CN104020536A - Method for packaging optical transceiver module - Google Patents
Method for packaging optical transceiver module Download PDFInfo
- Publication number
- CN104020536A CN104020536A CN201410251942.7A CN201410251942A CN104020536A CN 104020536 A CN104020536 A CN 104020536A CN 201410251942 A CN201410251942 A CN 201410251942A CN 104020536 A CN104020536 A CN 104020536A
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- China
- Prior art keywords
- transceiver module
- optical transceiver
- packing
- housing
- circuit chip
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Abstract
The invention provides a method for packaging an optical transceiver module. The method comprises the steps that an aluminum nitride substrate is provided; the aluminum nitride substrate is fixedly arranged on a metal cooling block; then a shell and the metal cooling block are fixed; an outer shell, the shell and a shell cover are fixedly packaged; finally, step type welding is carried out on the shell and the shell cover, an optical fiber output hole of the shell is sealed, the step type welding mode is adopted, and therefore welding air impermeability is enhanced, meanwhile, production cost is lowered, and market pressure is relieved.
Description
Technical field
The invention relates to a kind of method for packing, particularly the method for packing of optical transceiver module.
Background technology
Popularizing along with broadband network in recent years, between the each level equipment of data center (device), need to realize high speed interconnected, for realizing low cost, low-power consumption, highdensity transmission, industry adopts QSFP module as transmit port at core router towards outer net, and this QSFP module of later stage will progressively expand and be extended down to switch and server level.Wherein light emission secondary module and the light-receiving secondary module in the transceiver of QSFP (transceiver) is referred to as optical transceiver module.
The method for packing of optical transceiver module also can be described as and refers to install the shell that optical transceiver module circuit chip is used; it not only plays a part to lay, fixes, seals, protects chip and increased thermal conductivity energy; but also be link up the chip internal world and external circuit bridge---the contact on chip is wired on the pin of package casing, and these pins connect by the wire on printed circuit board (PCB) and other devices again.Therefore,, for a lot of optical articles, encapsulation technology is all unusual the key link.Along with the pressure in market, in the urgent need to exploitation method for packing more cheaply.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, a kind of method for packing of new optical transceiver module is provided.
In order to reach foregoing invention object, technical scheme provided by the invention is as follows: the method for packing of optical transceiver module, comprises:
Aluminium nitride substrate is provided; The circuit chip of optical transceiver module is fused on aluminium nitride substrate;
Heat dissipation metal piece is provided; Aluminium nitride substrate is fixed on heat dissipation metal piece;
Package casing is provided; Package casing comprises housing, cap, comprises fixed orifice and the optical fiber delivery outlet of conductive pin, filtering fixed orifice, receiver on its middle shell; First the filter plate, optical transceiver module being comprised is fixed to filter plate fixed orifice; Again by the pad of circuit chip and the conducting of conductive pin bonding; Then fix tail optical fiber and circuit chip; Last fixed reception device;
Fixing package casing and housing and cap; Housing and cap are carried out after staged welding, seal at the optical fiber outlet aperture of housing.
Wherein, preferred implementation is: by injection moulding mode by one-body molded to the fixed orifice of housing, conductive pin, filter plate fixed orifice, receiver and optical fiber delivery outlet.
Wherein, preferred implementation is: the fusion temp of aluminium nitride substrate and circuit chip is set to 280 DEG C, and set of time is 2Min.
Wherein, preferred implementation is: heat dissipation metal piece is set to T-shaped.
Wherein, preferred implementation is: the fixed form between aluminium nitride substrate and heat dissipation metal piece adopts adhesive to cohere.
Wherein, preferred implementation is: filter plate is encapsulated in filter plate fixed orifice and adopts adhesive to cohere.
Wherein, preferred implementation is: the fixed form between tail optical fiber and circuit chip adopts adhesive to cohere.
Compared with prior art, advantage and the good effect of the method for packing of optical transceiver module of the present invention are: first, the housing of method for packing of the present invention and cap be fixedly the welding manner by ladder, thereby add the impermeability of strong weld; Secondly, filter plate fixed orifice is set to V-type groove through hole, has both facilitated filter plate to put housing into, effectively blocks again or absorb the scattered light of tail optical fiber output; Again, heat dissipation metal piece is set to T-shaped, effectively prevents the disengaging of heat dissipation metal piece and housing, increases the impermeability of heat dissipation metal piece and housing surface of contact simultaneously; Finally, the method for packing of the optical transceiver module of the present embodiment by one-body molded to the fixed orifice of housing, conductive pin, filter plate fixed orifice, receiver and optical fiber delivery outlet, has reduced production cost by injection moulding mode, alleviates market pressure.
Brief description of the drawings
The schematic flow sheet of the method for packing that Fig. 1 a to Fig. 1 c is optical transceiver module of the present invention.
Fig. 2 is the structural representation of package casing of the present invention.
Fig. 3 a to Fig. 3 e is the fixing schematic flow sheet of housing of the present invention and heat dissipation metal piece.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is done further and described in detail.The schematic flow sheet of the method for packing that Fig. 1 a to Fig. 1 c is optical transceiver module of the present invention.
The method for packing of the optical transceiver module of the present embodiment by injection moulding mode by one-body molded to the fixed orifice 41 of housing 10, conductive pin 11, filter plate fixed orifice 31, receiver and optical fiber delivery outlet 51.
Optical transceiver module of the present invention comprises circuit chip C1, receiver R1 and tail optical fiber P1.Wherein, the upper integrated components and parts such as laser instrument L1, waveguide W1 of circuit chip C1.
In the method for packing of optical transceiver module of the present invention, need provide external power supply and external light source, so that the debugging in encapsulation process is used.
The detailed method for packing step of optical transceiver module is:
The first step, provides aluminium nitride substrate 100.The circuit chip C1 of optical transceiver module is fused on aluminium nitride substrate 100.Wherein, welding in the following way: circuit chip C1 and aluminium nitride substrate 100 are placed in vacuum drying oven, and temperature setting is set to 280 DEG C, and weld time is set to 2Min.
Second step, provides heat dissipation metal piece 20.And this heat dissipation metal piece 20 is set to T-shaped.By the aluminium nitride substrate in above-mentioned steps one 100 and welding, the circuit chip C1 on aluminium nitride substrate 100 is fixed on heat dissipation metal piece 20.Wherein, aluminium nitride substrate 100 and the mode that the fixing employing adhesive of heat dissipation metal piece 20 coheres, preferably adopt conducting resinl.Now, the upper surface of aluminium nitride substrate 100 and circuit chip C1 welding, lower surface is connected with heat dissipation metal piece 20.As shown in Figure 1 b.
The 3rd step, provides package casing 300.Package casing 300 comprises housing 10, cap 10 ', comprises fixed orifice 41 and the optical fiber delivery outlet 51 of conductive pin 11, filter plate fixed orifice 31, receiver on its middle shell 10.As shown in Figure 2.Wherein, housing 10 is as described below with the fixing step of heat dissipation metal piece 20:
First the filter plate, optical transceiver module being comprised is fixed to the filter plate fixed orifice 31 of package casing 300.Wherein, the mode that the fixing employing adhesive of filter plate coheres, preferably adopts conducting resinl.Wherein filter plate fixed orifice 31 is set to V-type groove through hole, facilitates the placement of filter plate.As shown in Figure 3 a.
Secondly, by the pad of circuit chip C1 and conductive pin 11 bonding conductings.Conduction mode is preferably and adopts diameter is pad and the conductive pin 11 of gold (Au) the silk connected circuit chip C1 of 25 μ m.As shown in Figure 3 b.
Again, fixing tail optical fiber P1 and circuit chip C1.Use external power supply to be energized to the conductive pin 11 of package casing 300, due to conductive pin 11 and circuit chip C1 electrically connect, therefore with circuit chip C1 in integrated laser instrument L1 luminous.Simultaneously tail optical fiber P1 receives the light that laser instrument L1 sends, and when monitoring tail optical fiber receives light time of specified power, tail optical fiber P1 and circuit chip C1 is fixed.Wherein, the mode that tail optical fiber P1 and circuit chip C1 fixed form adopt adhesive to cohere, preferably adopts UV glue.As shown in Figure 3 c.
