CN104084711B - 一种无铅焊锡助焊膏 - Google Patents
一种无铅焊锡助焊膏 Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 24
- 239000006071 cream Substances 0.000 title claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims abstract description 11
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 11
- 239000011777 magnesium Substances 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 239000004332 silver Substances 0.000 claims abstract description 11
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 claims abstract description 10
- FDWUUSLGWNMVCJ-UHFFFAOYSA-N 2-bromo-3-hexadecylpyridine Chemical compound CCCCCCCCCCCCCCCCC1=CC=CN=C1Br FDWUUSLGWNMVCJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 10
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims abstract description 10
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims abstract description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 10
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical class CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims abstract description 9
- LIHMQSPBDBGMJW-UHFFFAOYSA-N 1,1-dibromopropan-1-ol Chemical class CCC(O)(Br)Br LIHMQSPBDBGMJW-UHFFFAOYSA-N 0.000 claims abstract description 8
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 6
- QWVCIORZLNBIIC-UHFFFAOYSA-N 2,3-dibromopropan-1-ol Chemical compound OCC(Br)CBr QWVCIORZLNBIIC-UHFFFAOYSA-N 0.000 claims description 3
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims 1
- DVBJBNKEBPCGSY-UHFFFAOYSA-M cetylpyridinium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 DVBJBNKEBPCGSY-UHFFFAOYSA-M 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 10
- 230000007613 environmental effect Effects 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 8
- 239000007787 solid Substances 0.000 abstract description 7
- 238000003466 welding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- -1 stearic acid acyls Amine Chemical class 0.000 description 2
- DCXXMTOCNZCJGO-UHFFFAOYSA-N Glycerol trioctadecanoate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明公开了一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡80‑90份,银2‑4份,铜0.2‑1份,镁0.1‑0.3份,脱氢松香2‑6份,十六烷基溴代吡啶0.2‑1份,葵二酸2‑4份,乙二胺2‑3份，二乙二醇单丁醚2‑4份，二乙二醇单己醚3‑6份，双硬脂酸酰胺0.2‑1份，BHT0.2‑1份，2，3一二溴丙醇0.2‑1份。本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
Description
技术领域
本发明涉及金属焊接领域，具体涉及一种无铅焊锡助焊膏。
背景技术
助焊剂在焊接的过程中能去除氧化物，降低被焊接材质表面张力，广泛应用于钟表仪器、精密部件、医疗器械、移动通信、数码产品及各类PCB板和BGA锡球的焊接。
助焊膏出现在20世纪70年代的表面贴装技术(SurfaceMountAssembly,简称SMT),是指在印制电路板焊盘上印刷、涂布焊锡膏，并将表面贴装元器件准确的贴放到涂有焊锡膏的焊盘上，按照特定的回流温度曲线加热电路板，让焊锡膏融化，其合金成分冷却凝固后在元器件与印制电路板之间形成焊点而实现冶金连接的技术。焊锡膏是伴随着SMT应运而生的一种新型焊接材料。焊锡膏是一个复杂的体系，是由焊锡粉、助焊剂以及其它的添加物加以混合，形成的乳脂状混合物。焊锡膏在常温下有一定的勃度，可将电子元器件初粘在既定位置，在焊接温度下，随着溶剂和部分添加剂的挥发，将被焊元器件与印制电路焊盘焊接在一起形成永久连接。现有的助焊膏大多还有铅等重金属，不够环保，容易造成污染。现研究一种无铅焊锡助焊膏，环保高效，提高焊接的牢固性。
发明内容
针对上述问题，本发明提供了一种无铅焊锡助焊膏，环保无污染，提高了焊接的牢固性。
为了解决上述问题，本发明提供的技术方案为：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡80-90份,银2-4份,铜0.2-1份,镁0.1-0.3份,脱氢松香2-6份,十六烷基溴代吡啶0.2-1份,葵二酸2-4份,乙二胺2-3份，二乙二醇单丁醚2-4份，二乙二醇单己醚3-6份，双硬脂酸酰胺0.2-1份，BHT0.2-1份，2，3一二溴丙醇0.2-1份。
