CN103904007B - Cleaning device - Google Patents
Cleaning device Download PDFInfo
- Publication number
- CN103904007B CN103904007B CN201310736966.7A CN201310736966A CN103904007B CN 103904007 B CN103904007 B CN 103904007B CN 201310736966 A CN201310736966 A CN 201310736966A CN 103904007 B CN103904007 B CN 103904007B
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- China
- Prior art keywords
- mentioned
- plate workpiece
- cleaning
- clamp
- clamp arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 71
- 239000012530 fluid Substances 0.000 claims abstract description 20
- 230000000630 rising effect Effects 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 12
- 239000007921 spray Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 4
- 230000007423 decrease Effects 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of cleaning device, in the cleaning device of edge clamped-in style, realize the holdings actuating mechanism of the release of the holding and the holding that carry out plate workpiece and make to prevent the control facilitation for the up and down action mechanism for preventing cover up and down motion of dispersing that the cleaning fluid in cleaning process disperses.On cleaning device（1）, starting to clean plate workpiece（W）When, prevent cover when making to disperse（5）After rising, clamp arm（27）Pass through spring（28）Force make maintaining part（271）Clamp and keep being positioned over the plate workpiece of interim placement section temporarily（W）Periphery, after cleaning terminates, when make to disperse prevent cover decline after, press section（52）Press service portion（272）, thus, maintaining part is mobile to the outer circumferential side of plate workpiece and discharges plate workpiece.It therefore, there is no need to be respectively arranged to clamp the mechanism of plate workpiece and prevent mechanism that cover moves up and down for making to disperse and act each of which, actuating mechanism portion can be reduced.
Description
Technical field
The present invention relates to the cleaning device cleaned to plate workpieces such as semiconductor wafers.
Background technology
When implementing attrition process to plate workpieces such as semiconductor wafers, because lapping rejects etc. is attached on plate workpiece,
Therefore after grinding, it is necessary to spray cleaning fluid to plate workpiece to be cleaned using cleaning device.
, it is necessary to there is the holding structure for keeping the plate workpiece as cleaning object in the cleaning device of cleaning plate workpiece
Part, but holding member as being used as has：Suction keeps the holding workbench of plate workpiece lower surface；And keep tabular
The edge clamping device of the periphery of workpiece.When the two sides of the plate workpiece to ensure that thickness to a certain degree is cleaned,
The edge clamping device of the peripheral part of plate workpiece is kept to be used（For example, referring to patent document 1）.
Prior art literature
Patent document 1：Japanese Unexamined Patent Publication 11-031643 publications
But edge clamping device has：Actuating mechanism is kept, it is used to carry out the holding of plate workpiece and releasing for holding
Put；And mechanism is moved up and down, what it was used to making to prevent the cleaning fluid in cleaning process from dispersing, which disperses, prevents cover from moving up and down, and needs
The two actuating mechanisms are respectively controlled.
The content of the invention
The present invention be in view of so the problem of and the invention completed, problem of the invention are that clamped-in style is clear at edge
In cleaning device, make holding actuating mechanism and move up and down mechanism control facilitation, wherein it is described holding actuating mechanism be used for into
The release of holding and the holding of row plate workpiece, the up and down action mechanism are used to make to prevent the cleaning fluid in cleaning process from dispersing
Disperse and prevent cover from moving up and down.
Cleaning device of the present invention with lower part at least by being formed：Clamping component, it is used to clamping and keeping disk
The periphery of the plate workpiece of shape；Rotating member, the plate workpiece that it makes to be kept by above-mentioned clamping component is with by above-mentioned tabular work
Rotated centered on the rotary shaft at the center of part；Cleaning element, it is used to come pair to the above-mentioned plate workpiece jet cleaning liquid of rotation
Above-mentioned plate workpiece is cleaned；Dispersing prevents cover, above-mentioned to fly when by above-mentioned cleaning element to clean above-mentioned plate workpiece
Dissipating prevents cover from preventing dispersing for above-mentioned cleaning fluid；And component is moved up and down, it is used to make above-mentioned disperse prevent cover from moving up and down,
Above-mentioned cleaning device is characterised by that above-mentioned clamping component with lower part by being formed：Clamp base, it connects with above-mentioned rotary shaft
Connect；Clamp arm, it is at least configured with 3 with the angle of equalization centered on above-mentioned rotary shaft in above-mentioned clamp base, and
With fulcrum, force and application point；Interim placement section, it is configured at above-mentioned clamp base, for the outer of accommodating plate-shaped workpiece
All lower surfaces are to place the plate workpiece temporarily, and above-mentioned clamp arm is supported for rotate by fulcrum of central portion, above-mentioned folder
Tight arm with lower part by being formed：Maintaining part, it is located at the above-mentioned fulcrum of ratio of above-mentioned clamp arm one end by the top and as effect
Point, for clamping the periphery of plate workpiece；Service portion, it is located at the other end of the above-mentioned fulcrum of ratio of above-mentioned clamp arm on the lower,
And as the force of external force is born, for being opened and closed above-mentioned maintaining part；And spring, it is by putting on above-mentioned clamp arm
Elastic force makes the periphery of above-mentioned maintaining part clamping plate workpiece, and above-mentioned disperse prevents cover to have：The preventing portion of dispersing of ring-type, it is surrounded
Above-mentioned clamping component；And press section, it pushes the above-mentioned of above-mentioned clamp arm when by above-mentioned up and down action component to decline
Service portion, when starting to clean plate workpiece, above-mentioned disperse is set to prevent cover from rising, the force that above-mentioned clamp arm passes through above-mentioned spring
And clamp above-mentioned maintaining part and be maintained at the periphery for the plate workpiece that above-mentioned interim placement section is placed temporarily, terminate in cleaning
Afterwards, above-mentioned disperse is made to prevent cover from declining, above-mentioned press section pushes above-mentioned service portion, and thus, above-mentioned maintaining part is to plate workpiece
Outer circumferential side is mobile and discharges plate workpiece, and above-mentioned plate workpiece is positioned over into above-mentioned interim placement section temporarily.
In above-mentioned cleaning device, it is preferred that all parts for forming clamping component are formed by electroconductive component.Separately
Outside, it is preferred that cleaning element includes：First washer jet, it sprays to the upper surface of the plate workpiece kept by clamping component
Penetrate cleaning fluid；And second washer jet, its lower surface jet cleaning liquid to plate workpiece.
Invention effect
In the cleaning device of the present invention, dispersing prevents cover to have：The preventing portion of dispersing of ring-type, it surrounds clamping component；
And press section, it pushes the service portion of clamp arm when by moving up and down component to decline, and is starting to clean plate workpiece
When, when make to disperse prevent cover rise after, clamp arm is positioned over temporarily by the force of spring clamp maintaining part and keep
The periphery of the plate workpiece of interim placement section, after cleaning terminates, when make to disperse prevent that cover from declining after, press section suppressing action
Portion, thus, maintaining part are moved so as to discharge plate workpiece to the outer circumferential side of plate workpiece.It therefore, there is no need to be respectively arranged to
Clamp the mechanism of plate workpiece and prevent mechanism that cover moves up and down for making to disperse and act each of which, can reduce dynamic
Make mechanism part, and stroke defect can be prevented.
Brief description of the drawings
Fig. 1 is the longitudinal section for an example for representing cleaning device.
Fig. 2 is to represent the clamping component of cleaning device and disperse to prevent the top view of cover.
Fig. 3 is that schematically enlarged representation does not keep clamping component in the state of plate workpiece and dispersed to prevent cover
A part sectional view.
Fig. 4 is the longitudinal section for representing the cleaning device in the state of clamping component is clamped plate workpiece.
Fig. 5 is that schematically enlarged representation maintains the clamping component in the state of plate workpiece and dispersed and prevents cover
The sectional view of a part.