Finally, fixed reception device R1.External light source and tail optical fiber P1 are connected, and therefore the light of external light source output exports circuit chip C1 to by tail optical fiber P1, and because waveguide W1 is integrated in circuit chip C1 above, therefore the light of external light source output enters receiver R1 by the output terminal of waveguide W1 simultaneously.According to the power of output light, regulate the position of receiver R1, in the time that the output light of receiver R1 reception reaches specified power, receiver R1 is fixed on to receiver fixed orifice 31 places of package casing 300.Wherein, the mode that the fixed form of receiver R1 adopts adhesive to cohere, preferably adopts UV glue.As shown in Figure 3 e.
The 4th step, fixing package casing 300 housing 10 and caps 10 '.First, by ultrasonic welding machine, housing 10 and cap 10 ' are carried out to stepped welding; Secondly, seal by adhesive at optical fiber delivery outlet 51 places of housing 10.As shown in Fig. 1 c.
Compared with prior art, advantage and the good effect of the method for packing of optical transceiver module of the present invention are: first, the housing 10 of method for packing of the present invention is fixedly the welding manner by ladder with cap 10 ', thereby adds the impermeability of strong weld; Secondly, filter plate fixed orifice 31 is set to V-type groove through hole, has both facilitated filter plate to put housing 10 into, effectively blocks again or absorb the scattered light of tail optical fiber P1 output; Again, heat dissipation metal piece 20 is set to T-shaped, effectively prevents the disengaging of heat dissipation metal piece 20 and housing 10, increases the impermeability of heat dissipation metal piece 20 and housing 10 surface of contact simultaneously; Finally, the method for packing of optical transceiver module of the present invention by one-body molded to the fixed orifice 41 of housing 10, conductive pin 11, filter plate fixed orifice 31, receiver and optical fiber delivery outlet 51, has reduced production cost by injection moulding mode, alleviates market pressure.
The above, be only most preferred embodiment of the present invention, and not for limiting the scope of the invention, all equivalences of doing according to the present patent application the scope of the claims change or modify, and are all the present invention and contain.
Claims (7)
1. the method for packing of optical transceiver module, comprises:
Aluminium nitride substrate is provided; The circuit chip of optical transceiver module is fused on aluminium nitride substrate;
Heat dissipation metal piece is provided; Aluminium nitride substrate is fixed on heat dissipation metal piece;
Package casing is provided; Package casing comprises housing, cap, comprises fixed orifice and the optical fiber delivery outlet of conductive pin, filtering fixed orifice, receiver on its middle shell; First the filter plate, optical transceiver module being comprised is fixed to filter plate fixed orifice; Again by the pad of circuit chip and the conducting of conductive pin bonding; Then fix tail optical fiber and circuit chip; Last fixed reception device;
Fixing package casing and housing and cap; Housing and cap are carried out after staged welding, seal at the optical fiber outlet aperture of housing.
2. the method for packing of optical transceiver module according to claim 1, is characterized in that: by injection moulding mode by one-body molded to the fixed orifice of housing, conductive pin, filter plate fixed orifice, receiver and optical fiber delivery outlet.
3. the method for packing of optical transceiver module according to claim 1, is characterized in that: the fusion temp of aluminium nitride substrate and circuit chip is set to 280 DEG C, and set of time is 2Min.
4. the method for packing of optical transceiver module according to claim 1, is characterized in that: heat dissipation metal piece is set to T-shaped.
5. according to the method for packing of the optical transceiver module described in claim 1 or 4, it is characterized in that: the fixed form between aluminium nitride substrate and heat dissipation metal piece adopts adhesive to cohere.
6. the method for packing of optical transceiver module according to claim 1, is characterized in that: filter plate is encapsulated in filter plate fixed orifice and adopts adhesive to cohere.
