CN107219596B - A kind of optical secondary module and optical module - Google Patents
A kind of optical secondary module and optical module Download PDFInfo
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- CN107219596B CN107219596B CN201710660659.3A CN201710660659A CN107219596B CN 107219596 B CN107219596 B CN 107219596B CN 201710660659 A CN201710660659 A CN 201710660659A CN 107219596 B CN107219596 B CN 107219596B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The application discloses a kind of optical secondary module and a kind of optical module in fact.Optical secondary module includes shell, cover board, optical assembly, flexible board and optical window, shell includes a bottom surface and four side walls perpendicular to the bottom surface, in the identical supporting plate of inner surface setting height of side wall, the height of one of side wall and the height of supporting plate are identical, the height of the other three side wall is greater than the height of the supporting plate, and cover board and supporting plate are tightly connected.Flexible board provides electrical connection for optical assembly, and optical assembly passes through optical window and external realization light connects.The application is when encapsulating this optical secondary module, the gluing on the supporting plate of higher side wall, and after cover plate lid is closed on supporting plate, adhesive is solidified.The hot-air generated in adhesive solidification process will be discharged from the gap between lower side wall and cover board.Therefore, the active force of enclosure interior hot-air will not have an adverse effect to the fixation of cover board, so that it is guaranteed that the airtight performance of optical secondary module.
Description
Technical field
This application involves optical communication technology field more particularly to a kind of optical secondary modules and optical module.
Background technique
Optical module is the important devices that photoelectric conversion or electro-optic conversion are realized in optical fiber telecommunications system, it may include light-receiving
Module, light emitting secondary module or the integrated module of optical transceiver.Optical assembly is one of core component of optical secondary module, and Fig. 1 is one
The light path schematic diagram of the TOSA (light emitting secondary module) of the typical 40G/100G of kind.As seen from Figure 1, the light in light emitting secondary module
Component successively includes comprising 4 lasers, 4 collimation lenses corresponding with laser, by 4 tunnel photosynthesis from light emitting end
The light multiplexing component of 1 road light and 1 condenser lens.Pcb board outside light emitting secondary module can be connected by flexible board to swash
Light device, and control laser transmitting optical signal, the lens array that this optical signal is formed along other optical elements other than laser
Biographies are broadcast, and are transferred to external optical fiber eventually by fiber adapter, to realize that electric light changes.
Currently, optical module is applied to optical network communication equipment (such as convergence switch, core router, Digital Subscriber Line more
Road couple in multiplexer DSLAM and optical line terminal OLT etc.), external environment locating for optical network communication equipment can be to optical mode
The photoelectric conversion performance of block produces bigger effect, therefore, the photoelectric cell in optical module need to be encapsulated in one it is relatively closed
In structure, to reduce the adverse effect of the environmental factors such as humidity, temperature, electromagnetic interference.Fig. 2 is the encapsulation of common TOSA a kind of
Structural schematic diagram.From Figure 2 it can be seen that the encapsulating structure includes the open shell 1 in upper surface and the cover board 2 that matches with shell 1,
The inside of shell 1 is surrounded by supporting plate 11, and cover board 2 can be fixed on supporting plate 11, closes shell 1 with lid.Optical assembly in TOSA
It is fixed on by the way of active or passive coupling in the cavity that shell 1 and cover board 2 are formed, specifically, optical assembly is fixed on chamber
In intracorporal substrate (not shown).Adapter welding base 3 and soft is also respectively provided in the opposite two side walls of shell 1
Property plate welding base 4, is respectively used to fixed adapter and flexible board.Closed optical window 31, TOSA is additionally provided in adapter welding base 3
In optical signal can propagate to optical fiber by optical window 31.Currently, adapter welding base 3 and flexible board welding base 4 are usually with weldering
The mode connect is fixed on shell 1, and cover board is then fixed on shell 1 in a manner of glue envelope or sealing, shell 1, cover board 2, adaptation
Device welding base 3 and flexible board welding base 4 together form a closed encapsulating structure, enable optical assembly in the outer of complexity
It works to long-term normal table under portion's environment.
The glue envelope process of cover board 2 is usual are as follows: first coats one layer of adhesive on supporting plate 11, cover board 2 is covered on and is coated with glue
On the supporting plate 11 of glutinous agent, injecting glue in the gap between 1 side wall of the side wall of cover board 2 and shell again after pressing, finally, passing through high temperature
The mode of heating solidifies the adhesive of liquid, so that cover board 2 to be fixed on to the upper surface of shell 1, and is formed with shell 1 close
Closed chamber body.But during adhesive is cured, the air of inside cavity is easy expanded by heating so that cover board 2 simultaneously by
The bonding force of hot-air upward thrust and adhesive, bonding force of the adhesive before being fully cured is weaker, in this way, allowing for
Cover board 2 is easy to be jacked up by the air pressure of hot inside air, influences the airtight performance of TOSA.
Summary of the invention
This application provides a kind of optical secondary module and optical modules, lead to cover sidewall to solve the hot setting of adhesive
Unstable technical problem is bonded with housing sidewall.
In a first aspect, the application provides a kind of optical secondary module, the optical secondary module includes:
Shell a comprising bottom surface and four side walls perpendicular to the bottom surface are equipped in the inner surface of the side wall
The height of highly identical supporting plate, one of side wall of the shell is identical as the height of the supporting plate, the other three side wall
Height be greater than the supporting plate height；
Optical assembly is arranged in the enclosure interior；
Flexible board, one end are connected with the optical assembly, and the outside of the shell, the flexible board is arranged in the other end
It is tightly connected with the side wall of the shell；
Optical window is set on side wall, and the optical assembly can pass through the optical window and external fiber communicating optical signals；
Cover board is tightly connected with the supporting plate.
Second aspect, present invention also provides a kind of optical module, the optical module includes above-mentioned optical secondary module.
The application's has the beneficial effect that:
Optical secondary module provided by the present application includes shell, cover board, optical assembly, flexible board and optical window, wherein shell packet
A bottom surface and four side walls perpendicular to the bottom surface are included, the identical supporting plate of height is set in the inner surface of the side wall,
In a side wall height it is identical as the height of the supporting plate, the height of the other three side wall is greater than the height of the supporting plate, lid
Plate and the supporting plate are tightly connected.Flexible board provides electrical connection for optical assembly, and optical assembly passes through optical window and external realization light connects.
In the application, the height of one side wall of shell is identical as the height of the supporting plate, and the height of the other three side wall is greater than the support
The height of plate.When encapsulating this optical secondary module, the gluing on the supporting plate of higher side wall, after cover plate lid is closed on supporting plate,
Adhesive is solidified.The hot-air generated in adhesive solidification process will be arranged from the gap between lower side wall and cover board
Out.Therefore, the active force of enclosure interior hot-air will not have an adverse effect to the fixation of cover sidewall, so that it is guaranteed that cover board side
The bond properties of wall and housing sidewall.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the application, letter will be made to attached drawing needed in the embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without any creative labor,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the light path schematic diagram of the TOSA of typical 40G/100G a kind of；
Fig. 2 is the package structure diagram of common TOSA a kind of；
Fig. 3 is a kind of fractionation structural representation of optical secondary module provided by the embodiments of the present application；
Fig. 4 is a kind of package structure diagram of optical secondary module provided by the embodiments of the present application；
Fig. 5 is a kind of top view of shell provided by the embodiments of the present application；
Fig. 6 is a kind of method flow diagram of the packaging method of optical secondary module provided by the embodiments of the present application.
Specific embodiment
For in adhesive solidification process, the air of inside cavity is easy expanded by heating, so that cover board 2 is easy by internal heat
Air jacks up, and the technical issues of influence optical module airtight performance, present applicant proposes a kind of optical secondary module, core concepts
It is: by the difference in height between the one of side wall of shell 1 and other three side walls, constitutes one one in the upper surface of shell 1
The U-shaped structure of face opening.When encapsulating this optical secondary module, can on the supporting plate 11 of above three side wall gluing, cover board 2 is covered
It closes after the upper surface of shell 1, adhesive is solidified.The hot-air generated in adhesive solidification process will be from another side
It is discharged in gap between wall and cover board 2.Therefore, the active force of 1 hot inside air of shell will not generate not the fixed of cover board 2
Benefit influences, so that it is guaranteed that the airtight performance of optical secondary module.
