CN103904160A - 一种基于CdZnTe薄膜的X射线探测器的制备方法 - Google Patents
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- 229910004611 CdZnTe Inorganic materials 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000000859 sublimation Methods 0.000 claims abstract description 14
- 230000008022 sublimation Effects 0.000 claims abstract description 14
- 239000007789 gas Substances 0.000 claims abstract description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052786 argon Inorganic materials 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims description 24
- 238000002360 preparation method Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 12
- 238000000137 annealing Methods 0.000 claims description 10
- 230000007797 corrosion Effects 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 238000004821 distillation Methods 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- MODGUXHMLLXODK-UHFFFAOYSA-N [Br].CO Chemical compound [Br].CO MODGUXHMLLXODK-UHFFFAOYSA-N 0.000 claims description 4
- 239000003708 ampul Substances 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 4
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052714 tellurium Inorganic materials 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000005361 soda-lime glass Substances 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 2
- 238000002061 vacuum sublimation Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000004381 surface treatment Methods 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910004613 CdTe Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000005092 sublimation method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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Abstract
本发明公开了一种应用于X射线探测的CdZnTe薄膜的制备方法。所述制备方法是基于近空间升华(CSS)技术。该方法以CdZnTe单晶切片为升华源,使用氩气作为工作气体,并通过一定的表面处理获得理想的整流电极接触。该方法具有工艺简单、成本更低、可重复性高等特点,可以制备应用于大面积、低漏电流、高分辨率的X射线探测器的薄膜,有望X射线薄膜探测器的产业化生产。
Description
技术领域
本发明涉及一种基于CdZnTe薄膜的X射线探测器的制备方法,属于无机非金属材料制造工艺技术领域。
背景技术
CdZnTe是重要的 -族化合物半导体,由于其具有较高的平均原子序数和较大的禁带宽度,所以用这种材料制备的探测器具有较大的吸收系数、较高的能量分辨率,尤其不需任何的冷却设备就能在室温下工作。其优越的光电性能,可广泛应用于X射线等高能辐射探测、安全检测、医学成像以及空间研究。但由于CdZnTe固有的物性,熔体法生长的晶体存在成分不均匀性、晶界、孪晶、位错、夹杂相与沉淀相等许多缺陷,CdZnTe单晶材料不适合大面积平板探测器。为此,我们要寻找一种适合制备大面积CdZnTe薄膜、成本低的方法。
薄膜制备工艺相比单晶生长工艺简单,成本更低,批量生长可行性高,且基于薄膜的平面特性适合制备大面积的平板探测器。CdZnTe薄膜可由化学气相沉积等化学方法制备,也可通过热蒸发、磁控溅射、近空间升华法等物理气相沉积得到。在这些薄膜制备方法中,近空间升华法是最有前途的一种方法,这种方法成本低、速度快、质量好,适用于大面积沉积薄膜。目前,近空间升华法已用于CdTe薄膜的制备,但在CdZnTe薄膜的制备上较少。
