CN103934234B - A kind of cleaning of polished silicon wafer slide cassette - Google Patents
A kind of cleaning of polished silicon wafer slide cassette Download PDFInfo
- Publication number
- CN103934234B CN103934234B CN201410144428.3A CN201410144428A CN103934234B CN 103934234 B CN103934234 B CN 103934234B CN 201410144428 A CN201410144428 A CN 201410144428A CN 103934234 B CN103934234 B CN 103934234B
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- slide cassette
- cleaning
- cassette
- slide
- pure water
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to a kind of cleaning of polished silicon wafer slide cassette, it comprises the following steps: in rinse bath, put into pure water and add hydrophilic organic solvent, obtains cleaning fluid, is immersed in by slide cassette after soaking in the cleaning fluid in rinse bath and takes out; With pure water, the slide cassette taken out is rinsed, till slide cassette surface is without obvious cleaning agent foam; The slide cassette rinsed is put into rack for cleaning, then the rinse bath rack for cleaning installing slide cassette being put into supersonic wave cleaning machine carries out Ultrasonic Cleaning, taking-up slide cassette after Ultrasonic Cleaning completes; Use non-dust cloth to dip in wipe alcohol and carry out wiping to slide cassette surface; Air gun ejection gas is used to blow and spray drying to slide cassette; Finally dried slide cassette is transported to toilet or clean work station is stand-by.Adopt the slide cassette of the slide cassette alternative high-cleanness, high of invented technology after cleaning, not only eliminate the cost of high-cleanness, high auxiliary material, and strengthen the control of polished silicon wafer surface particles.
Description
Technical field
The present invention relates to photoelectron material polished silicon wafer packing technique field, the present invention especially relates to a kind of cleaning of polished silicon wafer slide cassette.
Background technology
Photoelectron material processing is generally main comprises the processes such as Material growth-blank-section-bevelling-grinding-polishing-cleaning-packaging.Will carry out surface examination after polished silicon wafer after processing cleans drying again, qualified polished silicon wafer is put into slide cassette and is encapsulated, then is processed into the functional material of needs through next procedure.Such as, cutoff filter is the blooming utilizing precision optics coating technique alternately to plate high low-refraction on optical glass, realize visible region (400 ~ 630nm) thoroughly high, the optical filter that near-infrared (700 ~ 1100nm) ends, the cutoff filter that camera lenses more than current 8,000,000 pixels is adopting starts to replace optical glass by smalt.The particle of smalt polished silicon wafer adsorption can affect coating quality, and then affects the optical characteristics of smalt cutoff filter.Therefore, the control of smalt polished silicon wafer surface particles degree is the key of smalt cutoff filter processing, in order to ensure that clean polished silicon wafer is not subject to secondary pollution, should implement strict management and control to the cleanliness factor of its packing box.
In current industry, the main disposable slide cassette (slide cassette material mainly PVC, PP, PE, PS etc.) of outsourcing that adopts is packed polished silicon wafer, but in use often find, use this slide cassette Proper Packing product to increase to some extent in placement a period of time rear surface granularity, if use the slide cassette of high-cleanness, high, be unfavorable for reducing cost of supplementary product.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of cleanliness factor higher, simple to operate and can the cleaning of cost-saving polished silicon wafer slide cassette.
According to technical scheme provided by the invention, the cleaning of described a kind of polished silicon wafer slide cassette comprises the following steps:
A, in rinse bath, put into the pure water of 25 ~ 35 DEG C and add hydrophilic organic solvent, pure water and hydrophilic organic solvent are stirred, obtain cleaning fluid, the volume ratio of pure water and hydrophilic organic solvent is 15 ~ 25:1, is immersed in by slide cassette after soaking 15 ~ 20min in the cleaning fluid in rinse bath and takes out;
B, with pure water to take out slide cassette rinse, until slide cassette surface without obvious cleaning agent foam till;
C, the slide cassette rinsed is put into rack for cleaning, and to make bottom the bottom surface of slide cassette and rack for cleaning in vertical state, the rinse bath rack for cleaning installing slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 30 ~ 50KHZ, ultrasonic power is 60 ~ 120W, Ultrasonic Cleaning temperature controls at 30 ~ 35 DEG C, Ultrasonic Cleaning time controling at 10 ~ 15min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in wipe alcohol and carry out wiping to slide cassette surface;
E, use air gun ejection gas to blow and spray drying to slide cassette, air gun spray gas temperature control, at 50 ~ 110 DEG C, to blow and spray time controling at 3 ~ 5min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
Hydrophilic organic solvent described in step a is ethanol, ether, acetone or their two kinds or two or more mixtures.
In step e, the gas of air gun ejection is nitrogen or clean air.
The present invention utilizes non-disposable slide cassette to replace the disposable slide cassette that price is higher, can ensure the high-cleanness, high of slide cassette through steps such as immersion, flushing, Ultrasonic Cleaning, alcohol wipe.Finally blow and spray nitrogen by air gun and drying process is carried out to slide cassette, the degree of drying of slide cassette can be ensured; Adopt the slide cassette of the slide cassette alternative high-cleanness, high of this technique after cleaning, not only eliminate the cost of high-cleanness, high auxiliary material, and strengthen the control of polished silicon wafer surface particles.
Detailed description of the invention
Below in conjunction with specific embodiment, the invention will be further described.
Embodiment 1
A kind of cleaning of polished silicon wafer slide cassette comprises the following steps:
A, in rinse bath, put into the pure water of 30 DEG C and add hydrophilic organic solvent, pure water and hydrophilic organic solvent are stirred, obtain cleaning fluid, the volume ratio of pure water and hydrophilic organic solvent is 20:1, hydrophilic organic solvent is that the ethanol of 1:1 and acetone are formed by volume ratio, is immersed in by slide cassette after soaking 18min in the cleaning fluid in rinse bath and takes out;
B, with pure water to take out slide cassette rinse, until slide cassette surface without obvious cleaning agent foam till;
C, the slide cassette rinsed is put into rack for cleaning, and to make bottom the bottom surface of slide cassette and rack for cleaning in vertical state, the rinse bath rack for cleaning installing slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 40KHZ, ultrasonic power is 100W, Ultrasonic Cleaning temperature controls at 32 DEG C, Ultrasonic Cleaning time controling at 12min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in wipe alcohol and carry out wiping to slide cassette surface;
E, use air gun ejection clean air to blow and spray drying to slide cassette, air gun spray gas temperature control, at 80 DEG C, to blow and spray time controling at 4min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
Shake all by the slide cassette after cleaning with after loading deionized water respectively without the slide cassette of cleaning, and adopt liquid particles degree detector to detect deionized water in two kinds of slide cassettes, slide cassette after cleaning is that granule number between 0.1 ~ 0.5 μm is about 32000 at particle diameter, and without the slide cassette after cleaning particle diameter be granule number between 0.1 ~ 0.5 μm more than 351000, for the former more than 10 times.
Use the slide cassette after present invention process cleaning to pack 200 polished silicon wafer after leaving standstill 5 days, product retest-ok rate reaches 100%.And adopting the polished silicon wafer of the disposable slide cassette packaging of traditional outsourcing to leave standstill after 5 days, product retest-ok rate is only 83.43%.
Embodiment 2
A kind of cleaning of polished silicon wafer slide cassette comprises the following steps:
A, put into the pure water of 25 DEG C and add ethanol in rinse bath, pure water and ethanol are stirred, obtain cleaning fluid, the volume ratio of pure water and ethanol is 15:1, is immersed in by slide cassette after soaking 15min in the cleaning fluid in rinse bath and takes out;
B, with pure water to take out slide cassette rinse, until slide cassette surface without obvious cleaning agent foam till;
C, the slide cassette rinsed is put into rack for cleaning, and to make bottom the bottom surface of slide cassette and rack for cleaning in vertical state, the rinse bath rack for cleaning installing slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 30KHZ, ultrasonic power is 60W, Ultrasonic Cleaning temperature controls at 30 DEG C, Ultrasonic Cleaning time controling at 10min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in wipe alcohol and carry out wiping to slide cassette surface;
E, use air gun ejection gas to blow and spray drying to slide cassette, air gun spray gas temperature control, at 50 DEG C, to blow and spray time controling at 3min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
Shake all by the slide cassette after cleaning with after loading deionized water respectively without the slide cassette of cleaning, and adopt liquid particles degree detector to detect deionized water in two kinds of slide cassettes, slide cassette after cleaning is that granule number between 0.1 ~ 0.5 μm is about 34200 at particle diameter, and without the slide cassette after cleaning particle diameter be granule number between 0.1 ~ 0.5 μm more than 376000, for the former more than 10 times.
Use the slide cassette after present invention process cleaning to pack 200 polished silicon wafer after leaving standstill 5 days, product retest-ok rate reaches 98%.And adopting the polished silicon wafer of the disposable slide cassette packaging of traditional outsourcing to leave standstill after 5 days, product retest-ok rate is only 83.43%.
Embodiment 3
A kind of cleaning of polished silicon wafer slide cassette comprises the following steps:
A, in rinse bath, put into the pure water of 35 DEG C and add hydrophilic organic solvent, pure water and hydrophilic organic solvent are stirred, obtain cleaning fluid, the volume ratio of pure water and hydrophilic organic solvent is 25:1, hydrophilic organic solvent is that the ether of 1:1 and acetone are formed by volume ratio, is immersed in by slide cassette after soaking 20min in the cleaning fluid in rinse bath and takes out;
B, with pure water to take out slide cassette rinse, until slide cassette surface without obvious cleaning agent foam till;
C, the slide cassette rinsed is put into rack for cleaning, and to make bottom the bottom surface of slide cassette and rack for cleaning in vertical state, the rinse bath rack for cleaning installing slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 50KHZ, ultrasonic power is 120W, Ultrasonic Cleaning temperature controls at 35 DEG C, Ultrasonic Cleaning time controling at 15min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in wipe alcohol and carry out wiping to slide cassette surface;
E, use air gun ejection gas to blow and spray drying to slide cassette, air gun spray gas temperature control, at 110 DEG C, to blow and spray time controling at 5min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
Shake all by the slide cassette after cleaning with after loading deionized water respectively without the slide cassette of cleaning, and adopt liquid particles degree detector to detect deionized water in two kinds of slide cassettes, slide cassette after cleaning is that granule number between 0.1 ~ 0.5 μm is about 33700 at particle diameter, and without the slide cassette after cleaning particle diameter be granule number between 0.1 ~ 0.5 μm more than 368000, for the former more than 10 times.
