CN104070256B - 焊剂涂布装置以及焊剂涂布方法 - Google Patents
焊剂涂布装置以及焊剂涂布方法 Download PDFInfo
- Publication number
- CN104070256B CN104070256B CN201410123065.5A CN201410123065A CN104070256B CN 104070256 B CN104070256 B CN 104070256B CN 201410123065 A CN201410123065 A CN 201410123065A CN 104070256 B CN104070256 B CN 104070256B
- Authority
- CN
- China
- Prior art keywords
- solder flux
- coating
- mentioned
- flow
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-072980 | 2013-03-29 | ||
| JP2013072980A JP6355893B2 (ja) | 2013-03-29 | 2013-03-29 | フラックス塗布装置およびフラックス塗布方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104070256A CN104070256A (zh) | 2014-10-01 |
| CN104070256B true CN104070256B (zh) | 2018-09-25 |
Family
ID=51592084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410123065.5A Active CN104070256B (zh) | 2013-03-29 | 2014-03-28 | 焊剂涂布装置以及焊剂涂布方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6355893B2 (https=) |
| CN (1) | CN104070256B (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6269568B2 (ja) * | 2015-05-12 | 2018-01-31 | 株式会社村田製作所 | フラックス塗布装置及びフラックス塗布方法 |
| JP5910787B1 (ja) * | 2015-10-22 | 2016-04-27 | 千住金属工業株式会社 | フラックス回収装置 |
| CN105789093A (zh) * | 2016-03-28 | 2016-07-20 | 珠海迈科智能科技股份有限公司 | 一种散热器自动贴装设备 |
| CN115835929A (zh) * | 2021-07-20 | 2023-03-21 | 株式会社新川 | 焊剂转印装置 |
| CN118385692B (zh) * | 2024-06-26 | 2024-09-06 | 深圳市丹宇电子有限公司 | 一种基于人工智能的波峰焊助焊剂喷雾控制方法及介质 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5460653A (en) * | 1990-06-28 | 1995-10-24 | Nec Corporation | Spray type flux applying device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2535473B2 (ja) * | 1987-08-27 | 1996-09-18 | 富士機械製造株式会社 | プリント基板用高粘性流体塗布装置 |
| JP2708957B2 (ja) * | 1990-04-19 | 1998-02-04 | 三洋電機株式会社 | 塗布装置 |
| JP2538701B2 (ja) * | 1990-06-28 | 1996-10-02 | 日本電気株式会社 | 噴霧式フラックス塗布装置 |
| JPH04113476U (ja) * | 1991-03-19 | 1992-10-05 | 日本電気株式会社 | フラツクス塗布装置 |
| JP2592948Y2 (ja) * | 1993-07-20 | 1999-03-31 | 大阪アサヒ化学株式会社 | スプレー塗布量のコントロール装置 |
| JP2820595B2 (ja) * | 1993-07-30 | 1998-11-05 | 日本電熱計器株式会社 | 噴霧式フラックス塗布装置および塗布方法 |
| JPH07321430A (ja) * | 1994-05-20 | 1995-12-08 | Nippon Avionics Co Ltd | プリント配線板の接着剤塗布径測定方法およびプリント配線板 |
| JP4365946B2 (ja) * | 1999-08-06 | 2009-11-18 | 株式会社タムラ製作所 | フラックス塗布方法およびフラックス塗布装置 |
| TW200800411A (en) * | 2006-06-28 | 2008-01-01 | Nordson Corp | Conformal coating system with closed loop control |
| JP5326565B2 (ja) * | 2008-12-27 | 2013-10-30 | 千住金属工業株式会社 | フラックス塗布装置及び方法 |
| JP2011025294A (ja) * | 2009-07-28 | 2011-02-10 | Hioki Ee Corp | フラックス塗布装置およびフラックス塗布方法 |
-
2013
- 2013-03-29 JP JP2013072980A patent/JP6355893B2/ja active Active
-
2014
- 2014-03-28 CN CN201410123065.5A patent/CN104070256B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5460653A (en) * | 1990-06-28 | 1995-10-24 | Nec Corporation | Spray type flux applying device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014197630A (ja) | 2014-10-16 |
| JP6355893B2 (ja) | 2018-07-11 |
| CN104070256A (zh) | 2014-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |