WO2016183978A1 - 芯片的封装结构及封装方法 - Google Patents

芯片的封装结构及封装方法 Download PDF

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Publication number
WO2016183978A1
WO2016183978A1 PCT/CN2015/089700 CN2015089700W WO2016183978A1 WO 2016183978 A1 WO2016183978 A1 WO 2016183978A1 CN 2015089700 W CN2015089700 W CN 2015089700W WO 2016183978 A1 WO2016183978 A1 WO 2016183978A1
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WIPO (PCT)
Prior art keywords
chip
sensing
substrate
layer
groove
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PCT/CN2015/089700
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English (en)
French (fr)
Inventor
王之奇
杨莹
喻琼
王蔚
Original Assignee
苏州晶方半导体科技股份有限公司
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Priority to US15/573,679 priority Critical patent/US20180108585A1/en
Publication of WO2016183978A1 publication Critical patent/WO2016183978A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
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Definitions

  • the present disclosure relates to the field of semiconductor manufacturing technologies, and in particular, to a package structure and a package method of a chip.
  • fingerprint identification technology has the characteristics of good security, high reliability and simple and convenient use, which makes fingerprint recognition technology widely used in various fields to protect personal information security.
  • information security of various electronic products has always been one of the key points of technology development.
  • mobile terminals such as mobile phones, notebook computers, tablet computers, digital cameras, etc.
  • the demand for information security is more prominent.
  • the sensing method of the fingerprint identification device includes a capacitive (electric field type) and an inductive type, and the fingerprint identification device obtains the fingerprint information of the user by extracting the user fingerprint and converting the user fingerprint into an electrical signal output.
  • FIG. 1 is a cross-sectional structural diagram of a fingerprint identification device, including: a substrate 100; a fingerprint identification chip 101 coupled to the surface of the substrate 100; and a glass substrate covering the surface of the fingerprint identification chip 101. 102.
  • the fingerprint identification chip 101 has one or more capacitor plates therein. Since the skin or the subcutaneous layer of the user's finger has convex ridges and valleys of depressions, when the user's finger 103 contacts the surface of the glass substrate 102, the distance between the ridge and the valley to the fingerprint recognition chip 101 is different, and therefore, the user's finger 103 The capacitance between the ridge or valley and the capacitor plate is different, and the fingerprint identification core
  • the slice 101 is capable of acquiring the different capacitance values and converting them into corresponding electrical signal outputs, and after the fingerprint identification device summarizes the received electrical signals, the fingerprint information of the user can be acquired.
  • the sensitivity of the fingerprint recognition chip is high, and the manufacture and application of the fingerprint recognition device are limited.
  • the embodiment of the invention provides a package structure and a packaging method of the chip, and improves the sensitivity of the sensor chip.
  • Some embodiments of the present invention provide a method for packaging a chip, including:
  • the sensing chip Integrating a sensing chip with the substrate, the sensing chip includes a first surface, and a second surface opposite to the first surface, wherein the second surface of the sensing chip faces the substrate, the sensing chip further includes a sensing area of the first surface and a peripheral area surrounding the sensing area, wherein the peripheral area is formed with a groove, the side wall and the bottom surface of the groove and the surface of the peripheral area have a rewiring layer, the sensing chip The groove is exposed on the side;
  • a plastic sealing layer is formed on the substrate, the plastic sealing layer surrounds the sensing chip and is filled in the groove, and the plastic sealing layer exposes a surface of the sensing region.
  • the step of forming the sensing chip comprises: providing a chip substrate, the chip substrate comprising a plurality of chip regions and a cutting region between adjacent chip regions, wherein the chip substrate comprises an opposite first surface And a second surface, the chip region including a sensing region on the first surface of the chip substrate and a peripheral region surrounding the sensing region; forming a groove in the cutting region and the peripheral region, the side of the groove a wall is located in a peripheral region around the cutting region; a rewiring layer is formed on a surface of the peripheral region and a sidewall and a bottom surface of the groove; and the rewiring layer and the chip substrate are cut in the cutting region, A plurality of chip regions are made independent of each other to form an inductive chip.
  • the step of coupling the sensing chip on the surface of the substrate comprises: fixing the sensing chip to a surface of the substrate; and electrically connecting the sensing chip to the substrate.
  • the method further includes: forming a first pad at the bottom of the groove, the first pad being electrically connected to the rewiring layer.
  • the substrate has a first surface
  • the sensing chip is coupled to a first surface of the substrate
  • the first surface of the substrate has a second bonding pad
  • the method further includes: forming a conductive line before forming the plastic sealing layer, wherein the two ends of the conductive line are respectively connected to the first pad and the second pad, so that the sensing chip is electrically connected to the substrate.
  • the groove is a continuous groove surrounding the sensing area.
  • the groove is a plurality of discrete grooves surrounding the sensing area.
  • the forming process of the plastic sealing layer is a fluid molding process.
  • the forming process of the plastic sealing layer includes a drip irrigation process.
  • Some embodiments of the present invention also provide a package structure of a chip, including:
  • the sensing chip coupled to the substrate, the sensing chip includes a first surface, and a second surface opposite to the first surface, wherein the second surface of the sensing chip faces the substrate, the sensing chip further includes a sensing area of the first surface and a peripheral area surrounding the sensing area, the peripheral area having a groove, the side wall and the bottom surface of the groove and the surface of the peripheral area having a rewiring layer, the side of the sensing chip Exposing the groove;
  • the method further includes: a first pad located at a bottom of the groove, the first pad being electrically connected to the rewiring layer.
  • the substrate has a first surface
  • the sensing chip is coupled to a first surface of the substrate
  • the first surface of the substrate has a second bonding pad
  • the method further includes: a conductive line, wherein the two ends of the conductive line are respectively connected to the first pad and the second pad, so that the sensing chip is electrically connected to the substrate.
  • the groove is a continuous groove surrounding the sensing area.
  • the groove is a plurality of discrete grooves surrounding the sensing area.
  • the surface of the plastic sealing layer is flush with the surface of the sensing area.
  • FIG. 1 is a schematic cross-sectional structural view of a fingerprint recognition device
  • FIG. 2 is a schematic cross-sectional structural view of a fingerprint identification chip structure
  • FIG. 3 to FIG. 10 are schematic cross-sectional structural views showing a process of forming a fingerprint identification chip according to an embodiment of the present invention.
  • the fingerprint recognition chip needs to have higher sensitivity.
  • the surface of the fingerprint identification chip 101 is covered with a glass substrate 102 for protecting the fingerprint identification chip 101 , and the user's finger 103 is directly in contact with the glass substrate 102 .
  • the thickness of the glass substrate 102 is relatively thick.
  • the sensitivity of the fingerprint identification chip 101 is required to be high, thereby ensuring accurate extraction of the user's fingerprint.
  • the high-sensitivity fingerprint identification chip is difficult to manufacture and the manufacturing cost is high, which in turn causes the application and promotion of the fingerprint identification chip to be limited.
  • the invention includes a substrate 200 having a first surface 230, and the first surface 230 of the substrate 200 has a plurality of first pads 205; a sensing chip 201 on the first surface 230 of the substrate 200, the sensing chip 201 having a first surface 210 and being associated with the first surface 210
  • the second surface 220 of the sensing chip 201 is located on the first surface 210 of the substrate 200.
  • the sensing chip 201 has a sensing area 211 located on the first surface 210 and surrounding the sensing area 211.
  • a peripheral portion 212 having a plurality of second pads 207 on the surface thereof, and the second pads 207 are in one-to-one correspondence with the positions and numbers of the first pads 205; 205 and a plurality of wires 208 electrically connected to the second pad 207, wherein a point on the wire 208 that is the largest distance from the first surface 210 of the substrate 200 is a vertex A, and the vertex is the first surface 210 of the sensing chip.
  • the material of the plastic sealing layer 203 is a polymer
  • the plastic sealing layer 203 surrounds the wire 208 and the sensing chip 201
  • the plastic sealing on the sensing area 201 The surface of the layer 203 is flat, and the surface of the plastic sealing layer 203 has a second distance to the first surface 210 of the sensing chip 201, and the second distance is greater than the first distance.
  • the traditional glass substrate is replaced by a plastic sealing layer located on the surface of the sensing area 211 for direct contact with the user's finger. Since the glass substrate is removed, it is advantageous to improve the sensing capability of the sensing chip 201.
  • the sensing chip 201 and the substrate 200 are electrically connected by a wire 208 having a vertex A higher than the first surface 210 of the sensing chip 201, in order to completely surround the molding layer 203
  • the second distance of the surface of the plastic encapsulation layer 203 to the first surface 210 of the sensing chip 201 needs to be greater than the first distance from the vertex A of the wire 208 to the first surface 210 of the sensing chip 201, and is located on the first surface 210 of the sensing chip 201.
  • the thickness of the plastic seal layer 203 is still relatively thick. Moreover, since the plastic sealing layer 203 also covers the sensing region 211 of the sensing chip 201, the thickness of the plastic sealing layer 203 located on the sensing region 211 is thicker, and the plastic sealing layer 203 is still unfavorable for improving the sensing sensitivity of the sensing chip 201. The resulting package structure has a poor sensing capability.
  • an embodiment of the present invention provides a package structure and a packaging method of a fingerprint identification chip.
  • the sensing chip coupled to the surface of the substrate has a recess located in the peripheral region, and the peripheral region surrounds the sensing region; the sidewall and the bottom surface of the recess have electrical connections for the substrate Rewiring the layer, and the sidewall of the sensing chip exposes the recess; thereby enabling the plastic encapsulation layer to surround and fix the sensing chip, the recess can be filled to protect the rewiring layer while The sensing zone can be exposed.
  • the surface of the sensing area is not covered by the plastic sealing layer, the user's finger can directly contact the sensing area, so that the sensing capability of the sensing chip is maximized, and the sensitivity of the sensing chip is improved.
  • FIG. 3 to FIG. 10 are schematic cross-sectional structural views of a packaging process of a fingerprint identification chip according to an embodiment of the present invention.
  • a chip substrate 350 is provided.
  • the chip substrate 350 includes a plurality of chip regions 351 and a dicing region 352 between adjacent chip regions 351.
  • the chip substrate 350 includes opposing first surfaces 310 and The second surface 320, the chip area 351 includes a sensing area 311 on the first surface 310 and a peripheral area 312 surrounding the sensing area 311.
  • the chip substrate 350 is a silicon substrate, a silicon germanium substrate, a silicon carbide substrate, a silicon-on-insulator (SOI) substrate, a germanium-on-insulator (GOI) substrate silicon substrate, a silicon germanium substrate, a silicon carbide liner. a bottom, a silicon-on-insulator (SOI) substrate, a germanium-on-insulator (GOI) substrate; moreover, the chip substrate 350 is a monolithic wafer.
  • SOI silicon-on-insulator
  • GOI germanium-on-insulator
  • the chip area 351 is used to form an inductive chip (for example, a fingerprint identification chip). Subsequently, by cutting the chip substrate 350, a plurality of chip areas 351 can be made independent of each other to form an independent sensing chip.
  • the chip regions 351 are arranged in an array, and the adjacent chip regions 351 further have a dicing region 352. By cutting the dicing region 352, the chip regions 351 can be separated from each other.
  • the sensing area 311 is formed with an inductive device for acquiring user fingerprint information.
  • the sensing device includes a capacitor structure or an inductive structure, so that the sensing area 311 can detect and receive fingerprint information of the user.
  • a chip circuit is formed in the sensing region 311 and the peripheral region 312 surrounding the sensing region 311, and the chip circuit is electrically connected to the sensing device in the sensing region 311 for sensing the output of the device. The signal is processed.
  • At least one capacitor plate is formed in the sensing region 311.
  • the capacitor plate and the user's finger constitute a capacitor structure; and, the sensing region 311
  • the difference in capacitance between the surface ridges of the user's finger and the valley and the capacitor plate can be obtained, and the difference in capacitance value is processed by the chip circuit to be output, thereby acquiring user fingerprint data.
  • the surface of the sensing region 311 of the sensing chip 301 is further formed with a passivation layer, and the material of the passivation layer is an insulating material.
  • the passivation layer is used as a dielectric layer between the user's finger and the capacitor plate to form a capacitor structure capable of acquiring user fingerprint information; and the passivation layer can also be used to avoid the chip circuit in the sensing region 311.
  • the inductive device is subject to wear and electrically insulates the chip circuit and the inductive device from the external environment.
  • a groove 313 is formed in the cutting zone 352 and the peripheral zone 312, the sidewall of the groove 313 being located in the peripheral zone 312 around the cutting zone 352.
  • the plastic sealing layer exposes the surface of the sensing region 311 while covering the peripheral region, so that the user's finger can contact the sensing region 311 without contacting the peripheral region 312. Not only can the sensitivity of the sensing chip be improved, but also the thickness of the formed package structure can be thinned to reduce the size of the package structure.
  • the forming step of the recess 313 includes: forming a patterned photoresist layer 353 on the first surface 310 of the chip substrate 350, the photoresist layer 353 exposing the peripheral region 312 and the cutting region 352;
  • the photoresist layer 353 is a mask, and the chip substrate 350 is etched, and a recess 313 is formed in the chip substrate 350.
  • the photoresist layer 353 is formed by a coating process and a photolithography development process; the process of etching the chip substrate 350 is an anisotropic dry etching process.
  • the sidewall of the formed recess 313 is inclined with respect to the surface of the chip substrate 350, the sidewall of the recess 313 is at an obtuse angle with the bottom surface, and the bottom of the recess 313 is smaller than the bottom. Top size. Since the sidewall of the recess 313 is inclined, it is advantageous to form a rewiring layer on the sidewall surface of the recess by a deposition and etching process, thereby facilitating patterning of the rewiring layer.
  • the groove 313 is a continuous groove surrounding the sensing region 311, and one or several first pads can be formed at the bottom of the continuous groove.
  • the recess 313 is a plurality of discrete recesses surrounding the sensing region 311, and each of the recesses 313 can be formed with one or several first pads later.
  • the electrical connection between the sensing chip formed by the cutting and the substrate can be achieved by the first bonding pad.
  • the depth of the formed groove 313 needs to be greater than the distance from the apex of the subsequently formed conductive line to the bottom of the groove 313, so as to prevent the apex of the subsequently formed conductive line from being higher than the surface of the sensing area 311, thereby ensuring that the subsequently formed plastic sealing layer can be completely completed.
  • the conductive wire is surrounded while the surface of the plastic seal layer is flush with the surface of the sensing region 311.
  • a re-wiring layer 314 is formed on the surface of the peripheral region 312 and the sidewalls and the bottom surface of the recess 313.
  • the photoresist layer 353 is removed (as shown in FIG. 4); the process of removing the photoresist layer 353 is a wet de-glue process or a dry process. Glue process.
  • the rewiring layer 314 is for electrically connecting to the chip circuit, and the rewiring layer is subsequently used for electrical connection with the substrate, so that the sensing device and the chip circuit of the sensing region 311 can be electrically connected to the substrate.
  • the material of the rewiring layer 314 is a metal; the step of forming the rewiring layer includes: depositing a conductive layer on the first surface 310 of the chip substrate 350 and sidewalls and a bottom surface of the recess 313; Forming a patterned layer on the surface of the conductive layer, the patterned layer defines a shape and a position of the rewiring layer; and etching the conductive layer to form the rewiring layer by using the patterned layer as a mask.
  • the patterned layer can be a patterned photoresist layer; the process of etching the conductive layer is an anisotropic dry etching process or a wet etching process.
  • the method further includes forming a first pad 315 at the bottom of the recess 313, the first pad 315 is electrically connected to the rewiring layer 314; the first pad 315 serves as the The exit point of the wiring layer can be subsequently electrically connected to the second pad of the substrate surface by a wire bonding process.
  • the material of the first pad is metal; the first pad can be formed after the rewiring layer 314 is formed, or formed while the rewiring layer 314 is formed.
  • the first pad 315 is formed on the bottom of the recess 313, and when one end of the conductive line for wire bonding is connected to the first pad 315, the conductive wire can be ensured to be located in the groove 313.
  • the apex of the conductive line is not easily higher than the surface of the sensing area 311, so after the subsequent formation of the plastic sealing layer, the plastic sealing layer can be ensured to surround the conductive line, and at the same time, the surface of the plastic sealing layer and the sensing area can be The 311 surface is flush.
  • the re-wiring layer 314 and the chip substrate 350 are cut in the dicing region 352 (shown in FIG. 5) to form a plurality of chip regions 351 (as shown in FIG. 5). Shown independently of each other to form the inductive chip 301.
  • the formed inductive chip 301 is used to couple with a subsequently provided substrate to form a package structure.
  • the formed sensing chip 301 has a first surface 310 and a second surface 320 opposite to the first surface 310.
  • the second surface 320 of the sensing chip 301 is located on a subsequently provided substrate surface, and the sensing chip 301 includes a sensing area 311 of a surface 310 and a peripheral area 312 surrounding the sensing area 311, a recess 313 is formed in the peripheral area 312, and sidewalls and a bottom surface of the recess 313 and a surface of the peripheral area 312 have a rewiring layer 314.
  • the sidewall of the sensing chip 301 exposes the recess 313.
  • the formed sensing chip 301 can be formed after the cutting region 352 is cut.
  • the sidewall exposes the bottom of the recess 313 such that the surface of the peripheral region 312 of the formed sensing chip 301 is lower than the surface of the sensing region 311, and then when the conductive line is connected in the peripheral region, The apex of the conductive line is lower than the surface of the sensing area 311 so that the subsequently formed plastic sealing layer can completely cover the conductive line.
  • the sensing area 311 Forming a capacitor structure or an inductive structure for acquiring user fingerprint information in the sensing area 311, so that the sensing area 311 can detect and receive fingerprint information of the user; the chip area and the sensing device are formed in the sensing area 311. And the chip circuit is electrically connected to the sensing device, and The rewiring layer is electrically connected to the chip circuit for processing an electrical signal output by the sensing device and outputted through the rewiring layer 314.
  • a substrate 300 is provided.
  • the substrate 300 is a rigid substrate or a flexible substrate.
  • the substrate 300 is a rigid substrate
  • the rigid substrate is a PCB substrate, a glass substrate, a metal substrate, a semiconductor substrate, or a polymer substrate.
  • the substrate 300 has a first surface 330, and the first surface 330 of the substrate 300 is subsequently used to couple the sensing chip.
  • the first surface 330 of the substrate 300 has a wiring layer (not shown) and a second pad 331, the wiring layer is connected to the second pad 331, and the second pad 331 is used for sensing Chip circuit connections on the surface of chip 301 (shown in Figure 7).
  • a connection portion is formed at one end of the substrate 300, and the connection portion is for electrically connecting the sensing chip to an external circuit.
  • the material of the connecting portion includes a conductive material, and the connecting portion is electrically connected to the wiring layer, so that the chip circuit on the sensing chip can pass through the wiring layer and the connecting portion of the third surface 330 of the substrate 300 and an external circuit or device. Electrical connections are made to deliver electrical signals.
  • the sensing chip 301 is coupled to the surface of the substrate 300.
  • the sensing chip 301 is coupled to the surface of the substrate 300 in conjunction with the drawings.
  • the sensing chip 301 is fixed on the surface of the substrate 300 .
  • the sensing chip 301 and the substrate 300 are fixed to each other by a first adhesive layer, and the first adhesive layer is a material having a surface that is adhesive.
  • a first adhesive layer is adhered to the second surface 320 of the sensing chip 301, and the first adhesive layer is pasted on the first surface 330 of the substrate 300, thereby The sensing chip 301 is fixed to the first surface 330 of the substrate 300.
  • the electrical connection between the rewiring layer on the surface of the sensing chip 301 and the wiring layer on the surface of the substrate 300 can be achieved by the wire bonding process, that is, the sensing chip 301 and the substrate 300 are coupled.
  • a first adhesive layer can be formed on the first surface 330 of the substrate 300, and the sensing chip 301 is pasted on the surface of the first adhesive layer to fix the sensing chip 301 on the surface of the substrate 300.
  • an electrical connection is made between the sensing chip 301 and the substrate 300.
  • the sensor chip 301 is electrically connected to the substrate 300 to couple the sensor chip 301 to the substrate 300.
  • the conductive line 302 is formed by a wire bonding process, and the two ends of the conductive line 302 are connected to the first pad 315 and the second pad 331 respectively, so that the sensing chip 301 and the substrate 300 are electrically connected to each other. Even.
  • the conductive line 302 can electrically connect the chip circuit to the wiring layer on the surface of the substrate 300, and the wiring layer is electrically connected to the connection portion, so that the chip circuit and the sensing device on the surface of the sensing chip 301 can be electrically connected to the external circuit or device. Signal transmission.
  • the material of the conductive line 302 is metal, and the metal is copper, tungsten, aluminum, gold or silver.
  • the process of electrically connecting the sensing chip 301 and the substrate 300 by using a wire bonding process is simple, and the process cost is low.
  • the wire bonding process includes: providing a conductive line 302; and connecting the two ends of the conductive line 302 to the first pad 315 and the second pad 331 by a soldering process.
  • the material of the conductive line 302 is metal, and the metal is copper, tungsten, aluminum, gold or silver.
  • the conductive line 302 is connected between the first pad 315 and the second pad 331 , the conductive line 302 is curved, and the point on the conductive line 302 that is the largest distance from the first surface 330 of the substrate 300 is an apex;
  • the apex is higher than the bottom surface of the groove 313, and the apex is lower than the first surface 310 of the sensing chip 301; due to the surface of the subsequently formed plastic sealing layer and the first surface 310 of the sensing chip 301 Flushing, therefore, the apex can be lower than the surface of the subsequently formed plastic sealing layer, and the subsequently formed plastic sealing layer can completely wrap the conductive wire 302, so that the conductive wire 302 can be electrically isolated from the sensing chip 301, and avoid The conductive line 302 is bare.
  • a plastic sealing layer 303 is formed on the surface of the substrate 300.
  • the plastic sealing layer 303 surrounds the sensing chip 301.
  • the plastic sealing layer 300 is filled in the groove 313, and the plastic sealing layer 303 is exposed.
  • the plastic sealing layer 303 is used to protect and fix the substrate 300, the sensing chip 301, and the conductive line 302, and electrically isolate the conductive line 302 from the sensing chip 301 or from an external environment.
  • the peripheral region 312 of the sensing chip 301 further has a recess 313, the plastic sealing layer 303 is filled in the recess 313, and the plastic sealing layer 303 is lower than or flush with the sensing.
  • the surface of the sensing region 311 of the chip 301 is such that the plastic sealing layer can protect the rewiring layer 314, the first pad 315, and the conductive line 302 located in the peripheral region 312.
  • the apex of the conductive line 302 is lower than the surface of the sensing area 311, and the surface of the plastic sealing layer 303 is lower or flush with the surface of the sensing area 311, so the plastic sealing layer 303
  • the conductive line 302 can be completely enclosed.
  • the surface of the plastic sealing layer 303 is flush with the surface of the sensing region 311, so that the user's finger can directly contact the surface of the sensing region 311, the sensing sensitivity of the sensing chip can be improved;
  • the surface of layer 303 is flush with the surface of sensing region 311, which facilitates thinning the thickness of the formed package structure, thereby reducing the size of the package structure formed.
  • the material of the plastic sealing layer 303 is a polymer material having good flexibility, ductility and covering ability, and the polymer material is epoxy resin, polyethylene, polypropylene, polyolefin, polyamide. Polyurethane, the plastic sealing layer 303 can also adopt other suitable molding materials.
  • the forming process of the plastic sealing layer 303 is a fluid molding process; in the fluid molding process, the molding material for molding is provided to the surface of the substrate 300 and the sensing chip 301 in a liquid or flow dynamic form. And after the thickness of the molding material reaches a higher level than the apex of the conductive line 302 and the surface of the sensing region 311 can be exposed, the molding material is cured to form the molding layer 303.
  • the thickness of the formed plastic sealing layer 303 can be strictly controlled to ensure that the surface of the plastic sealing layer 303 can be lower than or flush with the plastic sealing layer 303 while completely wrapping the conductive line 302.
  • the surface of the sensing area 311 is described.
  • the fluid molding process of the plastic seal layer 303 includes a potting process.
  • the forming process of the plastic sealing layer 303 is a drip irrigation process, including: dripping a low-viscosity molding material onto the surface of the substrate 300 and the sensing chip 301 by using a liquid dispenser, when the molding material is used After the thickness reaches a predetermined thickness, the molding material is heat-cured to form a molding layer 303.
  • the method further includes forming a guard ring on the surface of the substrate 300, the guard ring surrounding the sensing chip 301 and the molding layer 303.
  • the material of the guard ring is metal, and the guard ring is grounded through the substrate 300, and the guard ring is fixed to the first surface 330 of the substrate 300.
  • the guard ring is located around the sensing chip 301 and the plastic sealing layer 303, and a part of the guard ring also extends over the plastic sealing layer 303 and exposes the surface of the sensing area 311.
  • the guard ring is only located around the sensing chip 301 and the molding layer 303, and exposes the surface of the molding layer 303 and the sensing region 311.
  • the material of the guard ring is metal, and the metal is copper, tungsten, aluminum, silver or gold.
  • the protection ring is used for electrostatic protection of the sensing chip 301; since the protection ring is metal, the protection ring can conduct electricity, and when the user's finger generates static electricity when contacting the surface of the sensing area 311, the electrostatic charge will firstly
  • the protection ring is transmitted to the substrate 300, so that the sensing device in the sensing region 311 is prevented from being broken by an excessive electrostatic voltage, thereby protecting the sensing chip 301, improving the accuracy of fingerprint detection, and eliminating signal noise outputted by the sensing chip 301. Make the signal output by the sensor chip more accurate.
  • the method further includes forming an outer casing surrounding the plastic encapsulation layer 303, the sensing chip 301, and the guard ring, the outer casing exposing the surface of the sensing region 301.
  • the housing can be a housing of a device or terminal that requires a fingerprint identification chip, and can also be a housing of the packaging structure of the fingerprint identification chip.
  • the method further includes forming an outer casing surrounding the plastic encapsulation layer 303 and the sensing chip 301, the outer casing exposing the surface of the sensing region 311.
  • the sensing chip has a recess located in the peripheral region, and the peripheral region surrounds the sensing region; the sidewall and the bottom surface of the recess have a rewiring layer for electrically connecting to the substrate, And the sidewall of the sensing chip exposes the groove.
  • a plastic sealing layer surrounding the sensing chip is formed on the surface of the substrate, the plastic sealing layer is used to surround and fix the sensing chip, and the recess can be filled to protect the rewiring layer. At the same time, the sensing area is exposed.
  • the user's finger can directly contact the sensing area, thereby maximizing the sensing capability of the sensing chip and improving the sensing.
  • the sensitivity of the chip Therefore, the sensitivity of the package structure of the formed fingerprint identification chip is improved, and the thickness of the formed package structure is reduced and the size is reduced.
  • the embodiment of the present invention further provides a package structure of a fingerprint identification chip formed by using the foregoing method.
  • the following includes:
  • the sensing chip 301 is coupled to the surface of the substrate 300.
  • the sensing chip 301 has a first surface 310 and a second surface 320 opposite to the first surface 310.
  • the second surface 320 of the sensing chip 301 faces the substrate 300.
  • the sensing chip 301 includes a sensing area 311 on the first surface 310 and a peripheral area 312 surrounding the sensing area 311, the peripheral area 312 having a recess 313 therein, a sidewall and a bottom surface of the recess 313, and
  • the surface of the peripheral region 312 has a rewiring layer 314, the sidewall of the sensing chip 301 exposes the recess 313;
  • the sensing area 311 has an inductive device for acquiring user fingerprint information.
  • the sensing device includes a capacitor structure or an inductive structure, so that the sensing area 311 can detect and receive fingerprint information of the user.
  • sensing area 311 and the peripheral area 312 surrounding the sensing area 311 there is also a chip circuit electrically connected to the sensing device in the sensing area 311 for outputting electricity to the sensing device.
  • the signal is processed.
  • the sensing area 311 has at least one capacitor plate.
  • the capacitor plate and the user's finger constitute a capacitor structure; and, the sensing area 311
  • the difference in capacitance between the surface ridges of the user's finger and the valley and the capacitor plate can be obtained, and the difference in capacitance value is processed by the chip circuit to be output, thereby acquiring user fingerprint data.
  • the surface of the sensing area 311 of the sensing chip 301 further has a passivation layer, and the material of the passivation layer is an insulating material for ensuring isolation between the user's finger and the capacitor plate in the sensing area 311.
  • the passivation layer is used as a dielectric layer between the user's finger and the capacitor plate to form a capacitor structure capable of acquiring user fingerprint information; and the passivation layer can also be used to avoid the chip in the sensing region 311
  • the circuit and the inductive device are subject to wear and electrically isolate the chip circuit and the inductive device from the external environment.
  • the groove 313 is configured to make the surface of the peripheral region 312 lower than the surface of the sensing region 311, so that when the plastic sealing layer 303 surrounds the sensing chip 301, the molding layer 303 can be covered while covering the peripheral region 312.
  • the surface of the sensing area 311 is exposed, so that the user's finger can contact the sensing area 311 without contacting the peripheral area 312.
  • the thickness of the package structure can be thinned to reduce the size of the package structure.
  • the sidewall of the groove 313 is inclined with respect to the surface of the chip substrate 350, the sidewall of the groove 313 is at an obtuse angle with the bottom surface, and the bottom of the groove 313 is smaller than the top dimension.
  • the groove 313 is a continuous groove surrounding the sensing region 311, and the continuous groove bottom can subsequently have one or several first pads.
  • the recess 313 is a plurality of discrete recesses surrounding the sensing region 311, and each of the recesses 313 can have one or several first pads at the bottom. The electrical connection between the sensing chip 301 and the substrate can be achieved by the first pad.
  • the depth of the groove 313 needs to be greater than the distance from the vertex on the conductive line 302 to the bottom of the groove 313, so that the apex of the conductive line 302 is prevented from being higher than the surface of the sensing area 311, so that the plastic sealing layer 303 can completely surround the
  • the conductive line 302 can simultaneously make the surface of the plastic seal layer 303 flush with the surface of the sensing area 311.
  • the rewiring layer 314 is for electrically connecting to the chip circuit, and the rewiring layer is subsequently used for electrical connection with the substrate, so that the sensing device and the chip circuit of the sensing region 311 can be electrically connected to the substrate.
  • a first pad 315 located at the bottom of the recess 313 is further included, and the first pad 315 is electrically connected to the rewiring layer 314.
  • the substrate 300 is a rigid substrate or a flexible substrate.
  • the substrate 300 is a rigid substrate
  • the rigid substrate is a PCB substrate, a glass substrate, a metal substrate, a semiconductor substrate, or a polymer substrate.
  • the substrate 300 has a first surface 330 for coupling a first chip 330 of the substrate 300.
  • the first surface 330 of the substrate 300 has a wiring layer (not shown) and a second pad 331, the wiring layer is connected to the second pad 331, and the second pad 331 is used for sensing
  • the chip circuit on the surface of the chip 301 is connected.
  • a connection portion is provided at one end of the substrate 300 for electrically connecting the sensor chip 301 to an external circuit.
  • the material of the connecting portion includes a conductive material, and the connecting portion is electrically connected to the wiring layer, so that the chip circuit on the sensing chip 301 can pass through the wiring layer and the connecting portion of the first surface 330 of the substrate 300 and an external circuit or The device is electrically connected to deliver electrical signals.
  • the sensing chip 301 and the substrate 300 are fixed to each other by a first adhesive layer, and the first adhesive layer is a material having a surface that is adhesive.
  • the package structure further includes a conductive line 302.
  • the two ends of the conductive line 302 are respectively connected to the first pad 315 and the second pad 331 to electrically connect the sensing chip 301 and the substrate 300. interconnection.
  • the conductive line 302 can electrically connect the chip circuit to the wiring layer on the surface of the substrate 300, and the wiring layer is electrically connected to the connection portion, so that the chip circuit and the sensing device on the surface of the sensing chip 301 can be electrically connected to the external circuit or device. Signal transmission.
  • the material of the conductive line 302 is metal, and the metal is copper, tungsten, aluminum, gold or silver.
  • the plastic sealing layer 303 is used to protect and fix the substrate 300, the sensing chip 301, and the conductive line 302, and electrically isolate the conductive line 302 from the sensing chip 301 or from an external environment. Since the peripheral region 312 of the sensing chip 301 further has a recess 313, the plastic sealing layer 303 is filled in the recess 313, and the plastic sealing layer 303 is lower than or flush with the sensing region 311 of the sensing chip 301. The surface; enables the plastic seal layer to protect the rewiring layer 314, the first pad 315, and the conductive line 302 located in the peripheral region 312.
  • the material of the plastic sealing layer 303 is a polymer material, and the polymer material has good flexibility.
  • the polymer material is epoxy resin, polyethylene, polypropylene, polyolefin, polyamide, polyurethane, and the plastic sealing layer 303 can also adopt other suitable molding materials.
  • a guard ring is disposed on a surface of the substrate 300, and the guard ring surrounds the sensing chip 301 and the molding layer 303.
  • the material of the guard ring is metal, and the guard ring is grounded through the substrate 300, and the guard ring is fixed to the first surface 330 of the substrate 300.
  • an outer casing surrounding the plastic encapsulation layer 303, the sensing chip 301, and the guard ring is exposed, the outer casing exposing the surface of the sensing region 301.
  • the housing can be a housing of a device or terminal that requires a fingerprint identification chip, and can also be a housing of the packaging structure of the fingerprint identification chip.
  • a housing surrounding the plastic encapsulation layer 303 and the inductive chip 301 is exposed, the housing exposing the surface of the sensing region 311.
  • the sensing chip has a recess in the peripheral region, and the peripheral region surrounds the sensing region; the sidewall and the bottom surface of the recess have a rewiring layer for electrically connecting to the substrate, and The sidewall of the sensing chip exposes the recess.
  • a plastic sealing layer surrounding the sensing chip is formed on the surface of the substrate, the plastic sealing layer is used to surround and fix the sensing chip, and the recess can be filled to protect the rewiring layer. At the same time, the sensing area is exposed.
  • the surface of the sensing area is not covered by the plastic sealing layer, the user's finger can directly contact the sensing area, so that the sensing capability of the sensing chip is maximized, and the sensitivity of the sensing chip is improved. Therefore, the sensitivity of the package structure of the formed fingerprint identification chip is improved, and the thickness of the formed package structure is reduced and the size is reduced.
  • the step of forming the sensing chip includes forming a dicing area of the chip substrate, and a sidewall of the groove is located in a peripheral region around the dicing region, thereby forming after the dicing region cuts the chip substrate
  • the peripheral portion of the sensing chip has a recess, and the sidewall of the sensing chip can expose the recess, that is, the surface of the peripheral region is lower than the surface of the sensing region. Therefore, after the plastic sealing layer is formed, the sensing region can be exposed while the plastic sealing layer covers the peripheral region.
  • the recess sidewall and the bottom surface are formed with a rewiring layer, and after the chip substrate is cut, the rewiring The layer can be used to electrically connect the formed inductive chip to the substrate.
  • the sensing chip realizes electrical connection with the substrate through a conductive wire.
  • the two ends of the conductive line are respectively connected to the first pad of the peripheral area of the sensing chip and the second pad of the surface of the substrate. Therefore, the conductive line is curved, and the conductive line has the largest distance from the first surface of the substrate. a vertex; since the peripheral portion of the sensing chip has a groove, the peripheral surface is lower than the surface of the sensing region, so the vertex can be lower than the surface of the sensing region, after the plastic sealing layer fills the groove
  • the plastic sealing layer can completely align the conductive wire, and at the same time, can ensure that the sensing region is exposed, and the plastic sealing layer is flush with the surface of the sensing region. Therefore, it is advantageous to reduce the thickness of the formed package structure, which is advantageous for further miniaturization of the package structure, and at the same time improves the sensitivity of the sensor chip in the package structure.
  • the sensing chip coupled to the surface of the substrate has a recess in the peripheral region, and the peripheral region surrounds the sensing region; the sidewall and the bottom surface of the recess have electrical connections for the substrate a wiring layer, and a sidewall of the sensing chip exposes the groove; thereby enabling the plastic sealing layer to surround and fix the sensing chip, the recess can be filled to protect the rewiring layer, and at the same time The sensing area is exposed. Since the surface of the sensing area is not covered by the plastic sealing layer, the user's finger can directly contact the sensing area, so that the sensing capability of the sensing chip is maximized, and the sensitivity of the sensing chip is improved. Therefore, the sensitivity of the package structure of the fingerprint recognition chip is improved, and the thickness of the package structure is reduced and the size is reduced.
  • the sensing chip coupled to the surface of the substrate has a recess located in the peripheral region, and the peripheral region surrounds the sensing region; the sidewall and the bottom surface of the recess have electrical connections for the substrate a rewiring layer, and a sidewall of the sensing chip exposes the recess; thereby enabling the plastic encapsulation layer to surround and fix the sensing chip, the recess can be filled to protect the rewiring layer, At the same time, the sensing area can be exposed. Since the surface of the sensing area is not covered by the plastic sealing layer, the user's finger can directly contact the sensing area, so that the sensing capability of the sensing chip is maximized, and the sensitivity of the sensing chip is improved. Therefore, the sensitivity of the package structure of the fingerprint recognition chip is improved, and the thickness of the package structure is reduced and the size is reduced.

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Abstract

一种芯片的封装结构及封装方法，该封装结构包括：基板（300），与所述基板（300）耦合的感应芯片（301），位于所述基板（300）上的塑封层（303）。所述感应芯片（301）包括第一表面（310）、以及与第一表面（310）相对的第二表面（320），其中所述感应芯片（301）的第二表面（320）面向基板（300），所述感应芯片（301）还包括位于所述第一表面（310）的感应区（311）以及包围所述感应区（311）的外围区（312），所述外围区（312）内具有凹槽（313），所述凹槽（313）的侧壁和底部表面以及外围区（312）表面具有再布线层（314），所述感应芯片（301）的侧面暴露出所述凹槽（313）。所述塑封层（303）包围所述感应芯片（301）并填充于所述凹槽（313）内，且所述塑封层（303）暴露出所述感应区（311）的表面。

Description

芯片的封装结构及封装方法
相关申请的交叉引用
本申请要求2015年5月19日提交中国专利局、申请号为201510256904.5、发明名称为“指纹识别芯片的封装结构及封装方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及半导体制造技术领域，尤其涉及一种芯片的封装结构及封装方法。
背景技术
随着现代社会的进步，个人身份识别以及个人信息安全的重要性逐步受到人们的关注。由于人体指纹具有唯一性和不变性，使得指纹识别技术具有安全性好，可靠性高，使用简单方便的特点，使得指纹识别技术被广泛应用于保护个人信息安全的各种领域。而随着科学技术的不断发展，各类电子产品的信息安全问题始终是技术发展的关注要点之一。尤其是对于移动终端，例如手机、笔记本电脑、平板电脑、数码相机等，对于信息安全性的需求更为突出。
指纹识别器件的感测方式包括电容式(电场式)和电感式，指纹识别器件通过提取用户指纹，并将用户指纹转换为电信号输出，从而获取用户的指纹信息。具体的，如图1所示，图1是一种指纹识别器件的剖面结构示意图，包括：基板100；耦合于基板100表面的指纹识别芯片101；覆盖于所述指纹识别芯片101表面的玻璃基板102。
以电容式指纹识别芯片为例，所述指纹识别芯片101内具有一个或多个电容极板。由于用户手指的表皮或皮下层具有凸起的脊和凹陷的谷，当用户手指103接触所述玻璃基板102表面时，所述脊与谷到指纹识别芯片101的距离不同，因此，用户手指103脊或谷与电容极板之间的电容值不同，而指纹识别芯 片101能够获取所述不同的电容值，并将其转化为相应的电信号输出，而指纹识别器件汇总所受到的电信号之后，能够获取用户的指纹信息。
然而，在现有的指纹识别器件中，对指纹识别芯片的灵敏度要求较高，使得指纹识别器件的制造及应用受到限制。
发明内容
本发明实施例提供一种芯片的封装结构及封装方法，提高感应芯片的灵敏度。
本发明一些实施例提供一种芯片的封装方法，包括：
提供基板；
将感应芯片与所述基板耦合，所述感应芯片包括第一表面、以及与第一表面相对的第二表面，其中所述感应芯片的第二表面面向基板，所述感应芯片还包括位于所述第一表面的感应区以及包围所述感应区的外围区，所述外围区内形成有凹槽，所述凹槽的侧壁和底部表面以及外围区表面具有再布线层，所述感应芯片的侧面暴露出所述凹槽；
在所述基板上形成塑封层，所述塑封层包围所述感应芯片并填充于所述凹槽内，且所述塑封层暴露出所述感应区的表面。
可选的，所述感应芯片的形成步骤包括：提供芯片衬底，所述芯片衬底包括若干芯片区以及位于相邻芯片区之间的切割区，所述芯片衬底包括相对的第一表面和第二表面，所述芯片区包括位于芯片衬底的第一表面的感应区和包围所述感应区的外围区；在所述切割区和外围区内形成凹槽，所述凹槽的侧壁位于所述切割区周围的外围区内；在所述外围区表面以及凹槽的侧壁和底部表面形成再布线层；在所述切割区对所述再布线层和芯片衬底进行切割，使若干芯片区相互独立以形成感应芯片。
可选的，在所述基板表面耦合感应芯片的步骤包括：将所述感应芯片固定于基板表面；在所述感应芯片与基板之间进行电连接。
可选的，还包括：在所述凹槽底部形成第一焊垫，所述第一焊垫与所述再布线层电连接。
可选的，所述基板具有第一表面，所述感应芯片耦合于基板的第一表面，所述基板的第一表面具有第二焊垫。
可选的，还包括：在形成所述塑封层之前，形成导电线，所述导电线两端分别与第一焊垫与第二焊垫连接，使感应芯片与基板电连接。
可选的，所述导电线上到基板第一表面距离最大的点为顶点，所述顶点低于所述感应区表面。
可选的，所述凹槽为包围所述感应区的连续凹槽。
可选的，所述凹槽为包围感应区的若干分立凹槽。
可选的，所述塑封层的形成工艺为流体塑封工艺。
可选的，所述塑封层的形成工艺包括滴灌工艺。
可选的，所述塑封层表面与所述感应区表面齐平。本发明一些实施例还提供一种芯片的封装结构，包括：
基板；
与所述基板耦合的感应芯片，所述感应芯片包括第一表面、以及与第一表面相对的第二表面，其中所述感应芯片的第二表面面向基板，所述感应芯片还包括位于所述第一表面的感应区以及包围所述感应区的外围区，所述外围区内具有凹槽，所述凹槽的侧壁和底部表面以及外围区表面具有再布线层，所述感应芯片的侧面暴露出所述凹槽；
位于所述基板上的塑封层，所述塑封层包围所述感应芯片并填充于所述凹槽内，且所述塑封层暴露出所述感应区的表面。可选的，还包括：位于所述凹槽底部的第一焊垫，所述第一焊垫与所述再布线层电连接。
可选的，所述基板具有第一表面，所述感应芯片耦合于基板的第一表面，所述基板的第一表面具有第二焊垫。
可选的，还包括：导电线，所述导电线两端分别与第一焊垫与第二焊垫连接，使感应芯片与基板电连接。
可选的，所述导电线上到基板第一表面距离最大的点为顶点，所述顶点低于所述感应区表面。
可选的，所述凹槽为包围所述感应区的连续凹槽。
可选的，所述凹槽为包围感应区的若干分立凹槽。
可选的，所述塑封层表面与所述感应区表面齐平。
附图说明
图1是一种指纹识别器件的剖面结构示意图；
图2是一种指纹识别芯片结构的剖面结构示意图；
图3至图10是本发明实施例的指纹识别芯片的形成过程的剖面结构示意图。
具体实施方式
如背景技术所述，指纹识别芯片需要具有更高的灵敏度。
经过研究发现，请继续参考图1，指纹识别芯片101表面覆盖有玻璃基板102，所述玻璃基板102用于保护指纹识别芯片101，而用户的手指103直接与所述玻璃基板102相接触，因此，为了保证所述玻璃基板102具有足够的保护能力，所述玻璃基板102的厚度较厚。然而，由于所述玻璃基板102的厚度较厚，对指纹识别芯片101的灵敏度要求较高，以此保证能够精确提取到用户指纹。然而，高灵敏度的指纹识别芯片制造难度较大、制造成本较高，继而造成指纹识别芯片的应用和推广受到限制。
为了降低对指纹识别芯片灵敏度的要求，提出了另一种指纹识别芯片结构，请参考图2，包括：基板200，所述基板200具有第一表面230，所述基板200的第一表面230具有若干第一焊垫205；位于基板200第一表面230的感应芯片201，所述感应芯片201具有第一表面210、以及与第一表面210相 对的第二表面220，所述感应芯片201的第二表面220位于基板200的第一表面210，所述感应芯片201具有位于第一表面210的感应区211、以及包围所述感应区211的外围区212，所述外围区212表面具有若干第二焊垫207，且所述第二焊垫207与第一焊垫205的位置和数量一一对应；两端分别与所述第一焊垫205和第二焊垫207电连接的若干导线208，其中，位于所述导线208上且距离基板200第一表面210距离最大的点为顶点A，所述顶点到感应芯片第一表面210为第一距离；位于基板200和感应芯片201表面的塑封层203，所述塑封层203的材料为聚合物，所述塑封层203包围所述导线208和感应芯片201，所述感应区201上的塑封层203表面平坦，所述塑封层203表面到感应芯片201第一表面210具有第二距离，所述第二距离大于第一距离。
其中，由位于感应区211表面的塑封层替代传统的玻璃基板，用于直接与用户手指接触。由于去除了玻璃基板，有利于提高感应芯片201的感应能力。然而，由于所述感应芯片201与基板200之间通过导线208实现电连接，而所述导线208具有高于感应芯片201第一表面210的顶点A，为了使所述塑封层203完全包围所述导线208，所述塑封层203的表面到感应芯片201第一表面210的第二距离需要大于导线208顶点A到感应芯片201第一表面210的第一距离，位于感应芯片201第一表面210的塑封层203厚度依旧较厚。而且，由于所述塑封层203还覆盖感应芯片201的感应区211，因此，位于感应区211上的塑封层203部分厚度较厚，则所述塑封层203依旧不利于提高感应芯片201的感应灵敏度，则所形成的封装结构的感应能力较差。
为了解决上述问题，本发明实施例提供一种指纹识别芯片的封装结构及封装方法。其中，在封装结构中，耦合于基板表面的感应芯片具有位于外围区内的凹槽，而所述外围区包围感应区；所述凹槽的侧壁和底部表面具有用于与基板电连接的再布线层，且所述感应芯片的侧壁暴露出所述凹槽；从而能够使所述塑封层包围并固定所述感应芯片时，能够填充所述凹槽以保护所述再布线层，同时能够暴露出所述感应区。由于所述感应区表面不被塑封层覆盖，使得用户手指能够直接与感应区相接触，从而使感应芯片的感应能力得到最大限度的应用，提高了感应芯片的灵敏度。而且，还能够使所形成的 降低封装结构的厚度减薄。因此，所形成的指纹识别芯片的封装结构的灵敏度得到提升，且封装结构的尺寸缩小。
为使本发明的上述目的、特征和优点能够更为明显易懂，下面结合附图对本发明的具体实施例做详细的说明。
图3至图10是本发明实施例的指纹识别芯片的封装过程的剖面结构示意图。
请参考图3，提供芯片衬底350，所述芯片衬底350包括若干芯片区351以及位于相邻芯片区351之间的切割区352，所述芯片衬底350包括相对的第一表面310和第二表面320，所述芯片区351包括位于第一表面310的感应区311和包围所述感应区311的外围区312。
所述芯片衬底350为硅衬底、硅锗衬底、碳化硅衬底、绝缘体上硅(SOI)衬底、绝缘体上锗(GOI)衬底硅衬底、硅锗衬底、碳化硅衬底、绝缘体上硅(SOI)衬底、绝缘体上锗(GOI)衬底；而且，所述芯片衬底350为整片的晶圆。
所述芯片区351用于形成感应芯片(例如指纹识别芯片)，后续通过切割所述芯片衬底350，能够使若干芯片区351相互独立，以形成独立的感应芯片。在本实施例中，所述芯片区351呈阵列排列，而且相邻的芯片区351之间还具有切割区352，通过对所述切割区352进行切割，即能够使各芯片区351相互分立。
在本实施例中，所述感应区311内形成有用于获取用户指纹信息的感应器件；所述感应器件包括电容结构或者电感结构，使所述感应区311能够检测和接收用户的指纹信息。
此外，在所述感应区311、以及包围所述感应区311的外围区312内，还形成有芯片电路，所述芯片电路与感应区311内的感应器件电连接，用于感应器件输出的电信号进行处理。
在本实施例中，在所述感应区311内形成至少一个电容极板，当用户手指置于感应区311表面时，所述电容极板和用户手指构成电容结构；而且，所述感应区311能够获取用户手指表面脊与谷与电容极板之间的电容值差异，并将所述电容值差异通过芯片电路进行处理之后输出，以此获取用户指纹数据。
在本实施例中，由于后续形成的塑封层暴露出所述感应区311，用户的手指能够直接与感应区311表面相接触，因此，为了保证用户手指与感应区311内电容极板之间相互隔离，所述感应芯片301感应区311的表面还形成有钝化层，所述钝化层的材料为绝缘材料。所述钝化层用于作为用户手指与电容极板之间的介质层，以构成能够获取用户指纹信息的电容结构；而且，所述钝化层还能够用于避免感应区311内的芯片电路和感应器件受到磨损，并且使芯片电路和感应器件与外部环境电绝缘。
请参考图4，在所述切割区352和外围区312内形成凹槽313，所述凹槽313的侧壁位于所述切割区352周围的外围区312内。
形成所述凹槽313用于使外围区312的表面低于感应区311表面，从而在后续切割所述芯片衬底350以形成感应芯片之后，采用塑封层包围所述感应芯片时，能够使所述塑封层在覆盖所述外围区的同时，暴露出感应区311表面，从而能够使用户的手指在接触感应区311的同时，不会接触到外围区312。不仅能够使感应芯片的灵敏度提高，而且有利于减薄所形成的封装结构的厚度，以缩小封装结构的尺寸。
所述凹槽313的形成步骤包括：在芯片衬底350的第一表面310形成图形化的光刻胶层353，所述光刻胶层353暴露出外围区312和切割区352；以所述光刻胶层353为掩膜，刻蚀所述芯片衬底350，在所述芯片衬底350内形成凹槽313。其中，所述光刻胶层353采用涂布工艺和光刻显影工艺形成；刻蚀所述芯片衬底350的工艺为各向异性的干法刻蚀工艺。
在本实施例中，所形成的凹槽313侧壁相对于芯片衬底350表面倾斜，所述凹槽313的侧壁与底部表面之间呈钝角，所述凹槽313的底部尺寸小于 顶部尺寸。由于所述凹槽313的侧壁倾斜，有利于后续通过沉积和刻蚀工艺在所述凹槽的侧壁表面形成再布线层，便于对所述再布线层进行图形化。
在一实施例中，所述凹槽313为包围感应区311的连续凹槽，在所述连续凹槽底部后续能够形成一个或若干个第一焊垫。在另一实施例中，所述凹槽313为包围感应区311的若干分立凹槽，每一个凹槽313底部能够在后续形成一个或若干个第一焊垫。通过所述第一焊垫能够实现切割形成的感应芯片与基板之间的电连接。
所形成的凹槽313的深度需要大于后续形成的导电线上的顶点到凹槽313底部的距离，避免后续形成的导电线顶点高于感应区311表面，从而能够保证后续形成的塑封层能够完全包围所述导电线，同时能够使塑封层的表面与感应区311的表面齐平。
请参考图5，在所述外围区312表面以及凹槽313的侧壁和底部表面形成再布线层314。
在本实施例中，在形成所述再布线层314之后，去除光刻胶层353(如图4所示)；去除所述光刻胶层353的工艺为湿法去胶工艺或干法去胶工艺。
所述再布线层314用于与芯片电路电连接，且所述再布线层后续用于与基板电连接，从而实现感应区311的感应器件和芯片电路能够与基板电连接。
所述再布线层314的材料为金属；所述再布线层的形成步骤包括：在所述芯片衬底350的第一表面310以及凹槽313的侧壁和底部表面沉积导电层；在所述导电层表面形成图形化层，所述图形化层定义出所述再布线层的形状和位置；以所述图形化层为掩膜，刻蚀所述导电层，形成所述再布线层。其中，所述图形化层能够为图形化的光刻胶层；刻蚀所述导电层的工艺为各向异性的干法刻蚀工艺或湿法刻蚀工艺。
在本实施例中，还包括在所述凹槽313底部形成第一焊垫315，所述第一焊垫315与所述再布线层314电连接；所述第一焊垫315作为所述再布线层的接出点，后续能够通过打线工艺用于与基板表面的第二焊垫电连接。所述 第一焊垫的材料为金属；所述第一焊垫能够在形成再布线层314之后形成，或者在形成再布线层314的同时形成。
而且，所述第一焊垫315形成于凹槽313底部，后续用于打线的导电线一端与所述第一焊垫315连接时，能够确保所述导电线也位于所述凹槽313内，则所述导电线的顶点不易高于所述感应区311表面，因此在后续形成塑封层之后，能够确保所述塑封层包围所述导电线，同时能够使所述塑封层的表面与感应区311表面齐平。
请参考图6，在所述切割区352(如图5所示)对所述再布线层314和芯片衬底350(如图5所示)进行切割，使若干芯片区351(如图5所示)相互独立以形成感应芯片301。
经过切割之后，所形成的感应芯片301用于与后续提供的基板耦合，以形成封装结构。
所形成的感应芯片301具有第一表面310、以及与第一表面310相对的第二表面320，所述感应芯片301的第二表面320位于后续提供的基板表面，所述感应芯片301包括位于第一表面310的感应区311以及包围所述感应区311的外围区312，所述外围区312内形成凹槽313，所述凹槽313的侧壁和底部表面以及外围区312表面具有再布线层314，所述感应芯片301的侧壁暴露出所述凹槽313。
由于所述切割区352内具有凹槽313，且所述凹槽313延伸至切割区352周围的外围区312内，因此，在所述切割区352进行切割之后，能够使所形成的感应芯片301侧壁暴露出所述凹槽313的底部，从而使所形成的感应芯片301的外围区312表面低于所述感应区311表面，则后续在所述外围区连接导电线时，能够使所述导电线的顶点低于所述感应区311表面，以便后续形成的塑封层能够完全覆盖包围所述导电线。
在所述感应区311内形成用于获取用户指纹信息的电容结构、或者电感结构，使所述感应区311能够检测和接收用户的指纹信息；所述感应区311内形成有芯片电路和感应器件，且所述芯片电路与所述感应器件电连接，而 所述再布线层与所述芯片电路电连接，用于处理所述感应器件输出的电信号，并通过再布线层314输出。
请参考图7，提供基板300。
所述基板300为硬性基板或软性基板。在本实施例中，所述基板300为硬性基板，所述硬性基板为PCB基板、玻璃基板、金属基板、半导体基板或聚合物基板。
本实施例中，所述基板300具有第一表面330，所述基板300的第一表面330后续用于耦合感应芯片。所述基板300的第一表面330具有布线层(未示出)和第二焊垫331，所述布线层与所述第二焊垫331连接，而所述第二焊垫331用于与感应芯片301(如图7所示)表面的芯片电路连接。
在一实施例中，在所述基板300的一端形成连接部，所述连接部用于使感应芯片与外部电路电连接。所述连接部的材料包括导电材料，所述连接部与所述布线层电连接，使所述感应芯片上的芯片电路能够通过基板300第三表面330的布线层和连接部与外部电路或器件实现电连接，以此传递电信号。
之后，在所述基板300表面耦合所述感应芯片301，以下将结合附图对在基板300表面耦合感应芯片301进行说明。
请参考图8，将所述感应芯片301固定于基板300表面。
所述感应芯片301与基板300之间通过第一粘结层相互固定，所述第一粘结层为表面具有粘性的材料。
在本实施例中，在所述感应芯片301的第二表面320粘附第一粘结层，并将所述第一粘附层粘贴于所述基板300的第一表面330，从而使所述感应芯片301固定于基板300的第一表面330。后续通过打线工艺，能够使所述感应芯片301表面的再布线层与所述基板300表面的布线层之间实现电连接，即所述感应芯片301与基板300之间耦合。
在另一实施例中，还能够在所述基板300的第一表面330形成第一粘附层，将感应芯片301粘贴于所述第一粘附层表面，使感应芯片301固定于基板300表面。
请参考图9，在所述感应芯片301与基板300之间进行电连接。
使所述感应芯片301与基板300电连接即是使所述感应芯片301与所述基板300耦合。
在本实施例中，通过打线工艺形成导电线302，所述导电线302两端分别与第一焊垫315与第二焊垫331连接，使所述感应芯片301与基板300之间电互连。所述导电线302能够使芯片电路与基板300表面的布线层电连接，而所述布线层与连接部电连接，从而使感应芯片301表面的芯片电路和感应器件能够与外部电路或器件进行电信号的传输。所述导电线302的材料为金属，所述金属为铜、钨、铝、金或银。采用打线工艺实现感应芯片301与基板300电连接的工艺简单，且工艺成本低廉。
所述打线工艺包括：提供导电线302；将所述导电线302两端通过焊接工艺分别与第一焊垫315与第二焊垫331连接。所述导电线302的材料为金属，所述金属为铜、钨、铝、金或银。
由于所述导电线302连接于第一焊垫315与第二焊垫331之间，因此所述导电线302弯曲，所述导电线302上到基板300第一表面330距离最大的点为顶点；所述顶点高于所述凹槽313的底部表面，且所述顶点低于所述感应芯片301的第一表面310；由于后续形成的塑封层的表面与所述感应芯片301的第一表面310齐平，因此，所述顶点能够低于后续形成的塑封层表面，则后续形成的塑封层能够完全包裹所述导电线302，使导电线302能够与感应芯片301之间电隔离，并且避免所述导电线302裸露。
请参考图10，在所述基板300表面形成塑封层303，所述塑封层303包围所述感应芯片301，所述塑封层300填充于所述凹槽313内，且所述塑封层303暴露出所述感应区311表面。
所述塑封层303用于保护并固定所述基板300、感应芯片301和导电线302，并且使所述导电线302与感应芯片301之间或与外部环境之间电隔离。
在本实施例中，由于所述感应芯片301的外围区312内还具有凹槽313，所述塑封层303填充于所述凹槽313内，且所述塑封层303低于或齐平于感应芯片301的感应区311表面；使得所述塑封层能够保护位于外围区312的再布线层314、第一焊垫315和导电线302。
在本实施例中，所述导电线302的顶点低于所述感应区311的表面，而所述塑封层303的表面低于或齐平于所述感应区311表面，因此所述塑封层303能够完全包围所述导电线302。
在本实施例中，由于所述塑封层303的表面与感应区311表面齐平，使得用户手指能够直接与感应区311的表面相接触，能够提高感应芯片的感应灵敏度；而且，由于所述塑封层303表面与感应区311表面齐平，有利于减薄所形成的封装结构的厚度，由此缩小所形成的封装结构的尺寸。
所述塑封层303的材料为聚合物材料，所述聚合物材料具有良好的柔韧性、延展性以及覆盖能力，所述聚合物材料为环氧树脂、聚乙烯、聚丙烯、聚烯烃、聚酰胺、聚亚氨酯，所述塑封层303还可以采用其它合适的塑封材料。
在本实施例中，所述塑封层303的形成工艺为流体塑封工艺；在所述流体塑封工艺中，用于塑封的塑封材料以液态或流动态的形式提供到基底300和感应芯片301表面，并且当所述塑封材料的厚度达到高于导电线302的顶点并能够暴露出感应区311表面之后，对塑封材料进行固化，以形成所述塑封层303。采用所述流体塑封工艺，能够对所形成的塑封层303厚度进行严格控制，以保证塑封层303在完全包裹导电线302的同时，使所述塑封层303的表面能够低于或齐平于所述感应区311表面。所述塑封层303的流体塑封工艺包括滴灌工艺(potting)。
在一实施例中，所述塑封层303的形成工艺为滴灌工艺，包括：采用布液器将低粘度的塑封材料滴灌在基底300和感应芯片301表面，当塑封材料 的厚度达到预设厚度之后，对塑封材料进行加热固化，以形成塑封层303。
在一实施例中，还包括在基板300表面形成保护环，所述保护环包围所述感应芯片301和塑封层303。所述保护环的材料为金属，且所述保护环通过所述基板300接地，所述保护环固定于基板300的第一表面330。
所述保护环位于所述感应芯片301和塑封层303周围，且部分保护环还延伸至所述塑封层303上方、并暴露出所述感应区311表面。在另一实施例中，保护环仅位于感应芯片301和塑封层303的周围，且暴露出塑封层303和感应区311表面。
所述保护环的材料为金属，所述金属为铜、钨、铝、银或金。所述保护环用于对所述感应芯片301进行静电防护；由于所述保护环为金属，所述保护环能够导电，当用户手指在接触感应区311表面时产生静电，则静电电荷会首先自所述保护环传至基板300，从而避免感应区311内的感应器件被过大的静电电压击穿，以此保护感应芯片301，提高指纹检测的精确度，消除感应芯片301输出的信号噪声，使感应芯片输出的信号更精确。
在另一实施例中，还包括形成包围所述塑封层303、感应芯片301和保护环的外壳，所述外壳暴露出感应区301表面。所述外壳能够是需要设置指纹识别芯片的器件或终端的外壳，还能够是所述指纹识别芯片的封装结构的外壳。
在另一实施例中，还包括形成包围所述塑封层303和感应芯片301的外壳，所述外壳暴露出感应区311表面。
综上，本实施例中，感应芯片具有位于外围区内的凹槽，而所述外围区包围感应区；所述凹槽的侧壁和底部表面具有用于与基板电连接的再布线层，且所述感应芯片的侧壁暴露出所述凹槽。将感应芯片耦合于基板表面之后，在基板表面形成包围感应芯片的塑封层，所述塑封层用于包围并固定所述感应芯片，而且能够在填充所述凹槽以保护所述再布线层的同时，暴露出所述感应区。由于所述感应区表面不被塑封层覆盖，使得用户手指能够直接与感应区相接触，从而使感应芯片的感应能力得到最大限度的应用，提高了感应 芯片的灵敏度。因此，所形成的指纹识别芯片的封装结构的灵敏度得到提升，而且所形成的封装结构的厚度减小，尺寸缩减。
相应的，本发明实施例还提供一种采用上述方法所形成的指纹识别芯片的封装结构，请继续参考图10，包括：
基板300；
耦合于所述基板300表面的感应芯片301，所述感应芯片301具有第一表面310、以及与第一表面310相对的第二表面320，所述感应芯片301的第二表面320面向基板300，所述感应芯片301包括位于第一表面310的感应区311以及包围所述感应区311的外围区312，所述外围区312内具有凹槽313，所述凹槽313的侧壁和底部表面以及外围区312表面具有再布线层314，所述感应芯片301的侧壁暴露出所述凹槽313；
位于所述基板300表面的塑封层303，所述塑封层303包围所述感应芯片301，所述塑封层303填充于所述凹槽313内，且所述塑封层303暴露出所述感应区311表面。
以下将对上述结构进行说明。
在本实施例中，所述感应区311内具有用于获取用户指纹信息的感应器件；所述感应器件包括电容结构或者电感结构，使所述感应区311能够检测和接收用户的指纹信息。
此外，在所述感应区311、以及包围所述感应区311的外围区312内，还具有芯片电路，所述芯片电路与感应区311内的感应器件电连接，用于对感应器件输出的电信号进行处理。
在本实施例中，在所述感应区311内具有至少一个电容极板，当用户手指置于感应区311表面时，所述电容极板和用户手指构成电容结构；而且，所述感应区311能够获取用户手指表面脊与谷与电容极板之间的电容值差异，并将所述电容值差异通过芯片电路进行处理之后输出，以此获取用户指纹数据。
在本实施例中，所述感应芯片301感应区311的表面还具有钝化层，所述钝化层的材料为绝缘材料，用于保证用户手指与感应区311内电容极板之间相互隔离；所述钝化层用于作为用户手指与电容极板之间的介质层，以构成能够获取用户指纹信息的电容结构；而且，所述钝化层还能够用于避免感应区311内的芯片电路和感应器件受到磨损，并且使芯片电路和感应器件与外部环境电绝缘。
所述凹槽313用于使外围区312的表面低于感应区311表面，从而所述塑封层303包围所述感应芯片301时，能够使所述塑封层303在覆盖所述外围区312的同时，暴露出感应区311表面，从而能够使用户的手指在接触感应区311的同时，不会接触到外围区312。不仅能够使感应芯片的灵敏度提高，而且有利于减薄所述的封装结构的厚度，以缩小封装结构的尺寸。
在本实施例中，所述凹槽313侧壁相对于芯片衬底350表面倾斜，所述凹槽313的侧壁与底部表面之间呈钝角，所述凹槽313的底部尺寸小于顶部尺寸。
在一实施例中，所述凹槽313为包围感应区311的连续凹槽，所述连续凹槽底部后续能够具有一个或若干个第一焊垫。在另一实施例中，所述凹槽313为包围感应区311的若干分立凹槽，每一个凹槽313底部能够具有一个或若干个第一焊垫。通过所述第一焊垫能够实现感应芯片301与基板之间的电连接。
所述凹槽313的深度需要大于导电线302上的顶点到凹槽313底部的距离，避免所述导电线302顶点高于感应区311表面，从而能够保证所述塑封层303能够完全包围所述导电线302，同时能够使塑封层303的表面与感应区311的表面齐平。
所述再布线层314用于与芯片电路电连接，且所述再布线层后续用于与基板电连接，从而实现感应区311的感应器件和芯片电路能够与基板电连接。
在本实施例中，还包括位于所述凹槽313底部的第一焊垫315，所述第一焊垫315与所述再布线层314电连接。
所述基板300为硬性基板或软性基板。在本实施例中，所述基板300为硬性基板，所述硬性基板为PCB基板、玻璃基板、金属基板、半导体基板或聚合物基板。
所述基板300具有第一表面330，所述基板300的第一表面330用于耦合感应芯片。所述基板300的第一表面330具有布线层(未示出)和第二焊垫331，所述布线层与所述第二焊垫331连接，而所述第二焊垫331用于与感应芯片301表面的芯片电路连接。
在一实施例中，在所述基板300的一端具有连接部，所述连接部用于使感应芯片301与外部电路电连接。所述连接部的材料包括导电材料，所述连接部与所述布线层电连接，使所述感应芯片301上的芯片电路能够通过基板300第一表面330的布线层和连接部与外部电路或器件实现电连接，以此传递电信号。
所述感应芯片301与基板300之间通过第一粘结层相互固定，所述第一粘结层为表面具有粘性的材料。
在本实施例中，所述封装结构还包括导电线302，所述导电线302两端分别与第一焊垫315与第二焊垫331连接，使所述感应芯片301与基板300之间电互连。所述导电线302能够使芯片电路与基板300表面的布线层电连接，而所述布线层与连接部电连接，从而使感应芯片301表面的芯片电路和感应器件能够与外部电路或器件进行电信号的传输。所述导电线302的材料为金属，所述金属为铜、钨、铝、金或银。
所述塑封层303用于保护并固定所述基板300、感应芯片301和导电线302，并且使所述导电线302与感应芯片301之间或与外部环境之间电隔离。由于所述感应芯片301的外围区312内还具有凹槽313，所述塑封层303填充于所述凹槽313内，且所述塑封层303低于或齐平于感应芯片301的感应区311表面；使得所述塑封层能够保护位于外围区312的再布线层314、第一焊垫315和导电线302。
所述塑封层303的材料为聚合物材料，所述聚合物材料具有良好的柔韧 性、延展性以及覆盖能力，所述聚合物材料为环氧树脂、聚乙烯、聚丙烯、聚烯烃、聚酰胺、聚亚氨酯，所述塑封层303还可以采用其它合适的塑封材料。
在一实施例中，还包括位于所述基板300表面的保护环，所述保护环包围所述感应芯片301和塑封层303。所述保护环的材料为金属，且所述保护环通过所述基板300接地，所述保护环固定于基板300的第一表面330。
在另一实施例中，还包括包围所述塑封层303、感应芯片301和保护环的外壳，所述外壳暴露出感应区301表面。所述外壳能够是需要设置指纹识别芯片的器件或终端的外壳，还能够是所述指纹识别芯片的封装结构的外壳。
在另一实施例中，还包括包围所述塑封层303和感应芯片301的外壳，所述外壳暴露出感应区311表面。
与现有技术相比，本发明的技术方案具有以下优点：
本发明的方法中，感应芯片具有位于外围区内的凹槽，而所述外围区包围感应区；所述凹槽的侧壁和底部表面具有用于与基板电连接的再布线层，且所述感应芯片的侧壁暴露出所述凹槽。将感应芯片耦合于基板表面之后，在基板表面形成包围感应芯片的塑封层，所述塑封层用于包围并固定所述感应芯片，而且能够在填充所述凹槽以保护所述再布线层的同时，暴露出所述感应区。由于所述感应区表面不被塑封层覆盖，使得用户手指能够直接与感应区相接触，从而使感应芯片的感应能力得到最大限度的应用，提高了感应芯片的灵敏度。因此，所形成的指纹识别芯片的封装结构的灵敏度得到提升，而且所形成的封装结构的厚度减小，尺寸缩减。
进一步，所述感应芯片的形成步骤包括在芯片衬底的切割区内，且所述凹槽的侧壁位于切割区周围的外围区内，从而在切割区切割所述芯片衬底之后，所形成的感应芯片外围区内具有凹槽，且所述感应芯片的侧壁能够暴露出所述凹槽，即所述外围区表面低于感应区表面。因此，在形成塑封层之后，能够使塑封层覆盖所述外围区的同时，暴露出所述感应区。而且，所述凹槽侧壁和到底部表面形成有再布线层，在切割所述芯片衬底之后，所述再布线 层能够用于使所形成的感应芯片与基板实现电连接。
进一步，所述感应芯片通过导电线实现与基板的电连接。所述导电线两端分别与感应芯片外围区的第一焊垫、以及基板表面的第二焊垫连接，因此，所述导电线弯曲，所述导电线上具有到基板第一表面距离最大的顶点；由于所述感应芯片的外围区内具有凹槽，所述外围区表面低于感应区表面，因此所述顶点能够低于所述感应区表面，当所述塑封层填充所述凹槽之后，所述塑封层能够完全高位所述导电线，同时还能够保证所述感应区被暴露，实现塑封层与感应区表面的齐平。从而，有利于使所形成的封装结构的厚度减薄，有利于封装结构的进一步微型化，同时提高了封装结构内感应芯片的灵敏度。
本发明的结构中，耦合于基板表面的感应芯片具有位于外围区内的凹槽，而所述外围区包围感应区；所述凹槽的侧壁和底部表面具有用于与基板电连接的再布线层，且所述感应芯片的侧壁暴露出所述凹槽；从而能够使所述塑封层包围并固定所述感应芯片时，能够填充所述凹槽以保护所述再布线层，同时能够暴露出所述感应区。由于所述感应区表面不被塑封层覆盖，使得用户手指能够直接与感应区相接触，从而使感应芯片的感应能力得到最大限度的应用，提高了感应芯片的灵敏度。因此，所述指纹识别芯片的封装结构的灵敏度得到提升，而且所述封装结构的厚度减小，尺寸缩减。
综上，本实施例中，耦合于基板表面的感应芯片具有位于外围区内的凹槽，而所述外围区包围感应区；所述凹槽的侧壁和底部表面具有用于与基板电连接的再布线层，且所述感应芯片的侧壁暴露出所述凹槽；从而能够使所述塑封层包围并固定所述感应芯片时，能够填充所述凹槽以保护所述再布线层，同时能够暴露出所述感应区。由于所述感应区表面不被塑封层覆盖，使得用户手指能够直接与感应区相接触，从而使感应芯片的感应能力得到最大限度的应用，提高了感应芯片的灵敏度。因此，所述指纹识别芯片的封装结构的灵敏度得到提升，而且所述封装结构的厚度减小，尺寸缩减。
虽然本发明披露如上，但本发明并非限定于此。任何本领域技术人员，在不脱离本发明的精神和范围内，均可作各种更动与修改，因此本发明的保 护范围应当以权利要求所限定的范围为准。

Claims (21)

  1. 一种芯片的封装结构，包括：
    基板；
    与所述基板耦合的感应芯片，所述感应芯片包括第一表面、以及与第一表面相对的第二表面，其中所述感应芯片的第二表面面向基板，所述感应芯片还包括位于所述第一表面的感应区以及包围所述感应区的外围区，所述外围区内具有凹槽，所述凹槽的侧壁和底部表面以及外围区表面具有再布线层，所述感应芯片的侧面暴露出所述凹槽；
    位于所述基板上的塑封层，所述塑封层包围所述感应芯片并填充于所述凹槽内，且所述塑封层暴露出所述感应区的表面。
  2. 如权利要求1所述的芯片的封装结构，还包括：位于所述凹槽底部的第一焊垫，所述第一焊垫与所述再布线层电连接，所述基板具有第一表面，所述感应芯片耦合于基板的第一表面，所述基板的第一表面具有第二焊垫，所述第一焊垫与所述第二焊垫电连接。
  3. 如权利要求2所述的芯片的封装结构，还包括：导电线，所述导电线两端分别与第一焊垫与第二焊垫电连接。
  4. 如权利要求3所述的芯片的封装结构，其中，所述导电线上到基板第一表面距离最大的点为顶点，所述顶点低于所述感应区的表面。
  5. 如权利要求1所述的芯片的封装结构，其中，所述凹槽为包围所述感应区的连续凹槽。
  6. 如权利要求1所述的芯片的封装结构，其中，所述凹槽为包围所述感应区的多个分立凹槽。
  7. 如权利要求1所述的芯片的封装结构，其中，所述塑封层表面与所述感应区表面齐平。
  8. 如权利要求1所述的芯片的封装结构，还包括位于所述感应芯片的感应区 的表面上的钝化层，所述钝化层的材料包括绝缘材料。
  9. 一种芯片的封装方法，包括：
    提供基板；
    将感应芯片与所述基板耦合，所述感应芯片包括第一表面、以及与第一表面相对的第二表面，其中所述感应芯片的第二表面面向基板，所述感应芯片还包括位于所述第一表面的感应区以及包围所述感应区的外围区，所述外围区内形成有凹槽，所述凹槽的侧壁和底部表面以及外围区表面具有再布线层，所述感应芯片的侧面暴露出所述凹槽；
    在所述基板上形成塑封层，所述塑封层包围所述感应芯片并填充于所述凹槽内，且所述塑封层暴露出所述感应区的表面。
  10. 如权利要求9所述的芯片的封装方法，其中，所述感应芯片通过下述步骤形成：
    提供芯片衬底，所述芯片衬底包括多个芯片区以及位于相邻芯片区之间的切割区，所述芯片衬底还包括相对的第一表面和第二表面，所述芯片区包括位于芯片衬底的第一表面的感应区和包围所述感应区的外围区；
    在所述切割区和外围区内形成凹槽，所述凹槽的侧壁位于所述切割区周围的外围区内；
    在所述外围区表面以及凹槽的侧壁和底部表面形成再布线层；
    在所述切割区对所述再布线层和芯片衬底进行切割，使所述多个芯片区相互独立以形成感应芯片。
  11. 如权利要求9所述的芯片的封装方法，其中，将感应芯片与所述基板耦合包括：
    将所述感应芯片固定于基板；
    在所述感应芯片与基板之间进行电连接。
  12. 如权利要求9所述的芯片的封装方法，还包括：
    在所述凹槽底部形成第一焊垫，所述第一焊垫与所述再布线层电连接。
  13. 如权利要求12所述的芯片的封装方法，其中，所述基板具有第一表面，所述感应芯片耦合于基板的第一表面，所述基板的第一表面具有第二焊垫，所述方法还包括：形成导电结构使得第一焊垫与第二焊垫电连接。
  14. 如权利要求13所述的芯片的封装方法，还包括：在形成所述塑封层之前，形成导电线，所述导电线两端分别与第一焊垫与第二焊垫电连接。
  15. 如权利要求14所述的芯片的封装方法，其中，所述导电线上到基板第一表面距离最大的点为顶点，所述顶点低于所述感应区的表面。
  16. 如权利要求9所述的芯片的封装方法，其中，形成包围所述感应区的连续凹槽。
  17. 如权利要求9所述的芯片的封装方法，其中，形成包围所述感应区的多个分立凹槽。
  18. 如权利要求9所述的芯片的封装方法，还包括在所述感应芯片的感应区的表面上形成钝化层。
  19. 如权利要求9所述的芯片的封装方法，其中，所述塑封层通过流体塑封工艺形成。
  20. 如权利要求19所述的芯片的封装方法，其中，所述塑封层通过滴灌工艺形成。
  21. 如权利要求9所述的芯片的封装方法，其中，所述塑封层表面与所述感应区表面齐平。
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