Use the slide cassette after present invention process cleaning to pack 200 polished silicon wafer after leaving standstill 5 days, product retest-ok rate reaches 99%.And adopting the polished silicon wafer of the disposable slide cassette packaging of traditional outsourcing to leave standstill after 5 days, product retest-ok rate is only 83.43%.
In the above-described embodiments, detect slide cassette internal environment with liquid particles degree analyzer and consider, illustrate that this cleaning method effectively can be removed slide cassette inside and stain and particle; Consider with polished silicon wafer particle variable quantity, illustrate and adopt the slide cassette of this cleaning packaging polished silicon wafer surface particles degree to obtain effective control.
Claims (1)
1. a cleaning for polished silicon wafer slide cassette, is characterized in that this cleaning comprises the following steps:
A, in rinse bath, put into the pure water of 25 ~ 35 DEG C and add hydrophilic organic solvent, pure water and organic solvent are stirred, obtain cleaning fluid, the volume ratio of pure water and hydrophilic organic solvent is 15 ~ 25:1, is immersed in by slide cassette after soaking 15 ~ 20min in the cleaning fluid in rinse bath and takes out;
B, with pure water to take out slide cassette rinse, until slide cassette surface without obvious cleaning agent foam till;
C, the slide cassette rinsed is put into rack for cleaning, and to make bottom the bottom surface of slide cassette and rack for cleaning in vertical state, the rinse bath rack for cleaning installing slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 30 ~ 50KHZ, ultrasonic power is 60 ~ 120W, Ultrasonic Cleaning temperature controls at 30 ~ 35 DEG C, Ultrasonic Cleaning time controling at 10 ~ 15min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in wipe alcohol and carry out wiping to slide cassette surface;
E, use air gun ejection gas to blow and spray drying to slide cassette, air gun spray gas temperature control, at 50 ~ 110 DEG C, to blow and spray time controling at 3 ~ 5min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by;
Hydrophilic organic solvent described in step a is ethanol, ether, acetone or their two kinds or two or more mixtures;
In step e, the gas of air gun ejection is nitrogen or clean air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410144428.3A CN103934234B (en) | 2014-04-11 | 2014-04-11 | A kind of cleaning of polished silicon wafer slide cassette |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410144428.3A CN103934234B (en) | 2014-04-11 | 2014-04-11 | A kind of cleaning of polished silicon wafer slide cassette |
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| CN103934234A CN103934234A (en) | 2014-07-23 |
| CN103934234B true CN103934234B (en) | 2016-01-06 |
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| CN201410144428.3A Active CN103934234B (en) | 2014-04-11 | 2014-04-11 | A kind of cleaning of polished silicon wafer slide cassette |
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| CN105789025A (en) * | 2014-12-25 | 2016-07-20 | 上海旭福电子有限公司 | Novel cleaning process for wafer film-plated sheet mask |
| CN105109725B (en) * | 2015-06-29 | 2017-11-17 | 开平市盈光机电科技有限公司 | A kind of optical filter mounted box method |
| CN106876295A (en) * | 2015-12-10 | 2017-06-20 | 有研半导体材料有限公司 | A kind of method of tenor test in silicon chip film magazine |
| CN105598076A (en) * | 2015-12-26 | 2016-05-25 | 湖南长材电工科技有限公司 | Method for efficient and no-damage cleaning of shrinkable cable accessory |
| CN106238402B (en) * | 2016-08-12 | 2019-08-09 | 泉州市三星消防设备有限公司 | A kind of cleaning method of faraday's granule |
| CN106563650A (en) * | 2016-10-31 | 2017-04-19 | 芜湖赋兴光电有限公司 | Dirty product treatment method for mobile phone camera module production |
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| CN112676286A (en) * | 2020-12-09 | 2021-04-20 | 四川富乐德科技发展有限公司 | Method for cleaning Parylene-C filling material bag |
| CN112588639A (en) * | 2020-12-21 | 2021-04-02 | 兰州科近泰基新技术有限责任公司 | Single-wing cleaning method for four-wing type radio frequency quadrupole field linear accelerator |
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| CN103934234A (en) | 2014-07-23 |
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Effective date of registration: 20190911 Address after: 214037, Jinshan 9 photoelectric new material science and Technology Park, Jinshan four branch road, Jiangsu, Wuxi Patentee after: Wuxi Yangtze River Delta photoelectric New Material Co., Ltd. Address before: 214037, No. four branch 9, Jinshan Science Park, Jianghai West Road, Jianghai District, Wuxi, Jiangsu, Beitang Patentee before: Unionlight Technology Co., Ltd. |