TWI567881B - Fingerprint identification chip package structure and packaging method - Google Patents

Fingerprint identification chip package structure and packaging method Download PDF

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Publication number
TWI567881B
TWI567881B TW104120854A TW104120854A TWI567881B TW I567881 B TWI567881 B TW I567881B TW 104120854 A TW104120854 A TW 104120854A TW 104120854 A TW104120854 A TW 104120854A TW I567881 B TWI567881 B TW I567881B
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TW
Taiwan
Prior art keywords
sensing
substrate
wafer
sealing layer
plastic sealing
Prior art date
Application number
TW104120854A
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English (en)
Other versions
TW201603206A (zh
Inventor
Zhiqi Wang
Qiong Yu
Wei Wang
Original Assignee
China Wafer Level Csp Co Ltd
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Publication date
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Publication of TW201603206A publication Critical patent/TW201603206A/zh
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Publication of TWI567881B publication Critical patent/TWI567881B/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1365—Matching; Classification
    • G06V40/1376—Matching features related to ridge properties or fingerprint texture
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Description

指紋識別晶片封裝結構和封裝方法
本發明係涉及半導體製程技術領域，尤其指一種指紋識別晶片封裝結構及其封裝方法。
隨著現代社會的進步，個人身份識別以及個人資訊安全的重要性逐步受到人們的關注。由於人體指紋具有唯一性和不變性，使得指紋識別技術具有安全性好，可靠性高，使用簡單方便的特點，使得指紋識別技術被廣泛應用於保護個人資訊安全的各種領域。而隨著科學技術的不斷發展，各類電子產品的資訊安全問題始終是技術發展的關注要點之一。尤其是對於移動裝置，例如手機、筆記型電腦、平板電腦、數位相機等，對於資訊安全性的需求更為突出。
現有的指紋識別器件的感測方式包括電容式（電場式）和電感式，指紋識別器件通過提取使用者指紋，並將使用者指紋轉換為電信號輸出，從而獲取使用者的指紋資訊。具體的，請參閱圖1所示，圖1是現有技術的一種指紋識別器件的剖面結構示意圖，包括：一基板100；耦合於該基板100其表面之一指紋識別晶片101；覆蓋於該指紋識別晶片101其表面之一玻璃基板102。
以電容式指紋識別晶片為例，該指紋識別晶片101內具有一個或多個電容極板。由於使用者手指的表皮或皮下層具有凸起的脊和凹陷的谷，當使用者手指103接觸該玻璃基板102其表面時，該脊與該谷與指紋識別晶片101的距離不同，因此，使用者手指103脊或谷與該電容極板之間的電容值不同，而該指紋識別晶片101能夠獲取所述不同的電容值，並將其轉化為相應的電信號輸出，而指紋識別器件匯總所受到的電信號之後，能夠獲取使用者的指紋資訊。
然而，在現有的指紋識別器件中，對指紋識別晶片的靈敏度要求較高，使得指紋識別器件的製造及應用受到限制。
有鑑於上述現有技術之不足，本發明解決的問題方案係提供一種指紋識別晶片封裝結構及其封裝方法，該封裝結構能使該感應晶片對於靈敏度的要求降低，應用更廣泛。
