CN104040026B - 不含甲醛的化学镀镀铜溶液 - Google Patents

不含甲醛的化学镀镀铜溶液 Download PDF

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Publication number
CN104040026B
CN104040026B CN201280049015.6A CN201280049015A CN104040026B CN 104040026 B CN104040026 B CN 104040026B CN 201280049015 A CN201280049015 A CN 201280049015A CN 104040026 B CN104040026 B CN 104040026B
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China
Prior art keywords
acid
copper
electroless copper
aqueous solution
solution
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CN201280049015.6A
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English (en)
Chinese (zh)
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CN104040026A (zh
Inventor
E·施泰因豪泽
S·勒泽勒
S·维泽
T·C·L·阮
L·施坦普
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CN201280049015.6A 2011-10-05 2012-10-01 不含甲醛的化学镀镀铜溶液 Active CN104040026B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11183991 2011-10-05
EP11183991.6 2011-10-05
PCT/EP2012/069388 WO2013050332A2 (en) 2011-10-05 2012-10-01 Formaldehyde-free electroless copper plating solution

Publications (2)

Publication Number Publication Date
CN104040026A CN104040026A (zh) 2014-09-10
CN104040026B true CN104040026B (zh) 2019-01-01

Family

ID=46963736

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280049015.6A Active CN104040026B (zh) 2011-10-05 2012-10-01 不含甲醛的化学镀镀铜溶液

Country Status (7)

Country Link
US (1) US20140242264A1 (ja)
EP (1) EP2764135A2 (ja)
JP (1) JP6180419B2 (ja)
KR (1) KR101953940B1 (ja)
CN (1) CN104040026B (ja)
TW (1) TWI557271B (ja)
WO (1) WO2013050332A2 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
WO2015043975A1 (en) * 2013-09-25 2015-04-02 Atotech Deutschland Gmbh Method for depositing a copper seed layer onto a barrier layer and copper plating bath
EP3070185B1 (en) * 2014-01-27 2024-05-29 Okuno Chemical Industries Co., Ltd. Conductive film-forming bath
JP6539992B2 (ja) * 2014-11-14 2019-07-10 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法
US20160145745A1 (en) * 2014-11-24 2016-05-26 Rohm And Haas Electronic Materials Llc Formaldehyde-free electroless metal plating compositions and methods
EP3035122B1 (en) 2014-12-16 2019-03-20 ATOTECH Deutschland GmbH Method for fine line manufacturing
EP3035375B1 (en) * 2014-12-19 2017-05-03 ATOTECH Deutschland GmbH Treating module of an apparatus for horizontal wet-chemical treatment of large-scale substrates
US10975474B2 (en) 2016-05-04 2021-04-13 Atotech Deutschland Gmbh Process for depositing a metal or metal alloy on a surface of a substrate including its activation
KR102428755B1 (ko) * 2017-11-24 2022-08-02 엘지디스플레이 주식회사 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛
EP3578683B1 (en) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Electroless copper or copper alloy plating bath and method for plating
EP3670698B1 (en) 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof
JP7455859B2 (ja) 2019-04-04 2024-03-26 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法
EP3839092A1 (en) 2019-12-20 2021-06-23 ATOTECH Deutschland GmbH Method for activating at least one surface, activation composition, and use of the activation composition to activate a surface for electroless plating
WO2022043417A1 (en) 2020-08-27 2022-03-03 Atotech Deutschland GmbH & Co. KG A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
CN115679305B (zh) * 2023-01-03 2023-03-10 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺

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US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US5846925A (en) * 1995-08-30 1998-12-08 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US6660071B2 (en) * 2000-06-19 2003-12-09 Murata Manufacturing Co., Ltd. Electroless copper plating bath, electroless copper plating method and electronic part
CN1867697A (zh) * 2003-10-17 2006-11-22 株式会社日矿材料 无电镀铜溶液和无电镀铜方法
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
CN101104929A (zh) * 2006-07-07 2008-01-16 罗门哈斯电子材料有限公司 环境友好的无电镀铜组合物
CN102191491A (zh) * 2010-03-10 2011-09-21 比亚迪股份有限公司 一种化学镀铜液及一种化学镀铜方法

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US2761874A (en) 1954-09-30 1956-09-04 Dow Chemical Co Amino derivatives of n-alkyl substituted aspartic acids and their functional derivatives
US3158635A (en) 1959-03-18 1964-11-24 Stauffer Chemical Co Bis-adduction products and methods of preparing same
US3632704A (en) * 1967-12-04 1972-01-04 Stauffer Chemical Co Method for modifying electrically nonconductive surfaces for electroless plating
US4315045A (en) * 1978-12-19 1982-02-09 Crown City Plating Co. Conditioning of polyamides for electroless plating
JPS57116031A (en) 1981-01-13 1982-07-19 Tokyo Organ Chem Ind Ltd N-substituted polyamine and its preparation
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
GB9422762D0 (en) * 1994-11-11 1995-01-04 Ass Octel Use of a compound
JPH0949084A (ja) * 1995-05-31 1997-02-18 Nitto Chem Ind Co Ltd ジアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
CA2230282C (en) * 1995-08-30 2008-07-08 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US20020064592A1 (en) 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
KR100529371B1 (ko) * 2003-07-29 2005-11-21 주식회사 엘지화학 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법
EP1696719A4 (en) * 2003-11-14 2008-10-29 Bridgestone Corp ELECTROMAGNETIC SHIELDING TRANSLUCENT WINDOW MATERIAL AND METHOD OF MANUFACTURING THEREOF
WO2006102180A2 (en) * 2005-03-18 2006-09-28 Applied Materials, Inc. Contact metallization methods and processes
KR100702797B1 (ko) * 2005-12-09 2007-04-03 동부일렉트로닉스 주식회사 반도체소자의 구리배선막 형성방법
KR20080083790A (ko) * 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US5846925A (en) * 1995-08-30 1998-12-08 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US6660071B2 (en) * 2000-06-19 2003-12-09 Murata Manufacturing Co., Ltd. Electroless copper plating bath, electroless copper plating method and electronic part
CN1867697A (zh) * 2003-10-17 2006-11-22 株式会社日矿材料 无电镀铜溶液和无电镀铜方法
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
CN101104929A (zh) * 2006-07-07 2008-01-16 罗门哈斯电子材料有限公司 环境友好的无电镀铜组合物
CN102191491A (zh) * 2010-03-10 2011-09-21 比亚迪股份有限公司 一种化学镀铜液及一种化学镀铜方法

Also Published As

Publication number Publication date
WO2013050332A2 (en) 2013-04-11
EP2764135A2 (en) 2014-08-13
TW201323654A (zh) 2013-06-16
US20140242264A1 (en) 2014-08-28
KR101953940B1 (ko) 2019-03-04
WO2013050332A3 (en) 2014-03-13
JP2014528517A (ja) 2014-10-27
TWI557271B (zh) 2016-11-11
JP6180419B2 (ja) 2017-08-16
CN104040026A (zh) 2014-09-10
WO2013050332A8 (en) 2013-07-11
KR20140090145A (ko) 2014-07-16

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