CN107219596A - A kind of optical secondary module and optical module - Google Patents
A kind of optical secondary module and optical module Download PDFInfo
- Publication number
- CN107219596A CN107219596A CN201710660659.3A CN201710660659A CN107219596A CN 107219596 A CN107219596 A CN 107219596A CN 201710660659 A CN201710660659 A CN 201710660659A CN 107219596 A CN107219596 A CN 107219596A
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- Prior art keywords
- optical
- side wall
- housing
- supporting plate
- cover plate
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The application discloses a kind of optical secondary module and a kind of optical module in fact.Optical secondary module includes housing, cover plate, optical assembly, flexible board and optical window, housing includes a bottom surface and four side walls perpendicular to the bottom surface, the inner surface setting height identical supporting plate of wall in side, the height of one of side wall is identical with the height of supporting plate, the height of the other three side wall is more than the height of the supporting plate, and cover plate is tightly connected with supporting plate.Flexible board provides electrical connection for optical assembly, and optical assembly realizes light connects by optical window and outside.The application is when encapsulating this optical secondary module, and after cover plate is covered on supporting plate, adhesive is solidified for the gluing on the supporting plate of higher side wall.The hot-air produced in adhesive solidification process will be discharged in the gap between relatively low side wall and cover plate.Therefore, the active force of enclosure interior hot-air will not have a negative impact to the fixation of cover plate, so that it is guaranteed that the airtight performance of optical secondary module.
Description
Technical field
The application is related to optical communication technology field, more particularly to a kind of optical secondary module and optical module.
Background technology
Optical module is to realize opto-electronic conversion or the important devices of electro-optic conversion in optical fiber telecommunications system, it may include light-receiving
Module, light emission secondary module or the integrated module of optical transceiver.Optical assembly is one of core component of optical secondary module, and Fig. 1 is one
Plant typical 40G/100G TOSA (light emission secondary module) light path schematic diagram.As seen from Figure 1, the light in light emission secondary module
Component is included comprising 4 lasers successively from light transmitting terminal, 4 collimation lenses corresponding with laser difference, by 4 tunnel light compositings
The light multiplexing component of 1 road light and 1 condenser lens.Pcb board outside light emission secondary module can be connected by flexible board to swash
Light device, and control laser to launch optical signal, the lens array that this optical signal is constituted along other optical elements beyond laser
Biographies are broadcast, and external optical fiber is transferred to eventually through fiber adapter, so as to realize that electric light changes.
At present, optical network communication equipment (such as convergence switch, core router, Digital Subscriber Line are applied to optical module more
Road couple in multiplexer DSLAM and optical line terminal OLT etc.), the external environment residing for optical network communication equipment can be to optical mode
The opto-electronic conversion performance of block produces considerable influence, therefore, the photoelectric cell in optical module need to be encapsulated in one it is relatively closed
In structure, to reduce the adverse effect of the environmental factors such as humidity, temperature, electromagnetic interference.Fig. 2 is a kind of common TOSA encapsulation
Structural representation.From Figure 2 it can be seen that the encapsulating structure includes the housing 1 that upper surface is opened wide and the cover plate 2 being engaged with housing 1,
The inner side of housing 1 is surrounded by supporting plate 11, and cover plate 2 can be fixed on supporting plate 11, to cover housing 1.Optical assembly in TOSA
It is fixed on by the way of active or passive coupling in cavity of the housing 1 with the formation of cover plate 2, specifically, optical assembly is fixed on chamber
In internal substrate (not shown).Adapter welding base 3 is also respectively provided with two relative side walls of housing 1 and soft
Property plate weld seat 4, be respectively used to fixed adapter and flexible board.Closed optical window 31, TOSA is additionally provided with adapter welding base 3
In optical signal optical fiber can be propagated to by optical window 31.At present, adapter welding base 3 and flexible board welding base 4 are generally with weldering
The mode connect is fixed on housing 1, and cover plate is then fixed on housing 1 in the way of glue envelope or sealing, housing 1, cover plate 2, adaptation
Device welding base 3 and flexible board welding base 4 together form a closed encapsulating structure so that optical assembly can be in the outer of complexity
Worked under portion's environment long-term normal table.
The glue of cover plate 2 seals process：One layer of adhesive is first coated on supporting plate 11, cover plate 2 is covered in and scribbles glue
On the supporting plate 11 of glutinous agent, injecting glue in the gap after pressing again between the side wall and the side wall of housing 1 of cover plate 2 finally, passes through high temperature
The mode of heating, solidifies the adhesive of liquid, so that cover plate 2 to be fixed on to the upper surface of housing 1, and forms close with housing 1
Closed chamber body.But, adhesive solidify during, the easy expanded by heating of air of inside cavity so that cover plate 2 simultaneously by
The bonding force of the upward thrust of hot-air and adhesive, bonding force of the adhesive before being fully cured is weaker, so, allows for
Cover plate 2 is easy to, by the air pressure jack-up of hot inside air, influence TOSA airtight performance.
The content of the invention
This application provides a kind of optical secondary module and optical module, cover sidewall is caused with the hot setting for solving adhesive
Unstable technical problem is bonded with housing sidewall.
In a first aspect, the application provides a kind of optical secondary module, the optical secondary module includes：
Housing, it includes a bottom surface and four side walls perpendicular to the bottom surface, is provided with the inner surface of the side wall
Height identical supporting plate, the height of one of side wall of the housing is identical with the height of the supporting plate, the other three side wall
Height be more than the supporting plate height；
Optical assembly, it is arranged in the enclosure interior；
Flexible board, its one end is connected with the optical assembly, and the other end is arranged on the outside of the housing, the flexible board
It is tightly connected with the side wall of the housing；
Optical window, it is arranged on the wall of side, and the optical assembly can pass through the optical window and external fiber communicating optical signals；
Cover plate, it is tightly connected with the supporting plate.
Second aspect, present invention also provides a kind of optical module, the optical module includes above-mentioned optical secondary module.
The application's has the beneficial effect that：
The optical secondary module that the application is provided includes housing, cover plate, optical assembly, flexible board and optical window, wherein, housing bag
A bottom surface and four side walls perpendicular to the bottom surface are included, in the inner surface setting height identical supporting plate of the side wall, its
In a side wall height it is identical with the height of the supporting plate, the height of the other three side wall is more than the height of the supporting plate, lid
Plate is tightly connected with the supporting plate.Flexible board provides electrical connection for optical assembly, and optical assembly realizes light connects by optical window and outside.
In the application, the height of one side wall of housing is identical with the height of the supporting plate, and the height of the other three side wall is more than the support
The height of plate.When encapsulating this optical secondary module, the gluing on the supporting plate of higher side wall, after cover plate is covered on supporting plate,
Adhesive is solidified.The hot-air produced in adhesive solidification process will be arranged in the gap between relatively low side wall and cover plate
Go out.Therefore, the active force of enclosure interior hot-air will not have a negative impact to the fixation of cover sidewall, so that it is guaranteed that cover plate side
The bond properties of wall and housing sidewall.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme of the application, letter will be made to the required accompanying drawing used in embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without having to pay creative labor,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of typical 40G/100G TOSA light path schematic diagram；
Fig. 2 is a kind of common TOSA encapsulating structure schematic diagram；
A kind of fractionation structural representation for optical secondary module that Fig. 3 provides for the embodiment of the present application；
A kind of encapsulating structure schematic diagram for optical secondary module that Fig. 4 provides for the embodiment of the present application；
A kind of top view for housing that Fig. 5 provides for the embodiment of the present application；
A kind of method flow diagram of the method for packing for optical secondary module that Fig. 6 provides for the embodiment of the present application.
Embodiment
For in adhesive solidification process, the easy expanded by heating of air of inside cavity so that cover plate 2 is easily by internal warm
Air jack-up, and the technical problem of optical module airtight performance is influenceed, present applicant proposes a kind of optical secondary module, its core concept
It is：By the difference in height between the one of side wall of housing 1 and other three side walls, one one is constituted in the upper surface of housing 1
The U-shape structure of face opening.When encapsulating this optical secondary module, can on the supporting plate 11 of above three side wall gluing, cover plate 2 is covered
Close after the upper surface of housing 1, adhesive is solidified.The hot-air produced in adhesive solidification process will be from another side
Discharged in gap between wall and cover plate 2.Therefore, the active force of the hot inside air of housing 1 will not be produced not to the fixed of cover plate 2
Profit influence, so that it is guaranteed that the airtight performance of optical secondary module.
Referring to Fig. 3 to Fig. 5, shown is respectively that a kind of fractionation structure for optical secondary module that the embodiment of the present application one is provided is shown
It is intended to, a kind of encapsulating structure schematic diagram for optical secondary module that the embodiment of the present application one is provided and the embodiment of the present application one are provided
A kind of housing top view.As shown in Figures 3 to 5, the present embodiment provides a kind of optical secondary module, including：Housing 1, cover plate
2nd, optical assembly 5, flexible board 6 and optical window 7, wherein, flexible board 6 and optical window 7 are separately positioned on two ends relative on housing 1, light
Component 5 is arranged in the inside of housing 1, and cover plate 2 is covered on supporting plate 11, and the encapsulating structure of closure is constituted with housing 1.The present embodiment
In, optical secondary module can be light-receiving secondary module, or light emission secondary module.Certainly, it is flexible in the application other embodiment
Plate 6 and optical window 7 can also be arranged on two adjacent side walls of housing 1 according to the actual requirements.
Housing 1 includes a bottom surface and four side walls perpendicular to the bottom surface, and height is provided with the inner surface of the side wall
Identical supporting plate 11 is spent, the height of one of side wall of the housing 1 is identical with the height of the supporting plate 11, the housing 1
The other three side wall height be more than the supporting plate 11 height.Supporting plate 11 can be structure as a whole with side wall, actual product
It is middle possibly visually substantially to distinguish supporting plate and side wall, specifically, the part of support cover plate is supporting plate, non-support cover plate
Part is side wall.In the present embodiment, the inner surface of at least one group relative two side wall is provided with supporting plate 11, and the height of supporting plate 11
It is identical, covered so that cover plate 2 is firm in the presence of adhesive on supporting plate 11.In the present embodiment, four side walls of housing 1
And the common U-shape structure that an one side opening is constituted in the upper surface of housing 1 of supporting plate 11, the face of opening is height in four side walls
The relatively low face of degree.
In the present embodiment, housing 1 is rectangular parallelepiped structure, and optical assembly 5 is arranged in the inside of cuboid housing 1.Optical secondary
Block may include the optical elements, the above such as laser (and/or photo-detector), collimation lens, light multiplexing component and condenser lens
Optical element is arranged in inside housing 1 with order in the predetermined direction according to optical secondary module function and the difference of type.
There is the opto-electronic conversion of photoelectric converting function or the optical element of electro-optic conversion function for optical assembly 5 in optical assembly 5
End.For example, in light emission secondary module, the opto-electronic conversion end of optical assembly 5 is laser, and laser is connected with outside pcb board, and
Pcb board transmission electric signal is converted into optical signal, this optical signal is transmitted to external fiber along other optical elements；In light-receiving
In secondary module, the opto-electronic conversion end of optical assembly 5 is photo-detector, and the optical signal of external fiber input passes through other in optical assembly 5
Optical element is transmitted to photo-detector, and the optical signal received is converted into electric signal by photo-detector, and by this electric signal transmission
To pcb board.It can be seen from the conversion of above signal and transmitting procedure, the optical element at the two ends of optical assembly 5 needs and outer member
Communication, therefore, two relative side walls are also respectively fixed with the width of housing 1 (perpendicular to the direction of propagation of optical signal)
The connection member of optical assembly 5 and outer member.
Flexible board 6 can realize the communication of pcb board and optical assembly 5 as the connection member of optical assembly 5 and pcb board.It is flexible
One end of plate 6 is connected with outside pcb board, and the side wall of the other end through housing 1 is connected with optical assembly 5, is specially and optical assembly 5
Opto-electronic conversion end be connected, and be tightly connected with the intersection of housing 1, to ensure the seal of optical secondary module.
Optical window 7 is the sheet glass allowed light through, in order to strengthen the transmission of optical window 7, prevents light reflex from influenceing light
The performance of conversion element, generally tilts a predetermined angle (being usually 8 degree) by sheet glass, and the surface of sheet glass plates correspondence
The anti-reflection film of wavelength.Optical window 7 is generally disposed at the side relative with flexible board 6 as optical assembly 5 and the communication component of external fiber
On wall, optical assembly 5 can pass through the optical window and external fiber communicating optical signals.
In addition, in the present embodiment, cover plate 2 is the cuboid metallic plate matched with housing 1, the length and width of cover plate 2
It is slightly less than the distance between corresponding side wall of housing 1, enables to be embedded in inside housing 1, and covers in the upper surface of supporting plate 11.
Cover plate 2 needs to be tightly connected with housing 1, to ensure the seal of optical secondary module.In order to simplify the processing work of optical secondary module
Skill, saves the processing cost of optical secondary module, and cover plate 2 is connected by the present embodiment by adhesive with housing 1.Further,
The lower surface of cover plate 2 can be connected by adhesive with supporting plate 11, and the side wall of cover plate 2 can pass through adhesive and the side wall of housing 1
Upper edge is connected.More than by way of double-deck gluing, the seal of optical secondary module can be strengthened.
At present, optical secondary module is more and more extensive in the field of data transmission application of data center, and its working environment is compared
The working environment transmitted in traditional mobile communication is well a lot, and therefore, the sealing to optical element in optical secondary module will
Ask and also declined, the anti-aqueous vapor performance of some optical elements itself also increases in addition so that light is sealed using adhesive
Learning the encapsulation technology of secondary module becomes possibility.The structure for the optical secondary module that the application is proposed based on embodiment one there is provided
A kind of utilization adhesive seals the method for packing of optical assembly.Referring to Fig. 6, a kind of optics of the offer of the embodiment of the present application one is shown
The method flow diagram of secondary module method for packing.As shown in fig. 6, this method includes：
Step S100：Optical assembly 5 is arranged in the inside of housing 1 according to preset order.
For example, in common light emission secondary module, optical assembly 5 can be followed successively by sharp from the distributing order at opto-electronic conversion end
Light device, collimation lens, light multiplexing component and condenser lens；In common light-receiving secondary module, optical assembly 5 is from opto-electronic conversion
The distributing order at end can be followed successively by photo-detector and lens subassembly etc..
Step S200：One end of flexible board 6 is connected with optical assembly 5, the other end is arranged on the outside of the housing 1,
And be tightly connected the side wall of flexible board 6 and housing 1.
Step S300：One layer of adhesive is coated on supporting plate 11 of the height less than side wall, cover plate 2 is covered in supporting plate 11
On, using the mode of high-temperature heating, the adhesive being coated on the supporting plate 11 is solidified.
The use of adhesive can be the metal glue, ultraviolet solid using cyanacrylate as main component in the present embodiment
Change glue and other are capable of the glue of binding metal material.The metal glue coated on to optical secondary block assembly solidifies
When, generally the good optical secondary block assembly of direct-assembling or members are put into heater box and be heated at high temperature, makes liquid
The metal glue of state is converted into solid-state；When solidifying to uv-curable glue, it usually needs first pass through the side of ultraviolet light
Formula carries out precuring, and a positioning action is played to the component in optical secondary module.Adhesive bonding force after precuring is not strong,
If the uncomfortable situation of connection occurs in the component being now connected with each other, it can adjust in time, to improve optical secondary module each group
The precision of part assembling.After adhesive precuring, in addition it is also necessary to be heated at high temperature, to improve the bonding force of adhesive, so that
Ensure the sealing effectiveness of optical secondary module.
Step S400：To the cover plate 2 side wall and the housing 1 side wall between inject gluing in the gap that is formed
Agent, using the mode of high-temperature heating, the adhesive for injecting the gap is solidified.
Step S500：It is equal to height in the gap formed between the supporting plate 11 of side wall and the lower surface of cover plate 2 and injects gluing
Agent, using the mode of high-temperature heating, the adhesive for injecting the gap is solidified.
The present embodiment is by the difference in height between the one of side wall of housing 1 and other three side walls, in the upper end of housing 1
Face constitutes the U-shape structure of an one side opening.When encapsulating this optical secondary module, it can be applied on the supporting plate 11 of above three side wall
Glue, cover plate 2 is covered after supporting plate 11, adhesive is solidified.The hot-air produced in adhesive solidification process will be from addition
Discharged in gap between one side wall and cover plate 2.After treating that the adhesive on the wall of above three side is fully cured, then use gluing
Agent blocks the gap on another side wall (i.e. the opening surface of U-shape structure) and solidification.Now, cover plate 2 has phase with housing 1
When the bonding force of intensity, therefore, the active force of the hot inside air of housing 1 will not have a negative impact to the fixation of cover plate 2, so that
Ensure the airtight performance of optical secondary module.
Flexible board 6 can be fixed on housing 1 by the application according to traditional welding packaged type by flexible board welding base
On, to realize the connection of pcb board and optical assembly 5.But, because laser or photo-detector are first for the higher optics of precision
Part, it is easy to influenceed by external environment, the welding process of flexible board welding base and housing 1 is easily caused its aspect of performance
Deterioration.Therefore, the present embodiment sets a perforate 12 on the side wall of housing 1, and the perforate 12 is usually rectangle or strip
Perforate, can be arranged on any one side wall of housing 1.But under normal circumstances, flexible board 6 and optical window 7 are separately positioned on shell
On two relative side walls of body 1, it is contemplated that the arrangement of optical assembly 5 needs certain space, and therefore, the present embodiment can be by perforate 12
Housing 1 is arranged on the side wall of the arragement direction of optical assembly 5, and the position of perforate 12 turns with the photoelectricity of optical assembly 5
The position for changing end is corresponding, enables flexible board 6 through perforate 12 and extends to the inside of the housing 1, and with inside housing 1
The opto-electronic conversion end of optical assembly 5 is connected, and the other end stays in the outside of housing 1, so as to when optical secondary module is applied, with PCB
Plate is connected.
In order to avoid the optical element of high precision reduces performance, the present embodiment fixing flexible by the way of glue envelope
Injecting glue enters adhesive at plate 6, i.e., the gap between flexible board 6 and perforate 12, and utilizes the side of heating or ultraviolet irradiation
Formula, the adhesive for injecting the gap is solidified, flexible board 6 is sealed in into optical secondary with one end that optical assembly 5 is connected
The enclosure interior of block, so that it is guaranteed that the seal of optical secondary module.
In the application, any one side wall of housing 1 could be arranged to highly relatively low side wall, but for the ease of envelope
Highly relatively low side wall is arranged on the side wall at flexible board 6 or the place of optical window 7 by dress, the present embodiment.Because optical window 7 is generally set
Inside adapter welding base 3, and the volume of adapter welding base 3 is larger, and the set location of its top is usually above flexibility
The set location of plate 6, therefore, in order to the space that the transmission light signal reservations for optical window 7 are enough, without influenceing optical signal
In laser propagation effect, the application preferred embodiment, on the side wall that highly relatively low side wall can be arranged on to the place of flexible board 6.
Under normal circumstances, the size of cover plate 2 and housing 1 matches, therefore, during encapsulating optical secondary module, and cover plate 2 will be complete
Cover above housing 1 highly relatively low side wall so that the injecting glue position in the gap formed therebetween is difficult to after control, injecting glue
Packaging effect be difficult to ensure that.
Based on above reason, in the present embodiment, the length of cover plate is less than the distance between two opposite side walls, wherein, one
Side wall be and supporting plate height identical side wall.In the present embodiment, the side wall where flexible board 6 is provided with supporting plate 11, and
The length of cover plate 2 is less than the length of housing 1.When assembling cover plate 2, cover plate 2 is fixed along the position close to optical window, due to cover plate
2 length is smaller, and a ledge structure can be formed in the supporting plate 11 of the place side wall of flexible board 6 and the intersection of cover plate 2, to lid
When plate 2 carries out glue envelope, injecting glue and it can solidify into the gap formed between cover plate 2 and supporting plate 11 along this ledge structure, can
So that adhesive is more smoothly flowed into gap；Or, along this ledge structure dispensing, adhesive is flow to along ledge structure
The upper surface of supporting plate 11, so as to block the gap formed between cover plate 2 and supporting plate 11, second of glue envelope mode is conducive to improving close
Close effect and quality inspection effect.Certainly, in the application other embodiment, highly relatively low side wall can also be arranged on and flexible board 6
On the side wall that the side wall at place is connected, in this case, the width of cover plate 2 should be less than the width of housing 1.