Label declaration
1：Cleaning device
2：Clamping component
20：Clamp base 200：Second washer jet
21：Edge fixed part 22：Interim placement section
22A：Lift Part 23：Lifter plate
26：Basal part 260：Axle portion（Fulcrum）
27：Clamp arm
270：Recess 271：Maintaining part（Application point） 272：Service portion（Force） 273：Bar
28：Spring
29：Support member 290：Internal perisporium 291：Periphery wall 292：Bottom plate 293：Recess
3：Rotating member
30：Rotary shaft 300：Fluid path
31：Motor 310：Power supply 311：Encoder
4：Cleaning element
40：Container 41：First washer jet
5：Dispersing prevents cover
50：Preventing portion of dispersing 51：By fixed part 52：Press section
6：Move up and down component 60：Bar 61：Cylinder
7：Sensor
Embodiment
Cleaning device 1 shown in Fig. 1 is to maintain and cleaned the device for the plate workpiece W for being formed as discoid, cleaning dress
Putting 1 has：Clamping component 2, it is used to clamp and keeps discoid plate workpiece W periphery；Rotating member 3, it is used to make
It is clamped the plate workpiece W rotations that component 2 is kept；Cleaning element 4, it is used to spray cleaning fluid to the plate workpiece W of rotation；Fly
Dissipating prevents cover 5, and when being cleaned by cleaning element 4 to plate workpiece, this, which disperses, prevents cover 5 from preventing cleaning fluid from dispersing；With
And component 6 is moved up and down, it is used to make to disperse to prevent cover 5 from moving up and down.
Clamping component 2 has the clamp base 20 for being formed as circular as shown in Figure 2.Arranged in the outer circumferential side of clamp base 20
There is the edge fixed part 21 at fixed plate workpiece W edge.As shown in Fig. 2 circumference of the edge fixed part 21 along clamp base 20
Equally spaced at least it is equipped three.
As shown in figure 1, interim placement section 22 is equipped above the peripheral end of clamp base 20, the interim placement section 22
Accommodating plate-shaped workpiece W periphery lower surface from below.As shown in Fig. 2 between circumference of the interim placement section 22 along clamp base 20 waits
Three are at least equipped every ground, and is disposed in the centre of edge fixed part 21.
As shown in figure 1, cleaning element 4 is disposed in the top for the plate workpiece W that clamped component 2 clamps, the cleaning element 4
With storage cleaning fluid container 40 and downwards ejection cleaning fluid the first washer jet 41.
The central lower of clamp base 20 is connected with forming the rotary shaft 30 of rotating member 3.Rotary shaft 30 connects with motor 31
Connect, the rotation driving rotary shaft 30 of motor 31 and clamp base 20.In addition, motor 31 connects with power supply 310 and encoder 311
Connect.The center of rotary shaft 30 is consistent with the center for the plate workpiece W that clamped component 2 is kept.
In the fluid path 300 being internally formed for passing through for cleaning fluid of rotary shaft 30.Liquid can be imported from liquid
Mouth 301 imported into fluid path 300.Center of the fluid path 300 by clamp base 20 and the second washer jet with being positioned above
200 connections, the liquid imported from liquid inlet port 301 are sprayed upward from the second washer jet 200.
Support member 29 is equipped with around rotary shaft, the support member 29 from below supports clamp base 20 as energy
Enough rotations.Support member 29 has the internal perisporium 290 and periphery wall 291 for erecting and being provided in round, and the support member 29 is formed as
The lower end of internal perisporium 290 and the lower end of periphery wall 291 are by the bottom plate 292 of ring-type and the shape that connects.By internal perisporium 290, outside
The space that perisporium 291, bottom plate 292 surround forms recess 293, can accumulate used cleaning fluid in recess 293.
Lift Part 22A runs through bottom plate 292, and dispersing prevents cover 5 is screwed to be fixed on the upper of Lift Part 22A
End.On the other hand, Lift Part 22A lower end is connected with lifter plate 23, and lifter plate 23 is driven by up and down action component 6 and can
Lifting.Component 6 is moved up and down by being formed with lower part：Bar 60, it is connected with lifter plate 23；And cylinder 61, it makes 60 liters of bar
Drop.
As shown in figure 1, dispersing prevents cover 5 to have：Cap assembly is preventing portion 50 of dispersing, and it is formed as from outer circumferential side around folder
The ring-type of tight component 2 and towards inner circumferential side up- wards inclination；And by fixed part 51, it is fixed on Lift Part 22A.Dispersing prevents
Cover 5 is driven and can be lifted by up and down action component 6.
As shown in figure 3, edge fixed part 21 has：Basal part 26, it is fixed on clamp base 20；And clamp arm 27,
Its central portion is supported for rotate centered on axle portion 260 by basal part 26.
Clamp arm 27 at least configures three along the circumferential angle with equalization of the clamp base 20 centered on rotary shaft 30,
Clamp arm 27 be respectively formed as it is long in the longer i.e. longitudinal direction of substantially vertical direction, the lower section of axle portion 260 clamp arm 27 clamping
The face of the side of pedestal 20 is formed with recess 270.In maintaining part 271 of the upper end of clamp arm 27 formed with concave shape, the holding
Portion 271 has with the inclined-plane for leaving and rising from the side of clamp base 20.Maintaining part 271 is formed at the ratio fulcrum of clamp arm 27 i.e.
The one end of axle portion 260 by the top, the maintaining part 271 turns into clamps plate workpiece by the rotation centered on axle portion 260
The application point of periphery.In addition, clamp arm 27 the underlying other end formed with：Service portion 272, it dashes forward to outer peripheral side
Go out, and as the force of external force is born, rotate clamp arm 27 so that maintaining part 271 is opened and closed；And bar 273, it is downwards
It is prominent.
A side of spring 28 is accommodated with basal part 26, spring 28 is accommodated with the recess 270 of clamp arm 27
Another side, the bottom of clamp arm 27 are exerted a force by spring 28 by the outer circumferential side towards clamp base 20.Spring 28 is right
The periphery that clamp arm 27 exerts a force and makes maintaining part 271 clamp plate workpiece by elastic force.
The sensor 7 of the state of detection clamp arm 27 is equipped in the lower section of clamp arm 27.As shown in figure 3, sensor 7
The sensor of optical profile type in this way, the sensor 7 can whether there is in the surface of sensor 7 according to bar 273, to clamp arm 27
The edge for whether being clamped plate workpiece W is judged.
Form all parts of clamping component 2, i.e. at least clamp base 20, edge fixed part 21 and interim placement section
22 are formed by electroconductive component, in the case that plate workpiece W has electrostatic when in cleaning, can bleed off the electrostatic.
In the end for preventing portion 50 of dispersing formed with press section 52, the press section 52 prevents cover 5 from have dropped at present dispersing
Press the service portion 272 of clamp arm 27.
In plate workpiece W cleaning, as shown in figure 4, first, by the way that plate workpiece W is loaded into interim placement section 22
On, plate workpiece W is positioned in clamp base 20 temporarily.
When starting that cleaning is interim to be positioned over the plate workpiece W in clamp base 20, moving up and down component 6 and making to disperse prevents
Cover 5 rises, and the preventing portion 50 that makes to disperse is moved to the position that can prevent that cleaning fluid from dispersing to outer peripheral side.
When disperse prevent that cover 5 from rising after, as shown in figure 5, the active force for passing through spring 28 due to the bottom of clamp arm 27
And be pressed, therefore clamp arm 27 is rotated centered on axle portion 260, the maintaining part 271 of one end of clamp arm 27 is clamped and kept
Plate workpiece W periphery.When maintaining part 271 clamps plate workpiece W periphery, plate workpiece W is by along maintaining part 271
Inclined-plane slightly rises and left from interim placement section 22, and the state that plate workpiece W is loaded into interim placement section 22 is released from.This
Sample, prevent cover 5 from rising by dispersing, clamp arm 27 links, so as to automatically clamp plate workpiece W by clamping component 2, because
This, it is not necessary to it is respectively arranged to clamp the mechanism of plate workpiece and prevents mechanism that cover moves up and down for making to disperse and make it
Each action.In addition, by that need not control respectively, the stroke defect of device can be prevented.
