TWI557271B - 不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 - Google Patents
不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 Download PDFInfo
- Publication number
- TWI557271B TWI557271B TW101136996A TW101136996A TWI557271B TW I557271 B TWI557271 B TW I557271B TW 101136996 A TW101136996 A TW 101136996A TW 101136996 A TW101136996 A TW 101136996A TW I557271 B TWI557271 B TW I557271B
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- electroless copper
- copper
- copper plating
- plating solution
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11183991 | 2011-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201323654A TW201323654A (zh) | 2013-06-16 |
TWI557271B true TWI557271B (zh) | 2016-11-11 |
Family
ID=46963736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101136996A TWI557271B (zh) | 2011-10-05 | 2012-10-05 | 不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140242264A1 (ja) |
EP (1) | EP2764135A2 (ja) |
JP (1) | JP6180419B2 (ja) |
KR (1) | KR101953940B1 (ja) |
CN (1) | CN104040026B (ja) |
TW (1) | TWI557271B (ja) |
WO (1) | WO2013050332A2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2784181B1 (en) * | 2013-03-27 | 2015-12-09 | ATOTECH Deutschland GmbH | Electroless copper plating solution |
MY173728A (en) * | 2013-09-25 | 2020-02-18 | Atotech Deutschland Gmbh | Method for depositing a copper seed layer onto a barrier layer |
EP3070185B1 (en) * | 2014-01-27 | 2024-05-29 | Okuno Chemical Industries Co., Ltd. | Conductive film-forming bath |
JP6539992B2 (ja) * | 2014-11-14 | 2019-07-10 | 凸版印刷株式会社 | 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法 |
US20160145745A1 (en) * | 2014-11-24 | 2016-05-26 | Rohm And Haas Electronic Materials Llc | Formaldehyde-free electroless metal plating compositions and methods |
EP3035122B1 (en) | 2014-12-16 | 2019-03-20 | ATOTECH Deutschland GmbH | Method for fine line manufacturing |
EP3035375B1 (en) * | 2014-12-19 | 2017-05-03 | ATOTECH Deutschland GmbH | Treating module of an apparatus for horizontal wet-chemical treatment of large-scale substrates |
EP3452635B1 (en) | 2016-05-04 | 2020-02-26 | ATOTECH Deutschland GmbH | Process for depositing a metal or metal alloy on a surface of a substrate including its activation |
KR102428755B1 (ko) * | 2017-11-24 | 2022-08-02 | 엘지디스플레이 주식회사 | 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛 |
EP3578683B1 (en) | 2018-06-08 | 2021-02-24 | ATOTECH Deutschland GmbH | Electroless copper or copper alloy plating bath and method for plating |
EP3670698B1 (en) | 2018-12-17 | 2021-08-11 | ATOTECH Deutschland GmbH | Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof |
CN113614283A (zh) | 2019-04-04 | 2021-11-05 | 德国艾托特克公司 | 活化用于金属化的非导电或含碳纤维的衬底表面的方法 |
EP3839092A1 (en) | 2019-12-20 | 2021-06-23 | ATOTECH Deutschland GmbH | Method for activating at least one surface, activation composition, and use of the activation composition to activate a surface for electroless plating |
US20230340673A1 (en) | 2020-08-27 | 2023-10-26 | Atotech Deutschland GmbH & Co. KG | A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization |
CN114507850A (zh) * | 2021-12-06 | 2022-05-17 | 华东理工大学 | 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方 |
CN115679305B (zh) * | 2023-01-03 | 2023-03-10 | 湖南源康利科技有限公司 | 一种印制板用铝箔表面化学镀铜处理工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0949084A (ja) * | 1995-05-31 | 1997-02-18 | Nitto Chem Ind Co Ltd | ジアミン型生分解性キレート剤を用いた無電解Cuメッキ浴 |
US5741555A (en) * | 1995-05-22 | 1998-04-21 | The Dow Chemical Company | Succinic acid derivative degradable chelants, uses and compositions thereof |
US20020064592A1 (en) * | 2000-11-29 | 2002-05-30 | Madhav Datta | Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects |
US7220296B1 (en) * | 2005-12-15 | 2007-05-22 | Intel Corporation | Electroless plating baths for high aspect features |
US20080223253A1 (en) * | 2007-03-13 | 2008-09-18 | Samsung Electronics Co., Ltd. | Electroless copper plating solution, method of producing the same and electroless copper plating method |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2761874A (en) | 1954-09-30 | 1956-09-04 | Dow Chemical Co | Amino derivatives of n-alkyl substituted aspartic acids and their functional derivatives |
US3158635A (en) | 1959-03-18 | 1964-11-24 | Stauffer Chemical Co | Bis-adduction products and methods of preparing same |
US3632704A (en) * | 1967-12-04 | 1972-01-04 | Stauffer Chemical Co | Method for modifying electrically nonconductive surfaces for electroless plating |
US4315045A (en) * | 1978-12-19 | 1982-02-09 | Crown City Plating Co. | Conditioning of polyamides for electroless plating |
JPS57116031A (en) | 1981-01-13 | 1982-07-19 | Tokyo Organ Chem Ind Ltd | N-substituted polyamine and its preparation |
US4668532A (en) * | 1984-09-04 | 1987-05-26 | Kollmorgen Technologies Corporation | System for selective metallization of electronic interconnection boards |
US4617205A (en) * | 1984-12-21 | 1986-10-14 | Omi International Corporation | Formaldehyde-free autocatalytic electroless copper plating |
GB9422762D0 (en) * | 1994-11-11 | 1995-01-04 | Ass Octel | Use of a compound |
CA2230282C (en) * | 1995-08-30 | 2008-07-08 | The Dow Chemical Company | Succinic acid derivative degradable chelants, uses and compositions thereof |
US5733858A (en) * | 1995-08-30 | 1998-03-31 | The Dow Chemical Company | Succinic acid derivative degradable chelants, uses and compositions thererof |
JP3444276B2 (ja) * | 2000-06-19 | 2003-09-08 | 株式会社村田製作所 | 無電解銅めっき浴、無電解銅めっき方法および電子部品 |
KR100529371B1 (ko) * | 2003-07-29 | 2005-11-21 | 주식회사 엘지화학 | 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 |
JP4327163B2 (ja) * | 2003-10-17 | 2009-09-09 | 日鉱金属株式会社 | 無電解銅めっき液および無電解銅めっき方法 |
WO2005048674A1 (ja) * | 2003-11-14 | 2005-05-26 | Bridgestone Corporation | 電磁波シールド性光透過窓材及びその製造方法 |
TW200707640A (en) * | 2005-03-18 | 2007-02-16 | Applied Materials Inc | Contact metallization scheme using a barrier layer over a silicide layer |
KR100702797B1 (ko) * | 2005-12-09 | 2007-04-03 | 동부일렉트로닉스 주식회사 | 반도체소자의 구리배선막 형성방법 |
EP1876262A1 (en) | 2006-07-07 | 2008-01-09 | Rohm and Haas Electronic Materials, L.L.C. | Environmentally friendly electroless copper compositions |
CN102191491A (zh) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | 一种化学镀铜液及一种化学镀铜方法 |
-
2012
- 2012-10-01 US US14/350,153 patent/US20140242264A1/en not_active Abandoned
- 2012-10-01 WO PCT/EP2012/069388 patent/WO2013050332A2/en active Application Filing
- 2012-10-01 CN CN201280049015.6A patent/CN104040026B/zh active Active
- 2012-10-01 EP EP12766668.3A patent/EP2764135A2/en not_active Withdrawn
- 2012-10-01 KR KR1020147008668A patent/KR101953940B1/ko active IP Right Grant
- 2012-10-01 JP JP2014533846A patent/JP6180419B2/ja active Active
- 2012-10-05 TW TW101136996A patent/TWI557271B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5741555A (en) * | 1995-05-22 | 1998-04-21 | The Dow Chemical Company | Succinic acid derivative degradable chelants, uses and compositions thereof |
JPH0949084A (ja) * | 1995-05-31 | 1997-02-18 | Nitto Chem Ind Co Ltd | ジアミン型生分解性キレート剤を用いた無電解Cuメッキ浴 |
US20020064592A1 (en) * | 2000-11-29 | 2002-05-30 | Madhav Datta | Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects |
US7220296B1 (en) * | 2005-12-15 | 2007-05-22 | Intel Corporation | Electroless plating baths for high aspect features |
US20080223253A1 (en) * | 2007-03-13 | 2008-09-18 | Samsung Electronics Co., Ltd. | Electroless copper plating solution, method of producing the same and electroless copper plating method |
Also Published As
Publication number | Publication date |
---|---|
WO2013050332A2 (en) | 2013-04-11 |
JP6180419B2 (ja) | 2017-08-16 |
WO2013050332A3 (en) | 2014-03-13 |
TW201323654A (zh) | 2013-06-16 |
CN104040026B (zh) | 2019-01-01 |
EP2764135A2 (en) | 2014-08-13 |
JP2014528517A (ja) | 2014-10-27 |
CN104040026A (zh) | 2014-09-10 |
WO2013050332A8 (en) | 2013-07-11 |
KR20140090145A (ko) | 2014-07-16 |
US20140242264A1 (en) | 2014-08-28 |
KR101953940B1 (ko) | 2019-03-04 |
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