CN104051366A - 指纹识别芯片封装结构和封装方法 - Google Patents
指纹识别芯片封装结构和封装方法 Download PDFInfo
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- CN104051366A CN104051366A CN201410309750.7A CN201410309750A CN104051366A CN 104051366 A CN104051366 A CN 104051366A CN 201410309750 A CN201410309750 A CN 201410309750A CN 104051366 A CN104051366 A CN 104051366A
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Abstract
一种指纹识别芯片封装结构和封装方法,封装结构包括:基板;耦合于基板表面的感应芯片,所述感应芯片具有第一表面、以及与第一表面相对的第二表面,所述感应芯片的第一表面具有感应区,所述感应芯片的第二表面位于基板表面;至少位于感应芯片的感应区表面的上盖层,所述上盖层的材料为聚合物;位于基板和感应芯片表面的塑封层,所述塑封层暴露出所述上盖层。所述封装结构能对感应芯片灵敏度的要求降低,应用更广泛。
Description
技术领域
本发明涉及半导体制造技术领域,尤其涉及一种指纹识别芯片封装结构和封装方法。
背景技术
随着现代社会的进步,个人身份识别以及个人信息安全的重要性逐步受到人们的关注。由于人体指纹具有唯一性和不变性,使得指纹识别技术具有安全性好,可靠性高,使用简单方便的特点,使得指纹识别技术被广泛应用于保护个人信息安全的各种领域。而随着科学技术的不断发展,各类电子产品的信息安全问题始终是技术发展的关注要点之一。尤其是对于移动终端,例如手机、笔记本电脑、平板的电脑、数码相机等,对于信息安全性的需求更为突出。
现有的指纹识别器件的感测方式包括电容式(电场式)和电感式,指纹识别器件通过提取用户指纹,并将用户指纹转换为电信号输出,从而获取用户的指纹信息。具体的,如图1所示,图1是现有技术的一种指纹识别器件的剖面结构示意图,包括:基板100;耦合于基板100表面的指纹识别芯片101;覆盖于所述指纹识别芯片101表面的玻璃基板102。
以电容式指纹识别芯片为例,所述指纹识别芯片101内具有一个或多个电容极板。由于用户手指的表皮或皮下层具有凸起的脊和凹陷的谷,当用户手指103接触所述玻璃基板102表面时,所述脊与谷到指纹识别芯片101的距离不同,因此,用户手指103脊或谷与电容极板之间的电容值不同,而指纹识别芯片101能够获取所述不同的电容值,并将其转化为相应的电信号输出,而指纹识别器件汇总所受到的电信号之后,能够获取用户的指纹信息。
然而,在现有的指纹识别器件中,对指纹识别芯片的灵敏度要求较高,使得指纹识别器件的制造及应用受到限制。
发明内容
本发明解决的问题是提供一种指纹识别芯片封装结构和封装方法,所述封装结构能对感应芯片灵敏度的要求降低,应用更广泛。
为解决上述问题,本发明提供一种指纹识别芯片封装结构,包括:基板;耦合于基板表面的感应芯片,所述感应芯片具有第一表面、以及与第一表面相对的第二表面,所述感应芯片的第一表面具有感应区,所述感应芯片的第二表面位于基板表面;至少位于感应芯片的感应区表面的上盖层,所述上盖层的材料为聚合物;位于基板和感应芯片表面的塑封层,所述塑封层暴露出所述上盖层。
可选的,所述上盖层的厚度为20微米~100微米;所述上盖层的莫氏硬度大于或等于8H;所述上盖层的介电常数大于或等于7。
可选的,所述聚合物的材料为光敏材料。
可选的,所述上盖层内具有光敏颗粒,所述光敏颗粒的尺寸小于6微米。
可选的,所述感应芯片的第一表面还包括:包围所述感应区的外围区。
可选的,所述感应芯片还包括:位于所述外围区内具有边缘凹槽,所述感应芯片的侧壁暴露出所述凹槽;位于感应芯片外围区的芯片电路,所述芯片电路位于感应芯片的外围区表面、以及凹槽的侧壁和底部表面,且位于凹槽底部的部分芯片电路具有第一连接端。
可选的,所述边缘凹槽为包围感应区的连续凹槽;或者,所述边缘凹槽为包围感应区的若干分立凹槽。
可选的,所述基板具有第一表面,所述感应芯片耦合于基板的第一表面,所述基板的第一表面具有第二连接端。
可选的,还包括:导电线,所述导电线两端分别与第一连接端与第二连接端连接。
可选的,还包括:位于感应芯片侧壁表面、基板第一表面、以及边缘凹槽内的导电层,所述导电层两端分别与第一连接端和第二连接端连接。
可选的,还包括:位于感应芯片和基板之间的第一粘结层。
可选的,所述感应芯片还包括:贯穿所述感应芯片的导电插塞,所述感应芯片的第二表面暴露出所述导电插塞,所述导电插塞的一端与第一连接端连接;位于感应芯片第二表面暴露出的导电插塞顶部的焊料层,所述焊料层焊接于第二连接端表面。
可选的,还包括:位于基板表面的保护环,所述保护环包围所述感应芯片、上盖层和塑封层。
可选的,所述保护环的材料为金属;所述保护环通过所述基板接地。
可选的,还包括:包围所述塑封层、感应芯片和保护环的外壳,所述外壳暴露出所述上盖层,所述上盖层的颜色与所述外壳的颜色一致。
可选的,还包括:包围所述塑封层和感应芯片的外壳,所述外壳暴露出所述上盖层,所述上盖层的颜色与所述外壳的颜色一致。
可选的,所述基板为硬性基板或软性基板;所述基板的一端具有连接部,所述连接部用于使感应芯片与外部电路电连接。
相应的,本发明提供一种形成上述任一项结构的封装方法,包括:提供基板;在所述基板表面耦合感应芯片,所述感应芯片具有第一表面、以及与第一表面相对的第二表面,所述感应芯片的第一表面具有感应区,所述感应芯片的第二表面位于基板表面;至少在所述应芯片的感应区表面形成上盖层,所述上盖层的材料为聚合物;在基板和感应芯片表面的塑封层,所述塑封层暴露出所述上盖层。
可选的,当所述上盖层的材料为聚合物材料,且所述聚合物材料为光敏材料时,所述上盖层的形成方法包括:在基板表面和感应芯片表面涂布上盖膜;对所述上盖膜进行曝光显影,去除基板表面、以及感应芯片表面感应区以外的上盖膜,在感应区表面形成上盖层。
可选的,所述涂布工艺为旋涂工艺或喷涂工艺。
与现有技术相比,本发明的技术方案具有以下优点:
本发明的封装结构中,所述感应芯片的第二表面耦合于基板表面,所述感应芯片的第一表面具有感应区,所述感应区用于提取用户指纹;所述感应芯片的感应区表面具有上盖层,所述上盖层用于保护感应芯片的感应区,用户的手指置于所述上盖层表面,即能够使感应区提取到用户指纹,而感应芯片能够将所述用户指纹转换为电信号输出。由于所述上盖层的材料为聚合物,而聚合物材料具有较好的延展性和柔韧性,而且覆盖能力好,因此,所述能够使上盖层的厚度较薄,而且硬度较高,从而使所述上盖层具有足够大的硬度以保护感应芯片;同时,所述上盖层表面到感应芯片的距离减小,使感应芯片易于检测到用户指纹,相应地,所述封装结构能够降低对感应芯片灵敏度的要求,使得指纹识别芯片的封装结构的应用更为广泛。而且,所述上盖层的材料为聚合物,使得所述上盖层的成本低,降低了封装结构的制造成本。
进一步,所述上盖层的厚度为20微米~100微米;所述上盖层的莫氏硬度大于或等于8H;所述上盖层的介电常数大于或等于7。其中,所述上盖层的厚度较薄,且硬度较大,所述上盖层具有足够大的硬度以保护感应芯片的感应区,同时使所述感应芯片更易检测到置于上盖层表面的用户指纹,降低了对感应芯片灵敏度的要求。所述上盖层的介电常数较大,使所述上盖层的电隔离性能更佳,使所述上盖层对感应芯片感应区的保护能力更佳。
进一步,所述基板表面还具有包围所述感应芯片、上盖层和塑封层的保护环。所述保护环用于对所述感应芯片进行静电防护,避免感应区检测到的用户指纹数据精确度下降,或者能够消除感应芯片输出的信号噪声,使感应芯片检测到的数据、以及输出的信号更精确。
本发明的封装方法中,所述感应芯片的第一表面具有用于提取用户指纹的感应区,在所述感应芯片的感应区表面形成上盖层,使所述上盖层用于保护感应芯片的感应区,所述上盖层表面用于放置用户手指,以进行指纹检测。由于所述上盖层的材料为聚合物,而聚合物材料具有较好的延展性和柔韧性,且覆盖能力佳,能够使所形成的上盖层的厚度薄,且硬度高,因此,所形成的上盖层具有足够大的硬度以保护感应芯片,而且所述上盖层表面到感应芯片的距离减小,使感应区更易获取用户指纹数据,所形成的封装结构对感应芯片灵敏度的要求降低,所述封装方法的使用范围更广泛。而且,所述上盖层的材料为聚合物,形成所述上盖层的成本低,进而降低了制造所述封装结构的成本。
进一步,当所述上盖层的材料为聚合物材料,且所述聚合物材料为光敏材料时,由于所述光敏聚合物材料能够被直接曝光显影,因此,所述上盖层的形成方法包括:在基板表面和感应芯片表面涂布上盖膜之后,直接对所述上盖膜进行曝光显影,即能够去除基板表面、以及感应芯片表面感应区以外的上盖膜,从而在感应区表面形成上盖层。形成所述上盖层的方法简单,而且对基板和感应芯片的损伤较小,有利于提高所形成的封装结构的可靠性和稳定性。
附图说明
图1是现有技术的一种指纹识别器件的剖面结构示意图;
图2至图6是本发明实施例的指纹识别芯片的封装结构的示意图;
图7至图12是本发明实施例的一种指纹识别芯片的封装方法的剖面结构示意图。
具体实施方式
如背景技术所述,在现有的指纹识别器件中,对指纹识别芯片的灵敏度要求较高,使得指纹识别器件的制造及应用受到限制。
经过研究发现,请继续参考图1,指纹识别芯片101表面覆盖有玻璃基板102,所述玻璃基板102用于保护指纹识别芯片101,而用户的手指103直接与所述玻璃基板102相接触,因此,为了保证所述玻璃基板102具有足够的保护能力,所述玻璃基板102的厚度较厚。然而,由于所述玻璃基板102的厚度较厚,因此要求指纹识别芯片101具有较高的灵敏度,以保证能够精确提取到用户指纹。然而,高灵敏度的指纹识别芯片制造难度较大、制造成本较高,继而造成指纹识别芯片的应用和推广受到限制。
具体的,继续以电容式指纹识别器件为例,当用户手指置103于玻璃基板102表面时,用户手指103、与指纹识别芯片101中的电容极板之间能够构成电容;其中,所述用户手指103和电容极板为电容的两极,所述玻璃基板102为电容两极之间的电介质。然而,由于所述玻璃基板102的厚度较厚,使得用户手指103与电容基板之间的电容值较大,而用户手指103的脊与谷之间的高度差异较小,因此,所述脊与电容极板之间的电容值、相对于所述谷与电容极板之间的电容值之间的差值极小,为了能够精确检测到所述电容值的差异,要求所述指纹识别芯片101具有较高的灵敏度。
为了解决上述问题,本发明提出一种指纹识别芯片的封装结构和封装方法。其中,所述封装结构中,感应芯片的感应区表面覆盖有上盖层,所述上盖层替代了传统的玻璃基板,能够直接与用户手指接触,用于保护感应芯片。由于所述上盖层的材料为聚合物,而聚合物材料具有较好的延展性和柔韧性,能够使所述上盖层的厚度较薄且硬度较高,在所述上盖层足以保护感应芯片的同时,所述上盖层表面到感应芯片的距离减小,从而使感应芯片易于检测到用户指纹;相应地,所述封装结构降低了对感应芯片灵敏度的要求,使得指纹识别芯片的封装结构的应用更为广泛。
为使本发明的上述目的、特征和优点能够更为明显易懂,下面结合附图对本发明的具体实施例做详细的说明。
图2至图6是本发明实施例的指纹识别芯片的封装结构的示意图。
请参考图2,所述指纹识别芯片的封装结构包括:
基板200;
耦合于基板200表面的感应芯片201,所述感应芯片201具有第一表面210、以及与第一表面210相对的第二表面220,所述感应芯片201的第一表面210具有感应区211,所述感应芯片201的第二表面220位于基板200表面;
至少位于感应芯片201的感应区211表面的上盖层202,所述上盖层202的材料为聚合物;
位于基板200和感应芯片201表面的塑封层203,所述塑封层203暴露出所述上盖层202。
以下将对上述指纹识别芯片的封装结构进行详细说明。
所述基板200用于固定所述感应芯片201,并使所述感应芯片201与其它器件或电路电连接。所述基板200为硬性基板或软性基板,能够根据需要设置所述感应芯片201的器件或终端进行调整;在本实施例中,所述基板200为硬性基板,所述硬性基板为PCB基板、玻璃基板、金属基板、半导体基板或聚合物基板。
所述基板200具有第一表面230,而所述感应芯片201耦合于基板200的第一表面230。所述基板200的第一表面230具有布线层(未示出),而所述布线层与位于基板200第一表面230的第二连接端205连接,所述第二连接端205用于与感应芯片201表面的芯片电路连接。
本实施例中,所述基板200的一端具有连接部204,所述连接部204的材料包括导电材料,连接部204与所述布线层电连接,从而使所述芯片电路能够通过基板200第一表面230的布线层和连接部204与外部电路或器件电连接,从而实现电信号的传输。
位于感应芯片201第一表面210的感应区211用于检测和接收用户的指纹信息,所述感应区211内能够具有电容结构、或者具有电感结构,所述电容结构或电感结构能够用于获取用户指纹信息。
在本实施例中,所述感应区211内具有至少一个电容极板,当用户手指置于上盖层202表面时,所述电容极板、上盖层202和用户手指构成电容结构,而所述感应区211能够获取用户手指表面脊与谷与电容极板之间的电容值差异,并将所述电容值差异通过芯片电路进行处理之后输出,以此获取用户指纹数据。
所述感应芯片201的第一表面210还包括包围所述感应区211的外围区212,所述感应芯片201第一表面210的外围区212具有芯片电路(未标示),所述芯片电路与感应区211内的电容结构或电感结构电连接,用于对电容结构或电感结构输出的电信号进行处理。
