CN103934234A - Cleaning technology of polished wafer containing box - Google Patents
Cleaning technology of polished wafer containing box Download PDFInfo
- Publication number
- CN103934234A CN103934234A CN201410144428.3A CN201410144428A CN103934234A CN 103934234 A CN103934234 A CN 103934234A CN 201410144428 A CN201410144428 A CN 201410144428A CN 103934234 A CN103934234 A CN 103934234A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- slide cassette
- containing box
- wafer containing
- ultrasonic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a cleaning technology of a polished wafer containing box. The cleaning technology comprises the following steps that pure water is put in a cleaning tank, hydrophilic organic solvent is added, a cleaning solution is obtained, and the wafer containing box is immersed into the cleaning solution in the cleaning tank and then is taken out; the pure water is used for flushing the taken wafer containing box until the surface of the wafer containing box is free of obvious cleaning agent foam; the flushed wafer containing box is put in a cleaning rack, then the cleaning rack which is provided with the wafer containing box is placed in a cleaning tank of an ultrasonic cleaner for conducting ultrasonic cleaning, and after ultrasonic cleaning is completed, the wafer containing box is taken out; a piece of non-dust cloth is used for being dipped with ethyl alcohol to wipe the surface of the wafer containing box; the gas sprayed by a gas gun is used for drying the wafer containing box in blowing and spraying modes; at last, the dried wafer containing box is conveyed to a clean chamber or a clean workbench for standby application. The wafer containing box cleaned through the cleaning technology can be used for replacing a high-cleanliness wafer containing box, the cost of high-cleanliness auxiliary materials is omitted, and the control over surface particles of the polished wafer surface is enhanced.
Description
Technical field
The present invention relates to photoelectron material polished silicon wafer packing technique field, the present invention especially relates to a kind of cleaning of polished silicon wafer slide cassette.
Background technology
The general main Material growth-blank-section-bevelling-grinding-polishing-cleaning-processes such as packaging that comprise of photoelectron material processing.Polished silicon wafer after processing will be carried out surface examination after cleaning drying again, and qualified polished silicon wafer is put into slide cassette and encapsulated, then be processed into through next procedure the functional material needing.For example, cutoff filter is to utilize precision optics coating technique on optical glass, alternately to plate the blooming of high low-refraction, realize visible region (400 ~ 630nm) thoroughly high, the optical filter of near-infrared (700 ~ 1100nm) cut-off, the cutoff filter that camera lenses more than current 8,000,000 pixels is adopting starts to replace optical glass by smalt.The particle of smalt polished silicon wafer adsorption can affect coating quality, and then affects the optical characteristics of smalt cutoff filter.Therefore, the control of smalt polished silicon wafer surface particles degree is the key of smalt cutoff filter processing, in order to ensure that clean polished silicon wafer is not subject to secondary pollution, should implement strict management and control to the cleanliness factor of its packing box.
In industry, the main disposable slide cassette (slide cassette material is mainly PVC, PP, PE, PS etc.) that adopts outsourcing is packed polished silicon wafer at present, but in use often find, use this slide cassette Proper Packing product to increase to some extent in placement a period of time rear surface granularity, if use the slide cassette of high-cleanness, high to be unfavorable for reducing cost of supplementary product.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, the cleaning of higher, simple to operate and the polished silicon wafer slide cassette that can be cost-saving of a kind of cleanliness factor is provided.
According to technical scheme provided by the invention, the cleaning of described a kind of polished silicon wafer slide cassette comprises the following steps:
A, in rinse bath, put into the pure water of 25 ~ 35 DEG C and add hydrophilic organic solvent, pure water and hydrophilic organic solvent are stirred, obtain cleaning fluid, the volume ratio of pure water and hydrophilic organic solvent is 15 ~ 25:1, and slide cassette is immersed in after soaking 15 ~ 20min in the cleaning fluid in rinse bath and is taken out;
B, the slide cassette taking out is rinsed with pure water, until slide cassette surface is without obvious cleaning agent foam;
C, the slide cassette having rinsed is put into rack for cleaning, and make the bottom surface of slide cassette and rack for cleaning bottom in vertical state, the rinse bath of the rack for cleaning that installs slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 30 ~ 50KHZ, ultrasonic power is 60 ~ 120W, Ultrasonic Cleaning temperature is controlled at 30 ~ 35 DEG C, and the Ultrasonic Cleaning time is controlled at 10 ~ 15min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in to wipe alcohol wiping is carried out in slide cassette surface;
E, use air gun ejection gas blow and spray dry to slide cassette, the temperature of gas that air gun sprays is controlled at 50 ~ 110 DEG C, and the time of blowing and spraying is controlled at 3 ~ 5min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
Hydrophilic organic solvent described in step a is ethanol, ether, acetone or their two kinds or two or more mixtures.
In step e, the gas of air gun ejection is nitrogen or clean air.
The present invention utilizes non-disposable slide cassette to replace the higher disposable slide cassette of price, can ensure the high-cleanness, high of slide cassette through steps such as immersion, flushing, Ultrasonic Cleaning, alcohol wipe.Finally blow and spray nitrogen by air gun slide cassette is dried to processing, can ensure the degree of drying of slide cassette; The slide cassette that adopts the slide cassette alternative high-cleanness, high of this technique after cleaning, has not only saved the cost of high-cleanness, high auxiliary material, and has strengthened the control of polished silicon wafer surface particles.
Detailed description of the invention
Below in conjunction with specific embodiment, the invention will be further described.
Embodiment 1
A kind of cleaning of polished silicon wafer slide cassette comprises the following steps:
A, in rinse bath, put into the pure water of 30 DEG C and add hydrophilic organic solvent, pure water and hydrophilic organic solvent are stirred, obtain cleaning fluid, the volume ratio of pure water and hydrophilic organic solvent is 20:1, ethanol and acetone that hydrophilic organic solvent is 1:1 by volume ratio form, and slide cassette is immersed in after soaking 18min in the cleaning fluid in rinse bath and is taken out;
B, the slide cassette taking out is rinsed with pure water, until slide cassette surface is without obvious cleaning agent foam;
C, the slide cassette having rinsed is put into rack for cleaning, and make the bottom surface of slide cassette and rack for cleaning bottom in vertical state, the rinse bath of the rack for cleaning that installs slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 40KHZ, ultrasonic power is 100W, Ultrasonic Cleaning temperature is controlled at 32 DEG C, and the Ultrasonic Cleaning time is controlled at 12min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in to wipe alcohol wiping is carried out in slide cassette surface;
E, use air gun ejection clean air blow and spray dry to slide cassette, the temperature of gas that air gun sprays is controlled at 80 DEG C, and the time of blowing and spraying is controlled at 4min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
After loading respectively deionized water by the slide cassette after cleaning with without the slide cassette cleaning, shake all, and adopt liquid particles degree detector to detect the deionized water in two kinds of slide cassettes, slide cassette after cleaning is that granule number between 0.1 ~ 0.5 μ m is about 32000 at particle diameter, and be that granule number between 0.1 ~ 0.5 μ m exceedes 351000 without the slide cassette after cleaning at particle diameter, for the former more than 10 times.
Use the slide cassette after technique of the present invention is cleaned to pack 200 polished silicon wafer after leaving standstill 5 days, product retest-ok rate reaches 100%.And adopting the polished silicon wafer of the disposable slide cassette packaging of traditional outsourcing to leave standstill after 5 days, product retest-ok rate is only 83.43%.
Embodiment 2
A kind of cleaning of polished silicon wafer slide cassette comprises the following steps:
A, put into the pure water of 25 DEG C and add ethanol in rinse bath, pure water and ethanol are stirred, obtaining cleaning fluid, the volume ratio of pure water and ethanol is 15:1, and slide cassette is immersed in after soaking 15min in the cleaning fluid in rinse bath and is taken out;
B, the slide cassette taking out is rinsed with pure water, until slide cassette surface is without obvious cleaning agent foam;
C, the slide cassette having rinsed is put into rack for cleaning, and make the bottom surface of slide cassette and rack for cleaning bottom in vertical state, the rinse bath of the rack for cleaning that installs slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 30KHZ, ultrasonic power is 60W, Ultrasonic Cleaning temperature is controlled at 30 DEG C, and the Ultrasonic Cleaning time is controlled at 10min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in to wipe alcohol wiping is carried out in slide cassette surface;
E, use air gun ejection gas blow and spray dry to slide cassette, the temperature of gas that air gun sprays is controlled at 50 DEG C, and the time of blowing and spraying is controlled at 3min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
After loading respectively deionized water by the slide cassette after cleaning with without the slide cassette cleaning, shake all, and adopt liquid particles degree detector to detect the deionized water in two kinds of slide cassettes, slide cassette after cleaning is that granule number between 0.1 ~ 0.5 μ m is about 34200 at particle diameter, and be that granule number between 0.1 ~ 0.5 μ m exceedes 376000 without the slide cassette after cleaning at particle diameter, for the former more than 10 times.
Use the slide cassette after technique of the present invention is cleaned to pack 200 polished silicon wafer after leaving standstill 5 days, product retest-ok rate reaches 98%.And adopting the polished silicon wafer of the disposable slide cassette packaging of traditional outsourcing to leave standstill after 5 days, product retest-ok rate is only 83.43%.