When the maintaining part 271 of clamp arm 27 clamps plate workpiece W periphery, bar 273 as shown in Figure 5 is located at sensor 7
Surface.When sensor 7, which detects rod 273, is present in the surface of sensor 7, it is determined as that clamp arm 27 is clamped tabular
Workpiece W edge.On the other hand, when sensor 7 can not detect bar 273, it is determined as that clamp arm 27 does not have for some reason
Have and carry out desired rotation without clamping plate workpiece W, so as to not start plate workpiece W cleaning.So, by using
Sensor 7 detects the state of clamp arm 27, can reliably prevent from starting in the state of no holding plate workpiece W clear
Wash.
When plate workpiece W, which is clamped component 2, to be kept, the rotating member 3 shown in Fig. 4 rotates clamp base 20, and
From the jet cleaning liquid of the first washer jet 41 for forming cleaning element 4, so as to clean plate workpiece W upper surface.In addition, liquid
It is imported into the fluid path 300 for the inside for being formed at rotary shaft 30 from liquid inlet port 301, the liquid is from the second washer jet 200
Spray upward, so as to clean plate workpiece W lower surface.
After cleaning terminates, prevent cover 5 from declining as shown in figure 1, moving up and down component 6 and making to disperse.Then, by by pressing
Portion 52 comes suppressing action portion 272, and maintaining part 271 is moved so as to discharge plate workpiece W clamping shape to plate workpiece W outer circumferential side
State.Now, inclined-planes of the plate workpiece W along maintaining part 271 slightly declines, and interim placement section is positioned over temporarily so as to return to
State on 22.
Claims (3)
1. a kind of cleaning device, above-mentioned cleaning device with lower part at least by being formed：Clamping component, it is used to clamp and keeps round
The periphery of the plate workpiece of plate-like；Rotating member, the plate workpiece that it makes to be kept by above-mentioned clamping component is with by above-mentioned tabular
Rotated centered on the rotary shaft at the center of workpiece；Cleaning element, it is used to come to the above-mentioned plate workpiece jet cleaning liquid of rotation
Above-mentioned plate workpiece is cleaned；Dispersing prevents cover, above-mentioned when by above-mentioned cleaning element to clean above-mentioned plate workpiece
Dispersing prevents cover from preventing dispersing for above-mentioned cleaning fluid；And component is moved up and down, it is used to make above-mentioned disperse prevent from moving down on cover
It is dynamic,
Above-mentioned cleaning device is characterised by,
Above-mentioned clamping component with lower part by being formed：Clamp base, itself and above-mentioned rotation axis connection；Clamp arm, it is with above-mentioned rotation
3 are at least configured with above-mentioned clamp base with the angle of equalization centered on rotating shaft, and there is fulcrum, force and effect
Point；Interim placement section, it is configured at above-mentioned clamp base, and the periphery lower surface for accommodating plate-shaped workpiece is above-mentioned to place temporarily
Plate workpiece,
Above-mentioned clamp arm is supported for rotate by fulcrum of central portion, and above-mentioned clamp arm with lower part by being formed：Maintaining part,
It is located at the above-mentioned fulcrum of ratio of above-mentioned clamp arm one end by the top and turns into application point, for clamping the periphery of plate workpiece；
Service portion, it is located at the other end of the above-mentioned fulcrum of ratio of above-mentioned clamp arm on the lower, and as the force of external force is born, for making
Above-mentioned maintaining part opening and closing；Spring, it makes above-mentioned maintaining part clamp plate workpiece by putting on the elastic force of above-mentioned clamp arm
Periphery；And bar, the bar protrude downwards compared with above-mentioned fulcrum,
Above-mentioned cleaning device has sensor, and the sensor whether there is in surface according to above-mentioned bar, judge above-mentioned clamp arm
Whether the periphery of plate workpiece is clamped,
Above-mentioned disperse prevents cover to have：The preventing portion of dispersing of ring-type, it surrounds above-mentioned clamping component；And press section, it is logical
The above-mentioned service portion of above-mentioned clamp arm is pushed when crossing above-mentioned up and down action component and declining,
Start clean plate workpiece when, make above-mentioned disperse prevent cover from rising, above-mentioned clamp arm by the force of above-mentioned spring and
Clamp above-mentioned maintaining part and be maintained at the periphery for the plate workpiece that above-mentioned interim placement section is placed temporarily, when the sensor is examined
When measuring above-mentioned bar and being present in the surface of the sensor, it is judged to being clamped the periphery of plate workpiece, cleans plate workpiece,
After cleaning terminates, above-mentioned disperse is set to prevent cover from declining, above-mentioned press section pushes above-mentioned service portion, and thus, above-mentioned maintaining part is to plate
The outer circumferential side of shape workpiece is mobile and discharges plate workpiece, and above-mentioned plate workpiece is positioned over into above-mentioned interim placement section temporarily.