优选的，所述各重量份原料为：锡82-88份,银2.5-3.5份,铜0.4-0.8份,镁0.15-0.25份,脱氢松香3-5份,十六烷基溴代吡啶0.4-0.8份,葵二酸2.5-3.5份,乙二胺2.2-2.8份，二乙二醇单丁醚2.5-3.5份，二乙二醇单己醚4-5份，双硬脂酸酰胺0.4-0.8份，BHT0.4-0.8份，2，3一二溴丙醇0.4-0.8份。
优选的，所述各重量份原料为：锡85份,银3份,铜0.6份,镁0.2份,脱氢松香4份,十六烷基溴代吡啶0.6份,葵二酸3份,乙二胺2.5份，二乙二醇单丁醚3份，二乙二醇单己醚4.5份，双硬脂酸酰胺0.6份，BHT0.6份，2，3一二溴丙醇0.6份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
具体实施方式
下面对本发明做进一步说明：
实施例一：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡80份,银2份,铜0.2份,镁0.1份,脱氢松香2份,十六烷基溴代吡啶0.2份,葵二酸2份,乙二胺2份，二乙二醇单丁醚2份，二乙二醇单己醚3份，双硬脂酸酰胺0.2份，BHT0.2份，2，3一二溴丙醇0.2份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
实施例二：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡90份,银4份,铜1份,镁0.3份,脱氢松香6份,十六烷基溴代吡啶1份,葵二酸4份,乙二胺3份，二乙二醇单丁醚4份，二乙二醇单己醚6份，双硬脂酸酰胺1份，BHT1份，2，3一二溴丙醇1份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
实施例三：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡85份,银3份,铜0.6份,镁0.2份,脱氢松香4份,十六烷基溴代吡啶0.6份,葵二酸3份,乙二胺2.5份，二乙二醇单丁醚3份，二乙二醇单己醚4.5份，双硬脂酸酰胺0.6份，BHT0.6份，2，3一二溴丙醇0.6份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
实施例四：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡82份,银2.5份,铜0.4份,镁0.15份,脱氢松香3份,十六烷基溴代吡啶0.4份,葵二酸2.5份,乙二胺2.2份，二乙二醇单丁醚2.5份，二乙二醇单己醚4份，双硬脂酸酰胺0.4份，BHT0.4份，2，3一二溴丙醇0.4份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
实施例五：
一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡88份,银3.5份,铜0.8份,镁0.25份,脱氢松香5份,十六烷基溴代吡啶0.8份,葵二酸3.5份,乙二胺2.8份，二乙二醇单丁醚3.5份，二乙二醇单己醚5份，双硬脂酸酰胺0.8份，BHT0.8份，2，3一二溴丙醇0.8份。
本发明的有益效果为：本发明不含铅，可焊性好，固体含量低，焊后残留物少，无须清洗。本发明性能优良，并可以克服现有助焊剂的缺点，其使用也更符合环保的要求。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。
Claims (2)
1.一种无铅焊锡助焊膏，其特征在于：包括以下重量份原料：锡82-88份,银2.5-3.5份,铜0.4-0.8份,镁0.15-0.25份,脱氢松香3-5份,十六烷基溴代吡啶0.4-0.8份,葵二酸2.5-3.5份,乙二胺2.2-2.8份，二乙二醇单丁醚2.5-3.5份，二乙二醇单己醚4-5份，双硬脂酸酰胺0.4-0.8份，BHT0.4-0.8份，2，3一二溴丙醇0.4-0.8份。
2.根据权利要求1所述的无铅焊锡助焊膏，其特征在于：各重量份原料为：锡85份,银3份,铜0.6份,镁0.2份,脱氢松香4份,十六烷基溴代吡啶0.6份,葵二酸3份,乙二胺2.5份，二乙二醇单丁醚3份，二乙二醇单己醚4.5份，双硬脂酸酰胺0.6份，BHT0.6份，2，3一二溴丙醇0.6份。
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2116012A1 (de) * | 1970-04-02 | 1971-10-14 | Shikoku Chem | Verfahren zur Oberflachenbehand lung von Metallen, die zu loten sind |
| SU471979A1 (ru) * | 1973-11-30 | 1975-05-30 | Ленинградский Институт Текстильной И Легкой Промышленности Им.С.М. Кирова | Флюс дл пайки легкоплавкими припо ми |
| CN101143407A (zh) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | 一种焊锡膏及其制备方法 |
| CN102000927A (zh) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | 一种无铅焊锡膏 |
| CN103302421A (zh) * | 2013-06-24 | 2013-09-18 | 无锡市彩云机械设备有限公司 | 免清洗助焊剂及其锡焊膏 |
-
2014
- 2014-06-20 CN CN201410281277.6A patent/CN104084711B/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2116012A1 (de) * | 1970-04-02 | 1971-10-14 | Shikoku Chem | Verfahren zur Oberflachenbehand lung von Metallen, die zu loten sind |
| SU471979A1 (ru) * | 1973-11-30 | 1975-05-30 | Ленинградский Институт Текстильной И Легкой Промышленности Им.С.М. Кирова | Флюс дл пайки легкоплавкими припо ми |
| CN101143407A (zh) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | 一种焊锡膏及其制备方法 |
| CN102000927A (zh) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | 一种无铅焊锡膏 |
| CN103302421A (zh) * | 2013-06-24 | 2013-09-18 | 无锡市彩云机械设备有限公司 | 免清洗助焊剂及其锡焊膏 |
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