所述感应芯片201还包括:位于所述外围区212内具有边缘凹槽206,所述感应芯片201的侧壁暴露出所述凹槽206;位于感应芯片201外围区212的芯片电路还位于所述凹槽206的侧壁和底部表面,且位于凹槽206底部的部分芯片电路连接到第一连接端207。
所述边缘凹槽206,用于形成芯片电路的输出端,即所述第一连接端207,通过将第一连接端207与基板200表面的第二连接端205电连接,能够实现感应芯片201与基板200的耦合。
在一实施例中,所述边缘凹槽206为包围感应区211的连续凹槽,所述连续的边缘凹槽206底部表面具有一个或若干第一连接端207;在另一实施例中,所述边缘凹槽206为包围感应区211的若干分立凹槽,且每一边缘凹槽206内具有一个或若干第一连接端207。所述第一连接端207的数量和分布状态根据芯片电路的具体电路布线需要设计。
在本实施例中,所述边缘沟槽206的侧壁相对于感应芯片201的表面倾斜,且所述边缘沟槽206的侧壁与底部之间的夹角呈钝角,所述倾斜的边缘沟槽206侧壁表面易于形成芯片电路,以此感应区211到第一连接端207之间的电路布线。
所述上盖层202覆盖感应芯片201的感应区211,所述上盖层202还能够覆盖部分感应区211周围的外围区212。所述上盖层202的材料为聚合物材料,而聚合物材料具有良好的柔韧性、延展性以及覆盖能力,因此能够使所述上盖层202的厚度较薄,同时能够保证所述上盖层202具有较高的硬度,从而增强感应芯片201对用户手指指纹的感应能力,同时能够保证上盖层202对感应区211的保护能力。
所述上盖层202的厚度为20微米~100微米,所述上盖层202的厚度较薄,当用户手指置于所述上盖层202表面时,所述手指到感应区211的距离减少,因此,感应区211更容易检测到用户手指的指纹,从而降低了对感应芯片201高灵敏度的要求。
在本实施例中,所述感应区211内具有电容极板,由于上盖层202厚度较薄,使得用户手指与电容极板之间的距离较短,则用户手指与电容极板之间的电容值较小,相应的,用户手指表面的脊与电容基板之间的电容值、相对于谷与电容基板之间的电容值差异较大,使所述感应区211易于检测到用户手指的指纹信息。
所述上盖层202的莫氏硬度大于或等于8H,所述上盖层202的硬度较高,因此,即使所述上盖层202的厚度较薄,所述上盖层202也足以保护感应芯片201的感应区211,当用户手指在所述上盖层202表面移动时,不会对感应芯片201造成损伤。而且,由于所述上盖层202的硬度较高,因此所述上盖层202难以发生形变,即使用户手指按压与所述上盖层202表面,所述上盖层202的厚度也难以发生变化,从而保证了感应区211的检测结果精确度。
所述上盖层202的介电常数大于或等于7,所述上盖层202的电隔离能力较强,则所述上盖层202对感应区211的保护能力较强。
在本实施例中,由于上盖层202的厚度较薄,而用户手指与电容极板之间的电容值与上盖层202的厚度成反比,与上盖层202的介电常数成正比,因此,当上盖层202的厚度较薄,而介电常数较大时,能够使用户手指与电容极板之间的电容值在感应区211能够检测的范围内,避免电容值过大或过小而使感应区211的检测失效。
而且,当上盖层202的厚度在20微米~100微米的范围内,而介电常数在大于或等于7的范围内时,随着上盖层202的厚度增大,上盖层202的介电常数也相应增大,以便使用户手指与电容极板之间的电容值能够在一个稳定且感应区211可检测的范围内。
所述上盖层202的材料为环氧树脂、聚酰亚胺树脂、苯并环丁烯树脂、聚苯并恶唑树脂、聚对苯二甲酸丁二酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烃、聚氨酯、聚烯烃、聚醚砜、聚酰胺、聚亚氨酯、乙烯-醋酸乙烯共聚物、聚乙烯醇或其他合适的聚合物材料。
在本实施例中,所述聚合物材料为光敏材料,所述聚合物材料内具有光敏颗粒,所述光敏颗粒能够使聚合物材料能够被曝光显影,并实现图形化。所述光敏颗粒的尺寸小于6微米,使所述聚合物材料在曝光后形成的上盖层202的尺寸精确且易于控制。
在本实施例中,指纹识别芯片封装结构还包括:导电线208,所述导电线208两端分别与第一连接端207与第二连接端205连接,从而使芯片电路与基板200表面的布线层电连接,而所述布线层与连接部204电连接,从而使感应芯片201表面的芯片电路和感应区211能够与外部电路或器件进行电信号的传输。所述导电线208的材料为金属,所述金属为铜、钨、铝、金或银。
