CN104070256B - Solder flux apparatus for coating and solder flux coating method - Google Patents
Solder flux apparatus for coating and solder flux coating method Download PDFInfo
- Publication number
- CN104070256B CN104070256B CN201410123065.5A CN201410123065A CN104070256B CN 104070256 B CN104070256 B CN 104070256B CN 201410123065 A CN201410123065 A CN 201410123065A CN 104070256 B CN104070256 B CN 104070256B
- Authority
- CN
- China
- Prior art keywords
- solder flux
- coating
- mentioned
- flow
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Solder flux apparatus for coating according to the present invention is simple and confirms whether solder flux with the flow of setting is applied to substrate at low cost.Solder flux apparatus for coating（100）Has solder flux pre-blowing portion（20）, when carrying out confirming that flow confirmation action, coating modification that whether solder flux is applied with the flow set by operation display part act, solder flux is coated on by the solder flux pre-blowing portion with the flow of setting（20）.Solder flux pre-blowing portion（20）Planar plate members by being bent to inverted L shape are constituted, the solder flux pre-blowing portion（20）And spray nozzle part（30）Opposite side becomes is applied face for solder flux Fx coatings（20d）.It is being applied face（20d）Filter element for making be coated with solder flux not drip is installed（24）.In spray nozzle part（30）Flowmeter is set between pressurizing vessel, to solder flux pre-blowing portion（20）Flow is measured when being coated with solder flux, the feedback control etc. for according to the flow pressurize in container.
Description
Technical field
The present invention relates to for the base plate coating solder flux for being equipped with electronic component solder flux apparatus for coating and solder flux apply
Cloth method.
Background technology
Automatic soft soldering apparatus is used in previous solder.In automatic soft soldering apparatus, first, applied using solder flux
Cloth apparatus is coated with solder flux in the whole face or predetermined portions of the printed base plate for being equipped with electronic component.Using preheating device to being coated with
The substrate of solder flux is preheated, and fusion welding is made to be attached to the solder portion of printed base plate to carry out in jet stream solder bath later
Solder.
But the solder flux for being used in above-mentioned solder flux apparatus for coating, along with the temperature change of ambient enviroment, solder flux
Temperature also change.If the temperature of solder flux changes, there are the viscosity of solder flux to change, and causes solder flux therewith
The case where variation of flow.If the flow of solder flux changes, solder flux can be brought to printed base plate coating " coating weight "
It influences, there are problems that not stablizing and be equably coated with solder flux.
In order to solve the problems, following solder flux apparatus for coating is disclosed in patent document 1, is equipped with for by solder flux
Solder flux in supply container remains the temperature control equipment of predetermined temperature, and has for making solder flux in solder flux supply container
The flow path and pump of the solder flux recycled between spray nozzle.In addition, disclosed in patent document 2 and patent document 3 as
Lower solder flux apparatus for coating is conveyed, the temperature etc. of solder using control unit control jet velocity, injection interval, substrate, is thus made
Solder flux is in best coating weight.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2001-300358 bulletins
Patent document 2：Unexamined Patent 9-83120 bulletins
Patent document 3：Unexamined Patent 11-135931 bulletins
However, being had the following problems in solder flux apparatus for coating disclosed in above patent document 1~3.That is, according to reference
Solder flux apparatus for coating disclosed in document 1~3, though the temperature etc. of solder flux can be controlled, the coating of solder flux is to be directed to be equipped with
What the printed base plate on electronic component, actual production line carried out, therefore exist and be difficult to confirm solder flux whether with set
Flow is coated on the problem of printed base plate.
Invention content
Problems to be solved by the invention
Therefore, it is an object of the invention to solve the above subject and provide a kind of solder flux apparatus for coating and solder flux coating side
Method, the solder flux apparatus for coating and solder flux coating method are in the printing base to being equipped on electronic component, actual production line
When plate is coated with solder flux, the coating weight of solder flux can be preset, and solder flux is coated with certain solder flux coating weight of the setting
In substrate, the solder of stable quality can be carried out in the solder process as final process.
The solution to the problem
To solve the above-mentioned problems, solder flux apparatus for coating of the invention is used for base plate coating solder flux, and solder flux painting arranges
It sets and has：Spray nozzle part is configured at least one on the in-plane of substrate and the direction orthogonal with the in-plane
It is moved on a direction；Configuration part is used to set the flow for the solder flux being coated with from spray nozzle part；With flux flow confirmation portion, true
When recognizing solder flux and whether being applied with the flow set by configuration part, solder flux is coated on by the flux flow with the flow of setting and is confirmed
Portion.
In addition, the solder flux apparatus for coating of the present invention is used for base plate coating solder flux, which has：Nozzle
Portion is configured on the in-plane of aforesaid substrate and at least one direction in the direction orthogonal with the in-plane
It is mobile；Configuration part is used to set the flow for the above-mentioned solder flux being coated with from said nozzle portion；Pressurized air supply portion, passes through
Forced air is supplied into the container for storing above-mentioned solder flux and by above-mentioned flux delivery to above-mentioned spray nozzle part；Measurement portion,
It is supplied to the flow of the above-mentioned solder flux of above-mentioned spray nozzle part for measuring according to the above-mentioned flow set by above-mentioned configuration part；Control
Portion is calculated for the present flow rate of the above-mentioned solder flux measured by above-mentioned measurement portion to be adjusted to preset standard flow
Pressurization modification amount；And pressure adjustment unit, it is correspondingly adjusted from upper according to the pressurization modification amount transmitted from above-mentioned control unit
State the above-mentioned forced air in forced air portion, and by Pressurized air supply after adjustment to said vesse.
