (en) | 2013-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103394705B (en) | Off-resonance three-dimensional elliptical diamond vibration cutting method and device | |
| CN101972856B (en) | Non-resonant three-dimensional elliptical diamond fly-cutting optical free curved surface method and special device | |
| CN103611947B (en) | A kind of hinge parallel type elliptical vibration cutting flexible apparatus | |
| CN102078967B (en) | Hybrid frequency-driven three-dimensional ellipse turning method | |
| CN104117697B (en) | A kind of off-resonance elliptical vibration cutting device | |
| JP5103620B2 (en) | Elliptical vibration cutting apparatus and elliptical vibration cutting method | |
| CN102371359B (en) | Three-dimensional elliptical vibration cutting device | |
| CN105149626B (en) | A kind of two piezoelectricity vertical ellipse vibration cutting devices for being suitable to vertical Excircle machining | |
| Zhou et al. | Development of an innovative device for ultrasonic elliptical vibration cutting | |
| CN204997431U (en) | Flexible device of hinge serial -type elliptical vibration cutting | |
| CN105312679A (en) | Three-dimensional ultrasound elliptical vibration assisted cutting device and elliptical orbit generation method | |
| CN103116314B (en) | Method of correction on amplitude attenuation and phase delay of fast tool servo system | |
| CN111732073B (en) | Device and method for machining micro-nano composite structure based on needle point track movement | |
| EP2103376B1 (en) | Cutting device for vibration cutting | |
| CN105137723A (en) | Three-dimensional ellipse movement work table for two-photon polymerization processing | |
| CN103611988B (en) | A kind of off-resonance three-dimensional elliptical diamond vibrocutting flexible apparatus | |
| CN111823418B (en) | Ultra-precise fly-cutting machining tool surface shape error compensation and control method | |
| CN109759308A (en) | Laser assisted on-line measurement three-dimensional elliptical ultrasonic vibration assist processing platform | |
| CN105127452A (en) | Parallel-type oval vibration turning device applicable to vertical type excircle machining | |
| CN109866074A (en) | A kind of variable element three-D ultrasonic vibration processing device and processing method | |
| Jiang et al. | Novel tool offset fly cutting straight-groove-type micro structure arrays | |
| CN102139459A (en) | Cutter servo compensation driving device for micronano cutting | |
| CN105127818B (en) | A kind of hinge tandem elliptical vibration cutting flexible apparatus | |
| CN106041133A (en) | Angle-adjustable universal non-resonant elliptical vibration cutting flexible device | |
| Ahn et al. | Improvement of micro-machining accuracy by 2-dimensional vibration cutting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210630 Address after: 215500 5th floor, building 4, 68 Lianfeng Road, Changfu street, Changshu City, Suzhou City, Jiangsu Province Patentee after: Changshu intellectual property operation center Co.,Ltd. Address before: 130012 No. 2699 Qianjin Street, Jilin, Changchun Patentee before: Jilin University |