由于本实施例中,第一连接端207和第二连接端205之间通过导电线208连接,因此所述指纹识别芯片的封装结构还包括:位于感应芯片201和基板200之间的第一粘结层301,用于将感应芯片201固定于基板200的第一表面230。
在本实施例中,所述指纹识别芯片的封装结构还包括:位于基板200表面的保护环209,所述保护环209包围所述感应芯片201、上盖层202和塑封层203。所述保护环209的材料为金属,且所述保护环209通过所述基板200接地,所述保护环209固定于基板200的第一表面230。
在本实施例中,所述保护环209位于感应芯片201、上盖层202和塑封层203周围,覆盖于部分塑封层203上方,且暴露出上盖层202表面。在另一实施例中,保护环仅位于感应芯片201和塑封层203的周围,且暴露出塑封层203和上盖层202的表面。
所述保护环209的材料为金属,所述金属为铜、钨、铝、银或金。所述保护环209用于对所述感应芯片进行静电防护,由于所述保护环209为金属,所述保护环209能够导电,当用户手指在接触上盖层202时产生静电,则静电电荷会首先自所述保护环209传至基板200,从而避免上盖层202被过大的静电电压击穿,以此保护感应芯片201,提高指纹检测的精确度,消除感应芯片输出的信号噪声,使感应芯片输出的信号更精确。
在一实施例中,请参考图3,指纹识别芯片的封装结构还包括:位于感应芯片201侧壁表面、基板200第一表面210、以及边缘凹槽206内的导电层303,所述导电层303两端分别与第一连接端207和第二连接端205连接,以实现感应区211和芯片电路与基板200表面布线层之间的电连接。所述指纹识别芯片的封装结构还包括:位于感应芯片201和基板200之间的第一粘结层301。
在另一实施例中,请参考图4,所述感应芯片201内还具有贯穿所述感应芯片201的导电插塞304,所述感应芯片201的第二表面220暴露出所述导电插塞304,所述导电插塞304的一端与第一连接端207连接;位于感应芯片201第二表面220暴露出的导电插塞304顶部的焊料层305,所述焊料层305焊接于第二连接端205表面,使实现感应区211和芯片电路、与基板200表面布线层之间电连接。由于所述感应芯片201通过焊料层305焊接于基板200第一表面230,使所述感应芯片201相对于基板200固定。
在本实施例中,请参考图5,所述指纹识别芯片的封装结构还包括:包围所述塑封层203、感应芯片201和保护环209的外壳400,所述外壳400暴露出所述上盖层202,使用户手指能够触碰到所述上盖层202表面,以进行指纹检测。所述上盖层202的颜色与所述外壳400的颜色一致,例如当外壳400颜色为黑色时,所述上盖层202的颜色为黑色,当外壳400颜色为白色时,所述上盖层202颜色为白色,使得指纹识别芯片的封装结构整体美观协调。
在另一实施例中,请参考图6,所述指纹识别芯片的封装结构不包括上述保护环209,所述指纹识别芯片的封装结构包括:包围所述塑封层203和感应芯片201的外壳,所述外壳400暴露出所述上盖层202,所述上盖层202的颜色与所述外壳400的颜色一致。
本实施例中,所述感应芯片的第二表面耦合于基板表面,所述感应芯片的第一表面具有感应区,所述感应区用于提取用户指纹;所述感应芯片的感应区表面具有上盖层,所述上盖层用于保护感应芯片的感应区,用户的手指置于所述上盖层表面,即能够使感应区提取到用户指纹,而感应芯片能够将所述用户指纹转换为电信号输出。由于所述上盖层的材料为聚合物,而聚合物材料具有较好的延展性和柔韧性,而且覆盖能力好,因此,所述能够使上盖层的厚度较薄,而且硬度较高,从而使所述上盖层具有足够大的硬度以保护感应芯片;同时,所述上盖层表面到感应芯片的距离减小,使感应芯片易于检测到用户指纹,相应地,所述封装结构能够降低对感应芯片灵敏度的要求,使得指纹识别芯片的封装结构的应用更为广泛。而且,所述上盖层的材料为聚合物,使得所述上盖层的成本低,降低了封装结构的制造成本。
相应的,本发明实施例还提供一种形成上述指纹识别芯片封装结构的封装方法,如图7至图12所示。
请参考图7,提供基板200。
所述基板200为硬性基板或软性基板,能够根据需要设置所述感应芯片201的器件或终端进行调整;在本实施例中,所述基板200为硬性基板,所述硬性基板为PCB基板、玻璃基板、金属基板、半导体基板或聚合物基板。
所述基板200具有第一表面230,所述第一表面230用于耦合后续的感应芯片。在所述基板200的第一表面230形成布线层和第二连接端205,所述布线层与所述第二连接端205连接。