In addition, the solder flux apparatus for coating of the present invention is used for base plate coating solder flux, which has：Nozzle
Portion is configured at least one of the in-plane of aforesaid substrate and the direction orthogonal with the in-plane direction
Upper movement；Pressurized air supply portion, by above-mentioned weldering by supplying forced air into the container for storing above-mentioned solder flux
Agent is delivered to said nozzle portion；Coating width configuration part is used to set the coating width of the solder flux from said nozzle portion；Stream
Configuration part is measured, is used to set the flow for the above-mentioned solder flux being coated with from said nozzle portion；Flow measurement portion is used to measure basis
The above-mentioned flow that is set by above-mentioned configuration part and supply to the flow of the above-mentioned solder flux of above-mentioned spray nozzle part；Control unit is calculated and is used
It is changed in the pressurization that the present flow rate of the above-mentioned solder flux measured by above-mentioned measurement portion is adjusted to preset standard flow
Amount；And pressure adjustment unit, it is correspondingly adjusted according to the pressurization modification amount transmitted from above-mentioned control unit and comes from above-mentioned forced air
The above-mentioned forced air in portion, and by Pressurized air supply after adjustment to said vesse.
Moreover, the solder flux coating method of the present invention is the used weldering of solder flux apparatus for coating for having flux flow confirmation portion
Agent coating method, which, which is included in, confirms when whether solder flux is applied with the flow of setting by with the flow of setting
It is coated with the flux flow confirmation portion of solder flux, solder flux coating includes the following steps：1st step, setting is from can be in substrate
In-plane and at least one of the direction orthogonal with in-plane direction on the solder flux of spray nozzle part coating that moves
Flow；And second step, solder flux is coated with to flux flow confirmation portion with the flow using the setting of the 1st step.
The effect of invention
According to the present invention, when being coated with solder flux to the printed base plate being equipped on electronic component, actual production line, energy
It enough presets the coating weight of solder flux, and solder flux is coated on by substrate with certain solder flux coating weight of the setting, therefore
As in the solder process of final process, the solder of stable quality can be carried out.
Description of the drawings
Fig. 1 is the front view of the configuration example for the solder flux apparatus for coating for showing one embodiment of the present invention.
Fig. 2 is the figure of the configuration example of the sectional view for the line A-A for being showing along solder flux apparatus for coating.
Fig. 3 is the stereogram for the configuration example for showing solder flux apparatus for coating.
Fig. 4 is the figure for the configuration example for showing the solder flux coating width for confirming solder flux apparatus for coating.
Fig. 5 is the functional block diagram for the configuration example for showing solder flux apparatus for coating.
Fig. 6 is the chart for showing the relationship example between the flow of solder flux and pressure.
Fig. 7 is the figure of the configuration example for the coating modification picture for showing solder flux spreader.
Fig. 8 is the flow chart of an example of the standard flow for the solder flux for showing setting solder flux apparatus for coating.
Fig. 9 is the flow chart of an example for the coating modification action for showing solder flux apparatus for coating.
Figure 10 is the flow chart of an example for the flow confirmation action for showing solder flux apparatus for coating.
Reference sign
20 solder flux pre-blowing portions（Flux flow confirmation portion）, 20d be applied face, 30 spray nozzle parts,
50 control devices（Control unit）, 60 flowmeters（Measurement portion）, it is 62 pressurizing vessels, 66 electronic
Air-operated controller（Pressure adjustment unit）, 68 air supply units（Pressurized air supply portion）, 100 solder flux painting arrange
It sets, Fx solder flux
Specific implementation mode
Below, to the best mode for carrying out an invention（Hereinafter referred to as embodiment）It illustrates.
（The configuration example of solder flux apparatus for coating）
Fig. 1 is the vertical view for the configuration example for showing solder flux apparatus for coating 100, and Fig. 2 is arranged along solder flux shown in FIG. 1 painting
Set the sectional view of 100 line A-A.Fig. 3 is the stereogram for the configuration example for showing solder flux apparatus for coating 100.Moreover, in Fig. 1~Fig. 3
In, it illustrates for convenience, omits the detailed description of moving portion 14 etc..
As shown in FIG. 1 to 3, solder flux apparatus for coating 100 has solder flux spreader container 10, spray nozzle part 30, delivery section 18
With solder flux pre-blowing portion 20.Solder flux spreader container 10 is set to the entrance of automatic soft soldering apparatus, and control is arranged inside it
Device 50 processed, the pressurizing vessel 62 etc. for being accommodated with aftermentioned solder flux Fx, and in the upper surface part shape of solder flux spreader container 10
At the opening portion 12 for arrangings such as spray nozzle parts 30.
Spray nozzle part 30 is by moving portion 14（With reference to Fig. 5）It is supported on solder flux in a manner of it can be moved on the directions X-Y-Z
The opening portion 12 of spreader container 10.In this example, 2 spray nozzle parts 30 are provided with, 1 supporting plate is placed in 2 printed base plates
When coming along conveying direction D1 conveyings, from preset scheduled normal place（Home Position）Simultaneously respectively to keeping
The coating action of solder flux Fx is carried out in each substrate of supporting plate.Certainly, in the case where loading 1 printed base plate on 1 supporting plate,
It can be constituted using a spray nozzle part 30.It so, it is possible freely to carry out the number of nozzle, configuration according to the mode of production each
Kind change.
A pair of guide rails that delivery section 18 is extended by the conveying direction D1 along substrate is constituted, will be from automatic soft soldering apparatus
The substrate that entrance is packed into is delivered to the application place of solder flux Fx, and after the coating of solder flux Fx, which is delivered to next work
The preheater portion of sequence.
