CN104084711B - 一种无铅焊锡助焊膏 - Google Patents
一种无铅焊锡助焊膏 Download PDFInfo
- Publication number
- CN104084711B CN104084711B CN201410281277.6A CN201410281277A CN104084711B CN 104084711 B CN104084711 B CN 104084711B CN 201410281277 A CN201410281277 A CN 201410281277A CN 104084711 B CN104084711 B CN 104084711B
- Authority
- CN
- China
- Prior art keywords
- parts
- diethylene glycol
- free solder
- aiding cream
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 24
- 239000006071 cream Substances 0.000 title claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims abstract description 11
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 11
- 239000011777 magnesium Substances 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 239000004332 silver Substances 0.000 claims abstract description 11
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 claims abstract description 10
- FDWUUSLGWNMVCJ-UHFFFAOYSA-N 2-bromo-3-hexadecylpyridine Chemical compound CCCCCCCCCCCCCCCCC1=CC=CN=C1Br FDWUUSLGWNMVCJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 10
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims abstract description 10
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims abstract description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 10
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical class CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims abstract description 9
- LIHMQSPBDBGMJW-UHFFFAOYSA-N 1,1-dibromopropan-1-ol Chemical class CCC(O)(Br)Br LIHMQSPBDBGMJW-UHFFFAOYSA-N 0.000 claims abstract description 8
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 6
- QWVCIORZLNBIIC-UHFFFAOYSA-N 2,3-dibromopropan-1-ol Chemical compound OCC(Br)CBr QWVCIORZLNBIIC-UHFFFAOYSA-N 0.000 claims description 3
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims 1
- DVBJBNKEBPCGSY-UHFFFAOYSA-M cetylpyridinium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 DVBJBNKEBPCGSY-UHFFFAOYSA-M 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 10
- 230000007613 environmental effect Effects 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 8
- 239000007787 solid Substances 0.000 abstract description 7
- 238000003466 welding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- -1 stearic acid acyls Amine Chemical class 0.000 description 2
- DCXXMTOCNZCJGO-UHFFFAOYSA-N Glycerol trioctadecanoate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410281277.6A CN104084711B (zh) | 2014-06-20 | 2014-06-20 | 一种无铅焊锡助焊膏 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410281277.6A CN104084711B (zh) | 2014-06-20 | 2014-06-20 | 一种无铅焊锡助焊膏 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104084711A CN104084711A (zh) | 2014-10-08 |
CN104084711B true CN104084711B (zh) | 2016-12-28 |
Family
ID=51632528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410281277.6A Expired - Fee Related CN104084711B (zh) | 2014-06-20 | 2014-06-20 | 一种无铅焊锡助焊膏 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104084711B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2116012A1 (de) * | 1970-04-02 | 1971-10-14 | Shikoku Chem | Verfahren zur Oberflachenbehand lung von Metallen, die zu loten sind |
SU471979A1 (ru) * | 1973-11-30 | 1975-05-30 | Ленинградский Институт Текстильной И Легкой Промышленности Им.С.М. Кирова | Флюс дл пайки легкоплавкими припо ми |
CN101143407A (zh) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | 一种焊锡膏及其制备方法 |
CN102000927A (zh) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | 一种无铅焊锡膏 |
CN103302421A (zh) * | 2013-06-24 | 2013-09-18 | 无锡市彩云机械设备有限公司 | 免清洗助焊剂及其锡焊膏 |
-
2014
- 2014-06-20 CN CN201410281277.6A patent/CN104084711B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2116012A1 (de) * | 1970-04-02 | 1971-10-14 | Shikoku Chem | Verfahren zur Oberflachenbehand lung von Metallen, die zu loten sind |
SU471979A1 (ru) * | 1973-11-30 | 1975-05-30 | Ленинградский Институт Текстильной И Легкой Промышленности Им.С.М. Кирова | Флюс дл пайки легкоплавкими припо ми |
CN101143407A (zh) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | 一种焊锡膏及其制备方法 |
CN102000927A (zh) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | 一种无铅焊锡膏 |
CN103302421A (zh) * | 2013-06-24 | 2013-09-18 | 无锡市彩云机械设备有限公司 | 免清洗助焊剂及其锡焊膏 |
Also Published As
Publication number | Publication date |
---|---|
CN104084711A (zh) | 2014-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Wang Xu Inventor before: Luo Hongqiang |
|
COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160919 Address after: 266000 Shandong Province, Licang District, No. nine East Road, No. 320, building 205, room 2 Applicant after: Qingdao Shenda multi-creation Technology Service Co. Ltd. Address before: 242300 No. 98 West Ring Road, Ningguo, Anhui, Xuancheng Applicant before: NINGGUO XINBONENG ELECTRONIC CO., LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Lin Zhiming Inventor before: Wang Xu |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170601 Address after: 523598 Guangdong Province, Dongguan City Industrial Zone Patentee after: Dongguan Shengyang solder material Co., Ltd. Address before: 266000 Shandong Province, Licang District, No. nine East Road, No. 320, building 205, room 2 Patentee before: Qingdao Shenda multi-creation Technology Service Co. Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20180620 |
|
CF01 | Termination of patent right due to non-payment of annual fee |