為解決上述問題，本發明係提供一種指紋識別晶片封裝結構，包括：一基板，具有一基板表面；耦合於該基板表面之一感應晶片，該感應晶片具有一第一表面及與第一表面相對之一第二表面，該感應晶片之該第一表面具有一感應區，該感應晶片之該第二表面位於該基板表面；位於基板和感應晶片上之一塑封層，該塑封層覆蓋於該感應晶片之該感應區其表面，位於該感應區上之該塑封層其表面平坦，且位於該感應區其表面之該塑封層具有一預設厚度，該塑封層的材料為一聚合物。
其中，該塑封層位於該感應區其表面之該預設厚度為20微米~100微米。
其中，該預設厚度其公差範圍在-10% ~ +10%以內。
其中，該塑封層的莫氏硬度大於或等於8H；該塑封層的介電常數大於或等於7。
其中，該塑封層的材料包括了環氧樹脂、聚醯亞胺樹脂、苯並環丁烯樹脂、聚苯並惡唑樹脂、聚對苯二甲酸丁二酯、聚碳酸酯、聚對苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烴、聚氨酯、聚烯烴、聚醚碸、聚醯胺、聚亞氨酯、乙烯-醋酸乙烯共聚物或聚乙烯醇。
其中，該感應晶片之該第一表面更包括呵包圍該感應區的之一外圍區。
其中，該感應晶片更包括了位於該外圍區內之一邊緣凹槽，該感應晶片其側壁暴露出該邊緣凹槽；位於該感應晶片其該外圍區之一晶片電路，該晶片電路位於該感應晶片之該外圍區其表面、邊緣凹槽其側壁及其底部之表面，且位於該邊緣凹槽其底部具有一第一連接端，該晶片電路與該第一連接端連接。
其中，該邊緣凹槽為包圍該感應區之一連續凹槽；或者，該邊緣凹槽為包圍該感應區之一若干分立凹槽。
其中，該感應晶片耦合於基板表面，該基板表面具有一第二連接端。
其中，更包含了一導電線，該導電線其兩端分別與該第一連接端與該第二連接端連接。
其中，更包括了位於該感應晶片其側壁表面、基表面及該邊緣凹槽內之一導電層，該導電層其兩端分別與該第一連接端和該第二連接端連接。
其中，更包含了位於該感應晶片和該基板之間之一第一黏結層。
其中，該感應晶片更包含了貫穿該感應晶片之一導電插塞，該感應晶片之該第二表面暴露出該導電插塞，該導電插塞其一端與該第一連接端連接；位於該感應晶片之該第二表面暴露出之該導電插塞其頂部之一焊料層，該焊料層焊接於該第二連接端其表面。
其中，更包括了位於該基板表面之一保護環，該保護環包圍該該感應晶片及該塑封層。
其中，該保護環其材料為金屬；該保護環通透過該基板接地。
其中，更包含了包圍該塑封層、該感應晶片和及該保護環之一外殼，該外殼暴露出之該感應區其表面之該塑封層，該塑封層的顏色與該外殼的顏色一致。
其中，更包含了包圍該塑封層和該感應晶片之一外殼，該外殼暴露出該感應區其表面之該塑封層，該塑封層的顏色與該外殼的顏色一致。
其中，該基板可為一硬性基板或一軟性基板；該基板其一端具有一連接部，該連接部用於使該感應晶片與一外部電路電連接。
相應的，為了達成上述需求之目的而欲採取的又一主要技術手段係令形成上述任一項所述之指紋識別封裝結構其封裝方法包含：提供一基板，具有一基板表面；於該基板表面耦合一感應晶片，該感應晶片具有一第一表面及與第一表面相對之一第二表面，該感應晶片之該第一表面具有一感應區，該感應晶片之該第二表面位於該基板表面；於基板及感應晶片上形成一塑封層，該塑封層覆蓋於該感應晶片之該感應區其表面，形成於該感應區上之該塑封層其表面平坦，且位於該感應區其表面之該塑封層具有一預設厚度。
其中，該塑封層的形成工藝可為注塑工藝、轉塑工藝或絲網印刷工藝。
與現有技術相較之下，本發明之技術具有以下優點：
本發明的封裝結構中，該感應晶片該第二表面耦合於該基板表面，該感應晶片之該第一表面具有該感應區，該感應區用於提取使用者指紋。位於該基板和該感應晶片上之該塑封層覆蓋於該感應晶片之該感應區其表面，位於該感應區其表面之該塑封層能夠保護該感應區。當使用者的手指置於該感應區上之該塑封層其表面時，能夠使該感應區提取到使用者指紋，而該感應晶片能夠將該使用者指紋轉換為電信號輸出。由於該塑封層的材料為一聚合物材料，而該聚合物材料具有較好的延展性和柔韌性，而且覆蓋能力好，因此，能夠使該塑封層的厚度較薄，而且硬度較高，從而使該塑封層具有足夠大的硬度以保護該感應晶片；同時，該塑封層其表面與該感應晶片的距離減小，使該感應晶片更易於檢測到使用者指紋，相應地，該封裝結構能夠降低該感應晶片對於靈敏度的要求，使得指紋識別晶片的封裝結構的應用更為廣泛。
而且，該塑封層的材料為一聚合物，採用該塑封層保護該感應區能夠降低了該封裝結構的製造成本。此外，該塑封層還位於該基板和該感應晶片除該感應區以外其區域表面，該塑封層用於封裝該感應晶片，將該感應晶片固定於該基板表面，同時該塑封層還能夠保護該感應區，用於直接與使用者手指接觸，因此該指紋識別晶片封裝結構簡單。
進一步，位於該感應區其表面之該塑封層之該預設厚度為20微米~100微米，該塑封層的莫氏硬度大於或等於8H。雖然位於該感應區其表面之該塑封層厚度較薄，然而該塑封層的硬度較大，使得該塑封層足以保護該感應區免受損傷，同時，使得該感應區更易於檢測到接觸該塑封層其表面的使用者指紋，降低了該感應晶片對於靈敏度的要求。
進一步，該塑封層的介電常數大於或等於7，該塑封層的介電常數較大，使該塑封層的電隔離性能更佳，使該塑封層對感應區的保護能力更佳，即使位於該感應區其表面的之該塑封之層厚度較薄，也能夠使使用者手指與感應區之間構成的電容值處於能夠被檢測的較大範圍內。
進一步，該基板表面還具有包圍該感應晶片和該塑封層之該保護環。該保護環用於對該感應晶片進行靜電防護，避免該感應區檢測到的使用者指紋資料精確度下降；該保護環還能夠消除該感應晶片輸出的信號雜訊，使該感應晶片檢測到的資料、以及輸出的信號更精確。
本發明的封裝方法中，該感應晶片之該第一表面具有用於提取使用者指紋之該感應區，在該基板和該感應晶片上形成之該塑封層後，該塑封層還覆蓋於該感應區其表面，該塑封層用於保護該感應晶片的之該感應區，當使用者手指置於該感應區上之該塑封層其表面時，即能夠進行指紋檢測。該塑封層用於封裝該感應晶片，使該感應晶片固定於該基板表面。由於該塑封層的材料為一聚合物材料，而該聚合物材料具有較好的延展性和柔韌性，且覆蓋能力佳，能夠使形成於該感應區其表面之該塑封層厚度薄、且硬度高，因此，所形成的該塑封層具有足夠大的硬度以保護該感應晶片；而且，該塑封層其表面與該感應晶片的距離減小，使該感應區更易獲取使用者指紋資料，所形成的該封裝結構對於該感應晶片之靈敏度的要求降低，該封裝方法的使用範圍更廣泛。而且，由於該塑封層在封裝該感應晶片的同時，能夠保護該感應區，使得封裝該感應晶片的方法得以簡化。此外，該塑封層的材料為該聚合物，形成該塑封層的成本低，進而降低了製造該封裝結構的成本。
如先前技術所述，在現有的指紋識別器件中，對指紋識別晶片的靈敏度要求較高，使得指紋識別器件的製造及應用受到限制。
經過研究發現，請繼續參閱圖1所示，該指紋識別晶片101其表面覆蓋有該玻璃基板102，該玻璃基板102用於該保護指紋識別晶片101，而該使用者的手指103直接與該玻璃基板102接觸，因此，為了保證該玻璃基板102具有足夠的保護能力，該玻璃基板102其需求之厚度較厚。然而，由於該玻璃基板102其厚度較厚，因此要求該指紋識別晶片101需具有較高的靈敏度，以保證能夠精確提取到使用者指紋。然而，高靈敏度的指紋識別晶片製造難度較大、製造成本較高，繼而造成指紋識別晶片的應用和推廣受到限制。
具體的，繼續以電容式指紋識別器件為例，當該使用者手指置103於該玻璃基板102表面時，該使用者手指103及該指紋識別晶片101中之該電容極板之間能夠構成一電容；其中，該使用者手指103和該電容極板為干電容之兩極，該玻璃基板102為電容兩極之間的介電質。然而，由於該玻璃基板102其厚度較厚，使得該使用者手指103與該電容基板之間的電容值較大，而該使用者手指103中的該脊與該谷之間的高度差異較小，因此，該脊與該電容極板之間的電容值、相對于該谷與該電容極板之間的電容值之間的差值極小，為了能夠精確檢測到該電容值的差異，要求該指紋識別晶片101需具有較高的靈敏度。
為了解決上述問題，本發明係提出一種指紋識別晶片之封裝結構及其封裝方法。其中，該封裝結構中，一感應晶片之一感應區其表面覆蓋有一塑封層，該感應區其表面之該塑封層替代了傳統之玻璃基板，能夠直接與使用者手指接觸，用於保護該感應晶片。由於該塑封層的材料為一聚合物材料，而該聚合物材料具有較好的延展性和柔韌性，能夠使該塑封層的厚度較薄且硬度較高，在該塑封層足以保護該感應晶片的同時，使該塑封層表面與該感應晶片的距離減小，從而使該感應晶片更易於檢測到使用者指紋；相應地，該封裝結構降低了對該感應晶片靈敏度的要求，使得指紋識別晶片之該封裝結構的應用更為廣泛。
為使本發明的上述目的、特徵及優點能夠更為明顯易懂，下面結合圖式對本發明的之具體實施例做更詳細的說明。
圖2至圖6係本發明之實施例的指紋識別晶片的封裝結構的示意圖。
請參閱圖2所示，其中該指紋識別晶片之封裝結構包括：
一基板200，具有一基板表面230；
耦合於該基板表面230之一感應晶片201，該感應晶片201具有一第一表面210及與該第一表面210相對之一第二表面220，該感應晶片201之該第一表面210具有一感應區211，該感應晶片201之該第二表面220位於該基板表面230。
位於該基板200和感應晶片201上之一塑封層203，該塑封層203覆蓋於該感應晶片201之該感應區211其表面，位於該感應區211上之該塑封層203其表面平坦，且位於該感應區211其表面之該塑封層203具有一預設厚度，該塑封層203的材料為一聚合物。
以下將對該指紋識別晶片之封裝結構進行進一步詳細說明。
該該感應晶片201耦合於基板200之該基板表面230。該基板200之該基板表面230具有一佈線層（未示出），而該佈線層與位於該基板200之該基板表面230之一第二連接端205連接，該第二連接端205用於與該感應晶片201其表面之一晶片電路連接。
本實施例中，該基板200的一端具有一連接部204，該連接部204其材料為導電材料，該連接部204與該佈線層電連接，從而使該晶片電路能夠透過該基板200之該基板表面230之該佈線層和該連接部204與一外部電路或一器件電連接，從而實現電信號的傳輸。
位於該感應晶片201之該第一表面210其該感應區211用於檢測和接收使用者的指紋資訊，該感應區211內能夠具有一電容結構、或者具有一電感結構，該電容結構或祴電感結構能夠用於獲取使用者指紋資訊。
在本實施例中，該感應區211內具有至少一個電容極板，當使用者手指置於該感應區211上之該塑封層203其表面時，該電容極板、該塑封層203及該使用者手指構成一電容結構，而該感應區211能夠獲取該使用者手指其表面之脊及之谷與該電容極板之間的電容值差異，並將該電容值差異通過晶片電路進行處理之後輸出，以此獲取使用者指紋資料。
該感應晶片201之該第一表面210更包含包圍該感應區211之一外圍區212，該感應晶片201之該第一表面210之該外圍區212具有該晶片電路（未標示），該晶片電路與該感應區211內之一電容結構或一電感結構電連接，用於對該電容結構或祴電感結構輸出的電信號進行處理。
該感應晶片201更包括了位於該外圍區212內具有一邊緣凹槽206，該感應晶片201其側壁暴露出該邊緣凹槽206；位於該感應晶片201之該外圍區212之該晶片電路還位於該邊緣凹槽206其側壁及其底部表面，且位於該邊緣凹槽206其底部具有一第一連接端207，該晶片電路延伸到該凹槽206內，並且與該第一連接端207連接。
該邊緣凹槽206，用於形成該晶片電路之輸出端，即該第一連接端207，透過將該第一連接端207與該基板表面230之該第二連接端205電連接，能夠實現該感應晶片201與該基板200的耦合。
在一實施例中，該邊緣凹槽206可為包圍該感應區211之一連續凹槽，該連續的邊緣凹槽206其底部表面具有一個或若干第一連接端207；在另一實施例中，該邊緣凹槽206可為包圍感應區211之一若干分立凹槽，該分立凹槽中每一邊緣凹槽206內具有一個或若干第一連接端207。該第一連接端207其數量與分佈狀態依據該晶片電路之具體電路佈線設計。
在本實施例中，該邊緣溝槽206其側壁相對於該感應晶片201其表面傾斜，且該邊緣溝槽206其側壁與其底部之間的夾角呈一鈍角，該傾斜之該邊緣溝槽206其側壁表面易於形成該晶片電路，以此為該感應區211到該第一連接端207之間的電路佈線。
該塑封層203位於該基板表面230，並且包圍該感應晶片201，用於將該感應晶片固定於該基板表面230，並且用於保護並隔離該感應晶片201。而且，該塑封層203還位於該感應晶片201之該感應區211其表面，使得該塑封層203用於保護該感應區211，且使用者的手指能夠直接與該感應區211表面之該塑封層203接觸。由於該塑封層203用於保護並固定該感應晶片201的同時，亦能夠保護該感應晶片201之該感應區211，並且能夠與使用者手指直接接觸，因此，使得本實施例的指紋識別晶片之封裝結構簡單，能夠減少製造成本。
該塑封層203的材料為一聚合物材料，該聚合物材料具有良好的柔韌性、延展性以及覆蓋能力，能夠使位於該感應區211其表面之該塑封層203厚度較薄，從而增強了該感應晶片201對使用者手指其指紋的感應能力。同時，透過選擇和調整該聚合物材料的種類，能夠使位於該感應區211其表面之該塑封層203具有較高的硬度，從而保證了該塑封層203對該感應區211具有足夠的保護能力。
位於該感應區211其表面之該塑封層203其該預設厚度為20微米~100微米，該預設厚度較薄，當使用者手指置於該感應區211上之該塑封層203其表面時，該使用者手指與該感應區211的距離較小，因此，該感應區211更容易檢測到使用者手指的指紋，從而降低了該感應晶片201對於高靈敏度的要求。
而且，該預設厚度其公差需要控制在-10% ~ +10%的範圍內，以保證位於該感應區211其表面之該塑封層203其厚度均勻，且表面廷坦，繼而保證了對使用者手指之指紋進行檢測的結果精確。
在本實施例中，該感應區211內具有一電容極板，由於位於該感應區211其表面之該塑封層203其厚度較薄，當用該使用者手指置於感應區211上之該塑封層203其表面時，使用者手指與該與該電容極板的距離較短，則該使用者手指與該電容極板之間的電容值較小；相應的，使用者手指其表面的之脊（凸起）與該電容基板之間的電容值、相對於谷（凹陷）與該電容基板之間的電容值差異較大，因此，該感應區211更易於檢測到該使用者手指的指紋資訊。
而且，該預設厚度其公差在-10% ~ +10%以內，使得位於該感應區211其表面之該塑封層203表面厚度均勻，當檢測該使用者手指的指紋資訊時，能夠杜絕因該塑封層203之厚度差異引起該使用者手指與該電容基板之間的電容值發生偏差，從而使使用者手指之指紋的檢測結果更為準確。
該塑封層203的莫氏硬度大於或等於8H，該塑封層203的硬度較高，即使位於該感應區211表面其該塑封層203之厚度較薄，該塑封層203也足以保護該感應晶片201之該感應區211，當使用者手指在該感應區211上之該塑封層203其表面移動時，不會對該感應晶片201造成損傷。而且，由於該塑封層203的硬度較高，因此該塑封層203難以發生形變，即使使用者手指按壓於該塑封層203其表面，該塑封層203之厚度也難以發生變化，從而保證了該感應區211的檢測結果精確度。
該塑封層203的介電常數大於或等於7，該塑封層203的電隔離能力較強，位於該感應區211其表面之該塑封層203對該感應區211的保護能力較強。
在本實施例中，位於該感應區211其表面之該塑封層203其厚度較薄，而使用者手指與該電容極板之間的電容值與該塑封層203的厚度成反比，與該塑封層203的介電常數成正比，因此，當該感應區211其表面之該塑封層203其厚度較薄、且介電常數較大時，使用者手指與該電容極板之間的電容值處於該感應區211能夠檢測到的範圍內，避免電容值過大或過小而使該感應區211的感應失效。
而且，該感應區211其表面之該塑封層203其厚度在20微米~100微米範圍內、介電常數在大於或等於7的範圍內，則該塑封層203所選取的材料介電常數越大，位於該感應區211其表面之該塑封層203的厚度也應相應增大，以便使使用者手指與該電容極板之間的電容值能夠在一個穩定且於該感應區211可檢測的範圍內。
該塑封層203的材料可為環氧樹脂、聚醯亞胺樹脂、苯並環丁烯樹脂、聚苯並惡唑樹脂、聚對苯二甲酸丁二酯、聚碳酸酯、聚對苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烴、聚氨酯、聚烯烴、聚醚碸、聚醯胺、聚亞氨酯、乙烯-醋酸乙烯共聚物、聚乙烯醇或其他合適的聚合物材料。
在本實施例中，指紋識別晶片封裝結構更包括了一導電線208，該導電線208其兩端分別與該第一連接端207與該第二連接端205連接，從而使該晶片電路與該基板表面230之該佈線層電連接，而該佈線層與該連接部204電連接，從而使該感應晶片201其表面之該晶片電路和感應區211能夠與外部電路或器件進行電信號的傳輸。該導電線208的材料為金屬，其金屬可為銅、鎢、鋁、金或銀。
由於本實施例中，該第一連接端207和該第二連接端205之間透過該導電線208連接，其中該指紋識別晶片的封裝結構更包括了位於該感應晶片201及該基板200之間之一第一黏結層301，用以將該感應晶片201固定於該基板表面230。
在本實施例中，該指紋識別晶片的封裝結構更包括了位於該基板表面230之一保護環209，該保護環209包圍該感應晶片20及該塑封層203。該保護環209的材料為金屬，且該保護環209透過該基板200接地，該保護環209固定於該基板表面230。
在本實施例中，該保護環209位於該感應晶片201及該塑封層203其周圍，覆蓋於該塑封層203其部分之上方，且暴露出該感應區211其表面之該塑封層203。在另一實施例中，該保護環僅位於該感應晶片201和該塑封層203其周圍，且暴露出該塑封層203其表面。
該保護環209的材料為金屬，其金屬可為銅、鎢、鋁、銀或金。該保護環209用於對該感應晶片進行靜電防護，由於該保護環209為金屬，該保護環209能夠傳導電流，當該使用者手指於接觸該塑封層203產生一靜電時，該靜電之電荷會率先自該保護環209傳至該基板200，進而避免該塑封層203被過大的靜電電荷擊穿，藉此該保護感應晶片201，用以提高指紋檢測的精確度，消除該感應晶片輸出的信號雜訊，使該感應晶片輸出的信號更精確。
在一實施例中，請參閱圖3所示，指紋識別晶片之封裝結構更包括了位於該感應晶片201其側壁表面、該基板表面230及該邊緣凹槽206內之一導電層303，該導電層303其兩端分別與該第一連接端207和該第二連接端205連接，用以實現該感應區211、該晶片電路及基板表面230之該佈線層之間的電連接。該指紋識別晶片之封裝結構更包含了位於該感應晶片201和該基板200之間之該第一黏結層301。
在另一實施例中，請參閱圖4所示，該感應晶片201內還具有貫穿該感應晶片201之一導電插塞304，該感應晶片201之該第二表面220暴露出該導電插塞304，該導電插塞304的一端與該第一連接端207連接；位於該感應晶片201之該第二表面220暴露出的該導電插塞304其頂部之焊料層305，並藉由該焊料層305焊接於該第二連接端205其表面，用以實現該感應區211、該晶片電路及該基板表面230之該佈線層之間電連接。由於該感應晶片201透過該焊料層305焊接於該基板表面230，使該感應晶片201相對於該基板200固定。
在本實施例中，請參閱圖5所示，該指紋識別晶片之封裝結構更包含了包圍該塑封層203、該感應晶片201及該保護環209之一外殼400，該外殼400暴露出該感應區211上之該塑封層203其表面，使使用者手指能夠觸碰到該感應區211其表面之該塑封層203，以進行指紋檢測。該塑封層203的顏色與該外殼400的顏色一致，例如當該外殼400顏色為黑色時，該塑封層203的顏色為黑色，當該外殼400顏色為白色時，該塑封層203顏色為白色，使得該指紋識別晶片之封裝結構整體美觀協調。
在另一實施例中，請參閱圖6所示，該指紋識別晶片之封裝結構可省略該保護環209，該指紋識別晶片之封裝結構包含了包圍該塑封層203及該感應晶片201之一外殼400，該外殼400暴露出該感應區211其表面之該塑封層203，該塑封層203的顏色與該外殼400的顏色一致。
本實施例中，該感應晶片201之該第二表面220耦合於該基板表面230，該感應晶片201之該第一表面210具有該感應區211，該感應區211用於提取使用者手指之指紋。位於該基板200和該感應晶片201上之該塑封層203覆蓋於該感應晶片201之該感應區211其表面，位於該感應區211其表面之該塑封層203能夠保護該感應區211。當使用者手指置於該感應區211上之該塑封層203其表面時，能夠使該感應區211提取到使用者手指之指紋，而該感應晶片201能夠將該使用者手指之指紋轉換為電信號輸出。由於該塑封層203的材料可為該聚合物材料，而該聚合物材料具有較好的延展性和柔韌性，而且覆蓋能力好，因此，該能夠使塑封層203的厚度較薄，而且硬度較高，進而使該塑封層具有足夠大的硬度以保護該感應晶片201；同時，該塑封層203其表面與該感應晶片201之該感應區211的距離減小，使該感應晶片201更易於檢測到使用者手指之指紋，相應地，該封裝結構能夠降低該感應晶片對於靈敏度的要求，使得該指紋識別晶片之封裝結構其應用更加廣泛。而且，該塑封層203的材料為該聚合物，採用該聚合物形成該塑封層203保護該感應區211能夠進一步降低該封裝結構的製造成本。此外，該塑封層203還位於該基板200和該感應晶片201除了該感應區211以外之區域其表面，該塑封層203用於封裝該感應晶片201，將該感應晶片201固定於該基板表面230，同時該塑封層203還能夠保護該感應區211，用於直接與使用者手指接觸，可進一步簡化該指紋識別晶片封裝結構。
相應的，本發明實施例係提供一種形成上述指紋識別晶片封裝結構其封裝方法，請審閱圖7至圖10所示。
請參閱圖7所示，提供一基板200。
該基板200可為一硬性基板或一軟性基板，能夠根據需要設置該感應晶片201的器件或終端需求進行調整；在本實施例中，該基板200為該硬性基板，該硬性基板可選用PCB基板、玻璃基板、金屬基板、半導體基板或聚合物基板。
該基板200具有一基板表面230，該基板表面230用於耦合後續之一感應晶片201。在該基板200之該基板面230形成一佈線層(未顯示)即一第二連接端205，該佈線層與該第二連接端205連接。
本實施例中，在該基板200的一端形成一連接部204，該連接部204其材料為導電材料，且該佈線層連接到該連接部204，進而使該佈線層和該第二連接端205能夠與一外部電路或一器件電連接。
請參閱圖8所示，在該基板200表面230固定該感應晶片201，該感應晶片201具有一第一表面210及與該第一表面210相對之一第二表面220，該感應晶片201之該第一表面210具有一感應區211，該感應晶片201之該第二表面220位於該基板表面230。
該感應晶片201用於識別使用者手指之指紋。該感應晶片201之該感應區211用於感應使用者手指的指紋資訊，該感應區211內能夠具有一電容結構、或者具有一電感結構，用於檢測並獲取使用者手指其指紋資訊，並轉換為電信號輸出。
在本實施例中，該感應區211內形成有至少一個電容極板，當該使用者手指置於該感應區211上之該塑封層203其表面時，該電容極板、該塑封層203及該使用者手指形成一電容結構，而該感應區211能夠獲取使用者手指其表面之脊及谷與該電容極板之間的電容值差異，並將該電容值差異通過一晶片電路進行處理之後輸出，以此獲取使用者手指之指紋資料。
該感應晶片201更包括了包圍該感應區211之一外圍區212。在該感應晶片201之該外圍區212內形成有一邊緣凹槽206，該感應晶片201其側壁暴露出該邊緣凹槽206；在該邊緣凹槽206其底部形成一第一連接端207；在該感應晶片201之該第一表面210形成該晶片電路，且該晶片電路延伸入該邊緣凹槽206內，並且與該第一連接端207連接，該第一連接端207為該晶片電路的輸出端。
在一實施例中，該邊緣凹槽206可為包圍該感應區211之一連續凹槽，在該連續之邊緣凹槽206其底部表面形成一個或若干第一連接端207。在另一實施例中，該邊緣凹槽206可為包圍該感應區211之一若干分立凹槽，且該若干分立凹槽中每一邊緣凹槽206內形成有一個或若干第一連接端207。
在本實施例中，該邊緣溝槽206其側壁相對於該感應晶片201其表面傾斜，且該邊緣溝槽206其側壁與其底部之間的夾角呈一鈍角。在該邊緣溝槽206內形成該晶片電路時，易於對形成於該傾斜側壁其表面之該晶片電路材料進行光刻和刻蝕工藝，以此形成該晶片電路的佈線。
本實施例中，該感應晶片201通過一第一黏結層301固定於該基板表面230，後續通過一導電線208或一導電層303使該第一連接端207與該第二連接層205相互連接。
在另一實施例中，請繼續參閱圖4所示，在該感應晶片201內形成貫穿該感應晶片201之一導電插塞304，該感應晶片201之該第二表面220暴露出該導電插塞304，該導電插塞304的一端與該第一連接端207連接；在該感應晶片201之該第二表面220暴露出之該導電插塞304其頂部之一焊料層305；藉由將該焊料層305焊接於該第二連接端205其表面，使該感應晶片201與該基板200之間相互固定。
請參閱圖9所示，在將該感應晶片201固定於該基板表面230之後，使該基板200與該感應晶片201耦合。
在本實施例中，該感應晶片201透過該第一黏結層301固定於該基板表面230，藉此能夠透過該導電線208或該導電層303使該基板200與該感應晶片201耦合。
在本實施例中，在該基板表面230耦合該感應晶片201其方法包含了提供該導電線208；將該導電線208其兩端透過焊接工藝分別與該第一連接端207與該第二連接端205連接。該導電線208的材料為金屬，其金屬可為銅、鎢、鋁、金或銀。
在另一實施例中，請繼續參閱圖3所示，在該基板表面230耦合該感應晶片201其方法包含了在該感應晶片201其側壁表面、基板表面230及該邊緣凹槽206內之該導電層303，該導電層303其兩端分別與該第一連接端207和該第二連接端205連接。該導電層303的形成工藝包含了用以沉積工藝、電鍍工藝或化學鍍工藝形成一導電膜；刻蝕部分該導電膜用以形成該導電層303。該導電層303的材料為金屬，其金屬可為銅、鎢、鋁、銀、金、鈦、鉭、鎳、氮化鈦、氮化鉭中的一種或多種。
請參閱圖10所示，在該基板200和該感應晶片201上形成一塑封層203，該塑封層203覆蓋於該感應晶片201之該感應區211其表面，位於該感應區211上之該塑封層203其表面平坦，且位於該感應區211表面之該塑封層203具有一預設厚度。
該塑封層203的材料可為環氧樹脂、聚醯亞胺樹脂、苯並環丁烯樹脂、聚苯並惡唑樹脂、聚對苯二甲酸丁二酯、聚碳酸酯、聚對苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烴、聚氨酯、聚烯烴、聚醚碸、聚醯胺、聚亞氨酯、乙烯-醋酸乙烯共聚物、聚乙烯醇或其他合適的聚合物材料。
該塑封層203的形成工藝可為注塑工藝（injection molding）、轉塑工藝（transfer molding）或絲網印刷工藝。該塑封層203還可以採用其它合適的工藝形成。該塑封層203形成於該基板表面230，包圍該感應晶片201，並且覆蓋於該感應區211其表面。該塑封層203不僅用於將該感應晶片固定於該基板表面230，保護並隔離該感應晶片201，還能夠用於保護該感應區211，且使用者手指能夠直接與該感應區211其表面之該塑封層203接觸。因此，使得本實施例中指紋識別晶片之封裝結構其工藝簡單，能夠減少製造時間和製造成本。
形成於該感應區211其表面之該塑封層203之該預設厚度為20微米~100微米，該預設厚度較薄，當使用者手指置於該感應區211上之該塑封層203其表面時，該使用者手指與該感應區211之間距離較小，因此，該感應區211更容易檢測到使用者手指的指紋，從而降低了該感應晶片201需要高靈敏度之要求。而且，該預設厚度的公差需要控制在-10% ~ +10%的範圍內，以保證位於該感應區211其表面之該塑封層203其表面之厚度均勻且平坦，繼而保證了對使用者手指之指紋進行檢測的結果精確。
該塑封層203的莫氏硬度大於或等於8H。該塑封層203的硬度較高，即使位於該感應區211其表面之該塑封層203其厚度較薄，該塑封層203也足以保護該感應晶片201之該感應區211，當使用者手指在該感應區211上之該塑封層203其表面移動時，不會對該感應晶片201造成損傷。
該塑封層203的介電常數大於或等於7，該塑封層203的電隔離能力較強，位於該感應區211其表面之該塑封層203對該感應區211的保護能力較強。
在本實施例中，在形成該封裝層203之後，還能夠在該基板表面230形成一保護環209，該保護環209包圍該感應晶片201和該塑封層203。該保護環209的材料為金屬，該保護環209透過該基板200接地。該保護環209的材料為金屬，其金屬可為銅、鎢、鋁、銀或金。 【00100】 本實施例中，形成於該基板200和該感應晶片201其表面之該塑封層203用於封裝該感應晶片201。由於該塑封層的材料為該聚合物材料，該聚合物材料具有較好的延展性和柔韌性，且覆蓋能力佳，能夠使形成於該感應區211其表面之該塑封層203其厚度薄、且硬度高，所形成之該塑封層203具有足夠大的硬度以保護該感應晶片201；而且，該塑封層203其表面與該感應晶片之間距離減小，使該感應區211更易獲取使用者手指之指紋資料，所形成之該封裝結構可降低該感應晶片201對於靈敏度之要求，使該封裝方法其使用範圍更廣泛。而且，由於該塑封層203能夠在封裝該感應晶片201同時保護該感應區211，使得封裝該感應晶片201的方法得以簡化。 【00101】 雖然本發明披露如上，但本發明並非限定於此。任何本領域技術人員，在不脫離本發明的精神和範圍內，均可作各種更動與修改，因此本發明的保護範圍應當以權利要求所限定的範圍為准。
【00102】
100‧‧‧基板
101‧‧‧指紋辨別晶片
102‧‧‧玻璃基板
103‧‧‧使用者手指
200‧‧‧玻璃基板
201‧‧‧感應晶片
203‧‧‧塑封層
204‧‧‧連接部
205‧‧‧第二連接端
206‧‧‧邊緣凹槽
207‧‧‧第一連接端
208‧‧‧導電線
209‧‧‧保護環
210‧‧‧第一表面
211‧‧‧感應區
212‧‧‧外圍區
220‧‧‧第二表面
230‧‧‧基板表面
301‧‧‧第一黏結層
303‧‧‧導電層
304‧‧‧導電插塞
305‧‧‧焊料層
400‧‧‧外殼
