CN103928424A - Thickened lead frame - Google Patents
Thickened lead frame Download PDFInfo
- Publication number
- CN103928424A CN103928424A CN201410118708.7A CN201410118708A CN103928424A CN 103928424 A CN103928424 A CN 103928424A CN 201410118708 A CN201410118708 A CN 201410118708A CN 103928424 A CN103928424 A CN 103928424A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- lead
- fin
- terminal pin
- thickened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a thickened lead frame. The thickened lead frame is composed of a plurality of single rows of lead frame units, wherein the lead frame units are mutually connected through connection ribs, each lead frame unit comprises a cooling fin and a lead pin, the joint of each cooling fin and the corresponding lead pin is bent, the thickness of each cooling fin is 1.3+/-0.02mm, the thickness of each lead pin is 0.5+/-0.02mm, and the distance between the plane where the cooling fins are located and the plane where the lead pins are located is 2.67+/-0.1mm. The cooling fins and the lead pins of the lead frame are thickened compared with a traditional lead frame, so that the cooling effect is better, the frame is firmer, and more using convenience is achieved.
Description
Technical field
The present invention relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use plastic packaging lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame of thickening.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame of thickening, by multiple lead frames unit single composition, each lead frame interconnects by dowel between unit, described lead frame unit comprises fin and terminal pin, bends in fin and terminal pin junction, and described fin thickness is 1.3 ± 0.02mm, terminal pin thickness is 0.5 ± 0.02mm, and fin and terminal pin plane of living in is at a distance of 2.67 ± 0.1mm.
As a further improvement on the present invention, the width of described lead frame unit is 11.405 ± 0.03mm.
As a further improvement on the present invention, described lead frame unit is provided with location hole, and the diameter of location hole is 1.55 ± 0.05mm.
As a further improvement on the present invention, described fin is provided with louvre, and louvre diameter is 3.84 ± 0.04mm.
Adopt said structure, its beneficial effect is: the fin of this lead frame and terminal pin, than all thickenings to some extent of conventional lead frame, make radiating effect better, and framework is more firm, uses more convenient.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
In figure: 1-lead frame unit, 2-fin, 3-terminal pin, 4-location hole, 5-louvre.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Fig. 1, a kind of lead frame of thickening, by 1 single composition of multiple lead frames unit, between each lead frame unit 1, interconnect by dowel, described lead frame unit 1 comprises fin 2 and terminal pin 3, bend in fin 2 and terminal pin 3 junctions, described fin 2 thickness are 1.3 ± 0.02mm, terminal pin 3 thickness are 0.5 ± 0.02mm, fin 2 and terminal pin 3 plane of living in are at a distance of 2.67 ± 0.1mm, the width of described lead frame unit 1 is 11.405 ± 0.03mm, described lead frame unit 1 is provided with location hole 4, the diameter of location hole 4 is 1.55 ± 0.05mm, described fin 2 is provided with louvre 5, louvre 5 diameters are 3.84 ± 0.04mm.
The fin 2 of this lead frame and terminal pin 3, than all thickenings to some extent of conventional lead frame, make radiating effect better, and framework is more firm, uses more convenient.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (4)
1. the lead frame of a thickening, by multiple lead frames unit (1) single composition, between each lead frame unit (1), interconnect by dowel, described lead frame unit (1) comprises fin (2) and terminal pin (3), bend in fin (2) and terminal pin (3) junction, it is characterized in that: described fin (2) thickness is 1.3 ± 0.02mm, terminal pin (3) thickness is 0.5 ± 0.02mm, and fin (2) and terminal pin (3) plane of living in are at a distance of 2.67 ± 0.1mm.
2. the lead frame of a kind of thickening according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.405 ± 0.03mm.
3. the lead frame of a kind of thickening according to claim 1, is characterized in that: described lead frame unit (1) is provided with location hole (4), and the diameter of location hole (4) is 1.55 ± 0.05mm.
4. the lead frame of a kind of thickening according to claim 1, is characterized in that: described fin (2) is provided with louvre (5), and louvre (5) diameter is 3.84 ± 0.04mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118708.7A CN103928424A (en) | 2014-03-27 | 2014-03-27 | Thickened lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118708.7A CN103928424A (en) | 2014-03-27 | 2014-03-27 | Thickened lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103928424A true CN103928424A (en) | 2014-07-16 |
Family
ID=51146596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410118708.7A Pending CN103928424A (en) | 2014-03-27 | 2014-03-27 | Thickened lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103928424A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN102339805A (en) * | 2011-06-16 | 2012-02-01 | 沈健 | Lead frame with pressing edge on back side of matrix |
| CN102339807A (en) * | 2011-06-16 | 2012-02-01 | 沈健 | Lead frame with T-shaped gaps among radiating fins |
| CN203850285U (en) * | 2014-03-27 | 2014-09-24 | 张轩 | Thickened plastic-sealed lead frame |
-
2014
- 2014-03-27 CN CN201410118708.7A patent/CN103928424A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN102339805A (en) * | 2011-06-16 | 2012-02-01 | 沈健 | Lead frame with pressing edge on back side of matrix |
| CN102339807A (en) * | 2011-06-16 | 2012-02-01 | 沈健 | Lead frame with T-shaped gaps among radiating fins |
| CN203850285U (en) * | 2014-03-27 | 2014-09-24 | 张轩 | Thickened plastic-sealed lead frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203850280U (en) | Double-chip plastic-sealed lead frame | |
| CN203850288U (en) | Plastic-sealed lead frame with separated heat radiating fins | |
| CN203850285U (en) | Thickened plastic-sealed lead frame | |
| CN203850287U (en) | Plastic-sealed lead frame in full packaging manner | |
| CN203617290U (en) | Lead frame with pits | |
| CN203850278U (en) | Packaging-facilitated plastic-coated lead frame | |
| CN103928424A (en) | Thickened lead frame | |
| CN203617285U (en) | Lead frame capable of radiating heat quickly | |
| CN103943596A (en) | Fully packaged type lead frame | |
| CN203850279U (en) | Plastic-sealed lead frame suitable for high-power electrical appliances | |
| CN203850286U (en) | Plastic-sealed lead frame suitable for high-temperature environment | |
| CN203589012U (en) | Thickened lead frame | |
| CN103928429A (en) | Lead frame with split cooling fins | |
| CN203850289U (en) | Plastic-sealed lead frame for low-power electrical appliances | |
| CN203617282U (en) | Lead frame applied to low-power electrical appliance | |
| CN203850277U (en) | A plastic package lead wire framework with bosses formed through pressing | |
| CN203850274U (en) | A thin plastic packaging lead wire framework | |
| CN203850290U (en) | Plastic-sealed lead frame suitable for high-temperature electrical appliances | |
| CN203850276U (en) | A plastic package lead wire framework | |
| CN103617979A (en) | Plastic package lead frame convenient to package | |
| CN103617984A (en) | Plastic package lead frame | |
| CN203850282U (en) | Plastic-sealed lead frame with material locking openings | |
| CN203850283U (en) | Plastic-sealed lead frame with pressing marks | |
| CN103617986A (en) | Plastic-packaged lead frame capable of performing heat dissipation rapidly | |
| CN203617281U (en) | Lead frame convenient for packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140716 |