采用近空间升华法制备的CdZnTe薄膜是多晶薄膜,可以通过改变制备的条件来获得表面平整,电阻率相对较高的CdZnTe薄膜。此外,在制备接触电极前,我们可以通过不同的表面处理工艺来制备肖特基(Schottky)接触电极,并获得有较小漏电流的X射线探测器,解决了一般X射线探测器漏电流大,电荷收集率低的问题。
发明内容
本发明的目的是采用近空间升华方法制备基于CdZnTe薄膜的X射线探测器,给制备高性能核辐射辐射探测器提供了新的方案。
为达到上述目的, 本发明是基于CdZnTe薄膜的X射线探测器的制备方法,其特征在于该方法包括如下过程和步骤:
A. CdZnTe单晶升华源的准备:根据已知的先有技术,将高纯Cd、Zn、Te放入石英管中,在高真空下,采用移动加热法生长出质量好、成分分布相对均匀的CdZnTe单晶体,其中锌的摩尔含量为2~20%,将生长好的晶体切片作为升华源。
B. 衬底预处理:采用镀有透明导电层ITO玻璃或普通钠钙玻璃作为衬底,将衬底用去离子水、丙酮和乙醇分别超声清洗5~15分钟,洗去表面的杂质与有机物,烘干后放入近空间升华反应室内
C. CdZnTe薄膜生长过程:开机械泵抽真空,将升华腔内气压抽至1Pa以下后关闭机械泵,通入氩气将气压调至10~100Pa,关闭气瓶;将升华源及衬底分别加热到500~650℃和400~550℃;生长30min~180min后开机械泵抽真空至气压为10Pa以下,关机械泵,待样品冷却至室温,取出CdZnTe薄膜样品,薄膜厚度50-500mm。
D. CdZnTe薄膜退火及腐蚀:将样品在1Pa以下的真空升华腔中200~350°C退火20~60分钟;配制摩尔浓度为0.1~0.5%的溴甲醇溶液以及重铬酸钾和硫酸混合溶液,将退过火的样品依此浸入两种溶液腐蚀10~60s,腐蚀后的样品用去离子水清洗后用N2吹干。
E. 制备肖特基(Schottky)接触电极及后退火:采用离子溅射仪在样品表面沉积金电极,在样品表面放置孔洞直径为1mm的圆形电极掩膜版,溅射离子流为1~5mA,溅射时间10~30分钟;紧接着制备完电极后,再1Pa以下真空退火中200~350°C退火10~30分钟。
本发明是基于CdZnTe薄膜的X射线探测器,其特点在于,采用近空间升华方法制备的CdZnTe薄膜,制备出的薄膜具有较高的电阻率,较好的X射线能谱响应,薄膜的厚度为50~500mm,同现有技术相比,本发明具有如下显著优点:
近空间升华法(CSS)是一种实用性薄膜生长的工艺,已在CdTe薄膜制备上已经得到应用。近空间升华法CdZnTe薄膜制备工艺相比CdZnTe单晶生长工艺简单、成本更低、可大面积制备、批量生长可行性高。
制备接触电极前的表面处理,直接影响了金半接触的类型,本发明采用的表面处理工艺可以制得理想的肖特基(Schottky)整流电极接触,大幅减小了期间的漏电流,比常规的X射线探测器有更小的漏电流和更好的能谱响应。
附图说明
图1为本发明基于CdZnTe薄膜的X射线探测器的结构图。
具体实施方式
下面结合实施例对本发明进行详细说明:
实施例一 具体步骤如下:
A.CdZnTe单晶升华源的准备:根据已知的先有技术,将高纯Cd、Zn、Te放入石英管中,在高真空下,采用移动加热法生长出质量好、成分分布相对均匀的CdZnTe单晶体,其中锌的摩尔含量为4%,将生长好的晶体切片作为升华源。
B.衬底预处理:采用镀有透明导电层ITO的玻璃作为衬底,将衬底用去离子水、丙酮和乙醇分别超声清洗15分钟,洗去表面的杂质与有机物,烘干后放入近空间升华反应室内。
C.CdZnTe薄膜生长过程:开机械泵抽真空,将升华腔内气压抽至1Pa以下后关闭机械泵,通入氩气将气压调至12Pa,关闭气瓶;将升华源及衬底分别加热到650℃和500℃保持不变,生长30min后关闭加热源,开机械泵抽真空至气压为10Pa以下,关机械泵,待样品冷却至室温,取出样品。
D.CdZnTe薄膜退火及腐蚀:将样品在真空0.5Pa中250°C退火30min;配制摩尔浓度为0.1%的溴甲醇溶液以及0.2%的重铬酸钾和硫酸混合溶液,将退过火的样品浸入溶液腐蚀30s。
E.制备肖特基(Schottky)接触电极及后退火:在样品表面放置孔洞直径为1mm的圆形电极掩膜版,并放入溅射室,溅射离子流为1mA,溅射时间20分钟;紧接着在1Pa真空退火中200°C退火20分钟。获得厚度为200μm,40V时漏电流密度为15nA/cm2的X射线探测器。
实施例二
A. CdZnTe单晶升华源的准备:根据已知的先有技术,将高纯Cd、Zn、Te放入石英管中,在高真空下,采用移动加热法生长出质量好、成分分布相对均匀的CdZnTe单晶体,其中锌的摩尔含量为4%,将生长好的晶体切片作为升华源;
B. 衬底预处理:采用普通钠钙玻璃玻璃作为衬底,将衬底用去离子水、丙酮和乙醇分别超声清洗15分钟,洗去表面的杂质与有机物,烘干后放入近空间升华反应室内;
C. CdZnTe薄膜生长过程:开机械泵抽真空,将升华腔内气压抽至1Pa以下后关闭机械泵,通入氩气将气压调至25Pa,关闭气瓶;将升华源及衬底分别加热到650℃和500℃保持不变,生长60min后关闭加热源,开机械泵抽真空至气压为10Pa以下,关机械泵,待样品冷却至室温,取出样品;
D. CdZnTe薄膜退火及腐蚀:将样品在真空0.4Pa中250°C退火25min;配制摩尔浓度为0.1%的溴甲醇溶液以及0.2%的重铬酸钾和硫酸混合溶液,将退过火的样品浸入溶液腐蚀40s;