In order to further improve in the operability of injecting glue, the embodiment of the present application, the thickness of cover plate 2 is more than higher three
The height difference of side wall and supporting plate 11.Specifically, in the present embodiment, above three side wall is in addition to side wall where flexible board
Three side walls.When cover plate 2 is covered on supporting plate 11, if the face on the basis of level ground, cover plate 2 is higher than housing 1, cover plate 2
The upper surface of side wall and the above three side wall of housing 1 can form a ledge structure., can edge when carrying out glue envelope to cover plate 2
This ledge structure injecting glue into the gap formed between the side wall and the side wall of housing 1 of cover plate 2, enables to adhesive more suitable
In the inflow gap of profit, so as to further improve packaging efficiency.
In order to ensure the sealing of optical secondary module, the leak detection test implemented to housing 1 is essential.Leak detection test
Device is usually microscope, whether there is obvious through hole by the adhesive under micro- sem observation curdled appearance, you can judge optics
The seal degree of secondary module.However, the gap between the side wall of cover plate 2 and the side wall of housing 1 is relatively small, seen by microscope
The tool of the through hole in the gap is surveyed to acquire a certain degree of difficulty.Therefore, the present embodiment can also along this ledge structure dispensing, adhesive along
Ledge structure flow to the upper surface of side wall, so as to block the gap formed between cover plate 2 and supporting plate 11.By way of this glue envelope
The gap of closure, microscope is readily observed the morphological feature of the adhesive overflowed in gap, so that simplify leakage detecting process, drop
Low leak detection difficulty.
In addition, the processing mode of the present embodiment housing 1 is machining, and compared with conventional die sinking processing mode, machinery
The mode of processing advantageously reduces the processing cost of housing 1, and improves the flexibility of shell structure design.In addition, tradition is opened
Molding makes the mode of housing, and its dimensional tolerance is generally in 100um or so, and the mode being machined can meet housing encapsulation
Simultaneously, the dimensional tolerance of housing can be controlled within 20um for technical requirements, so as to improve the machining accuracy of housing 1.
The application also provides a kind of optical module, and the optical module includes the optical secondary module described in above example.
Between the embodiment of each in this specification identical similar part mutually referring to.Invention described above is real
The mode of applying is not intended to limit the scope of the present invention..
Claims (6)
1. a kind of optical secondary module, it is characterised in that the optical secondary module includes：
Housing, it includes a bottom surface and four side walls perpendicular to the bottom surface, and height is provided with the inner surface of the side wall
Identical supporting plate, the height of one of side wall of the housing is identical with the height of the supporting plate, the height of the other three side wall
Height of the degree more than the supporting plate；
Optical assembly, it is arranged in the enclosure interior；
Flexible board, its one end is connected with the optical assembly, and the other end is arranged on the outside of the housing, the flexible board and institute
The side wall for stating housing is tightly connected；
Optical window, it is arranged on the side wall, and the optical assembly can pass through the optical window and external fiber communicating optical signals；
Cover plate, it is tightly connected with the supporting plate.
2. optical secondary module as claimed in claim 1, it is characterised in that the thickness of the cover plate is more than the other three side
The height difference of wall and the supporting plate.
3. optical secondary module as claimed in claim 1, it is characterised in that perforate, the flexible board are additionally provided with the side wall
The perforate can be passed through and extend to the inside of the housing, the side wall phase that the flexible board passes through adhesive and the housing
Connection.
4. optical secondary module as claimed in claim 1, it is characterised in that the length of the cover plate is less than between two opposite side walls
Distance, one of side wall be and supporting plate height identical side wall.
5. optical secondary module as claimed in claim 2, it is characterised in that the lower surface of the cover plate by adhesive with it is described
Supporting plate is connected, and the side wall of the cover plate is connected by adhesive with the upper edge of the housing sidewall.
6. a kind of optical module, it is characterised in that the optical module includes the optical secondary module as described in claim 1-5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710660659.3A CN107219596B (en) | 2017-08-04 | 2017-08-04 | A kind of optical secondary module and optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710660659.3A CN107219596B (en) | 2017-08-04 | 2017-08-04 | A kind of optical secondary module and optical module |
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| CN107219596A true CN107219596A (en) | 2017-09-29 |
| CN107219596B CN107219596B (en) | 2019-04-05 |
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| CN117082794A (en) * | 2023-10-13 | 2023-11-17 | 苏州熹联光芯微电子科技有限公司 | Protective structure, preparation method thereof and optical communication module |
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