本实施例中,在基板200的一端形成连接部204,所述连接部204的材料包括导电材料,且所述布线层连接到所述连接部204,从而使布线层和第二连接端能够与外部电路或器件电连接。
请参考图8,在所述基板200的第一表面230固定感应芯片201,所述感应芯片201具有第一表面210、以及与第一表面210相对的第二表面220,所述感应芯片201的第一表面210具有感应区211,所述感应芯片201的第二表面220位于基板200表面。
感应区211用于检测和接收用户的指纹信息,所述感应区211内能够具有电容结构、或者具有电感结构,所述电容结构或电感结构能够用于获取用户指纹信息。
在本实施例中,所述感应区211内形成有至少一个电容极板,当用户手指置于上盖层202表面时,所述电容极板、上盖层202和用户手指构成电容结构,而所述感应区211能够获取用户手指表面脊与谷与电容极板之间的电容值差异,并将所述电容值差异通过芯片电路进行处理之后输出,以此获取用户指纹数据。
所述感应芯片201还包括:包围所述感应区211的外围区212。在所述感应芯片201的外围区212内形成有边缘凹槽206,所述感应芯片201的侧壁暴露出所述凹槽206;在所述凹槽206底部形成第一连接端207;在感应芯片201的第一表面210形成芯片电路,且所述芯片电路延伸入所述凹槽206内,并且与第一连接端207连接,所述第一连接端207为芯片电路的输出端。
在一实施例中,所述边缘凹槽206为包围感应区211的连续凹槽,在所述连续的边缘凹槽206底部表面形成一个或若干第一连接端207。在另一实施例中,所述边缘凹槽206为包围感应区211的若干分立凹槽,且每一边缘凹槽206内形成有一个或若干第一连接端207。
在本实施例中,所述边缘沟槽206的侧壁相对于感应芯片201的表面倾斜,且所述边缘沟槽206的侧壁与底部之间的夹角呈钝角。在所述边缘沟槽206内形成芯片电路时,易于对形成于所述倾斜侧壁表面的芯片电路材料进行光刻和刻蚀工艺,以此形成芯片电路的布线。
本实施例中,所述感应芯片通过第一粘结层301固定于基板200的第一表面230,后续通过导电线或导电层时第一连接端207与第二连接层205相连接。
在另一实施例中,请参考图4,在感应芯片201内形成贯穿所述感应芯片201的导电插塞304,所述感应芯片201的第二表面220暴露出所述导电插塞304,所述导电插塞304的一端与第一连接端207连接;在感应芯片201第二表面220暴露出的导电插塞304顶部的焊料层305;将所述焊料层305焊接于第二连接端205表面,使所述感应芯片201与基板200之间相互固定。
请参考图9,在基板200表面和感应芯片201表面涂布上盖膜202a,所述上盖膜202a的材料为聚合物材料。
所述上盖膜202a后续用于形成上盖层。所述聚合物材料具有良好的柔韧性、延展性以及覆盖能力,而且流动性好,因此能够通过涂布工艺在感应区211表面形成厚度较薄的上盖膜202a,从而使后续形成于感应区211表面的上盖层厚度较薄。而所述上盖层的厚度较薄,能够增强感应芯片201对用户手指指纹的感应能力,相应降低了对感应芯片201检测灵敏度的要求。
所述涂布工艺包括旋涂工艺、喷涂工艺或蒸镀工艺,所形成的上盖膜202a的材料具有为流体,因此能够使形成于感应芯片201表面的上盖膜202a厚度较薄,而基板200表面的上盖膜202a厚度较厚。形成于感应芯片201表面的上盖膜202a厚度为20微米~100微米。
所述上盖膜202a的材料为环氧树脂、聚酰亚胺树脂、苯并环丁烯树脂、聚苯并恶唑树脂、聚对苯二甲酸丁二酯、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烃、聚氨酯、聚烯烃、聚醚砜、聚酰胺、聚亚氨酯、乙烯-醋酸乙烯共聚物、聚乙烯醇或其他合适的聚合物材料。
在本实施例中,所述聚合物材料为光敏材料,所述聚合物材料内具有光敏颗粒,所述光敏颗粒能够使聚合物材料能够被曝光显影,因此,后续直接对所述上盖膜202a进行曝光,即能够形成上盖层。所述光敏颗粒的尺寸小于6微米,使后续以曝光后形成的上盖层202的尺寸精确且易于控制。
请参考图10,去除基板200表面、以及感应芯片201表面感应区211以外的上盖膜202a(如图9所示),在感应区211表面形成上盖层202。
本实施例中,由于所述上盖膜202a的聚合物材料为光敏材料,因此,能够通过曝光显影工艺去除感应区211以外的上盖膜202a,形成上盖层202。并且,在进行曝光显影之后,对所形成的上盖层202进行固胶工艺,使上盖层202的材料固化。所形成的上盖层202除了覆盖于感应区211表面之外,还能够覆盖部分感应区211周围的外围区212。
在另一实施例中,所述上盖层202的形成工艺包括:在上盖膜202a表面形成掩膜层,所述掩膜层定义了需要形成上盖层202的对应位置和图形;以所述掩膜层为掩膜,刻蚀所述上盖膜202a,直至暴露出基板200和感应芯片201表面,形成上盖层202。
上盖层202的厚度为20微米~100微米,使所述感应区211易于检测到用户手指的指纹信息。
所述上盖膜202a经过固胶工艺之后,莫氏硬度大于或等于8H,所述上盖层202的硬度较高,当用户手指在所述上盖层202表面移动时,不会对感应芯片201造成损伤。而且,由于所述上盖层202的硬度较高,因此所述上盖层202难以发生形变,即使用户手指按压与所述上盖层202表面,所述上盖层202的厚度也难以发生变化,从而保证了感应区211的检测结果精确度。
所述上盖层202的介电常数大于或等于7,所述上盖层202的电隔离能力较强,则所述上盖层202对感应区211的保护能力较强。而且,在本实施例中,当上盖层202的厚度较薄,而介电常数较大时,能够使用户手指与电容极板之间的电容值在感应区211能够检测的范围内,避免检测失效。
请参考图11,在形成上盖层202之后,使所述基板200与感应芯片201耦合。
在本实施例中,由于感应芯片201通过第一粘结层301固定于基板200表面,因此能够通过导电线或导电层时基板200与感应芯片201耦合。
在本实施例中,在所述基板200表面耦合感应芯片201的方法包括:提供导电线208;将所述导电线208两端通过焊接工艺分别与第一连接端207与第二连接端205连接。所述导电线208的材料为金属,所述金属为铜、钨、铝、金或银。
在一实施例中,请参考图3,在所述基板200表面耦合感应芯片201的方法包括:在感应芯片201侧壁表面、基板200第一表面230、以及边缘凹槽206内的导电层303,所述导电层303两端分别与第一连接端207和第二连接端205连接。所述导电层303的形成工艺包括:以沉积工艺、电镀工艺或化学镀工艺形成导电膜;刻蚀部分所述导电膜以形成导电层303。所述导电层303的材料为金属,所述金属为铜、钨、铝、银、金、钛、钽、镍、氮化钛、氮化钽中的一种或多种。
请参考图12,在基板200和感应芯片201表面形成塑封层203,所述塑封层203暴露出所述上盖层202。
所述塑封层203的材料为环氧树脂、聚乙烯、聚丙烯、聚烯烃、聚酰胺、聚亚氨酯,所述塑封层203还可以采用其它合适的塑封材料。所述塑封层203的形成工艺为注塑工艺(injection molding)、转塑工艺(transfer molding)或丝网印刷工艺。所述封料层400还可以采用其它合适的工艺形成。
在本实施例中,请继续参考图2,在形成封装层203之后,在基板200表面形成保护环209,所述保护环209包围所述感应芯片201、上盖层202和塑封层203。所述保护环209的材料为金属,所述保护环209通过所述基板200接地。所述保护环209的材料为金属,所述金属为铜、钨、铝、银或金。
所述保护环209用于对所述感应芯片进行静电防护,避免上盖层202被过大的静电电压击穿,以此保护感应芯片201,提高指纹检测的精确度,消除感应芯片输出的信号噪声,使感应芯片输出的信号更精确。
本实施例中,所述感应芯片的第一表面具有用于提取用户指纹的感应区,在所述感应芯片的感应区表面形成上盖层,使所述上盖层用于保护感应芯片的感应区,所述上盖层表面用于放置用户手指,以进行指纹检测。由于所述上盖层的材料为聚合物,而聚合物材料具有较好的延展性和柔韧性,且覆盖能力佳,因此,能够使所形成的上盖层的厚度薄,且硬度高,因此,所形成的上盖层具有足够大的硬度以保护感应芯片,而且所述上盖层表面到感应芯片的距离减小,使感应区更易获取用户指纹数据。因此,所形成的封装结构对感应芯片灵敏度的要求降低,所述封装方法的使用范围更广泛。而且,所述上盖层的材料为聚合物,形成所述上盖层的成本低,进而降低了制造所述封装结构的成本。
虽然本发明披露如上,但本发明并非限定于此。任何本领域技术人员,在不脱离本发明的精神和范围内,均可作各种更动与修改,因此本发明的保护范围应当以权利要求所限定的范围为准。
Claims (20)
1.一种指纹识别芯片封装结构,其特征在于,包括:
基板;
耦合于基板表面的感应芯片,所述感应芯片具有第一表面、以及与第一表面相对的第二表面,所述感应芯片的第一表面具有感应区,所述感应芯片的第二表面位于基板表面;
至少位于感应芯片的感应区表面的上盖层,所述上盖层的材料为聚合物;
