CN103981486A - 金属遮罩制造方法以及金属遮罩 - Google Patents
金属遮罩制造方法以及金属遮罩 Download PDFInfo
- Publication number
- CN103981486A CN103981486A CN201410210364.2A CN201410210364A CN103981486A CN 103981486 A CN103981486 A CN 103981486A CN 201410210364 A CN201410210364 A CN 201410210364A CN 103981486 A CN103981486 A CN 103981486A
- Authority
- CN
- China
- Prior art keywords
- etching
- metal cover
- depressed part
- vacancy section
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 47
- 239000002184 metal Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 60
- 239000010410 layer Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000011241 protective layer Substances 0.000 claims abstract description 14
- 230000000994 depressogenic effect Effects 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 23
- 239000007921 spray Substances 0.000 claims description 5
- 230000002265 prevention Effects 0.000 abstract 3
- 238000000576 coating method Methods 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 238000004528 spin coating Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- ing And Chemical Polishing (AREA)
- Micromachines (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102144941 | 2013-12-06 | ||
TW102144941A TWI490637B (zh) | 2013-12-06 | 2013-12-06 | 金屬遮罩製造方法以及金屬遮罩 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103981486A true CN103981486A (zh) | 2014-08-13 |
CN103981486B CN103981486B (zh) | 2017-04-12 |
Family
ID=51273654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410210364.2A Active CN103981486B (zh) | 2013-12-06 | 2014-05-19 | 金属遮罩制造方法以及金属遮罩 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9205443B2 (zh) |
CN (1) | CN103981486B (zh) |
TW (1) | TWI490637B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104561896A (zh) * | 2014-12-31 | 2015-04-29 | 昆山国显光电有限公司 | 用于蒸镀的掩膜板及其制作方法 |
CN105720212A (zh) * | 2014-12-17 | 2016-06-29 | 三星显示有限公司 | 沉积用掩模制造方法 |
CN105951040A (zh) * | 2016-05-03 | 2016-09-21 | 上海天马有机发光显示技术有限公司 | 掩膜块、掩膜版及掩膜版的制造方法 |
CN109195312A (zh) * | 2018-09-14 | 2019-01-11 | 江西合力泰科技有限公司 | 补强板及提高补强板蚀刻精度的方法 |
CN113416924A (zh) * | 2021-01-13 | 2021-09-21 | 达运精密工业股份有限公司 | 遮罩、遮罩的制造方法及用于制造遮罩的母模 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102090198B1 (ko) * | 2013-03-29 | 2020-03-18 | 삼성디스플레이 주식회사 | 파인 메탈 마스크 및 그 제조 방법 |
CN103882375B (zh) * | 2014-03-12 | 2016-03-09 | 京东方科技集团股份有限公司 | 一种掩膜板及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005183153A (ja) * | 2003-12-18 | 2005-07-07 | Dainippon Screen Mfg Co Ltd | 蒸着用マスクの製造方法 |
CN101988181A (zh) * | 2009-07-29 | 2011-03-23 | 株式会社日立显示器 | 金属加工方法、金属掩模制造方法以及有机el显示装置制造方法 |
CN102998897A (zh) * | 2011-09-15 | 2013-03-27 | 三星显示有限公司 | 制造掩模的方法 |
CN103205675A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 蒸镀用狭长沟槽掩模板的制备方法 |
CN103205692A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 一种蒸镀用掩模板的加工工艺、返修工艺 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6070185A (ja) * | 1983-09-26 | 1985-04-20 | Toshiba Corp | シヤドウマスクの製造方法 |
-
2013
- 2013-12-06 TW TW102144941A patent/TWI490637B/zh active
-
2014
- 2014-05-19 CN CN201410210364.2A patent/CN103981486B/zh active Active
- 2014-12-05 US US14/561,993 patent/US9205443B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005183153A (ja) * | 2003-12-18 | 2005-07-07 | Dainippon Screen Mfg Co Ltd | 蒸着用マスクの製造方法 |
CN101988181A (zh) * | 2009-07-29 | 2011-03-23 | 株式会社日立显示器 | 金属加工方法、金属掩模制造方法以及有机el显示装置制造方法 |
CN102998897A (zh) * | 2011-09-15 | 2013-03-27 | 三星显示有限公司 | 制造掩模的方法 |
CN103205675A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 蒸镀用狭长沟槽掩模板的制备方法 |
CN103205692A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 一种蒸镀用掩模板的加工工艺、返修工艺 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105720212A (zh) * | 2014-12-17 | 2016-06-29 | 三星显示有限公司 | 沉积用掩模制造方法 |
CN105720212B (zh) * | 2014-12-17 | 2019-07-05 | 三星显示有限公司 | 沉积用掩模制造方法 |
CN104561896A (zh) * | 2014-12-31 | 2015-04-29 | 昆山国显光电有限公司 | 用于蒸镀的掩膜板及其制作方法 |
CN105951040A (zh) * | 2016-05-03 | 2016-09-21 | 上海天马有机发光显示技术有限公司 | 掩膜块、掩膜版及掩膜版的制造方法 |
CN109195312A (zh) * | 2018-09-14 | 2019-01-11 | 江西合力泰科技有限公司 | 补强板及提高补强板蚀刻精度的方法 |
CN109195312B (zh) * | 2018-09-14 | 2024-04-09 | 江西合力泰科技有限公司 | 补强板及提高补强板蚀刻精度的方法 |
CN113416924A (zh) * | 2021-01-13 | 2021-09-21 | 达运精密工业股份有限公司 | 遮罩、遮罩的制造方法及用于制造遮罩的母模 |
CN113416924B (zh) * | 2021-01-13 | 2023-08-22 | 达运精密工业股份有限公司 | 遮罩、遮罩的制造方法及用于制造遮罩的母模 |
Also Published As
Publication number | Publication date |
---|---|
US9205443B2 (en) | 2015-12-08 |
CN103981486B (zh) | 2017-04-12 |
US20150159283A1 (en) | 2015-06-11 |
TWI490637B (zh) | 2015-07-01 |
TW201523127A (zh) | 2015-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: FUXIANG INDUSTRIAL CO., LTD. Free format text: FORMER OWNER: JINGZHI ELECTRONICS CO., LTD. Effective date: 20150209 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150209 Address after: Taiwan District, Taichung City Chinese Minsheng Road 3 Lane 313 No. 45 Applicant after: Fuxiang Industrial Co., Ltd. Address before: Longtan County, Taoyuan County, Taiwan, China, 185, 4, 4 Applicant before: Jingzhi Electronics Co., Ltd. |
|
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Taiwan District, Taichung City Chinese Minsheng Road 3 Lane 313 No. 45 Applicant after: Da Yun Precision Industrial stock Co., Ltd Address before: Taiwan District, Taichung City Chinese Minsheng Road 3 Lane 313 No. 45 Applicant before: Fuxiang Industrial Co., Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: FUXIANG INDUSTRIAL CO., LTD. TO: DAYUN PRECISION INDUTRY CO., LTD. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |