CN104040422B - 照相机模块用液晶性树脂组合物 - Google Patents

照相机模块用液晶性树脂组合物 Download PDF

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Publication number
CN104040422B
CN104040422B CN201380004759.0A CN201380004759A CN104040422B CN 104040422 B CN104040422 B CN 104040422B CN 201380004759 A CN201380004759 A CN 201380004759A CN 104040422 B CN104040422 B CN 104040422B
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Prior art keywords
camera module
composition
crystalline resin
liquid crystalline
resin composition
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Chinese (zh)
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CN104040422A (zh
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广濑悠人
平等文雄
深津博树
田口吉昭
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Polyplastics Co Ltd
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Polyplastics Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C08L23/0884—Epoxide containing esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
CN201380004759.0A 2012-02-29 2013-02-25 照相机模块用液晶性树脂组合物 Active CN104040422B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012044660 2012-02-29
JP2012-044660 2012-02-29
PCT/JP2013/054822 WO2013129338A1 (ja) 2012-02-29 2013-02-25 カメラモジュール用液晶性樹脂組成物

Publications (2)

Publication Number Publication Date
CN104040422A CN104040422A (zh) 2014-09-10
CN104040422B true CN104040422B (zh) 2016-04-13

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Country Status (5)

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JP (1) JP5680788B2 (ko)
KR (1) KR101537109B1 (ko)
CN (1) CN104040422B (ko)
TW (2) TWI608037B (ko)
WO (1) WO2013129338A1 (ko)

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JP5826411B2 (ja) * 2012-12-03 2015-12-02 ポリプラスチックス株式会社 カメラモジュール用液晶性樹脂組成物及びそれを用いたカメラモジュール
KR102230002B1 (ko) 2013-03-13 2021-03-19 티코나 엘엘씨 컴팩트 카메라 모듈
JP6174406B2 (ja) * 2013-07-23 2017-08-02 ポリプラスチックス株式会社 カメラモジュール用液晶性樹脂組成物
JP6165608B2 (ja) * 2013-12-03 2017-07-19 Ｊｘｔｇエネルギー株式会社 全芳香族液晶ポリエステル樹脂組成物およびその射出成形品を構成部材として含むカメラモジュール部品
CN106164172B (zh) 2014-04-09 2019-07-26 提克纳有限责任公司 摄像模组
US9862809B2 (en) 2015-07-31 2018-01-09 Ticona Llc Camera module
US10407605B2 (en) 2015-07-31 2019-09-10 Ticona Llc Thermally conductive polymer composition
TWI708806B (zh) 2015-08-17 2020-11-01 美商堤康那責任有限公司 用於相機模組之液晶聚合物組合物
JP6581659B2 (ja) * 2015-09-01 2019-09-25 ポリプラスチックス株式会社 カメラモジュール用液晶性樹脂組成物及びそれを用いたカメラモジュール
US10633535B2 (en) 2017-02-06 2020-04-28 Ticona Llc Polyester polymer compositions
JP6878149B2 (ja) * 2017-05-30 2021-05-26 上野製薬株式会社 液晶ポリマー組成物
TW201922862A (zh) * 2017-11-15 2019-06-16 日商住友化學股份有限公司 液晶聚酯組成物及樹脂成形體
JP7372915B2 (ja) 2017-12-05 2023-11-01 ティコナ・エルエルシー カメラモジュールにおいて使用するための芳香族ポリマー組成物
TW201932533A (zh) * 2017-12-18 2019-08-16 日商住友化學股份有限公司 液晶聚酯組成物及成形體
EP3749710A1 (en) 2018-02-08 2020-12-16 Celanese Sales Germany GmbH Polymer composite containing recycled carbon fibers
JP7353288B2 (ja) 2018-02-20 2023-09-29 ティコナ・エルエルシー 熱伝導性ポリマー組成物
WO2019201010A1 (zh) 2018-04-16 2019-10-24 Oppo广东移动通信有限公司 激光投射器、相机模组和电子装置
WO2020100618A1 (ja) * 2018-11-15 2020-05-22 ポリプラスチックス株式会社 液晶性樹脂組成物、及び当該液晶性樹脂組成物の成形品を含むコネクター
US11086200B2 (en) 2019-03-20 2021-08-10 Ticona Llc Polymer composition for use in a camera module
US11722759B2 (en) 2019-03-20 2023-08-08 Ticona Llc Actuator assembly for a camera module
WO2021173411A1 (en) 2020-02-26 2021-09-02 Ticona Llc Polymer composition for an electronic device
WO2021173408A1 (en) 2020-02-26 2021-09-02 Ticona Llc Electronic device
CN115700014A (zh) 2020-02-26 2023-02-03 提克纳有限责任公司 电路结构
US11728065B2 (en) 2020-07-28 2023-08-15 Ticona Llc Molded interconnect device

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CN101305056A (zh) * 2005-10-13 2008-11-12 宝理塑料株式会社 注塑成型用液晶性树脂组合物
CN101981123A (zh) * 2008-03-28 2011-02-23 吉坤日矿日石能源株式会社 照相机模块用液晶聚酯树脂组合物

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JPH08183910A (ja) * 1994-12-28 1996-07-16 Toray Ind Inc 熱可塑性樹脂組成物
JPH10330602A (ja) * 1997-05-29 1998-12-15 Sumitomo Chem Co Ltd 液晶ポリエステル樹脂組成物、それよりなる射出成形品およびフィルム
JP2002509573A (ja) * 1997-07-09 2002-03-26 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 液晶性ポリマー−ポリ（フェニレンオキシド）ブレンド
US20070190346A1 (en) * 2004-03-10 2007-08-16 Matsushita Electric Works, Ltd. Metal-coated resin molded article and production method therefor
JP2007254717A (ja) * 2006-02-27 2007-10-04 Toray Ind Inc 液晶性樹脂組成物およびそれからなる成形品
JP2009030044A (ja) * 2007-07-02 2009-02-12 Asahi Kasei Chemicals Corp 特異なモルフォロジーを有する樹脂組成物
JP5752990B2 (ja) * 2011-05-18 2015-07-22 帝人株式会社 ハイサイクル成形性熱可塑性樹脂組成物

Patent Citations (2)

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CN101305056A (zh) * 2005-10-13 2008-11-12 宝理塑料株式会社 注塑成型用液晶性树脂组合物
CN101981123A (zh) * 2008-03-28 2011-02-23 吉坤日矿日石能源株式会社 照相机模块用液晶聚酯树脂组合物

Also Published As

Publication number Publication date
WO2013129338A1 (ja) 2013-09-06
TW201402664A (zh) 2014-01-16
CN104040422A (zh) 2014-09-10
KR20140141570A (ko) 2014-12-10
TWI608037B (zh) 2017-12-11
TW201639908A (zh) 2016-11-16
KR101537109B1 (ko) 2015-07-15
JP5680788B2 (ja) 2015-03-04
TWI608038B (zh) 2017-12-11
JPWO2013129338A1 (ja) 2015-07-30

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