PH12014000029A1 - Polishing apparatus, and method for polishing and manufacturing glass substrate - Google Patents

Polishing apparatus, and method for polishing and manufacturing glass substrate

Info

Publication number
PH12014000029A1
PH12014000029A1 PH12014000029A PH12014000029A PH12014000029A1 PH 12014000029 A1 PH12014000029 A1 PH 12014000029A1 PH 12014000029 A PH12014000029 A PH 12014000029A PH 12014000029 A PH12014000029 A PH 12014000029A PH 12014000029 A1 PH12014000029 A1 PH 12014000029A1
Authority
PH
Philippines
Prior art keywords
polishing
glass substrate
manufacturing glass
polishing surface
polishing apparatus
Prior art date
Application number
PH12014000029A
Other languages
English (en)
Inventor
Hiroshi Kimura
Masabumi Ito
Ryu Yamaguchi
Shigeki Takano
Hiroyuki Ezura
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of PH12014000029A1 publication Critical patent/PH12014000029A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Surface Treatment Of Glass (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
PH12014000029A 2013-01-21 2014-01-21 Polishing apparatus, and method for polishing and manufacturing glass substrate PH12014000029A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013008782A JP5983422B2 (ja) 2013-01-21 2013-01-21 ガラス基板の研磨方法及び製造方法

Publications (1)

Publication Number Publication Date
PH12014000029A1 true PH12014000029A1 (en) 2015-07-27

Family

ID=51182759

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014000029A PH12014000029A1 (en) 2013-01-21 2014-01-21 Polishing apparatus, and method for polishing and manufacturing glass substrate

Country Status (3)

Country Link
JP (1) JP5983422B2 (ja)
CN (1) CN103934747A (ja)
PH (1) PH12014000029A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8421684B2 (en) * 2009-10-01 2013-04-16 Qualcomm Incorporated Methods and apparatus for beam steering using steerable beam antennas with switched parasitic elements
JP6589762B2 (ja) * 2016-07-13 2019-10-16 株式会社Sumco 両面研磨装置
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
CN107584407B (zh) * 2017-07-08 2019-02-19 合肥嘉东光学股份有限公司 一种激光晶体双面抛光装置
JP6938262B2 (ja) * 2017-07-24 2021-09-22 株式会社ディスコ ウエーハの加工方法
CN108789133A (zh) * 2018-07-13 2018-11-13 航天精工股份有限公司 一种适用于轴承套圈的研磨载盘及研磨装置
TW202129731A (zh) * 2019-08-13 2021-08-01 美商應用材料股份有限公司 Cmp溫度控制的裝置及方法
CN114521161B (zh) * 2019-09-30 2023-06-20 Hoya株式会社 基板配置辅助治具及基板的制造方法
CN110665589A (zh) * 2019-10-19 2020-01-10 王刚 一种玉米粉碎机
CN110744440A (zh) * 2019-10-22 2020-02-04 西安奕斯伟硅片技术有限公司 一种双面研磨装置及方法
JP6813813B2 (ja) * 2019-11-26 2021-01-13 日本電気硝子株式会社 ガラス板
JPWO2021215115A1 (ja) 2020-04-23 2021-10-28
JP7004026B2 (ja) * 2020-06-12 2022-01-21 株式会社Sumco ワークの両面研磨方法、ワークの製造方法、及びワークの両面研磨装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06170728A (ja) * 1992-11-30 1994-06-21 Naoetsu Seimitsu Kako Kk 硬脆薄板の研磨方法
JP2004141984A (ja) * 2002-10-22 2004-05-20 Hoya Corp マスクブランクス用基板の製造方法
JP2004306173A (ja) * 2003-04-03 2004-11-04 Sharp Corp 基板研磨装置
JP5454180B2 (ja) * 2010-02-02 2014-03-26 旭硝子株式会社 磁気記録媒体用ガラス基板の製造方法及び磁気記録媒体用ガラス基板

Also Published As

Publication number Publication date
CN103934747A (zh) 2014-07-23
JP5983422B2 (ja) 2016-08-31
JP2014138973A (ja) 2014-07-31

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