CN103943595A - Leading frame convenient to package - Google Patents
Leading frame convenient to package Download PDFInfo
- Publication number
- CN103943595A CN103943595A CN201410114421.7A CN201410114421A CN103943595A CN 103943595 A CN103943595 A CN 103943595A CN 201410114421 A CN201410114421 A CN 201410114421A CN 103943595 A CN103943595 A CN 103943595A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- leading
- fin
- leading frame
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a leading frame convenient to package. The leading frame is composed of a plurality of leading frame units in a single-row mode, and the leading frame units are connected through connecting ribs. Each leading frame unit comprises a cooling fin and leading pins, the position where the cooling fin is connected with the leading pins is bent, two wire grooves are formed in the back face of the cooling fin, the depths of the wire grooves are 0.1 mm, the angles of the wire grooves are 90 degrees, the thickness of the cooling fin is 1.27 mm+/-0.015 mm, the thicknesses of the leading pins are 0.38 mm+/-0.015 mm, and the distance between the plane where the cooling fin is located and the plane where the leading pins are located is 2.67 mm+/-0.015 mm. The widths of the leading frame units are 11.405 mm+/-0.03 mm, a cooling hole is formed in each cooling fin, and the diameters of the cooling holes are 3.85 mm+/-0.05 mm. After the leading frame is packaged, overflowed materials on the back face are fewer and easy to remove, and the packaging efficiency can be improved.
Description
Technical field
The present invention relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame of being convenient to seal.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame of being convenient to seal, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, described lead frame unit comprises fin and terminal pin, bends in fin and terminal pin junction, and the described fin back side is provided with twice wire casing, the dark 0.1mm of wire casing, angle is 90 °.
As a further improvement on the present invention, fin thickness is 1.27 ± 0.015mm, and terminal pin thickness is 0.38 ± 0.015mm, and fin and terminal pin plane of living in is at a distance of 2.67 ± 0.015mm.
As a further improvement on the present invention, the width of described lead frame unit is 11.405 ± 0.03mm.
As a further improvement on the present invention, described fin is provided with louvre, and louvre diameter is 3.85 ± 0.05mm.
Adopt said structure, its beneficial effect is: it is few that this lead frame is sealed rear back side flash, easily removes, and can improve packaging efficiency.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is that the A-A of Fig. 1 is to view.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, 4-wire casing, 5-louvre.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Fig. 1 and 2, a kind of lead frame of being convenient to seal, by 1 single composition of multiple lead frames unit, between each lead frame unit 1, interconnect by dowel, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, described fin 2 back sides are provided with twice wire casing 4, the dark 0.1mm of wire casing 4, angle is 90 °, fin 2 thickness are 1.27 ± 0.015mm, terminal pin 3 thickness are 0.38 ± 0.015mm, fin 2 and terminal pin 3 plane of living in are at a distance of 2.67 ± 0.015mm, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described fin 2 is provided with louvre 5, louvre 5 diameters are 3.85 ± 0.05mm.
It is few that this lead frame is sealed rear back side flash, easily removes, and can improve packaging efficiency.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. a lead frame of being convenient to seal, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, it is characterized in that: described lead frame unit (1) comprises fin (2) and terminal pin (3), bend in fin (2) and terminal pin (3) junction, described fin (2) back side is provided with twice wire casing (4), the dark 0.1mm of wire casing (4), and angle is 90 °.
2. a kind of lead frame of being convenient to seal according to claim 1, it is characterized in that: fin (2) thickness is 1.27 ± 0.015mm, terminal pin (3) thickness is 0.38 ± 0.015mm, and fin (2) and terminal pin (3) plane of living in are at a distance of 2.67 ± 0.015mm.
3. a kind of lead frame of being convenient to seal according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
4. a kind of lead frame of being convenient to seal according to claim 1, is characterized in that: described fin (2) is provided with louvre (5), louvre (5) diameter is 3.85 ± 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410114421.7A CN103943595A (en) | 2014-03-26 | 2014-03-26 | Leading frame convenient to package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410114421.7A CN103943595A (en) | 2014-03-26 | 2014-03-26 | Leading frame convenient to package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103943595A true CN103943595A (en) | 2014-07-23 |
Family
ID=51191193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410114421.7A Pending CN103943595A (en) | 2014-03-26 | 2014-03-26 | Leading frame convenient to package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103943595A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN202127015U (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Lead frame with blank holders at backs of matrixes |
| CN103545284A (en) * | 2013-10-28 | 2014-01-29 | 沈健 | High-power lead frame |
| CN203850278U (en) * | 2014-03-26 | 2014-09-24 | 张轩 | Packaging-facilitated plastic-coated lead frame |
-
2014
- 2014-03-26 CN CN201410114421.7A patent/CN103943595A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN202127015U (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Lead frame with blank holders at backs of matrixes |
| CN103545284A (en) * | 2013-10-28 | 2014-01-29 | 沈健 | High-power lead frame |
| CN203850278U (en) * | 2014-03-26 | 2014-09-24 | 张轩 | Packaging-facilitated plastic-coated lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140723 |