Solder flux pre-blowing portion 20 is an example in flux flow confirmation portion, is set to and above-mentioned scheduled normal place（Home
Position）Different positions, such as set on the position that is staggered of position for being conveyed the substrate that the when of coming is held in supporting plate with supporting plate,
It is used in and confirms whether solder flux Fx is coated on the flow of substrate with flow set using aftermentioned operation display part 70 and confirms and move
When making, being coated with modification action.Here, flow confirmation action refers to confirming solder flux by being coated with solder flux Fx to solder flux pre-blowing portion 20
When the present flow rate of Fx, when obtaining the coefficient used when pressurization modification amount when calculating coating modification action the control carried out move
Make.Coating modification action refers to acting control as follows, and present flow rate is obtained by being coated with solder flux Fx to solder flux pre-blowing portion 20,
Pressurization modification amount when being calculated according to the present flow rate and preset standard flow for making flow be in normal range (NR), will
After the pressurization modification amount of the pressurizing altered calculating in container, solder flux Fx is coated on solder flux pre-blowing portion 20 again, is confirmed at this time
The flow of solder flux Fx.
Solder flux pre-blowing portion 20 is made of the planar plate members for being bent to inverted L shape with horizontal part 20a and vertical component effect 20b,
Solder flux spreader container is installed in a manner of assemble and unassemble by the mounting portion 20c for the setting that is connected with the lower end of vertical component effect 20b
10.Solder flux pre-blowing portion 20 is for example using resin material, metal material.The long side direction in solder flux pre-blowing portion 20 is with respectively along opening
The mode of ora terminalis 12a, the 12b in portion 12 are arranged, and are set to the outside misaligned with the substrate for the application place for being delivered to solder flux Fx
Region.
The horizontal part 20a in solder flux pre-blowing portion 20 stretches out in a manner of in face of opening portion 12 to the top of opening portion 12, horizontal
Solder flux Fx is coated with when the side opposite with spray nozzle part 30 of portion 20a becomes the when of carrying out flow confirmation action, coating modification action
Be applied face 20d.It is applied face 20d and is pasted with for making such as net construction that be coated with solder flux Fx is not easy to drip at this
Filter element 24.The metal material such as using being not easy to be corroded or be not easy the nickel of deterioration by solder flux of filter element 24, with energy
The mode enough replaced, which is installed on, is applied face 20d.The construction in solder flux pre-blowing portion 20, material are not limited to this example.
The length L1 of the long side direction in solder flux pre-blowing portion 20, which is chosen to be, has solder flux Fx while scan nozzle portion 30 steady
Surely start the distance of coating, the length L2 of short side direction is chosen to be slightly wider than the coating width of ideal solder flux Fx.In this example
In the case of, the length L1 of long side direction is set as 200mm, in addition, the length L2 of short side direction is set as 20mm.Spray nozzle part 30
Top and the interval W1 being applied between the 20d of face in solder flux pre-blowing portion 20 be for example chosen to be 10mm.Through such composition, it is spraying
When mouth 30 is moved to application place PA, PB, solder flux pre-blowing portion 20 is applied face 20d and can be placed exactly in the spray nozzle part 30
Top is coated.
In addition, in the case of this example, the coating width of solder flux Fx is set as 8mm~10mm.The setting of the coating width
By using immitation, that is, glass plate G of size identical with actual substrate（With reference to Fig. 3 and Fig. 4）It carries out.Specifically,
From positioned at the scheduled coating width confirmation flag being printed with as benchmark（M1=8mm、M2=10mm）Glass plate G lower section
Normal place（Home Position）Spray nozzle part 30 with preset pressurization value be coated with solder flux Fx, by adjustment section into
Row adjusts to set coating width, so that the coating width of solder flux Fx reaches defined coating width, which is set to spray
The tip portion of mouth 30, and played as (not shown) for setting the coating width configuration part of the coating width of solder flux Fx
Function.The coating width of pressurization value on the basis of preset pressurization value at this time, setting becomes benchmark coating width.In this example
In the case of, benchmark pressurization value is set as 0.08Pa, and benchmark coating width is set as 8mm~10mm.With the preset base
The flow that quasi- pressurization value and the state of benchmark coating width carry out the solder flux Fx in the case of the coating of solder flux Fx becomes following
The standard flow of the illustrated flow for controlling solder flux（Normal discharge）.The length of the long side direction in above-mentioned solder flux pre-blowing portion 20
The numerical value for spending the parameters such as L1, the length L2 of short side direction, the coating width benchmark pressurization value of solder flux Fx, benchmark coating width is energy
Enough values for taking the circumstances into consideration setting.
（The modular construction example of solder flux apparatus for coating）
Fig. 5 shows an example of the functional structure of the solder flux apparatus for coating 100 of one embodiment of the present invention.As shown in figure 5,
Solder flux apparatus for coating 100 has spray nozzle part 30, moving portion 14, driving portion 52, flowmeter 60, pressurizing vessel 62, electropneumatic tune
Save device 66, air supply unit 68, solenoid valve 64 and operation display part 70.
Control device 50 is for example made of programmable logic controller (PLC), has the memories 50a such as ROM, RAM.Control device
50 will make the program of the action of some output equipment, stopping etc. according to the command signal inputted from input equipments such as operation display parts 70
It is stored in memory 50a, after each input equipment input instruction signal, program is read from memory 50a, controls output equipment
Action.In addition, control device 50 be coated modification action when according to the current of the solder flux Fx measured by flowmeter 60
Flow and the preset flow using when setting above-mentioned coating width are as the standard flow of benchmark（Normal discharge）Difference
Value is calculated for the pressurization modification amount by the flow correction of solder flux Fx for normal discharge（The amount of pressurization of pressurizing vessel 62）, will calculate
The pressurization modification amount gone out is transmitted to electropneumatic controller 66.Moreover, being described after the computational methods of pressurization modification amount.
Air supply unit 68 is an example of Pressurized air supply, such as is made of compressor etc..68 basis of air supply unit
The command signal Sa for carrying out self-control device 50 generates forced air obtained from compressed air, make the forced air of generation via with
Pipe H1 is supplied with certain pressurization value to electropneumatic controller 66.In the case of this example, base is supplied from air supply unit 68
Quasi- pressurization value is 0.08Pa.
Electropneumatic controller 66 is set between solenoid valve 64 and air supply unit 68, is exported according to from control device 50
Command signal Sr to being controlled set on internal valve etc., thus the forced air supplied from air supply unit 68 is adjusted to
Pressure corresponding with command signal Sr is simultaneously exported to pressurizing vessel 62.Command signal Sr is in order to which basis is measured by flowmeter 60
Present flow rate measured value Df the flows modification of solder flux Fx changed by temperature change is utilized for normal discharge control fill
Set the 50 pressurization modification amounts according to the calculated pressurizing vessel of the measurement result of flowmeter 60 62.
Solenoid valve 64 is set between pressurizing vessel 62 and electropneumatic controller 66, which fills according to from control
It sets the command signal Sb of 50 transmission and is opened and closed, thus control to pressurizing vessel 62 and supply forced air.If for example, being coated
Solenoid valve 64 is opened when modification acts, then carries out the modified forced air of pressure via piping using electropneumatic controller 66
H2 is supplied to pressurizing vessel 62.
Pressurizing vessel 62 is the container of hermetic type, and the solder flux Fx of predetermined amount is accommodated in inside.Solder flux Fx uses organic molten
Agent, such as use IPA（Isopropanol）Deng.With the biography (not shown) for detecting the amount of solder flux Fx being set in pressurizing vessel 62
The output of sensor accordingly supplies solder flux Fx from solder flux tank (not shown).If forced air is from air supply unit 68 via piping
H2 is supplied to pressurizing vessel 62, then internal solder flux Fx is transported to spray nozzle part 30 by the pressure of forced air.
Flowmeter 60 is an example of measurement unit, and the piping H3 being set between pressurizing vessel 62 and spray nozzle part 30.Flow
Meter 60 measures the present flow rate of the solder flux Fx flowed in the piping H3 between pressurizing vessel 62 and spray nozzle part 30, will measure gained
The present flow rate measured value Df arrived（Analog voltage）It is transmitted to control device 50.
Spray nozzle part 30 is connect via piping H3 with pressurizing vessel 62, and the weldering supplied from pressurizing vessel 62 is coated with from spray nozzle part 30
Agent Fx.Driving portion 52 is constituted such as by stepper motor, servo motor, according to from the command signal Sk that control device 50 exports into
Row drives and moving portion 14 is made to be moved in X-direction, Y-direction or Z-direction.In this example, X-direction is equivalent to the conveying side of substrate
To D1, Y-direction is equivalent to the orthogonal direction D2 orthogonal with conveying direction D1.Moving portion 14 is for example by can dimensionally move
XYZ workbench is constituted, and so that spray nozzle part 30 is moved in X-direction, Y-direction or Z-direction using the driving of driving portion 52.Certainly,
The XY worktable that can two-dimensionally move can be used.
Operation display part 70 is constituted such as by the touch screen resistance-type, condenser type, such as is set to automatic brazing device
Face portion.The detection of operation display part 70 inputting the input information operated and operation signal So be transmitted to control based on user
Device 50, also, operation display part 70 also shows inputted information etc. other than the input function of various information.For example,
Operation display part 70 is also as start information, the preset coefficient for receiving coating modification action（With reference to formula（1）, formula
（2））Deng input or receive the base of solder flux Fx obtained in the state of said reference pressurization value and benchmark coating width
The flow set portion of the setting of quasi- flow（Configuration part）And function, it will be believed based on operation obtained from received setting
Number it is transmitted to control device 50.Moreover, the standard flow can also utilize control device 50 to set automatically.
（The calculated example for modification amount of pressurizeing）
Next, being illustrated to the pressurization modification amount calculated when being coated modification and acting.Pressurization modification amount is profit
The benchmark pressurization value that the forced air supplied from air supply unit 68 is adjusted with electropneumatic controller 66, to make to become because of temperature
The flow of the solder flux Fx of change and variation restores to the pressurization value of normal standard flow range, under being utilized in coating modification action
State formula（1）And formula（2）It calculates.
Difference in flow=standard flow-present flow rate（1）
Pressurize modification amount=difference in flow × coefficient（2）
In above-mentioned formula（1）In, standard flow refers in preset benchmark pressurization value as described above and base
The flow of solder flux Fx in the state of quasi- coating width in the case of the coating of progress solder flux Fx.In this example, it shows in base
Standard flow 750 in the case that quasi- pressurization value is 0.08Pa, benchmark coating width is coated in the range of being 8mm~10mm
μ l/min.The information of standard flow, benchmark pressurization value and benchmark coating width is pre-stored within the memory of control device 50
50a.Present flow rate refers to the flow of the current solder flux Fx for passing through piping H3 measured by flowmeter 60.
Then, to above-mentioned formula（2）An example of computational methods of coefficient illustrate.Fig. 6 is the stream for showing solder flux Fx
The chart of an example of the relationship between amount and forced air.In this example, coefficient is the solder flux Fx that will be obtained by flowmeter 60
Present flow rate measured value Df is transformed to the transformation coefficient used when pressurization value, such as is calculated when carrying out flow confirmation action.
During the calculating of coefficient, as shown in fig. 6, measuring the stream of the solder flux Fx when P1 that pressurizes to be set as to 0.05MPa using flowmeter 60
Measure F2.The flow F2 of solder flux Fx at this time is 500 μ l/min.Pressurization P2 is set as 0.1MPa in addition, being measured using flowmeter 60
When solder flux Fx flow F1.Flow F1 at this time is 1000 μ l/min.It acts to obtain by the way that such flow confirmation will be carried out
2 points pressurization P1, P2 and these pressurizations P1, P2 under each flow F1, F2 of solder flux Fx substitute into following formulas（3）And it calculates
Go out coefficient.