Referring to Fig. 3 to Fig. 5, shown is respectively that a kind of fractionation structure for optical secondary module that the embodiment of the present application one provides is shown
It is intended to, a kind of package structure diagram for optical secondary module that the embodiment of the present application one provides and the embodiment of the present application one provide
A kind of shell top view.As shown in Figures 3 to 5, the present embodiment provides a kind of optical secondary modules, comprising: shell 1, cover board
2, optical assembly 5, flexible board 6 and optical window 7, wherein flexible board 6 and optical window 7 are separately positioned on both ends opposite on shell 1, light
Component 5 is arranged in the inside of shell 1, and the lid of cover board 2 closes on supporting plate 11, and the encapsulating structure of closure is constituted with shell 1.The present embodiment
In, optical secondary module can be light-receiving secondary module or light emitting secondary module.Certainly, flexible in the application other embodiments
Plate 6 and optical window 7 can also be arranged in the adjacent two side walls of shell 1 according to actual needs.
Shell 1 includes a bottom surface and four side walls perpendicular to the bottom surface, is equipped with height in the inner surface of the side wall
Identical supporting plate 11 is spent, the height of one of side wall of the shell 1 is identical as the height of the supporting plate 11, the shell 1
The other three side wall height be greater than the supporting plate 11 height.Supporting plate 11 can be structure as a whole with side wall, actual product
It is middle possibly visually obviously to distinguish supporting plate and side wall, specifically, the part of support cover board is supporting plate, non-support cover board
Part is side wall.In the present embodiment, the inner surface of the opposite two side walls of at least one group is equipped with supporting plate 11, and 11 height of supporting plate
It is identical, so that the lid that cover board 2 consolidates under the action of adhesive closes on supporting plate 11.In the present embodiment, four side walls of shell 1
And supporting plate 11 constitutes the U-shaped structure of an one side opening, height in the face of opening i.e. four side wall in the upper surface of shell 1 jointly
Spend lower face.
In the present embodiment, shell 1 is rectangular parallelepiped structure, and optical assembly 5 is arranged in the inside of cuboid housing 1.Optical secondary
Block may include the optical elements such as laser (and/or optical detector), collimation lens, light multiplexing component and condenser lens, above
Optical element according to the difference of optical secondary module function and type, in the predetermined direction be sequentially arranged in inside shell 1.
Optical element with photoelectric converting function or electro-optic conversion function in optical assembly 5 is the photoelectric conversion of optical assembly 5
End.For example, the photoelectric conversion end of optical assembly 5 is laser in light emitting secondary module, laser is connected with external pcb board, and
Optical signal is converted by pcb board transmission electric signal, this optical signal is transmitted to external fiber along other optical elements；In light-receiving
In secondary module, the photoelectric conversion end of optical assembly 5 is optical detector, and the optical signal of external fiber input passes through other in optical assembly 5
Optical element is transmitted to optical detector, and the optical signal received is converted electric signal by optical detector, and by this electric signal transmission
To pcb board.According to the conversion of the above signal and transmission process it is found that the optical element at 5 both ends of optical assembly needs and outer member
Communication, therefore, opposite two side walls are also respectively fixed on 1 width direction of shell (perpendicular to the direction of propagation of optical signal)
The connecting component of optical assembly 5 and outer member.
Connecting component of the flexible board 6 as optical assembly 5 and pcb board, can be realized the communication of pcb board Yu optical assembly 5.It is flexible
One end of plate 6 is connected with external pcb board, and the other end is connected across the side wall of shell 1 with optical assembly 5, specially with optical assembly 5
Photoelectric conversion end be connected, and with the intersection of shell 1 be tightly connected, to ensure the airtightness of optical secondary module.
Optical window 7 is the sheet glass allowed light through, in order to enhance the transmission of optical window 7, prevents light reflex from influencing light
Sheet glass is usually tilted a predetermined angle (usually 8 degree) by the performance of conversion element, and the surface of sheet glass plates correspondence
The anti-reflection film of wavelength.Communication component of the optical window 7 as optical assembly 5 and external fiber, is generally disposed at the side opposite with flexible board 6
On wall, optical assembly 5 can pass through the optical window and external fiber communicating optical signals.
In addition, cover board 2 is the cuboid metal plate to match with shell 1, the length and width of cover board 2 in the present embodiment
It is slightly less than the distance between corresponding side wall of shell 1, enables to be embedded in inside shell 1, and covers conjunction in 11 upper surface of supporting plate.