E. 制备肖特基(Schottky)接触电极及后退火:在样品表面放置孔洞直径为1mm的圆形电极掩膜版,并放入溅射室,溅射离子流为1mA,溅射时间20分钟;紧接着在1Pa真空退火中250°C退火20分钟。获得厚度为400μm,40V时漏电流密度为18nA/cm2的X射线探测器。
Claims (1)
1.一种基于CdZnTe薄膜的X射线探测器的制备方法,其特征在于该方法具有以下步骤:
A. CdZnTe单晶升华源的准备:将高纯Cd、Zn、Te放入石英管中,在高真空下,采用移动加热法生长出质量好、成分分布相对均匀的CdZnTe单晶体,其中锌的摩尔含量为2~20%,将生长好的晶体切片作为升华源;
B. 衬底预处理:采用镀有透明导电层ITO玻璃或普通钠钙玻璃作为衬底,将衬底用去离子水、丙酮和乙醇分别超声清洗5~15分钟,洗去表面的杂质与有机物,烘干后放入近空间升华反应室内;
C. CdZnTe薄膜生长过程:开机械泵抽真空,将升华腔内气压抽至1Pa以下后关闭机械泵,通入氩气将气压调至10~100Pa,关闭气瓶;将升华源及衬底分别加热到500~650℃和400~550℃;生长30min~180min后开机械泵抽真空至气压为10Pa以下,关机械泵,待样品冷却至室温,取出CdZnTe薄膜样品,薄膜厚度50-500mm;
D. CdZnTe薄膜退火及腐蚀:将样品在1Pa以下的真空升华腔中200~350°C退火20~60分钟;配制摩尔浓度为0.1~0.5%的溴甲醇溶液以及重铬酸钾和硫酸混合溶液,将退过火的样品依此浸入两种溶液腐蚀10~60s,腐蚀后的样品用去离子水清洗后用N2吹干;
E. 制备肖特基(Schottky)接触电极及后退火:采用离子溅射仪在样品表面沉积金电极,在样品表面放置孔洞直径为1mm的圆形电极掩膜版,溅射离子流为1~5mA,溅射时间10~30分钟;紧接着制备完电极后,再1Pa以下真空退火中200~350°C退火10~30分钟。
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Cited By (6)
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CN104952972A (zh) * | 2015-04-14 | 2015-09-30 | 上海大学 | 自支撑CdZnTe薄膜的制备方法 |
CN105161565A (zh) * | 2015-06-29 | 2015-12-16 | 上海大学 | 含有石墨烯过渡层的CdZnTe光电探测器及其制备方法 |
CN107170853A (zh) * | 2017-05-08 | 2017-09-15 | 上海大学 | 一种复合结构的GaN/CdZnTe薄膜紫外光探测器的制备方法 |
CN110148627A (zh) * | 2019-04-28 | 2019-08-20 | 上海大学 | 具有金属缓冲层的czt薄膜复合材料及其制备方法 |
CN112103350A (zh) * | 2020-08-19 | 2020-12-18 | 上海大学 | 具有复合钝化层的czt膜复合材料、核辐射探测器件及其制备方法 |
CN113113508A (zh) * | 2021-03-17 | 2021-07-13 | 西北工业大学 | 条形电极结构的电流型CdZnTe探测器及其制备方法 |
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CN103500776A (zh) * | 2013-09-26 | 2014-01-08 | 上海大学 | 一种硅基CdZnTe薄膜紫外光探测器的制备方法 |
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CN103500776A (zh) * | 2013-09-26 | 2014-01-08 | 上海大学 | 一种硅基CdZnTe薄膜紫外光探测器的制备方法 |
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CN104952972A (zh) * | 2015-04-14 | 2015-09-30 | 上海大学 | 自支撑CdZnTe薄膜的制备方法 |
CN105161565A (zh) * | 2015-06-29 | 2015-12-16 | 上海大学 | 含有石墨烯过渡层的CdZnTe光电探测器及其制备方法 |
CN107170853A (zh) * | 2017-05-08 | 2017-09-15 | 上海大学 | 一种复合结构的GaN/CdZnTe薄膜紫外光探测器的制备方法 |
CN107170853B (zh) * | 2017-05-08 | 2019-02-22 | 上海大学 | 一种复合结构的GaN/CdZnTe薄膜紫外光探测器的制备方法 |
CN110148627A (zh) * | 2019-04-28 | 2019-08-20 | 上海大学 | 具有金属缓冲层的czt薄膜复合材料及其制备方法 |
CN112103350A (zh) * | 2020-08-19 | 2020-12-18 | 上海大学 | 具有复合钝化层的czt膜复合材料、核辐射探测器件及其制备方法 |
CN113113508A (zh) * | 2021-03-17 | 2021-07-13 | 西北工业大学 | 条形电极结构的电流型CdZnTe探测器及其制备方法 |
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