位于基板和感应芯片表面的塑封层,所述塑封层暴露出所述上盖层。
2.如权利要求1所述的指纹识别芯片封装结构,其特征在于,所述上盖层的厚度为20微米~100微米;所述上盖层的莫氏硬度大于或等于8H;所述上盖层的介电常数大于或等于7。
3.如权利要求1所述的指纹识别芯片封装结构,其特征在于,所述聚合物的材料为光敏材料。
4.如权利要求3所述的指纹识别芯片封装结构,其特征在于,所述上盖层内具有光敏颗粒,所述光敏颗粒的尺寸小于6微米。
5.如权利要求1所述的指纹识别芯片封装结构,其特征在于,所述感应芯片的第一表面还包括:包围所述感应区的外围区。
6.如权利要求5所述的指纹识别芯片封装结构,其特征在于,所述感应芯片还包括:位于所述外围区内的边缘凹槽,所述感应芯片的侧壁暴露出所述凹槽;位于感应芯片外围区的芯片电路,所述芯片电路位于感应芯片的外围区表面、以及凹槽的侧壁和底部表面,且位于凹槽底部的部分芯片电路具有第一连接端。
7.如权利要求6所述的指纹识别芯片封装结构,其特征在于,所述边缘凹槽为包围感应区的连续凹槽;或者,所述边缘凹槽为包围感应区的若干分立凹槽。
8.如权利要求6所述的指纹识别芯片封装结构,其特征在于,所述基板具有第一表面,所述感应芯片耦合于基板的第一表面,所述基板的第一表面具有第二连接端。
9.如权利要求8所述的指纹识别芯片封装结构,其特征在于,还包括:导电线,所述导电线两端分别与第一连接端与第二连接端连接。
10.如权利要求8所述的指纹识别芯片封装结构,其特征在于,还包括:位于感应芯片侧壁表面、基板第一表面、以及边缘凹槽内的导电层,所述导电层两端分别与第一连接端和第二连接端连接。
11.如权利要求9或10所述的指纹识别芯片封装结构,其特征在于,还包括:位于感应芯片和基板之间的第一粘结层。
12.如权利要求8所述的指纹识别芯片封装结构,其特征在于,所述感应芯片还包括:贯穿所述感应芯片的导电插塞,所述感应芯片的第二表面暴露出所述导电插塞,所述导电插塞的一端与第一连接端连接;位于感应芯片第二表面暴露出的导电插塞顶部的焊料层,所述焊料层焊接于第二连接端表面。
13.如权利要求1所述的指纹识别芯片封装结构,其特征在于,还包括:位于基板表面的保护环,所述保护环包围所述感应芯片、上盖层和塑封层。
14.如权利要求13所述的指纹识别芯片封装结构,其特征在于,所述保护环的材料为金属;所述保护环通过所述基板接地。
15.如权利要求13所述的指纹识别芯片封装结构,其特征在于,还包括:包围所述塑封层、感应芯片和保护环的外壳,所述外壳暴露出所述上盖层,所述上盖层的颜色与所述外壳的颜色一致。
16.如权利要求1所述的指纹识别芯片封装结构,其特征在于,还包括:包围所述塑封层和感应芯片的外壳,所述外壳暴露出所述上盖层,所述上盖层的颜色与所述外壳的颜色一致。
17.如权利要求1所述的指纹识别芯片封装结构,其特征在于,所述基板为硬性基板或软性基板;所述基板的一端具有连接部,所述连接部用于使感应芯片与外部电路电连接。
18.一种形成如权利要求1至17任一项结构的封装方法,其特征在于,包括:提供基板;
在所述基板表面耦合感应芯片,所述感应芯片具有第一表面、以及与第一表面相对的第二表面,所述感应芯片的第一表面具有感应区,所述感应芯片的第二表面位于基板表面;
至少在所述应芯片的感应区表面形成上盖层,所述上盖层的材料为聚合物;
在基板和感应芯片表面的塑封层,所述塑封层暴露出所述上盖层。
19.如权利要求18所述的指纹识别芯片封装方法,其特征在于,当所述上盖层的材料为聚合物材料,且所述聚合物材料为光敏材料时,所述上盖层的形成方法包括:在基板表面和感应芯片表面涂布上盖膜;对所述上盖膜进行曝光显影,去除基板表面、以及感应芯片表面感应区以外的上盖膜,在感应区表面形成上盖层。
20.如权利要求19所述的指纹识别芯片封装方法,其特征在于,所述涂布工艺为旋涂工艺或喷涂工艺。
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US10133907B2 (en) | 2018-11-20 |
TWI569384B (zh) | 2017-02-01 |
US20170140195A1 (en) | 2017-05-18 |
WO2016000596A1 (zh) | 2016-01-07 |
KR20170026537A (ko) | 2017-03-08 |
TW201603207A (zh) | 2016-01-16 |
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