圖1 係現有技術的一種指紋識別器件的剖面結構示意圖。 圖2 係本發明一較佳實施例的封裝結構之剖面結構示意圖。 圖3 係本發明又一較佳實施例的封裝結構之剖面結構示意圖。 圖4 係本發明又一較佳實施例的封裝結構之剖面結構示意圖。 圖5 係本發明又一較佳實施例的封裝結構之剖面結構示意圖。 圖6 係本發明又一較佳實施例的封裝結構之剖面結構示意圖。 圖7至圖10 係本發明一較佳實施例的封裝方法之剖面結構示意圖。
200‧‧‧基板
201‧‧‧感應晶片
203‧‧‧塑封層
204‧‧‧連接部
205‧‧‧第二連接端
206‧‧‧邊緣凹槽
207‧‧‧第一連接端
208‧‧‧導電線
209‧‧‧保護環
210‧‧‧第一表面
211‧‧‧感應區
212‧‧‧外圍區
220‧‧‧第二表面
230‧‧‧基板表面
301‧‧‧第一黏結層

Claims (17)

  1. 一種指紋識別晶片封裝結構，包含：一基板，具有一基板表面；耦合於該基板表面之一感應晶片，該感應晶片具有一第一表面及與該第一表面相對的之一第二表面，該感應晶片之該第一表面具有一感應區，該感應晶片之該第二表面位於該基板表面；以及位於該基板和該感應晶片上之一塑封層，該塑封層覆蓋於該感應晶片之該感應區其表面，位於感應區上之該塑封層其表面平坦，且位於該感應區其表面之該塑封層具有一預設厚度，該塑封層的材料為聚合物；位於該基板表面之一保護環，該保護環包圍該感應晶片和該塑封層，該保護環的材料為金屬，該保護環透過該基板接地；包圍該塑封層、該感應晶片和該保護環之一外殼，該外殼暴露出該感應區其表面之該塑封層。
  2. 如請求項1所述之指紋識別晶片封裝結構，其中該塑封層位於感應區表面之該預設厚度為20微米~100微米。
  3. 如請求項2所述之指紋識別晶片封裝結構，其中該預設厚度的公差範圍在-10%~+10%以內。
  4. 如請求項1所述之指紋識別晶片封裝結構，其中該塑封層的莫氏硬度大於或等於8H；該塑封層的介電常數大於或等於7。
  5. 如請求項4所述之指紋識別晶片封裝結構，其中該塑封層的材料包括：環氧樹脂、聚醯亞胺樹脂、苯並環丁烯樹脂、聚苯並惡唑樹脂、聚對苯二甲酸丁二酯、聚碳酸酯、聚對苯二甲酸乙二醇酯、聚乙烯、聚丙烯、聚烯烴、聚氨酯、聚烯烴、聚醚碸、聚醯胺、聚亞氨酯、乙烯-醋酸乙烯共聚物或聚乙烯醇。
  6. 如請求項1所述之指紋識別晶片封裝結構，其中該感應晶片之該第一表面更包括了包圍該感應區之一外圍區。
  7. 如請求項6所述之指紋識別晶片封裝結構，其中該感應晶片更包括了位於該外圍區內的之一邊緣凹槽，該感應晶片其側壁暴露出該邊緣凹槽；位於該感應晶片外圍區之一晶片電路，該晶片電路位於該感應晶片之該外圍區表面、及該邊緣凹槽其側壁及其底部表面，且位於該邊緣凹槽其底部具有一第一連接端，該晶片電路與該第一連接端連接。
  8. 如請求項7所述之指紋識別晶片封裝結構，其中該邊緣凹槽為包圍該感應區之一連續凹槽；或者，該邊緣凹槽為包圍該感應區之一若干分立凹槽。
  9. 如請求項7所述之指紋識別晶片封裝結構，其中該感應晶片耦合於基板表面，該基板的第一表面具有一第二連接端。
  10. 如請求項9所述之指紋識別晶片封裝結構，其中更包括了一導電線，該導電線其兩端分別與該第一連接端與該第二連接端連接。
  11. 如請求項9所述之指紋識別晶片封裝結構，其中更包括了位於該感應晶片其側壁表面、該基板表面及該邊緣凹槽內之一導電層，該導電層其兩端分別與該第一連接端和該第二連接端連接。
  12. 如請求項10或11其中一項所述之指紋識別晶片封裝結構，其中更包含了位於該感應晶片和該基板之間之一第一黏結層。
  13. 如請求項9所述之指紋識別晶片封裝結構，其中該感應晶片更包括了貫穿該感應晶片之一導電插塞，該感應晶片之該第二表面暴露出該導電插塞，該導電插塞其一端與該第一連接端連接；位於該感應晶片之該第二表面暴露出的該導電插塞其頂部之一焊料層，該焊料層焊接於該第二連接端其表面。
  14. 如請求項1所述之指紋識別晶片封裝結構，其中該塑封層的顏色與該外殼的顏色一致。
  15. 如請求項1所述之指紋識別晶片封裝結構，其中該基板可為一硬性基板或一軟性基板；該基板的一端具有一連接部，該連接部用於使該感應晶片與一外部電路電連接。
  16. 一種如請求項1~15項其中一項所述之指紋識別晶片封裝結構之封裝方法，包含：提供一基板，該基板具有一基板表面；在該基板表面耦合一感應晶片，該感應晶片具有一第一表面、以及與第一表面相對的一第二表面，該感應晶片之該第一表面具有一感應區，該感應晶片之該第二表面位於該基板表面；在該基板和該感應晶片上形成一塑封層，該塑封層覆蓋於該感應晶片其該感應區其表面，形成於該感應區上之該塑封層表面平坦，且位於該感應區其表面之該塑封層具有一預設厚度形成一保護環，該保護環包圍該感應晶片和該塑封層，該保護環的材料為金屬，該保護環透過該基板接地；形成一外殼，該外殼包圍該塑封層、該感應晶片和該保護環，該外殼暴露出該感應區其表面之該塑封層。
  17. 如請求項16所述之指紋識別晶片封裝結構，其中該塑封層的形成工藝可為注塑工藝、轉塑工藝或絲網印刷工藝。
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