Embodiment 3
A kind of cleaning of polished silicon wafer slide cassette comprises the following steps:
A, in rinse bath, put into the pure water of 35 DEG C and add hydrophilic organic solvent, pure water and hydrophilic organic solvent are stirred, obtain cleaning fluid, the volume ratio of pure water and hydrophilic organic solvent is 25:1, ether and acetone that hydrophilic organic solvent is 1:1 by volume ratio form, and slide cassette is immersed in after soaking 20min in the cleaning fluid in rinse bath and is taken out;
B, the slide cassette taking out is rinsed with pure water, until slide cassette surface is without obvious cleaning agent foam;
C, the slide cassette having rinsed is put into rack for cleaning, and make the bottom surface of slide cassette and rack for cleaning bottom in vertical state, the rinse bath of the rack for cleaning that installs slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 50KHZ, ultrasonic power is 120W, Ultrasonic Cleaning temperature is controlled at 35 DEG C, and the Ultrasonic Cleaning time is controlled at 15min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in to wipe alcohol wiping is carried out in slide cassette surface;
E, use air gun ejection gas blow and spray dry to slide cassette, the temperature of gas that air gun sprays is controlled at 110 DEG C, and the time of blowing and spraying is controlled at 5min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
After loading respectively deionized water by the slide cassette after cleaning with without the slide cassette cleaning, shake all, and adopt liquid particles degree detector to detect the deionized water in two kinds of slide cassettes, slide cassette after cleaning is that granule number between 0.1 ~ 0.5 μ m is about 33700 at particle diameter, and be that granule number between 0.1 ~ 0.5 μ m exceedes 368000 without the slide cassette after cleaning at particle diameter, for the former more than 10 times.
Use the slide cassette after technique of the present invention is cleaned to pack 200 polished silicon wafer after leaving standstill 5 days, product retest-ok rate reaches 99%.And adopting the polished silicon wafer of the disposable slide cassette packaging of traditional outsourcing to leave standstill after 5 days, product retest-ok rate is only 83.43%.
In the above-described embodiments, detect slide cassette internal environment with liquid particles degree analyzer and consider, illustrate that this cleaning method can effectively remove that slide cassette is inner to stain and particle; Consider with polished silicon wafer particle variable quantity, illustrate and adopt the slide cassette packaging polished silicon wafer surface particles degree of this cleaning to obtain effective control.
Claims (3)
1. a cleaning for polished silicon wafer slide cassette, is characterized in that this cleaning comprises the following steps:
A, in rinse bath, put into the pure water of 25 ~ 35 DEG C and add hydrophilic organic solvent, pure water and organic solvent are stirred, obtain cleaning fluid, the volume ratio of pure water and hydrophilic organic solvent is 15 ~ 25:1, and slide cassette is immersed in after soaking 15 ~ 20min in the cleaning fluid in rinse bath and is taken out;
B, the slide cassette taking out is rinsed with pure water, until slide cassette surface is without obvious cleaning agent foam;
C, the slide cassette having rinsed is put into rack for cleaning, and make the bottom surface of slide cassette and rack for cleaning bottom in vertical state, the rinse bath of the rack for cleaning that installs slide cassette being put into supersonic wave cleaning machine again carries out Ultrasonic Cleaning, ultrasonic frequency is 30 ~ 50KHZ, ultrasonic power is 60 ~ 120W, Ultrasonic Cleaning temperature is controlled at 30 ~ 35 DEG C, and the Ultrasonic Cleaning time is controlled at 10 ~ 15min, taking-up slide cassette after Ultrasonic Cleaning completes;
D, use non-dust cloth to dip in to wipe alcohol wiping is carried out in slide cassette surface;
E, use air gun ejection gas blow and spray dry to slide cassette, the temperature of gas that air gun sprays is controlled at 50 ~ 110 DEG C, and the time of blowing and spraying is controlled at 3 ~ 5min;
F, finally dried slide cassette is transported to toilet or clean work station is stand-by.
2. the cleaning of polished silicon wafer slide cassette as claimed in claim 1, is characterized in that: the hydrophilic organic solvent described in step a is ethanol, ether, acetone or their two kinds or two or more mixtures.
3. the cleaning of polished silicon wafer slide cassette as claimed in claim 1, is characterized in that: in step e, the gas of air gun ejection is nitrogen or clean air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410144428.3A CN103934234B (en) | 2014-04-11 | 2014-04-11 | A kind of cleaning of polished silicon wafer slide cassette |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410144428.3A CN103934234B (en) | 2014-04-11 | 2014-04-11 | A kind of cleaning of polished silicon wafer slide cassette |
Publications (2)
| Publication Number | Publication Date |
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| CN103934234A true CN103934234A (en) | 2014-07-23 |
| CN103934234B CN103934234B (en) | 2016-01-06 |
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| CN201410144428.3A Active CN103934234B (en) | 2014-04-11 | 2014-04-11 | A kind of cleaning of polished silicon wafer slide cassette |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105109725A (en) * | 2015-06-29 | 2015-12-02 | 开平市盈光机电科技有限公司 | Optical filter packing method |
| CN105598076A (en) * | 2015-12-26 | 2016-05-25 | 湖南长材电工科技有限公司 | Method for efficient and no-damage cleaning of shrinkable cable accessory |
| CN105789025A (en) * | 2014-12-25 | 2016-07-20 | 上海旭福电子有限公司 | Novel cleaning process for wafer film-plated sheet mask |
| CN106238402A (en) * | 2016-08-12 | 2016-12-21 | 泉州市三星消防设备有限公司 | A kind of cleaning method of faraday's granule |
| CN106563650A (en) * | 2016-10-31 | 2017-04-19 | 芜湖赋兴光电有限公司 | Dirty product treatment method for mobile phone camera module production |
| CN106694443A (en) * | 2016-11-30 | 2017-05-24 | 北京七星华创电子股份有限公司 | Dispatching method and dispatching system for silicon wafer cleaning |
| CN106824869A (en) * | 2016-12-29 | 2017-06-13 | 芜湖乐普汽车科技有限公司 | The cleaning method of resin product |
| CN106876295A (en) * | 2015-12-10 | 2017-06-20 | 有研半导体材料有限公司 | A kind of method of tenor test in silicon chip film magazine |
| CN109013517A (en) * | 2018-08-20 | 2018-12-18 | 六安名家汇光电科技有限公司 | A kind of dust removal method of LED projector lamp plastic shell |
| CN112588639A (en) * | 2020-12-21 | 2021-04-02 | 兰州科近泰基新技术有限责任公司 | Single-wing cleaning method for four-wing type radio frequency quadrupole field linear accelerator |
| CN112676286A (en) * | 2020-12-09 | 2021-04-20 | 四川富乐德科技发展有限公司 | Method for cleaning Parylene-C filling material bag |
| CN115184374A (en) * | 2022-06-28 | 2022-10-14 | 西安奕斯伟材料科技有限公司 | Wafer box detection method and device and wafer box cleaning machine |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789025A (en) * | 2014-12-25 | 2016-07-20 | 上海旭福电子有限公司 | Novel cleaning process for wafer film-plated sheet mask |
| CN105109725A (en) * | 2015-06-29 | 2015-12-02 | 开平市盈光机电科技有限公司 | Optical filter packing method |
| CN105109725B (en) * | 2015-06-29 | 2017-11-17 | 开平市盈光机电科技有限公司 | A kind of optical filter mounted box method |
| CN106876295A (en) * | 2015-12-10 | 2017-06-20 | 有研半导体材料有限公司 | A kind of method of tenor test in silicon chip film magazine |
| CN105598076A (en) * | 2015-12-26 | 2016-05-25 | 湖南长材电工科技有限公司 | Method for efficient and no-damage cleaning of shrinkable cable accessory |
| CN106238402B (en) * | 2016-08-12 | 2019-08-09 | 泉州市三星消防设备有限公司 | A kind of cleaning method of faraday's granule |
| CN106238402A (en) * | 2016-08-12 | 2016-12-21 | 泉州市三星消防设备有限公司 | A kind of cleaning method of faraday's granule |
| CN106563650A (en) * | 2016-10-31 | 2017-04-19 | 芜湖赋兴光电有限公司 | Dirty product treatment method for mobile phone camera module production |
| CN106694443A (en) * | 2016-11-30 | 2017-05-24 | 北京七星华创电子股份有限公司 | Dispatching method and dispatching system for silicon wafer cleaning |
| CN106824869A (en) * | 2016-12-29 | 2017-06-13 | 芜湖乐普汽车科技有限公司 | The cleaning method of resin product |
| CN109013517A (en) * | 2018-08-20 | 2018-12-18 | 六安名家汇光电科技有限公司 | A kind of dust removal method of LED projector lamp plastic shell |
| CN112676286A (en) * | 2020-12-09 | 2021-04-20 | 四川富乐德科技发展有限公司 | Method for cleaning Parylene-C filling material bag |
| CN112588639A (en) * | 2020-12-21 | 2021-04-02 | 兰州科近泰基新技术有限责任公司 | Single-wing cleaning method for four-wing type radio frequency quadrupole field linear accelerator |
| CN115184374A (en) * | 2022-06-28 | 2022-10-14 | 西安奕斯伟材料科技有限公司 | Wafer box detection method and device and wafer box cleaning machine |
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Effective date of registration: 20190911 Address after: 214037, Jinshan 9 photoelectric new material science and Technology Park, Jinshan four branch road, Jiangsu, Wuxi Patentee after: Wuxi Yangtze River Delta photoelectric New Material Co., Ltd. Address before: 214037, No. four branch 9, Jinshan Science Park, Jianghai West Road, Jianghai District, Wuxi, Jiangsu, Beitang Patentee before: Unionlight Technology Co., Ltd. |
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