TWI557271B - 不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 - Google Patents

不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 Download PDF

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Publication number
TWI557271B
TWI557271B TW101136996A TW101136996A TWI557271B TW I557271 B TWI557271 B TW I557271B TW 101136996 A TW101136996 A TW 101136996A TW 101136996 A TW101136996 A TW 101136996A TW I557271 B TWI557271 B TW I557271B
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TW
Taiwan
Prior art keywords
acid
electroless copper
copper
copper plating
plating solution
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TW101136996A
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English (en)
Chinese (zh)
Other versions
TW201323654A (zh
Inventor
路茲 史坦佩
艾迪斯 史坦華西爾
珊卓 羅瑟勒
史戴芬妮 衛斯
安谷元 坦 坎 賴
Original Assignee
德國艾托特克公司
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Publication of TW201323654A publication Critical patent/TW201323654A/zh
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Publication of TWI557271B publication Critical patent/TWI557271B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW101136996A 2011-10-05 2012-10-05 不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法 TWI557271B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11183991 2011-10-05

Publications (2)

Publication Number Publication Date
TW201323654A TW201323654A (zh) 2013-06-16
TWI557271B true TWI557271B (zh) 2016-11-11

Family

ID=46963736

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101136996A TWI557271B (zh) 2011-10-05 2012-10-05 不含甲醛之無電鍍銅溶液、其用途及無電鍍銅之方法

Country Status (7)

Country Link
US (1) US20140242264A1 (ja)
EP (1) EP2764135A2 (ja)
JP (1) JP6180419B2 (ja)
KR (1) KR101953940B1 (ja)
CN (1) CN104040026B (ja)
TW (1) TWI557271B (ja)
WO (1) WO2013050332A2 (ja)

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EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
MY173728A (en) * 2013-09-25 2020-02-18 Atotech Deutschland Gmbh Method for depositing a copper seed layer onto a barrier layer
EP3070185B1 (en) * 2014-01-27 2024-05-29 Okuno Chemical Industries Co., Ltd. Conductive film-forming bath
JP6539992B2 (ja) * 2014-11-14 2019-07-10 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法
US20160145745A1 (en) * 2014-11-24 2016-05-26 Rohm And Haas Electronic Materials Llc Formaldehyde-free electroless metal plating compositions and methods
EP3035122B1 (en) 2014-12-16 2019-03-20 ATOTECH Deutschland GmbH Method for fine line manufacturing
EP3035375B1 (en) * 2014-12-19 2017-05-03 ATOTECH Deutschland GmbH Treating module of an apparatus for horizontal wet-chemical treatment of large-scale substrates
EP3452635B1 (en) 2016-05-04 2020-02-26 ATOTECH Deutschland GmbH Process for depositing a metal or metal alloy on a surface of a substrate including its activation
KR102428755B1 (ko) * 2017-11-24 2022-08-02 엘지디스플레이 주식회사 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛
EP3578683B1 (en) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Electroless copper or copper alloy plating bath and method for plating
EP3670698B1 (en) 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof
CN113614283A (zh) 2019-04-04 2021-11-05 德国艾托特克公司 活化用于金属化的非导电或含碳纤维的衬底表面的方法
EP3839092A1 (en) 2019-12-20 2021-06-23 ATOTECH Deutschland GmbH Method for activating at least one surface, activation composition, and use of the activation composition to activate a surface for electroless plating
US20230340673A1 (en) 2020-08-27 2023-10-26 Atotech Deutschland GmbH & Co. KG A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
CN115679305B (zh) * 2023-01-03 2023-03-10 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺

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US20020064592A1 (en) * 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
US20080223253A1 (en) * 2007-03-13 2008-09-18 Samsung Electronics Co., Ltd. Electroless copper plating solution, method of producing the same and electroless copper plating method

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Publication number Priority date Publication date Assignee Title
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
JPH0949084A (ja) * 1995-05-31 1997-02-18 Nitto Chem Ind Co Ltd ジアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
US20020064592A1 (en) * 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
US20080223253A1 (en) * 2007-03-13 2008-09-18 Samsung Electronics Co., Ltd. Electroless copper plating solution, method of producing the same and electroless copper plating method

Also Published As

Publication number Publication date
WO2013050332A2 (en) 2013-04-11
JP6180419B2 (ja) 2017-08-16
WO2013050332A3 (en) 2014-03-13
TW201323654A (zh) 2013-06-16
CN104040026B (zh) 2019-01-01
EP2764135A2 (en) 2014-08-13
JP2014528517A (ja) 2014-10-27
CN104040026A (zh) 2014-09-10
WO2013050332A8 (en) 2013-07-11
KR20140090145A (ko) 2014-07-16
US20140242264A1 (en) 2014-08-28
KR101953940B1 (ko) 2019-03-04

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