Cover board 2 needs to be tightly connected with shell 1, to ensure the airtightness of optical secondary module.In order to simplify the processing work of optical secondary module
Skill, saves the processing cost of optical secondary module, and cover board 2 is connected by the present embodiment by adhesive with shell 1.Further,
The lower surface of cover board 2 can be connected by adhesive with supporting plate 11, and the side wall of cover board 2 can pass through adhesive and 1 side wall of shell
Upper edge is connected.By way of the above double-deck gluing, the airtightness of optical secondary module can be enhanced.
Currently, optical secondary module data center field of data transmission using more and more extensive, working environment is compared
It is well many in the working environment that traditional mobile communication transmits, therefore, the leakproofness of optical element in optical secondary module is wanted
It asks and is also declined, the anti-aqueous vapor performance of some optical elements itself also increases in addition, so that sealing light using adhesive
The encapsulation technology for learning secondary module becomes possibility.The structure for the optical secondary module that the application is proposed based on embodiment one, provides
A kind of packaging method using adhesive sealing optical assembly.Referring to Fig. 6, it show a kind of optics of the offer of the embodiment of the present application one
The method flow diagram of secondary module packaging method.As shown in fig. 6, this method comprises:
Step S100: optical assembly 5 is arranged in the inside of shell 1 according to preset order.
For example, optical assembly 5 can be followed successively by sharp from the distributing order at photoelectric conversion end in common light emitting secondary module
Light device, collimation lens, light multiplexing component and condenser lens；In common light-receiving secondary module, optical assembly 5 is from photoelectric conversion
The distributing order at end can be followed successively by optical detector and lens subassembly etc..
Step S200: one end of flexible board 6 is connected with optical assembly 5, and the outside of the shell 1 is arranged in the other end,
And the side wall of flexible board 6 and shell 1 is tightly connected.
Step S300: coating one layer of adhesive on supporting plate 11 of the height lower than side wall, and the lid of cover board 2 is closed in supporting plate 11
On, in the way of high-temperature heating, the adhesive on the supporting plate 11 will be coated in and solidified.
It can be for cyanacrylate metal glue as main component, ultraviolet solid using adhesive in the present embodiment
Change glue and other are capable of the glue of binding metal material.The metal glue coated on to optical secondary block assembly solidifies
When, usually the good optical secondary block assembly of direct-assembling or members are put into heater box and are heated at high temperature, makes liquid
The metal glue of state is converted into solid-state；When solidifying to uv-curable glue, it usually needs first pass through the side of ultraviolet light
Formula carries out precuring, plays a positioning action to the component in optical secondary module.Adhesive bonding force after precuring is not strong,
At this time if the uncomfortable situation of connection occurs in component interconnected, can adjust in time, to improve optical secondary module each group
The precision of part assembling.After adhesive precuring, it is also necessary to it is heated at high temperature, to improve the bonding force of adhesive, thus
Ensure the sealing effect of optical secondary module.
Gluing is injected in the gap formed between the side wall of S400: Xiang Suoshu cover board 2 of step and the side wall of the shell 1
Agent is solidified the adhesive for injecting the gap in the way of high-temperature heating.
Step S500: it is equal in the gap formed between 2 lower surface of supporting plate 11 and cover board of side wall to height and injects gluing
Agent is solidified the adhesive for injecting the gap in the way of high-temperature heating.
The present embodiment is by the difference in height between the one of side wall of shell 1 and other three side walls, in the upper end of shell 1
Face constitutes the U-shaped structure of an one side opening.When encapsulating this optical secondary module, it can be applied on the supporting plate 11 of above three side wall
The lid of cover board 2 is closed after supporting plate 11, adhesive is solidified by glue.The hot-air generated in adhesive solidification process will be from addition
It is discharged in gap between one side wall and cover board 2.Gluing is fully cured and then used to the adhesive on above three side wall
Agent blocks the gap on another side wall (i.e. the opening face of U-shaped structure) and solidification.At this point, cover board 2 has had phase with shell 1
When the bonding force of intensity, therefore, the active force of 1 hot inside air of shell will not have an adverse effect to the fixation of cover board 2, thus
Ensure the airtight performance of optical secondary module.