7. the method for packing of optical transceiver module according to claim 1, is characterized in that: the fixed form between tail optical fiber and circuit chip adopts adhesive to cohere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410251942.7A CN104020536B (en) | 2014-06-09 | 2014-06-09 | The packaging method of optical transceiver module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410251942.7A CN104020536B (en) | 2014-06-09 | 2014-06-09 | The packaging method of optical transceiver module |
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| CN104020536A true CN104020536A (en) | 2014-09-03 |
| CN104020536B CN104020536B (en) | 2018-10-19 |
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| CN201410251942.7A Active CN104020536B (en) | 2014-06-09 | 2014-06-09 | The packaging method of optical transceiver module |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104410773A (en) * | 2014-11-04 | 2015-03-11 | 深圳市豪恩汽车电子装备有限公司 | Car reversing image pick-up device and manufacturing method thereof |
| CN106842432A (en) * | 2017-02-21 | 2017-06-13 | 郑州大学 | A kind of novel optical fiber array and preparation method thereof |
| CN107219596A (en) * | 2017-08-04 | 2017-09-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical secondary module and optical module |
| CN107567202A (en) * | 2017-08-28 | 2018-01-09 | 广东小天才科技有限公司 | Circuit board assemblies and its manufacture method |
| WO2020125646A1 (en) * | 2018-12-17 | 2020-06-25 | 青岛海信宽带多媒体技术有限公司 | Optical sub-module and optical module |
| CN112578508A (en) * | 2019-09-29 | 2021-03-30 | 苏州旭创科技有限公司 | Optical module |
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| CN102356523A (en) * | 2009-03-18 | 2012-02-15 | 古河电气工业株式会社 | Semiconductor laser module and optical module |
| CN102360106A (en) * | 2011-10-31 | 2012-02-22 | 索尔思光电（成都）有限公司 | Single-fiber bidirectional transceiving module and package thereof |
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| US20030044128A1 (en) * | 2001-08-29 | 2003-03-06 | Crane Stanford W. | Optoelectronic packaging assembly |
| US7364374B2 (en) * | 2006-09-21 | 2008-04-29 | Truelight Corporation | Bi-directional optical signal transmitting and receiving device |
| CN201004104Y (en) * | 2006-12-05 | 2008-01-09 | 深圳新飞通光电子技术有限公司 | Small cooling light radiation component |
| CN201314960Y (en) * | 2008-09-19 | 2009-09-23 | 飞康技术(深圳)有限公司 | Single-fiber bidirectional two-port component device |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104410773A (en) * | 2014-11-04 | 2015-03-11 | 深圳市豪恩汽车电子装备有限公司 | Car reversing image pick-up device and manufacturing method thereof |
| CN104410773B (en) * | 2014-11-04 | 2018-06-22 | 深圳市豪恩汽车电子装备股份有限公司 | Car reversing image pickup device and its manufacturing method |
| CN106842432A (en) * | 2017-02-21 | 2017-06-13 | 郑州大学 | A kind of novel optical fiber array and preparation method thereof |
| CN107219596A (en) * | 2017-08-04 | 2017-09-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical secondary module and optical module |
| CN107219596B (en) * | 2017-08-04 | 2019-04-05 | 青岛海信宽带多媒体技术有限公司 | A kind of optical secondary module and optical module |
| CN107567202A (en) * | 2017-08-28 | 2018-01-09 | 广东小天才科技有限公司 | Circuit board assemblies and its manufacture method |
| WO2020125646A1 (en) * | 2018-12-17 | 2020-06-25 | 青岛海信宽带多媒体技术有限公司 | Optical sub-module and optical module |
| US11828993B2 (en) | 2018-12-17 | 2023-11-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical sub-module and optical module |
| CN112578508A (en) * | 2019-09-29 | 2021-03-30 | 苏州旭创科技有限公司 | Optical module |
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| Publication number | Publication date |
|---|---|
| CN104020536B (en) | 2018-10-19 |
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Address after: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Patentee after: Ona Technology (Shenzhen) Group Co.,Ltd. Address before: 518118 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Patentee before: O-NET COMMUNICATIONS (SHENZHEN) Ltd. |
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