CN103934747A - 玻璃基板的研磨方法及制造方法、以及研磨装置 - Google Patents

玻璃基板的研磨方法及制造方法、以及研磨装置 Download PDF

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Publication number
CN103934747A
CN103934747A CN201410027681.0A CN201410027681A CN103934747A CN 103934747 A CN103934747 A CN 103934747A CN 201410027681 A CN201410027681 A CN 201410027681A CN 103934747 A CN103934747 A CN 103934747A
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CN
China
Prior art keywords
abradant surface
glass substrate
grinding
motor
electric power
Prior art date
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Pending
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CN201410027681.0A
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English (en)
Chinese (zh)
Inventor
木村宏
伊藤正文
山口龙
高野茂喜
江面裕行
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AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN103934747A publication Critical patent/CN103934747A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
CN201410027681.0A 2013-01-21 2014-01-21 玻璃基板的研磨方法及制造方法、以及研磨装置 Pending CN103934747A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-008782 2013-01-21
JP2013008782A JP5983422B2 (ja) 2013-01-21 2013-01-21 ガラス基板の研磨方法及び製造方法

Publications (1)

Publication Number Publication Date
CN103934747A true CN103934747A (zh) 2014-07-23

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CN201410027681.0A Pending CN103934747A (zh) 2013-01-21 2014-01-21 玻璃基板的研磨方法及制造方法、以及研磨装置

Country Status (3)

Country Link
JP (1) JP5983422B2 (ja)
CN (1) CN103934747A (ja)
PH (1) PH12014000029A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107584407A (zh) * 2017-07-08 2018-01-16 合肥嘉东光学股份有限公司 一种激光晶体双面抛光装置
CN108789133A (zh) * 2018-07-13 2018-11-13 航天精工股份有限公司 一种适用于轴承套圈的研磨载盘及研磨装置
CN109290941A (zh) * 2017-07-24 2019-02-01 株式会社迪思科 晶片的加工方法
CN109414799A (zh) * 2016-07-13 2019-03-01 胜高股份有限公司 双面研磨装置
CN110665589A (zh) * 2019-10-19 2020-01-10 王刚 一种玉米粉碎机
CN110744440A (zh) * 2019-10-22 2020-02-04 西安奕斯伟硅片技术有限公司 一种双面研磨装置及方法
CN114206553A (zh) * 2019-08-13 2022-03-18 应用材料公司 Cmp温度控制的装置和方法
CN114521161A (zh) * 2019-09-30 2022-05-20 Hoya株式会社 基板配置辅助治具及基板的制造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8421684B2 (en) * 2009-10-01 2013-04-16 Qualcomm Incorporated Methods and apparatus for beam steering using steerable beam antennas with switched parasitic elements
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
JP6813813B2 (ja) * 2019-11-26 2021-01-13 日本電気硝子株式会社 ガラス板
KR20230008030A (ko) 2020-04-23 2023-01-13 에이지씨 가부시키가이샤 유리 물품 및 유리 물품의 제조 방법
JP7004026B2 (ja) * 2020-06-12 2022-01-21 株式会社Sumco ワークの両面研磨方法、ワークの製造方法、及びワークの両面研磨装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06170728A (ja) * 1992-11-30 1994-06-21 Naoetsu Seimitsu Kako Kk 硬脆薄板の研磨方法
JP2004141984A (ja) * 2002-10-22 2004-05-20 Hoya Corp マスクブランクス用基板の製造方法
JP2004306173A (ja) * 2003-04-03 2004-11-04 Sharp Corp 基板研磨装置
JP5454180B2 (ja) * 2010-02-02 2014-03-26 旭硝子株式会社 磁気記録媒体用ガラス基板の製造方法及び磁気記録媒体用ガラス基板

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109414799A (zh) * 2016-07-13 2019-03-01 胜高股份有限公司 双面研磨装置
CN109414799B (zh) * 2016-07-13 2020-12-11 胜高股份有限公司 双面研磨装置
CN107584407A (zh) * 2017-07-08 2018-01-16 合肥嘉东光学股份有限公司 一种激光晶体双面抛光装置
CN109290941A (zh) * 2017-07-24 2019-02-01 株式会社迪思科 晶片的加工方法
CN109290941B (zh) * 2017-07-24 2021-11-02 株式会社迪思科 晶片的加工方法
CN108789133A (zh) * 2018-07-13 2018-11-13 航天精工股份有限公司 一种适用于轴承套圈的研磨载盘及研磨装置
CN114206553A (zh) * 2019-08-13 2022-03-18 应用材料公司 Cmp温度控制的装置和方法
CN114521161A (zh) * 2019-09-30 2022-05-20 Hoya株式会社 基板配置辅助治具及基板的制造方法
CN114521161B (zh) * 2019-09-30 2023-06-20 Hoya株式会社 基板配置辅助治具及基板的制造方法
CN110665589A (zh) * 2019-10-19 2020-01-10 王刚 一种玉米粉碎机
CN110744440A (zh) * 2019-10-22 2020-02-04 西安奕斯伟硅片技术有限公司 一种双面研磨装置及方法

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Publication number Publication date
PH12014000029A1 (en) 2015-07-27
JP2014138973A (ja) 2014-07-31
JP5983422B2 (ja) 2016-08-31

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Application publication date: 20140723