Flexible board 6 can be fixed on shell 1 by flexible board welding base according to traditional welding packaged type by the application
On, to realize the connection of pcb board Yu optical assembly 5.But since laser or optical detector are the higher optics member of precision
Part, it is easy to be influenced by external environment, the welding process of flexible board welding base and shell 1 is easy to cause its aspect of performance
Deterioration.Therefore, an aperture 12 is arranged in the present embodiment on the side wall of shell 1, which is usually rectangle or strip
Aperture can be set on any one side wall of shell 1.But under normal conditions, flexible board 6 and optical window 7 are separately positioned on shell
In the opposite two side walls of body 1, it is contemplated that the arrangement of optical assembly 5 needs certain space, and therefore, the present embodiment can be by aperture 12
Shell 1 is set perpendicular on the side wall of 5 arragement direction of optical assembly, and the position of aperture 12 and 5 photoelectricity of optical assembly turn
The position for changing end is corresponding, so that flexible board 6 is passed through aperture 12 and extends to the inside of the shell 1, and with inside shell 1
The photoelectric conversion end of optical assembly 5 is connected, and the other end stays in the outside of shell 1, so as in optical secondary module in application, and PCB
Plate is connected.
In order to avoid the optical element of high precision reduces service performance, the present embodiment is fixed flexible by the way of glue envelope
Plate 6, i.e., injecting glue enters adhesive at the gap between flexible board 6 and aperture 12, and utilizes the side of heating or ultraviolet light irradiation
The adhesive for injecting the gap is solidified, one end that flexible board 6 is connected with optical assembly 5 is sealed in optical secondary by formula
The enclosure interior of block, so that it is guaranteed that the airtightness of optical secondary module.
In the application, any one side wall of shell 1 can be set to a lower height of side wall, but for the ease of envelope
Dress, the present embodiment a lower height of side wall are arranged on the side wall at 7 place of flexible board 6 or optical window.Since optical window 7 is usually arranged
Inside adapter welding base 3, and the volume of adapter welding base 3 is larger, and the setting position of the top is usually above flexibility
The setting position of plate 6, therefore, in order to reserve enough spaces for the transmission optical signal of optical window 7, without influencing optical signal
Laser propagation effect in the application preferred embodiment, a lower height of side wall can be arranged on the side wall where flexible board 6.
Under normal conditions, cover board 2 and the size of shell 1 match, and therefore, when encapsulating optical secondary module, cover board 2 will be complete
Lid closes above a lower height of side wall of shell 1, so that the injecting glue position in the gap formed therebetween is difficult to control, after injecting glue
Packaging effect be difficult to ensure.
Based on the above reasons, in the present embodiment, the length of cover board is less than the distance between two opposite side walls, wherein one
Side wall is identical side wall with the supporting plate height.In the present embodiment, the side wall where flexible board 6 is equipped with supporting plate 11, and
The length of cover board 2 is less than the length of shell 1.When assembling cover board 2, cover board 2 is fixed along the position close to optical window, due to cover board
2 length is smaller, will form a step structure in the supporting plate 11 of 6 place side wall of flexible board and the intersection of cover board 2, to lid
When plate 2 carries out glue envelope, injecting glue and it can solidify along this step structure into the gap formed between cover board 2 and supporting plate 11, it can
So that adhesive more smoothly flows into gap；Alternatively, along this step structure dispensing, adhesive is flow to along step structure
The upper surface of supporting plate 11, to block the gap formed between cover board 2 and supporting plate 11, second of glue envelope mode is conducive to improve close
Close effect and quality inspection effect.Certainly, in the application other embodiments, a lower height of side wall also can be set with flexible board 6
On the side wall that the side wall at place is connected, in this case, the width of cover board 2 should be less than the width of shell 1.
In order to further increase the operability of injecting glue, in the embodiment of the present application, the thickness of cover board 2 is greater than higher three
The height difference of side wall and supporting plate 11.Specifically, above three side wall is in addition to side wall where flexible board in the present embodiment
Three side walls.When the lid of cover board 2 closes on supporting plate 11, if cover board 2 is higher than shell 1, cover board 2 using level ground as benchmark face
Side wall and the upper surface of 1 above three side wall of shell can form a step structure.It, can edge when carrying out glue envelope to cover board 2
This step structure injecting glue into the gap formed between 1 side wall of side wall and shell of cover board 2, enable to adhesive more suitable
In the inflow gap of benefit, to further increase packaging efficiency.
In order to ensure the leakproofness of optical secondary module, the leak detection test implemented to shell 1 is essential.Leak detection test
Device is usually microscope, by the adhesive under micro- sem observation curdled appearance whether there is or not apparent through-hole, that is, can determine whether optics
The seal degree of secondary module.However, the gap between 1 side wall of 2 side wall of cover board and shell be it is relatively small, seen by microscope
The through-hole tool surveyed in the gap acquires a certain degree of difficulty.Therefore, the present embodiment can also along this step structure dispensing, adhesive along
Step structure flow to the upper surface of side wall, to block the gap formed between cover board 2 and supporting plate 11.By way of this glue envelope
The gap of closure, microscope are readily observed the morphological feature of the adhesive overflowed in gap, thus simplify leakage detecting process, drop
Low leak detection difficulty.
In addition, the processing method of the present embodiment shell 1 is machining, it is mechanical compared with commonly die sinking processing method
The mode of processing advantageously reduces the processing cost of shell 1, and improves the flexibility of shell structure design.In addition, tradition is opened
Molding makes the mode of shell, and dimensional tolerance is usually in 100um or so, and the mode being machined can meet shell encapsulation
Simultaneously, the dimensional tolerance of shell can control within 20um for technical requirements, to improve the machining accuracy of shell 1.
The application also provides a kind of optical module, and the optical module includes optical secondary module described in above embodiments.
Same and similar part may refer to each other between each embodiment in this specification.Invention described above is real
The mode of applying is not intended to limit the scope of the present invention..
Claims (5)
1. a kind of optical secondary module, which is characterized in that the optical secondary module includes:
Shell a comprising bottom surface and four side walls perpendicular to the bottom surface are equipped with height in the inner surface of the side wall
The height of identical supporting plate, one of side wall of the shell is identical as the height of the supporting plate, the height of the other three side wall
Degree is greater than the height of the supporting plate；
Optical assembly is arranged in the enclosure interior；
Flexible board, one end are connected with the optical assembly, and the outside of the shell, the flexible board and institute is arranged in the other end
The side wall for stating shell is tightly connected；
Both ends opposite on the housing are respectively set in optical window, the flexible board and the optical window, alternatively, being arranged in the shell
In the adjacent two side walls of body；
The optical assembly can pass through the optical window and external fiber communicating optical signals；
Cover board is tightly connected with the supporting plate, and the length of the cover board is less than the distance between two opposite side walls, one of them
Side wall is identical side wall with the supporting plate height.
2. optical secondary module as described in claim 1, which is characterized in that the thickness of the cover board is greater than the other three side
The height difference of wall and the supporting plate.
3. optical secondary module as described in claim 1, which is characterized in that be additionally provided with aperture, the flexible board on the side wall
The aperture can be passed through and extend to the inside of the shell, the flexible board passes through the side wall phase of adhesive and the shell
Connection.
4. optical secondary module as claimed in claim 2, which is characterized in that the lower surface of the cover board by adhesive with it is described
Supporting plate is connected, and the side wall of the cover board is connected by adhesive with the upper edge of the housing sidewall.
5. a kind of optical module, which is characterized in that the optical module includes the optical secondary module as described in claim 1-4 is any.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710660659.3A CN107219596B (en) | 2017-08-04 | 2017-08-04 | A kind of optical secondary module and optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710660659.3A CN107219596B (en) | 2017-08-04 | 2017-08-04 | A kind of optical secondary module and optical module |
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| CN107219596A CN107219596A (en) | 2017-09-29 |
| CN107219596B true CN107219596B (en) | 2019-04-05 |
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| WO2023050748A1 (en) * | 2021-09-30 | 2023-04-06 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN117082794A (en) * | 2023-10-13 | 2023-11-17 | 苏州熹联光芯微电子科技有限公司 | Protective structure, preparation method thereof and optical communication module |
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| CN104020536A (en) * | 2014-06-09 | 2014-09-03 | 昂纳信息技术（深圳）有限公司 | Method for packaging optical transceiver module |
| CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
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