2. cleaning device according to claim 1, it is characterised in that
All parts for forming above-mentioned clamping component are formed by electroconductive component.
3. cleaning device according to claim 1, it is characterised in that
Above-mentioned cleaning element includes：First washer jet, it sprays to the upper surface of the plate workpiece kept by above-mentioned clamping component
Penetrate cleaning fluid；And second washer jet, its lower surface jet cleaning liquid to above-mentioned plate workpiece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-284763 | 2012-12-27 | ||
| JP2012284763A JP6068975B2 (en) | 2012-12-27 | 2012-12-27 | Cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103904007A CN103904007A (en) | 2014-07-02 |
| CN103904007B true CN103904007B (en) | 2018-01-23 |
Family
ID=50995271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310736966.7A Active CN103904007B (en) | 2012-12-27 | 2013-12-26 | Cleaning device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6068975B2 (en) |
| KR (1) | KR102058754B1 (en) |
| CN (1) | CN103904007B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105222562A (en) * | 2015-09-22 | 2016-01-06 | 桂林市鑫隆机电工程有限责任公司 | A kind of flusher of drying equipment |
| JP6554392B2 (en) * | 2015-11-12 | 2019-07-31 | 株式会社ディスコ | Spinner device |
| KR101770221B1 (en) * | 2016-05-03 | 2017-08-22 | (주)에스티아이 | Substrate holding apparatus |
| CN112230006A (en) * | 2020-09-30 | 2021-01-15 | 柳州市妇幼保健院 | Urine detection equipment |
| CN112103239B (en) * | 2020-11-23 | 2021-02-12 | 西安奕斯伟硅片技术有限公司 | Device for clamping silicon wafer in visual detection process of silicon wafer |
| CN114203600A (en) * | 2021-12-14 | 2022-03-18 | 北京烁科精微电子装备有限公司 | Workpiece processing device and CMP (chemical mechanical polishing) post-cleaning equipment with same |
| CN115090458A (en) * | 2022-08-29 | 2022-09-23 | 深圳市圭华智能科技有限公司 | Semiconductor laser cutting spouts gluey coating subassembly |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3831043B2 (en) * | 1997-01-24 | 2006-10-11 | 東京エレクトロン株式会社 | Rotation processing device |
| KR200238129Y1 (en) | 1998-12-28 | 2001-11-15 | 김영환 | Apparatus for removing particle on back side of wafer in semiconductor wafer cleaner |
| JP2007049005A (en) * | 2005-08-11 | 2007-02-22 | Speedfam Co Ltd | Workpiece holding device for spin dryer |
| TWI373804B (en) * | 2007-07-13 | 2012-10-01 | Lam Res Ag | Apparatus and method for wet treatment of disc-like articles |
| JP5327144B2 (en) * | 2010-06-16 | 2013-10-30 | 東京エレクトロン株式会社 | Processing apparatus and processing method |
| JP6091060B2 (en) | 2011-12-02 | 2017-03-08 | 芝浦メカトロニクス株式会社 | Spin processing device |
-
2012
- 2012-12-27 JP JP2012284763A patent/JP6068975B2/en active Active
-
2013
- 2013-12-10 KR KR1020130152861A patent/KR102058754B1/en active IP Right Grant
- 2013-12-26 CN CN201310736966.7A patent/CN103904007B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103904007A (en) | 2014-07-02 |
| JP6068975B2 (en) | 2017-01-25 |
| KR102058754B1 (en) | 2019-12-23 |
| KR20140085308A (en) | 2014-07-07 |
| JP2014127638A (en) | 2014-07-07 |
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