Coefficient=（Pressurize P2- pressurizations P1）/（Flow F1- flows F2）···（3）
Utilize above-mentioned formula（3）The coefficient of calculating is stored in the memory 50a of control device 50, when being coated modification
The coefficient is read using control device 50 and is used.
（The configuration example of the picture of operation display part）
Fig. 7 shows an example of the solder flux spreader shown in operation display part 70 coating modification picture 70a.Such as Fig. 7 institutes
Show, is shown in proceed by the right side of the central portion that solder flux spreader is coated with modification picture 70a and press when coating modification action
Change button 700.If modification button 700 is pressed, it is coated with modification action and starts.It can also make painting by the setting of timer
Cloth modification action is automatically begun to.
It is shown on the left of the central portion that solder flux spreader is coated with modification picture 70a and indicates above-mentioned formula（1）Formula+numerical value
Formula information 702, show indicate above-mentioned formula above it（2）Formula+numerical value formula information 704.If coating modification
Action starts, then the present flow rate obtained by flowmeter 60 is shown in formula information 702, and is added by what control device 50 calculated
The numerical value of pressure modification amount etc. is shown in formula information 702,704.The case where modification action is coated in automatic operating
Under, the flicker display of icon 706 in the modification of solder flux spreader.It is shown on the right side of the lower part that solder flux spreader is coated with modification picture 70a
Show the modification result 708 of the amount of pressurization as obtained from being coated with modification action, and shows the modification result of flow thereunder
710.In the case where it is to be more than such as ± 10% value relative to desired value to change the numerical value of result 708,710, display
“ERROR”.In the case of display " ERROR ", modification button 700 is pressed, starts again at coating modification action.
Display is for the case where carrying out flow confirmation action on the right side of the lower part that solder flux spreader is coated with modification picture 70a
The pressurization input field 712 of the setting of lower input pressurization and the change button 714 for determining carried out input.By pressurizeing
At input field 712 input pressure and press change button 714, so that it is determined that pressurization.It is coated with modification picture 70a in solder flux spreader
Upper right display indicate current pressurization current pressurization value 716.Confirm flow in the right side display of change button 714
720, display is for determining the ACK button 718 for confirming flow 720 above it.Moreover, because from start be coated with solder flux Fx to
The scheduled time is needed until stability of flow, therefore is equipped with for setting, the beginning delay time button of display delay time
722。
（The setting example of standard flow）
Fig. 8 is to show to preset benchmark pressurization in the coating modification action for carrying out aftermentioned solder flux apparatus for coating 100
It is worth, the flow chart of an example of the action of benchmark coating width and standard flow.Standard flow is set for illustrating.
In the flow, first, spray nozzle part 30 is located at normal place（Home Position）（Step S10）And the glass plate G of immitation
Positioned at the top of spray nozzle part 30.Utilize spray nozzle part 30 from normal place in this state（Home Position）To preset
Pressurization value（Benchmark pressurization value）It is coated with solder flux from the lower direction glass plate G of glass plate G（Step S20）.
Confirm whether solder flux is coated on benchmark coating width using coating width confirmation flag M1, M2 of glass plate G
In range（Step S30）.In the case of in the range of solder flux is coated on benchmark coating width, it will measure at this time（Step
S40）Flow on the basis of the flow set of the solder flux arrived（Step S50）.In addition, the coating width of solder flux does not have in step s 30
In the case of in the range of benchmark coating width, the conduct (not shown) of spray nozzle part 30 is adjusted using well-known method
The adjustment section of coating width configuration part（Step S60）.Confirm that the coating width of solder flux is again by step S20, S30 after adjustment
It is no to be located in the range of benchmark coating width.
By such step, solder flux is carried out in the state of preset benchmark pressurization value and benchmark coating width
The flow of solder flux Fx in the case of the coating of Fx, as the standard flow described below for controlling the flow of solder flux（Just
Normal flow）It is set by operation display part 70.In the case of this example, benchmark pressurization value 0.08Pa, benchmark coating width 8mm~
10mm, 750 μ l/min of standard flow are each set to benchmark.
（Action example is changed in the coating of solder flux apparatus for coating）
Fig. 9 is the action for showing to carry out the control device 50 in the case of the coating modification action of solder flux apparatus for coating 100
An example flow chart.Moreover, in the following description, being repaiied to using a solder flux pre-blowing portion 20 in Fig. 1 to carry out solder flux coating
Change as the case where illustrate.
In the flow, the control that standard flow is maintained to certain value is completed, the standard flow is with as shown in fig. 8
Based on the benchmark pressurization value that is set in flow, benchmark coating width.
First, as shown in figure 9, in the step s 100, control device 50 judges whether to start to be coated with modification action.About being
It is no to start to be coated with modification action, such as in the case where timer is set as carrying out for every 30 minutes 1 coating modification action, according to
Whether the coating modification action away from last time, which have passed through 30 minutes, is judged, judges that solder flux is applied in the case where not setting timer
Whether the modification button 700 of cloth device coating modification picture 70a has been pressed.At this point, actually carrying out solder flux Fx to base plate coating
Coating action in the case of, supporting plate is waited for until be moved to the preheater of subsequent processing, and controls supporting plate not
It is conveyed to solder flux apparatus for coating 100.On the other hand, in the case where being judged as that coating modification action is not started in waiting shape
State.
In step s 110, if the operation mode of control device 50 switchs to be coated with modification action, driving portion 52 is carried out
Driving, makes spray nozzle part 30 be moved to application place PA（Referring to Fig.1）.Application place PA refers to the long side direction in solder flux pre-blowing portion 20
On one end（Front side in Fig. 1）Position.
In the step s 120, control device 50 is by keeping solenoid valve 64 in the open state and extremely adding Pressurized air supply
Pressure vessel 62, to be coated on solder flux pre-blowing portion 20 from spray nozzle part 30 by solder flux Fx.At this point, pressurization is pressurizeed on the basis of for example setting
Value 0.08MPa.Moreover, in step S120, become the state since the solder flux coating that spray nozzle part 30 sprays solder flux, but from spray
Movements of the application place PA of mouth 30 to PB（Scanning）In starting after delay time for step S130.The reason is that
It is needed from the stability of flow that is applied to for starting solder flux Fx by the scheduled time.Control device 50 judges whether in step s 130
It has passed through delay time.In the case where being judged as have passed through delay time, step S140 is entered, is being judged as without prolonging
In the case of the slow time, wait until by delay time.After delay time, spray nozzle part 30 is made in step S140
It is moved from application place PA to application place PB（Scanning）.Moreover, application place PB refers to the long side direction in solder flux pre-blowing portion 20
On the other end（Inboard in Fig. 1）Position.
In step S150, control device 50 obtains spray nozzle part 30 and is moved from application place PA to application place PB（Scanning）
When flux flow.Specifically, obtain measured by flowmeter 60, from pressurizing vessel 62 supply to spray nozzle part 30 solder flux
The present flow rate of Fx, and by the current flow indication in the solder flux spreader coating modification picture of operation display part 70 shown in Fig. 7
Face 70a.About the acquisition of the present flow rate, step S110~step S140 can also be repeatedly carried out, using average flow rate as working as
Preceding flow.
In step S160, control device 50 calculates pressurization modification amount according to the present flow rate of acquired solder flux Fx.Control
Device 50 processed is by using above-mentioned formula（1）Present flow rate is subtracted from standard flow and calculates difference in flow, by using above-mentioned calculation
Formula（2）So that coefficient is multiplied with difference in flow and calculates pressurization modification amount.
In step S170, after spray nozzle part 30 reaches application place PB, control device 50 makes solenoid valve 64 be in closing
State and stop being coated with solder flux Fx from spray nozzle part 30.
In step S180, control device 50 makes the pressurization modification amount of calculating be added with benchmark pressurization value, changes in container
Pressurization.Command signal Sr based on the pressurization modification amount after change is transmitted to electropneumatic controller 66 by control device 50.By
This, the pressure supplied from air supply unit 68 is adjusted to make to become because of temperature change of solder flux Fx etc. by electropneumatic controller 66
The flow of the solder flux Fx of change reverts to the pressure of standard flow and supplies to pressurizing vessel 62.
In step S190, control device 50 change pressurize after keep solenoid valve 64 in the open state and by forced air
Thus supply is coated on solder flux pre-blowing portion 20 to pressurizing vessel 62 from spray nozzle part 30 by solder flux Fx.Pressurization at this time be with by controlling
The corresponding pressurization value of pressurization modification amount that device 50 processed is fed back.Moreover, in step S190, though being formed makes solder flux from spray nozzle part
30 solder flux sprayed are coated with beginning state, but movement of the spray nozzle part 30 from application place PB to application place PA（Scanning）Passing through
Start after delay time in step S200.The reason is that being needed from the stability of flow that is applied to for starting solder flux Fx by pre-
The fixed time.
Whether the judgement of control device 50 have passed through delay time in step s 200.It is being judged as have passed through delay time
In the case of, step S210 is entered, in the case where being judged as without delay time, is waited until by delay time.
Spray nozzle part 30 after delay time, is set to be moved from application place PB to application place PA on one side in step S210, on one side
It is coated on solder flux pre-blowing portion 20 from spray nozzle part 30 by solder flux Fx.
In step S220, control device 50 obtains spray nozzle part 30 and is moved from application place PB to application place PA（Scanning）
When flux flow.Specifically, obtain measured by flowmeter 60, from pressurizing vessel 62 supply to spray nozzle part 30 solder flux
The present flow rate of Fx.Since the present flow rate of acquisition is coated with modification picture 70a as flow indication after modification in solder flux spreader
Flow modification result 710 in, therefore whether user can be easy to confirm the flow of solder flux Fx by coating modification action
Restore to normal range (NR).
In step S230, after spray nozzle part 30 reaches application place PA, control device 50 drives driving portion 52
And spray nozzle part 30 is made to be moved to normal place.Solder flux coating modification is carried out using such a series of actions to act, every predetermined
Time repeats to carry out solder flux coating modification action after user's input operation starts.
（The flow of solder flux apparatus for coating confirms action example）
Figure 10 shows the action of the control device 50 in the case where carrying out the flow confirmation action of solder flux apparatus for coating 100
An example flow chart.Moreover, pair acting common action with above-mentioned coating modification simplifies explanation.It is shown in Fig. 7 by operating
The ACK button 718 of solder flux spreader coating modification picture 70a acts to carry out the flow confirmation.
As shown in figure 8, control device 50 judges whether to start flow confirmation action in step S300.Control device 50 exists
It is judged as entering step S310 in the case of proceeding by flow confirmation action, is being judged as that not proceeding by flow confirmation moves
In the case of work, waits until and proceed by flow confirmation action.
In step S310, if the operation mode of control device 50 switchs to flow confirmation action, driving portion 52 is carried out
It drives and spray nozzle part 30 is made to be moved to application place PA.
Solder flux Fx is coated on solder flux pre-blowing portion 20 by control device 50 from spray nozzle part 30 in step s 320.In the step
In S320, though becoming the state since the solder flux coating that spray nozzle part 30 sprays solder flux, spray nozzle part 30 is from application place PA to painting
The movement of cloth position PB（Scanning）Start after the judgement of step S330 has been subjected to delay time.The control device in step S330
50 judge whether to have passed through delay time.Control device 50 enters step in the case where being judged as have passed through delay time
S340 is waited until in the case where being judged as without delay time by delay time.
After delay time, spray nozzle part 30 is made to be moved from application place PA to application place PB in step S340（It sweeps
It retouches）.
In step S350, control device 50 obtains spray nozzle part 30 and is moved from application place PA to application place PB（Scanning）
When flux flow.Specifically, obtain using flowmeter 60 measure, from pressurizing vessel 62 supply to spray nozzle part 30 solder flux
The present flow rate of Fx, and by the current flow indication in the solder flux spreader coating modification picture of operation display part 70 shown in Fig. 7
The confirmation flow 720 of face 70a.
In step S360, after spray nozzle part 30 reaches application place PB, control device 50 makes solder flux Fx from spray nozzle part 30
The coating of progress stops.Then, driving portion 52 is driven and spray nozzle part 30 is made to be moved to normal place.In this way one
Action acts to execute flow confirmation.
As mentioned above, according to the present embodiment, it is coated with relative in common solder flux apparatus for coating painting process
Substrate be set independently for the dedicated solder flux pre-blowing portion 20 of coating solder flux Fx.Therefore, it carrying out flow confirmation action, applying
Cloth modification act when, can using the solder flux Fx obtained in the coating carried out to solder flux pre-blowing portion 20 flow, be coated on by
Coating width of actual solder flux Fx of coated face 20d etc. confirms whether solder flux Fx is applied with the flow of setting.In addition, by
In carrying out the confirmation using solder flux pre-blowing portion 20, there is no need to use the substrate of coating confirmation to be just able to confirm that the stream of solder flux Fx
Amount.Thereby, it is possible to simply with low cost confirm setting flow whether be in normal range (NR), even if solder flux Fx flow because
The variation of environment temperature etc. and in the case of changing, also can more precisely control the flow of solder flux Fx.
In addition, since the face 20d that is applied in solder flux pre-blowing portion 20 is equipped with filter element 24, solder flux can be prevented
Fx drips to substrate, solder flux spreader container 10.In addition, solder flux pre-blowing portion 20 can be unloaded from solder flux spreader container 10,
Therefore it by the way that solder flux pre-blowing portion 20 to be unloaded to and is being changed to new filter element 24 after certain period, can reliably keep away
Exempt from dripping for solder flux Fx.
In addition, according to the present embodiment, according to measured using flowmeter 60 present flow rate of solder flux Fx by solder flux Fx because
Temperature change etc. and the variation of flow that generates is revised as normal discharge, according to the mathematic interpolation of the present flow rate and standard flow
Pressurize modification amount, the pressurization modification amount of the calculating fed back into electropneumatic controller 66, therefore even if solder flux Fx temperature
In the case of changing because of the variation of use environment, the flow of solder flux Fx can also be made to keep certain.
Moreover, coating modification action according to the present embodiment, it can be logical from the application place PA in solder flux pre-blowing portion 20
Pressurization modification amount corresponding with the changes in flow rate of solder flux Fx is calculated into the path of application place PB, and can be from application place PB
It is back to the flow for the solder flux Fx that the modification amount of the pressurization based on feedback is confirmed in the path of application place PA.Thereby, it is possible to effective
Ground carries out the modification and confirmation of flow.
Moreover, the technical scope of the present invention is not limited to the above embodiment, it is included in the model for not departing from the purport of the present invention
Enclose technical solution obtained from the interior various changes to the above embodiment application.In the above-described embodiment, by solder flux pre-blowing portion
20 are respectively arranged on the both ends of solder flux spreader container 10, but can also be only in the end set solder flux pre-blowing portion 20 of side.
Claims (2)
1. a kind of solder flux apparatus for coating, substrate is conveyed in such a way that the solder flux of substrate coating surface side is underlying, which applies
Cloth apparatus is coated with solder flux from the solder flux coated face for the aforesaid substrate that the conveying of the lower direction of aforesaid substrate comes, which is characterized in that
The solder flux apparatus for coating has：
Spray nozzle part, be configured to aforesaid substrate in-plane and the direction orthogonal with the in-plane at least one
It is moved on a direction；
Pressurized air supply portion, it is by supplying forced air into the container for storing above-mentioned solder flux that above-mentioned solder flux is defeated
It send to above-mentioned spray nozzle part；
Coating width configuration part is used to set the coating width of the solder flux from said nozzle portion；
Flow set portion is used to set the flow for the above-mentioned solder flux being coated with from said nozzle portion；
Flow measurement portion is used to measure according to the above-mentioned flow set by above-mentioned configuration part and supply to above-mentioned spray nozzle part
State the flow of solder flux；
Control unit is calculated for the present flow rate of the above-mentioned solder flux measured by above-mentioned measurement portion to be adjusted to preset
The pressurization modification amount of standard flow；With
Pressure adjustment unit is adjusted according to the pressurization modification amount transmitted from above-mentioned control unit from above-mentioned Pressurized air supply portion
Above-mentioned forced air, and by Pressurized air supply after adjustment to said vesse；
Above-mentioned coating width configuration part is configured to：The immitation as aforesaid substrate can will be loaded using said nozzle portion
In aforesaid substrate solder flux application place, be formed with the glass plate of coating width confirmation flag from being placed in the coating of above-mentioned solder flux
The coating width of the above-mentioned solder flux of the lower section coating of the above-mentioned glass plate of position is adjusted to the model of above-mentioned coating width confirmation flag
In enclosing, wherein above-mentioned coating width confirmation flag is the benchmark of the coating width of solder flux.
2. a kind of solder flux coating method is that have solder flux coating side used in the solder flux apparatus for coating of coating width configuration part
Method, substrate are conveyed in such a way that the solder flux of substrate coating surface side is underlying, and the solder flux apparatus for coating is under aforesaid substrate
The solder flux coated face for the aforesaid substrate that direction conveying comes is coated with solder flux, is confirming whether solder flux is applied with the coating width of setting
When, which is coated with above-mentioned solder flux with the coating width of above-mentioned setting, which is characterized in that
The solder flux coating method includes the following steps：
1st step, receive from can aforesaid substrate in-plane and the direction orthogonal with the in-plane at least one
The setting of the flow of the above-mentioned solder flux for the spray nozzle part coating moved on a direction：
In the step of solder flux application place loads glass plate as the immitation of aforesaid substrate；With
Second step, with the above-mentioned flow that is set using above-mentioned 1st step from the above-mentioned glass for being placed in above-mentioned solder flux application place
The above-mentioned glass plate that the lower direction of plate is formed with coating width confirmation flag is coated with above-mentioned solder flux, will be with the coating width of the solder flux
Mode in the range of above-mentioned coating width confirmation flag is wide by the coating of the solder flux after the adjustment of above-mentioned coating width configuration part
Degree is as benchmark coating width and receives, wherein above-mentioned coating width confirmation flag is the benchmark of the coating width of above-mentioned solder flux.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013072980A JP6355893B2 (en) | 2013-03-29 | 2013-03-29 | Flux coating apparatus and flux coating method |
| JP2013-072980 | 2013-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104070256A CN104070256A (en) | 2014-10-01 |
| CN104070256B true CN104070256B (en) | 2018-09-25 |
Family
ID=51592084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410123065.5A Active CN104070256B (en) | 2013-03-29 | 2014-03-28 | Solder flux apparatus for coating and solder flux coating method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6355893B2 (en) |
| CN (1) | CN104070256B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6269568B2 (en) * | 2015-05-12 | 2018-01-31 | 株式会社村田製作所 | Flux coating apparatus and flux coating method |
| JP5910787B1 (en) * | 2015-10-22 | 2016-04-27 | 千住金属工業株式会社 | Flux recovery device |
| CN105789093A (en) * | 2016-03-28 | 2016-07-20 | 珠海迈科智能科技股份有限公司 | Automatic surface mounting device of radiator |
| US20240082941A1 (en) * | 2021-07-20 | 2024-03-14 | Shinkawa Ltd. | Flux transfer apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5460653A (en) * | 1990-06-28 | 1995-10-24 | Nec Corporation | Spray type flux applying device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2535473B2 (en) * | 1987-08-27 | 1996-09-18 | 富士機械製造株式会社 | High-viscosity fluid coating device for printed circuit boards |
| JP2708957B2 (en) * | 1990-04-19 | 1998-02-04 | 三洋電機株式会社 | Coating device |
| JP2538701B2 (en) * | 1990-06-28 | 1996-10-02 | 日本電気株式会社 | Spray type flux applicator |
| JPH04113476U (en) * | 1991-03-19 | 1992-10-05 | 日本電気株式会社 | Flux coating equipment |
| JP2592948Y2 (en) * | 1993-07-20 | 1999-03-31 | 大阪アサヒ化学株式会社 | Spray control device |
| JP2820595B2 (en) * | 1993-07-30 | 1998-11-05 | 日本電熱計器株式会社 | Spray type flux coating device and coating method |
| JPH07321430A (en) * | 1994-05-20 | 1995-12-08 | Nippon Avionics Co Ltd | Adhesive-coating-diameter measuring method of printed-wiring board and printed-wiring board |
| JP4365946B2 (en) * | 1999-08-06 | 2009-11-18 | 株式会社タムラ製作所 | Flux coating method and flux coating apparatus |
| TW200800411A (en) * | 2006-06-28 | 2008-01-01 | Nordson Corp | Conformal coating system with closed loop control |
| JP5326565B2 (en) * | 2008-12-27 | 2013-10-30 | 千住金属工業株式会社 | Flux coating apparatus and method |
| JP2011025294A (en) * | 2009-07-28 | 2011-02-10 | Hioki Ee Corp | Device and method for flux coating |
-
2013
- 2013-03-29 JP JP2013072980A patent/JP6355893B2/en active Active
-
2014
- 2014-03-28 CN CN201410123065.5A patent/CN104070256B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5460653A (en) * | 1990-06-28 | 1995-10-24 | Nec Corporation | Spray type flux applying device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104070256A (en) | 2014-10-01 |
| JP2014197630A (en) | 2014-10-16 |
| JP6355893B2 (en) | 2018-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104070256B (en) | Solder flux apparatus for coating and solder flux coating method | |
| TWI537061B (en) | A coating method for a liquid material, a coating apparatus, and a memory medium having a memory program | |
| TWI293260B (en) | Method of dispensing viscous material onto a substrate from a dispenser | |
| US9126280B2 (en) | Print head for stencil printer | |
| EP2922640B1 (en) | Dispenser and method of dispensing and controlling with a flow meter | |
| CN102714165B (en) | Method for applying liquid material, application device | |
| JP5280702B2 (en) | Application method of liquid material, apparatus and program thereof | |
| US11185879B2 (en) | Systems and methods for calibrating flow and for coating a substrate | |
| JP6862478B2 (en) | How to apply a liquid coating to a substrate | |
| CN105665182A (en) | Working apparatus | |
| KR20180054679A (en) | Dispensing monitoring and control | |
| CN101573185B (en) | Method and apparatus for filling liquid material | |
| JP3877038B2 (en) | Liquid application method and apparatus | |
| JP5437752B2 (en) | Coating apparatus and coating state correction method | |
| US20190240688A1 (en) | Systems and methods for calibrating flow and for coating a substrate | |
| Geren et al. | Solder paste dispensing in robotic SMD rework | |
| TW201313338A (en) | Solvent supplying unit, washing system and washing method thereof | |
| CN102990183A (en) | Method for transferring paste soldering flux in process of repairing ball grid array (BGA) device | |
| JPH0846339A (en) | Spray type solder flux coating system | |
| KR100944469B1 (en) | Apparatus for measuring liquid discharging amount for chip potting machine and method thereof | |
| JP2001046928A (en) | Flux coating method and flux coater | |
| CN111940256A (en) | Nozzle management device, nozzle management method, and coating device | |
| JP2001079472A (en) | Method for discharging liquid material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |