CN104084711A - 一种无铅焊锡助焊膏 - Google Patents
一种无铅焊锡助焊膏 Download PDFInfo
- Publication number
- CN104084711A CN104084711A CN201410281277.6A CN201410281277A CN104084711A CN 104084711 A CN104084711 A CN 104084711A CN 201410281277 A CN201410281277 A CN 201410281277A CN 104084711 A CN104084711 A CN 104084711A
- Authority
- CN
- China
- Prior art keywords
- parts
- diethylene glycol
- lead
- tin
- dibromo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title abstract 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 13
- QWVCIORZLNBIIC-UHFFFAOYSA-N 2,3-dibromopropan-1-ol Chemical compound OCC(Br)CBr QWVCIORZLNBIIC-UHFFFAOYSA-N 0.000 claims abstract description 12
- FDWUUSLGWNMVCJ-UHFFFAOYSA-N 2-bromo-3-hexadecylpyridine Chemical compound CCCCCCCCCCCCCCCCC1=CC=CN=C1Br FDWUUSLGWNMVCJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 12
- 239000011777 magnesium Substances 0.000 claims abstract description 12
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims abstract description 5
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000006071 cream Substances 0.000 claims description 15
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 claims description 11
- -1 0.2 part Chemical compound 0.000 claims description 7
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical class CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000002171 ethylene diamines Chemical class 0.000 claims description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- 230000007613 environmental effect Effects 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 abstract description 7
- 239000007787 solid Substances 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 abstract 2
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 abstract 1
- QUUCYKKMFLJLFS-UHFFFAOYSA-N Dehydroabietan Natural products CC1(C)CCCC2(C)C3=CC=C(C(C)C)C=C3CCC21 QUUCYKKMFLJLFS-UHFFFAOYSA-N 0.000 abstract 1
- NFWKVWVWBFBAOV-UHFFFAOYSA-N Dehydroabietic acid Natural products OC(=O)C1(C)CCCC2(C)C3=CC=C(C(C)C)C=C3CCC21 NFWKVWVWBFBAOV-UHFFFAOYSA-N 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- NFWKVWVWBFBAOV-MISYRCLQSA-N dehydroabietic acid Chemical compound OC(=O)[C@]1(C)CCC[C@]2(C)C3=CC=C(C(C)C)C=C3CC[C@H]21 NFWKVWVWBFBAOV-MISYRCLQSA-N 0.000 abstract 1
- 229940118781 dehydroabietic acid Drugs 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明公开了一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡80-90份,银2-4份,铜0.2-1份,镁0.1-0.3份,脱氢松香2-6份,十六烷基溴代吡啶0.2-1份,葵二酸2-4份,乙二胺2-3份，二乙二醇单丁醚2-4份，二乙二醇单己醚3-6份，双硬脂酸酰胺0.2-1份，BHT0.2-1份，2，3一二溴丙醇0.2-1份。本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
Description
技术领域
本发明涉及金属焊接领域，具体涉及一种无铅焊锡助焊膏。
背景技术
助焊剂在焊接的过程中能去除氧化物，降低被焊接材质表面张力，广泛应用于钟表仪器、精密部件、医疗器械、移动通信、数码产品及各类PCB板和BGA锡球的焊接。
助焊膏出现在20世纪70年代的表面贴装技术(SurfaceMountAssembly,简称SMT),是指在印制电路板焊盘上印刷、涂布焊锡膏，并将表面贴装元器件准确的贴放到涂有焊锡膏的焊盘上，按照特定的回流温度曲线加热电路板，让焊锡膏融化，其合金成分冷却凝固后在元器件与印制电路板之间形成焊点而实现冶金连接的技术。焊锡膏是伴随着SMT应运而生的一种新型焊接材料。焊锡膏是一个复杂的体系，是由焊锡粉、助焊剂以及其它的添加物加以混合，形成的乳脂状混合物。焊锡膏在常温下有一定的勃度，可将电子元器件初粘在既定位置，在焊接温度下，随着溶剂和部分添加剂的挥发，将被焊元器件与印制电路焊盘焊接在一起形成永久连接。现有的助焊膏大多还有铅等重金属，不够环保，容易造成污染。现研究一种无铅焊锡助焊膏，环保高效，提高焊接的牢固性。
发明内容
针对上述问题，本发明提供了一种无铅焊锡助焊膏，环保无污染，提高了焊接的牢固性。
为了解决上述问题，本发明提供的技术方案为：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡80-90份,银2-4份,铜0.2-1份,镁0.1-0.3份,脱氢松香2-6份,十六烷基溴代吡啶0.2-1份,葵二酸2-4份,乙二胺2-3份，二乙二醇单丁醚2-4份，二乙二醇单己醚3-6份，双硬脂酸酰胺0.2-1份，BHT0.2-1份，2，3一二溴丙醇0.2-1份。
优选的，所述各重量份原料为：锡82-88份,银2.5-3.5份,铜0.4-0.8份,镁0.15-0.25份,脱氢松香3-5份,十六烷基溴代吡啶0.4-0.8份,葵二酸2.5-3.5份,乙二胺2.2-2.8份，二乙二醇单丁醚2.5-3.5份，二乙二醇单己醚4-5份，双硬脂酸酰胺0.4-0.8份，BHT0.4-0.8份，2，3一二溴丙醇0.4-0.8份。
优选的，所述各重量份原料为：锡85份,银3份,铜0.6份,镁0.2份,脱氢松香4份,十六烷基溴代吡啶0.6份,葵二酸3份,乙二胺2.5份，二乙二醇单丁醚3份，二乙二醇单己醚4.5份，双硬脂酸酰胺0.6份，BHT0.6份，2，3一二溴丙醇0.6份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
具体实施方式
下面对本发明做进一步说明：
实施例一：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡80份,银2份,铜0.2份,镁0.1份,脱氢松香2份,十六烷基溴代吡啶0.2份,葵二酸2份,乙二胺2份，二乙二醇单丁醚2份，二乙二醇单己醚3份，双硬脂酸酰胺0.2份，BHT0.2份，2，3一二溴丙醇0.2份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
实施例二：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡90份,银4份,铜1份,镁0.3份,脱氢松香6份,十六烷基溴代吡啶1份,葵二酸4份,乙二胺3份，二乙二醇单丁醚4份，二乙二醇单己醚6份，双硬脂酸酰胺1份，BHT1份，2，3一二溴丙醇1份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
实施例三：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡85份,银3份,铜0.6份,镁0.2份,脱氢松香4份,十六烷基溴代吡啶0.6份,葵二酸3份,乙二胺2.5份，二乙二醇单丁醚3份，二乙二醇单己醚4.5份，双硬脂酸酰胺0.6份，BHT0.6份，2，3一二溴丙醇0.6份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
实施例四：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡82份,银2.5份,铜0.4份,镁0.15份,脱氢松香3份,十六烷基溴代吡啶0.4份,葵二酸2.5份,乙二胺2.2份，二乙二醇单丁醚2.5份，二乙二醇单己醚4份，双硬脂酸酰胺0.4份，BHT0.4份，2，3一二溴丙醇0.4份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
实施例五：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡88份,银3.5份,铜0.8份,镁0.25份,脱氢松香5份,十六烷基溴代吡啶0.8份,葵二酸3.5份,乙二胺2.8份，二乙二醇单丁醚3.5份，二乙二醇单己醚5份，双硬脂酸酰胺0.8份，BHT0.8份，2，3一二溴丙醇0.8份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。
Claims (3)
1.一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡80-90份,银2-4份,铜0.2-1份,镁0.1-0.3份,脱氢松香2-6份,十六烷基溴代吡啶0.2-1份,葵二酸2-4份,乙二胺2-3份，二乙二醇单丁醚2-4份，二乙二醇单己醚3-6份，双硬脂酸酰胺0.2-1份，BHT0.2-1份，2，3一二溴丙醇0.2-1份。
2.根据权利要求1所述的无铅焊锡助焊膏，其特征在于：所述各重量份原料为：锡82-88份,银2.5-3.5份,铜0.4-0.8份,镁0.15-0.25份,脱氢松香3-5份,十六烷基溴代吡啶0.4-0.8份,葵二酸2.5-3.5份,乙二胺2.2-2.8份，二乙二醇单丁醚2.5-3.5份，二乙二醇单己醚4-5份，双硬脂酸酰胺0.4-0.8份，BHT0.4-0.8份，2，3一二溴丙醇0.4-0.8份。
3.根据权利要求1或2所述的无铅焊锡助焊膏，其特征在于：所述各重量份原料为：锡85份,银3份,铜0.6份,镁0.2份,脱氢松香4份,十六烷基溴代吡啶0.6份,葵二酸3份,乙二胺2.5份，二乙二醇单丁醚3份，二乙二醇单己醚4.5份，双硬脂酸酰胺0.6份，BHT0.6份，2，3一二溴丙醇0.6份。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410281277.6A CN104084711B (zh) | 2014-06-20 | 2014-06-20 | 一种无铅焊锡助焊膏 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410281277.6A CN104084711B (zh) | 2014-06-20 | 2014-06-20 | 一种无铅焊锡助焊膏 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104084711A true CN104084711A (zh) | 2014-10-08 |
| CN104084711B CN104084711B (zh) | 2016-12-28 |
Family
ID=51632528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410281277.6A Expired - Fee Related CN104084711B (zh) | 2014-06-20 | 2014-06-20 | 一种无铅焊锡助焊膏 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104084711B (zh) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2116012A1 (de) * | 1970-04-02 | 1971-10-14 | Shikoku Chem | Verfahren zur Oberflachenbehand lung von Metallen, die zu loten sind |
| SU471979A1 (ru) * | 1973-11-30 | 1975-05-30 | Ленинградский Институт Текстильной И Легкой Промышленности Им.С.М. Кирова | Флюс дл пайки легкоплавкими припо ми |
| CN101143407A (zh) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | 一种焊锡膏及其制备方法 |
| CN102000927A (zh) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | 一种无铅焊锡膏 |
| CN103302421A (zh) * | 2013-06-24 | 2013-09-18 | 无锡市彩云机械设备有限公司 | 免清洗助焊剂及其锡焊膏 |
-
2014
- 2014-06-20 CN CN201410281277.6A patent/CN104084711B/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2116012A1 (de) * | 1970-04-02 | 1971-10-14 | Shikoku Chem | Verfahren zur Oberflachenbehand lung von Metallen, die zu loten sind |
| SU471979A1 (ru) * | 1973-11-30 | 1975-05-30 | Ленинградский Институт Текстильной И Легкой Промышленности Им.С.М. Кирова | Флюс дл пайки легкоплавкими припо ми |
| CN101143407A (zh) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | 一种焊锡膏及其制备方法 |
| CN102000927A (zh) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | 一种无铅焊锡膏 |
| CN103302421A (zh) * | 2013-06-24 | 2013-09-18 | 无锡市彩云机械设备有限公司 | 免清洗助焊剂及其锡焊膏 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104084711B (zh) | 2016-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5722302B2 (ja) | 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品 | |
| CN104476016A (zh) | 一种半导体用无铅无卤焊锡膏 | |
| JP5643972B2 (ja) | 金属フィラー、低温接続鉛フリーはんだ、及び接続構造体 | |
| KR20130137122A (ko) | Ｂｉ-Ｓｎ계 고온 땜납 합금 | |
| JP2013045650A (ja) | 異方性導電性ペースト | |
| JP6383544B2 (ja) | はんだ付け用フラックス組成物およびそれを用いた電子基板の製造方法 | |
| CN101269444A (zh) | 一种锡-银-铜三元合金无铅焊锡膏 | |
| JP2013049073A (ja) | はんだ合金 | |
| TWI546149B (zh) | 錫膏及其製備方法 | |
| CN101347875B (zh) | 调谐器专用中温节能无铅锡膏 | |
| JP2014028380A (ja) | 金属フィラー、はんだペースト、及び接続構造体 | |
| CN107552996A (zh) | 一种贴片二极管焊接专用焊锡膏 | |
| CN107695567A (zh) | 一种贴片二极管焊接专用焊锡膏的制备方法 | |
| CN104084711A (zh) | 一种无铅焊锡助焊膏 | |
| JP2009255153A (ja) | ソルダペースト | |
| CN104384752B (zh) | 一种应用于传感器的助焊剂 | |
| CN104942461A (zh) | 一种锡膏制备方法 | |
| CN104275561A (zh) | 一种环保型无铅助焊膏 | |
| JP5724088B2 (ja) | 金属フィラー及びこれを含む鉛フリーはんだ | |
| JP2006512212A (ja) | 混合された合金からなる無鉛はんだペースト | |
| CN100453246C (zh) | 无铅软钎焊料 | |
| TW541549B (en) | Electronic parts, electronic machines having said electronic parts installed therein, and method of making same | |
| JP5827522B2 (ja) | 配線基板の接続方法 | |
| CN104827198A (zh) | 一种焊锡膏 | |
| JP2005297011A (ja) | ソルダーペーストおよび半田付け物品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Xu Inventor before: Luo Hongqiang |
|
| COR | Change of bibliographic data | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160919 Address after: 266000 Shandong Province, Licang District, No. nine East Road, No. 320, building 205, room 2 Applicant after: Qingdao Shenda multi-creation Technology Service Co. Ltd. Address before: 242300 No. 98 West Ring Road, Ningguo, Anhui, Xuancheng Applicant before: NINGGUO XINBONENG ELECTRONIC CO., LTD. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Lin Zhiming Inventor before: Wang Xu |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170601 Address after: 523598 Guangdong Province, Dongguan City Industrial Zone Patentee after: Dongguan Shengyang solder material Co., Ltd. Address before: 266000 Shandong Province, Licang District, No. nine East Road, No. 320, building 205, room 2 Patentee before: Qingdao Shenda multi-creation Technology Service Co. Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20180620 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |