JP2014127638A - Cleaning device - Google Patents

Cleaning device Download PDF

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JP2014127638A
JP2014127638A JP2012284763A JP2012284763A JP2014127638A JP 2014127638 A JP2014127638 A JP 2014127638A JP 2012284763 A JP2012284763 A JP 2012284763A JP 2012284763 A JP2012284763 A JP 2012284763A JP 2014127638 A JP2014127638 A JP 2014127638A
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Prior art keywords
plate
workpiece
cleaning
clamp
holding
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JP2012284763A
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JP6068975B2 (en
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Yasutomo Kimura
康友 木村
Hiroshi Yoshimura
寛 吉村
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2012284763A priority Critical patent/JP6068975B2/en
Priority to KR1020130152861A priority patent/KR102058754B1/en
Priority to CN201310736966.7A priority patent/CN103904007B/en
Publication of JP2014127638A publication Critical patent/JP2014127638A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To facilitate control of a holding operation mechanism for holding and releasing a plate work and a vertical operation mechanism for vertically moving a splash prevention cover for preventing splash of a cleaning fluid during cleaning, in an edge-clamp type cleaning device.SOLUTION: In a cleaning device 1, when a splash prevention cover 5 is moved up in starting cleaning of a plate work W, a clamp arm 27 clamps and holds the outer periphery of the plate work W which is temporarily placed in a temporary placement part, with a holding part 271 by energization of a spring section 28. When the splash prevention cover 5 is moved down after the end of cleaning, a pressing section 52 presses an acting part 272, such that the holding part 271 is moved to the outer peripheral side of the plate work W and releases the plate work W. Therefore, it is not necessary to individually provide and individually operate a mechanism for clamping the plate work W and the splash prevention cover 5, thereby reducing the number of operational mechanism sections.

Description

本発明は、半導体ウェーハ等の板状ワークを洗浄する洗浄装置に関する。   The present invention relates to a cleaning apparatus for cleaning a plate-shaped workpiece such as a semiconductor wafer.

半導体ウェーハ等の板状ワークに対して研磨加工を施すと、研磨屑等が板状ワークに付着するため、研磨後は、洗浄装置を用いて板状ワークに洗浄液を吹き付けて洗浄を行う必要がある。   When polishing is performed on a plate-shaped workpiece such as a semiconductor wafer, polishing scraps adhere to the plate-shaped workpiece. Therefore, after polishing, it is necessary to clean the plate-shaped workpiece by spraying a cleaning liquid using a cleaning device. is there.

板状ワークを洗浄する洗浄装置においては、洗浄対象の板状ワークを保持する保持手段が必要となるが、かかる保持手段としては、板状ワークの下面を吸引保持する保持テーブルと、板状ワークの外周を保持するエッジクランプとがある。ある程度の厚みが確保されている板状ワークの両面を洗浄する場合は、板状ワークの外周部を保持するエッジクランプが使用される（例えば、特許文献１参照）。   In a cleaning apparatus for cleaning a plate-like workpiece, a holding means for holding the plate-like workpiece to be cleaned is required. As the holding means, a holding table for sucking and holding the lower surface of the plate-like workpiece, and a plate-like workpiece are included. There is an edge clamp that holds the outer periphery of the. When cleaning both surfaces of a plate-like workpiece having a certain thickness, an edge clamp that holds the outer periphery of the plate-like workpiece is used (for example, see Patent Document 1).

特開平１１−０３１６４３号公報Japanese Patent Laid-Open No. 11-031643

しかし、エッジクランプは、板状ワークの保持と保持の開放とを行う保持動作機構と、洗浄中における洗浄液の飛散を防止する飛散防止カバーを上下動させる上下動作機構とを備えており、これら２つの動作機構を個別に制御させる必要があった。   However, the edge clamp includes a holding operation mechanism that holds and releases the plate-like workpiece, and a vertical operation mechanism that moves the scattering prevention cover up and down to prevent the cleaning liquid from scattering during cleaning. It was necessary to control each operating mechanism individually.

本発明は、このような問題にかんがみなされたもので、エッジクランプ式の洗浄装置において、板状ワークの保持と保持の開放とを行う保持動作機構及び洗浄中における洗浄液の飛散を防止する飛散防止カバーを上下動させる上下動作機構の制御を容易化することを課題とする。   The present invention has been considered in view of such a problem, and in an edge clamp type cleaning apparatus, a holding operation mechanism for holding and releasing a plate-like workpiece, and scattering prevention for preventing scattering of cleaning liquid during cleaning. It is an object of the present invention to facilitate control of a vertical movement mechanism that moves a cover up and down.

本発明は、円盤状の板状ワークの外周をクランプして保持するクランプ手段と、クランプ手段によって保持された板状ワークを板状ワークの中心を通る回転軸を中心に回転させる回転手段と、回転する板状ワークに洗浄液を噴射して板状ワークを洗浄する洗浄手段と、板状ワークを洗浄手段によって洗浄する際に洗浄液の飛散を防止する飛散防止カバーと、飛散防止カバーを上下に移動させる上下動作手段とから少なくとも構成される洗浄装置に関し、クランプ手段は、回転軸に連結されるクランプベースと、回転軸を中心として均等な角度でクランプベースに少なくとも３つ配置され支点と力点と作用点とを備えるクランプアームと、クランプベースに板状ワークの外周下面を支持して仮置きさせる仮置き部とから構成され、クランプアームは、中央部を支点として回転可能に支持され、支点より上方の一端が作用点となり板状ワークの外周をクランプする保持部と、他端が外力を受ける力点となり保持部を開閉させる作用部と、クランプアームに付勢されるバネ力によって保持部に板状ワークの外周をクランプさせるバネ部と、で構成され、飛散防止カバーは、クランプ手段を囲繞するリング状の飛散防止部と、上下動作手段によって下げられた時にクランプアームの作用部を押し下げる押下げ部と、を備え、板状ワークの洗浄開始時は、飛散防止カバーを上昇させ、クランプアームは、仮置き部に仮置きされる板状ワークの外周をバネ部の付勢によって保持部においてクランプして保持し、洗浄終了後は、飛散防止カバーを下降させ、押下げ部が作用部を押し下げることによって保持部が板状ワークの外周側に移動し板状ワークを開放するとともに板状ワークを仮置き部に仮置きする。   The present invention includes a clamping unit that clamps and holds the outer periphery of a disc-shaped plate-shaped workpiece, a rotating unit that rotates the plate-shaped workpiece held by the clamping unit around a rotation axis that passes through the center of the plate-shaped workpiece, A cleaning unit that sprays cleaning liquid onto the rotating plate-shaped workpiece to clean the plate-shaped workpiece, a scattering prevention cover that prevents the cleaning liquid from splashing when the plate-shaped workpiece is cleaned by the cleaning unit, and a scattering prevention cover that moves up and down The clamp means includes at least three clamp bases connected to the rotary shaft and at an equal angle around the rotary shaft, and the fulcrum, the force point, and the action. A clamp arm having a point, and a temporary placement part for temporarily placing the clamp base by supporting the lower surface of the outer periphery of the plate-like workpiece. Is supported rotatably around the center part, one end above the fulcrum serves as an action point and clamps the outer periphery of the plate-like workpiece, and the other end serves as a force point receiving external force and the action part opens and closes the holding part. A spring part that clamps the outer periphery of the plate-like workpiece on the holding part by a spring force biased by the clamp arm, and the anti-scatter cover includes a ring-like anti-scatter part that surrounds the clamp means, and a vertical movement A push-down part that pushes down the action part of the clamp arm when lowered by the means, and at the start of cleaning the plate-like workpiece, the scattering prevention cover is raised, and the clamp arm is temporarily placed on the temporary placement part. The outer periphery of the workpiece is clamped and held at the holding part by the bias of the spring part.After the cleaning is completed, the anti-scattering cover is lowered and the pushing part pushes down the acting part. Holding portion Te is temporarily placed temporary unit plate workpiece with opening the moving plate workpiece on the outer peripheral side of the plate-shaped workpiece.

上記洗浄装置においては、クランプ手段を構成するすべての部品が導電性部材で形成されることが望ましい。また、洗浄手段は、クランプ手段によって保持される板状ワークの上面に洗浄液を噴射する第１の洗浄ノズルと、板状ワークの下面に洗浄液を噴射する第２の洗浄ノズルとを含んで構成されることが望ましい。   In the cleaning apparatus, it is desirable that all the parts constituting the clamping means are formed of a conductive member. The cleaning means includes a first cleaning nozzle that injects the cleaning liquid onto the upper surface of the plate-like work held by the clamp means, and a second cleaning nozzle that injects the cleaning liquid onto the lower surface of the plate-like work. It is desirable.

本発明に係る洗浄装置では、飛散防止カバーが、クランプ手段を囲繞するリング状の飛散防止部と、上下動作手段によって下げられた時にクランプアームの作用部を押し下げる押下げ部とを備えており、板状ワークの洗浄開始時は、飛散防止カバーを上昇させると、クランプアームが仮置き部に仮置きされる板状ワークの外周をバネ部の付勢によって保持部においてクランプして保持し、洗浄終了後は、飛散防止カバーを下降させると、押下げ部が作用部を押し下げることによって保持部が板状ワークの外周側に移動し板状ワークを開放する。したがって、板状ワークをクランプするための機構と飛散防止カバーを上下動させるための機構とを個別に設けて個々に動作させる必要がなくなり、動作機構部を少なくすることができるとともに、動作ミスが発生するのを防止することができる。   In the cleaning device according to the present invention, the scattering prevention cover includes a ring-shaped scattering prevention portion that surrounds the clamp means, and a pressing portion that presses down the action portion of the clamp arm when lowered by the vertical movement means. At the start of cleaning of the plate workpiece, lift the anti-scattering cover and clamp the outer periphery of the plate workpiece on which the clamp arm is temporarily placed on the temporary placement portion by holding it in the holding portion by the urging force of the spring portion. After the completion, when the scattering prevention cover is lowered, the pressing part pushes down the action part, so that the holding part moves to the outer peripheral side of the plate-like work and opens the plate-like work. Therefore, there is no need to separately provide a mechanism for clamping the plate-shaped workpiece and a mechanism for moving the anti-scattering cover up and down, and the number of operation mechanisms can be reduced, and an operation error can be reduced. It can be prevented from occurring.

洗浄装置の一例を示す縦断面図である。It is a longitudinal cross-sectional view which shows an example of a washing | cleaning apparatus. 洗浄装置のクランプ手段及び飛散防止カバーを示す平面図である。It is a top view which shows the clamp means and scattering prevention cover of a washing | cleaning apparatus. 板状ワークを保持していない状態におけるクランプ手段及び飛散防止カバーの一部を拡大して略示的に示す断面図である。It is sectional drawing which expands and shows roughly a part of clamp means in the state which does not hold | maintain a plate-shaped workpiece, and a scattering prevention cover. クランプ手段が板状ワークをクランプした状態の洗浄装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the washing | cleaning apparatus of the state which the clamp means clamped the plate-shaped workpiece. 板状ワークを保持した状態におけるクランプ手段及び飛散防止カバーの一部を拡大して略示的に示す断面図である。It is sectional drawing which expands and shows roughly a part of clamp means and scattering prevention cover in the state holding the plate-shaped workpiece.

図１に示す洗浄装置１は、円盤状に形成された板状ワークＷを保持して洗浄する装置であり、円盤状の板状ワークＷの外周をクランプして保持するクランプ手段２と、クランプ手段２によって保持された板状ワークＷを回転させる回転手段３と、回転する板状ワークＷに洗浄液を洗浄する洗浄手段４と、板状ワークを洗浄手段４によって洗浄する際に洗浄液の飛散を防止する飛散防止カバー５と、飛散防止カバー５を上下に移動させる上下動作手段６とを備えている。   A cleaning apparatus 1 shown in FIG. 1 is an apparatus that holds and cleans a disk-shaped workpiece W formed in a disk shape, and includes a clamp unit 2 that clamps and holds the outer periphery of the disk-shaped plate workpiece W, a clamp Rotating means 3 for rotating the plate-shaped workpiece W held by the means 2, cleaning means 4 for cleaning the cleaning liquid on the rotating plate-shaped workpiece W, and splashing of the cleaning liquid when cleaning the plate-shaped workpiece by the cleaning means 4 An anti-scattering cover 5 to be prevented and an up / down operation means 6 for moving the anti-scattering cover 5 up and down are provided.

クランプ手段２は、図２に示すように円形に形成されたクランプベース２０を備えている。クランプベース２０の外周側には、板状ワークＷのエッジを固定するエッジ固定部２１が配設されている。エッジ固定部２１は、図２に示すように、クランプベース２０の周方向に少なくとも３つ等間隔に配設されている。   As shown in FIG. 2, the clamp means 2 includes a clamp base 20 formed in a circular shape. An edge fixing portion 21 that fixes the edge of the plate-like workpiece W is disposed on the outer peripheral side of the clamp base 20. As shown in FIG. 2, at least three edge fixing portions 21 are arranged at equal intervals in the circumferential direction of the clamp base 20.

図１に示すように、クランプベース２０の外周端部上方には、板状ワークＷの外周下面を下方から支持する仮置き部２２が配設されている。図２に示すように、仮置き部２２は、クランプベース２０の周方向に少なくとも３つ等間隔に、かつ、エッジ固定部２１の中間に配設されている。   As shown in FIG. 1, a temporary placement portion 22 that supports the outer peripheral lower surface of the plate-like workpiece W from below is disposed above the outer peripheral end of the clamp base 20. As shown in FIG. 2, at least three temporary placement portions 22 are arranged at equal intervals in the circumferential direction of the clamp base 20, and in the middle of the edge fixing portion 21.

図１に示すように、洗浄手段４は、クランプ手段２によってクランプされた板状ワークＷの上方に配設されており、洗浄液を貯留するタンク４０と、洗浄液を下方に向けて噴出する第一の洗浄ノズル４１とを備えている。   As shown in FIG. 1, the cleaning means 4 is disposed above the plate-like workpiece W clamped by the clamp means 2, and a tank 40 that stores the cleaning liquid and a first jet that jets the cleaning liquid downward. The cleaning nozzle 41 is provided.

クランプベース２０の中心下部には、回転手段３を構成する回転軸３０が連結されている。回転軸３０は、モータ３１に連結されており、モータ３１は、回転軸３０及びクランプベース２０を回転駆動する。また、モータ３１には、電源３１０及びエンコーダ３１１が接続されている。回転軸３０の中心は、クランプ手段２によって保持される板状ワークＷの中心と一致する。   A rotating shaft 30 constituting the rotating means 3 is connected to the lower center of the clamp base 20. The rotating shaft 30 is connected to a motor 31, and the motor 31 rotationally drives the rotating shaft 30 and the clamp base 20. In addition, a power source 310 and an encoder 311 are connected to the motor 31. The center of the rotating shaft 30 coincides with the center of the plate-like workpiece W held by the clamping means 2.

回転軸３０の内部には、洗浄液を通すための液路３００が形成されている。液路３００には、液体導入口３０１から液体を導入することができる。この液路３００は、クランプベース２０の中心を通ってその上方に位置する第２の洗浄ノズル２００に連通しており、液体導入口３０１から導入された液体は、第２の洗浄ノズル２００から上方に向けて噴射される。   A liquid path 300 for allowing the cleaning liquid to pass therethrough is formed inside the rotary shaft 30. A liquid can be introduced into the liquid path 300 from the liquid inlet 301. The liquid path 300 communicates with the second cleaning nozzle 200 positioned above the center of the clamp base 20, and the liquid introduced from the liquid inlet 301 is upwardly moved from the second cleaning nozzle 200. It is injected toward

回転軸の周囲には、クランプベース２０を回転可能に下方から支持する受け部材２９が配設されている。受け部材２９は、円形に立設された内周壁２９０と外周壁２９１とを備え、内周壁２９０の下端と外周壁２９１の下端とがリング状の底板２９２によって連結された形状となっている。内周壁２９０と外周壁２９１と底板２９２とによって囲まれた空間は凹部２９３を形成しており、凹部２９３には使用済みの洗浄液を溜めておくことができる。   A receiving member 29 that supports the clamp base 20 from below so as to be rotatable is disposed around the rotation shaft. The receiving member 29 includes an inner peripheral wall 290 and an outer peripheral wall 291 erected in a circular shape. The lower end of the inner peripheral wall 290 and the lower end of the outer peripheral wall 291 are connected by a ring-shaped bottom plate 292. A space surrounded by the inner peripheral wall 290, the outer peripheral wall 291, and the bottom plate 292 forms a concave portion 293, and used cleaning liquid can be stored in the concave portion 293.

底板２９２には昇降部材２２が貫通しており、昇降部材２２の上端には飛散防止カバー５がネジ止めにより固定されている。一方、昇降部材２２の下端には昇降板２３が連結され、昇降板２３は、上下動作手段６によって駆動されて昇降可能となっている。上下動作手段６は、昇降板２３に連結されたロッド６０と、ロッド６０を昇降させるシリンダ６１とから構成されている。   The elevating member 22 passes through the bottom plate 292, and the scattering prevention cover 5 is fixed to the upper end of the elevating member 22 by screws. On the other hand, an elevating plate 23 is connected to the lower end of the elevating member 22, and the elevating plate 23 can be moved up and down by being driven by the vertical movement means 6. The vertical movement means 6 includes a rod 60 connected to the lifting plate 23 and a cylinder 61 that lifts and lowers the rod 60.

図１に示すように、飛散防止カバー５は、クランプ手段２を外周側から囲繞するリング状に形成され内周側に向けて上昇する傾斜を有するカバー部材である飛散防止部５０と、昇降部材２２に固定される被固定部５１とを備えている。飛散防止カバー５は、上下動作手段６によって駆動されて昇降可能となっている。   As shown in FIG. 1, the scattering prevention cover 5 includes a scattering prevention portion 50 that is a cover member that is formed in a ring shape surrounding the clamp means 2 from the outer peripheral side and has an inclination that rises toward the inner peripheral side, and an elevating member. And a fixed portion 51 fixed to 22. The anti-scattering cover 5 is driven by the vertical movement means 6 and can be moved up and down.

図３に示すように、エッジ固定部２１は、クランプベース２０に固定されたベース部２６と、中央部がベース部２６によって軸部２６０を中心として回転可能に支持されたクランプアーム２７とを備えている。   As shown in FIG. 3, the edge fixing portion 21 includes a base portion 26 fixed to the clamp base 20, and a clamp arm 27 whose central portion is rotatably supported by the base portion 26 around the shaft portion 260. ing.

クランプアーム２７は、回転軸３０を中心とするクランプベース２０の周方向に少なくとも３つ均等な角度で配置され、それぞれがほぼ鉛直方向縦長に形成されており、軸部２６０の下方であってクランプベース２０側の面に凹部２７０が形成されている。クランプアーム２７の上端部には、クランプベース２０側から離れるにつれて上昇する斜面を有する凹んだ形状の保持部２７１が形成されている。保持部２７１は、クランプアーム２７の支点である軸部２６０より上方の一端に形成されており、軸部２６０を中心とした回転により板状ワークの外周をクランプする作用点となる。また、クランプアーム２７の下方の他端には、外周側に突出し、外力を受ける力点となってクランプアーム２７を回転させて保持部２７１を開閉させる作用部２７２と、下方に突出したロッド２７３とが形成されている。   The clamp arm 27 is disposed at an equal angle in the circumferential direction of the clamp base 20 with the rotation shaft 30 as the center, and each of the clamp arms 27 is formed to be vertically long in the vertical direction. A recess 270 is formed on the surface on the base 20 side. At the upper end of the clamp arm 27, a recessed holding portion 271 having a slope that rises with increasing distance from the clamp base 20 side is formed. The holding portion 271 is formed at one end above the shaft portion 260 that is a fulcrum of the clamp arm 27, and serves as an action point for clamping the outer periphery of the plate-like workpiece by rotation around the shaft portion 260. Further, the other lower end of the clamp arm 27 protrudes to the outer peripheral side, and acts as a force point for receiving external force to rotate the clamp arm 27 to open and close the holding portion 271, and a rod 273 protruding downward. Is formed.

ベース部２６にはバネ部２８の一端側が収容され、クランプアーム２７の凹部２７０にはバネ部２８の他端側が収容されており、クランプアーム２７は、その下部がバネ部２８によってクランプベース２０の外周側に向けて付勢されている。バネ部２８は、クランプアーム２６を付勢しバネ力によって保持部２７１に板状ワークの外周をクランプさせる。   One end side of the spring portion 28 is accommodated in the base portion 26, and the other end side of the spring portion 28 is accommodated in the concave portion 270 of the clamp arm 27, and the lower portion of the clamp arm 27 is held by the spring portion 28. It is biased toward the outer periphery. The spring part 28 urges the clamp arm 26 to cause the holding part 271 to clamp the outer periphery of the plate-like workpiece by the spring force.

クランプアーム２７の下方には、クランプアーム２７の状態を検出するセンサ７が配設されている。図３に示すように、センサ７は、例えば光学式のセンサであり、ロッド２７３が直上に存在するか否かに基づき、クランプアーム２７が板状ワークＷのエッジをクランプしているか否かを判断することができる。   A sensor 7 that detects the state of the clamp arm 27 is disposed below the clamp arm 27. As shown in FIG. 3, the sensor 7 is, for example, an optical sensor, and determines whether the clamp arm 27 clamps the edge of the plate-like workpiece W based on whether the rod 273 exists immediately above. Judgment can be made.

クランプ手段２を構成するすべての部品、すなわち、少なくともクランプベース２０、エッジ固定部２１及び仮置き部２２は、導電性部材によって形成されており、洗浄時に板状ワークＷに静電気が発生した場合にその静電気を逃がすことができる。   All the parts constituting the clamp means 2, that is, at least the clamp base 20, the edge fixing portion 21 and the temporary placement portion 22 are formed of conductive members, and when static electricity is generated in the plate-like workpiece W during cleaning. The static electricity can be released.

飛散防止部５０の先端には、飛散防止カバー５が降下した際にクランプアーム２７の作用部２７２を押し下げる押下げ部５２が形成されている。   A push-down portion 52 is formed at the tip of the scattering prevention portion 50 to push down the action portion 272 of the clamp arm 27 when the scattering prevention cover 5 is lowered.

板状ワークＷの洗浄時は、図４に示すように、まず、仮置き部２２の上に板状ワークＷを載置することにより、クランプベース２０に板状ワークＷを仮置きする。   When cleaning the plate-like workpiece W, as shown in FIG. 4, first, the plate-like workpiece W is temporarily placed on the clamp base 20 by placing the plate-like workpiece W on the temporary placement portion 22.

クランプベース２０に仮置きされた板状ワークＷの洗浄開始時は、上下動作手段６が飛散防止カバー５を上昇させ、洗浄液が外周側に飛散するのを防止できる位置に飛散防止部５０を位置させる。   When the cleaning of the plate-like workpiece W temporarily placed on the clamp base 20 is started, the vertical movement means 6 raises the anti-scattering cover 5 and the anti-scattering unit 50 is located at a position where the cleaning liquid can be prevented from scattering to the outer peripheral side. Let

飛散防止カバー５が上昇すると、図５に示すように、バネ部２８の付勢力によってクランプアーム２７の下部が押圧されるため、クランプアーム２７が軸部２６０を中心として回転し、クランプアーム２７の一端の保持部２７１が板状ワークＷの外周をクランプして保持する。保持部２７１が板状ワークＷの外周をクランプすると、板状ワークＷは、保持部２７１の斜面に沿って若干上昇することにより仮置き部２２から離間され、仮置き部２２に載置された状態が解除される。このように、飛散防止カバー５が上昇することにより、クランプアーム２７が連動して板状ワークＷが自動的にクランプ手段２によってクランプされるため、板状ワークをクランプするための機構と飛散防止カバーを上下動させるための機構とを個別に設けて個々に動作させる必要がなくなる。また、個別の制御が不要となることで、装置の動作ミスが生じるのを防止することができる。   When the anti-scattering cover 5 is raised, the lower portion of the clamp arm 27 is pressed by the biasing force of the spring portion 28 as shown in FIG. The holding part 271 at one end clamps and holds the outer periphery of the plate-like workpiece W. When the holding portion 271 clamps the outer periphery of the plate-like workpiece W, the plate-like workpiece W is separated from the temporary placement portion 22 by being slightly raised along the slope of the holding portion 271 and is placed on the temporary placement portion 22. The state is released. As described above, when the anti-scattering cover 5 is raised, the clamp arm 27 is interlocked and the plate-like workpiece W is automatically clamped by the clamping means 2, so a mechanism for clamping the plate-like workpiece and anti-scattering are provided. There is no need to separately provide a mechanism for moving the cover up and down and operate it individually. In addition, since individual control is unnecessary, it is possible to prevent an operation error of the apparatus.

クランプアーム２７の保持部２７１が板状ワークＷの外周をクランプすると、図５に示すようにロッド２７３がセンサ７の直上に位置する。センサ７は、ロッド２７３が直上に存在することを検知すると、クランプアーム２７が板状ワークＷのエッジをクランプできていると判断する。一方、センサ７がロッド２７３を検知できない場合は、何らかの理由によりクランプアーム２７が所望の回転をせず板状ワークＷをクランプできていないと判断し、板状ワークＷの洗浄を開始しないようにする。このように、センサ７によってクランプアーム２７の状態を検出することで、板状ワークＷが保持されていない状態で洗浄が開始されるのを確実に防ぐことができる。   When the holding portion 271 of the clamp arm 27 clamps the outer periphery of the plate-like workpiece W, the rod 273 is positioned immediately above the sensor 7 as shown in FIG. When the sensor 7 detects that the rod 273 exists immediately above, it determines that the clamp arm 27 can clamp the edge of the plate-like workpiece W. On the other hand, if the sensor 7 cannot detect the rod 273, it is determined that the clamp arm 27 does not rotate as desired for some reason and the plate-like workpiece W cannot be clamped, and the cleaning of the plate-like workpiece W is not started. To do. Thus, by detecting the state of the clamp arm 27 by the sensor 7, it is possible to reliably prevent the cleaning from being started in a state where the plate-like workpiece W is not held.

板状ワークＷがクランプ手段２に保持されると、図４に示す回転手段３がクランプベース２０を回転させるとともに、洗浄手段４を構成する第１の洗浄ノズル４１から洗浄液が噴射され、板状ワークＷの上面が洗浄される。また、液体導入口３０１から回転軸３０の内部に形成された液路３００に液体が導入され、その液体が第２の洗浄ノズル２００から上方に噴出し、板状ワークＷの下面も洗浄される。   When the plate-like workpiece W is held by the clamp means 2, the rotating means 3 shown in FIG. 4 rotates the clamp base 20, and the cleaning liquid is ejected from the first washing nozzle 41 constituting the washing means 4 to form a plate-like shape. The upper surface of the workpiece W is cleaned. Further, the liquid is introduced from the liquid introduction port 301 into the liquid path 300 formed inside the rotary shaft 30, and the liquid is ejected upward from the second washing nozzle 200, and the lower surface of the plate-like workpiece W is also washed. .

洗浄終了後は、図１に示したように、上下動作手段６が飛散防止カバー５を下降させる。そして、押下げ部５２が作用部２７２を押し下げることによって、保持部２７１が板状ワークＷの外周側に移動して板状ワークＷのクランプ状態を開放する。このとき、板状ワークＷは、保持部２７１の斜面に沿って若干降下し、仮置き部２２の上に仮置きされた状態に戻る。   After the cleaning is completed, as shown in FIG. 1, the vertical movement means 6 lowers the scattering prevention cover 5. Then, when the push-down part 52 pushes down the action part 272, the holding part 271 moves to the outer peripheral side of the plate-like workpiece W to release the clamped state of the plate-like workpiece W. At this time, the plate-like workpiece W is slightly lowered along the slope of the holding portion 271 and returns to the state temporarily placed on the temporary placement portion 22.

１：洗浄装置
２：クランプ手段
２０：クランプベース ２００：第２の洗浄ノズル
２１：エッジ固定部 ２２：仮置き部
２２：昇降部材 ２３：昇降板
２６：ベース部 ２６０：軸部（支点）
２７：クランプアーム
２７０：凹部 ２７１：保持部（作用点） ２７２：作用部（力点） ２７３：ロッド
２８：バネ部
２９：受け部材 ２９０：内周壁 ２９１：外周壁 ２９２：底板 ２９３：凹部
３：回転手段
３０：回転軸 ３００：液路
３１：モータ ３１０：電源 ３１１：エンコーダ
４：洗浄手段
４０：タンク ４１：第１の洗浄ノズル
５：飛散防止カバー
５０：飛散防止部 ５１：被固定部 ５２：押下げ部
６：上下動作手段 ６０：ロッド ６１：シリンダ
７：センサ 1: Cleaning device 2: Clamping means 20: Clamp base 200: Second cleaning nozzle 21: Edge fixing part 22: Temporary placing part 22: Lifting member 23: Lifting plate 26: Base part 260: Shaft part (fulcrum)
27: Clamp arm 270: Recessed portion 271: Holding portion (working point) 272: Working portion (power point) 273: Rod 28: Spring portion 29: Receiving member 290: Inner peripheral wall 291: Outer peripheral wall 292: Bottom plate 293: Recessed portion 3: Rotation Means 30: Rotating shaft 300: Liquid passage
31: Motor 310: Power supply 311: Encoder 4: Cleaning means 40: Tank 41: First cleaning nozzle 5: Spattering prevention cover 50: Scattering prevention part 51: Fixed part 52: Pushing part 6: Vertical movement means 60: Rod 61: Cylinder 7: Sensor

Claims (3)

円盤状の板状ワークの外周をクランプして保持するクランプ手段と、該クランプ手段によって保持された板状ワークを該板状ワークの中心を通る回転軸を中心に回転させる回転手段と、回転する該板状ワークに洗浄液を噴射して該板状ワークを洗浄する洗浄手段と、該板状ワークを該洗浄手段によって洗浄する際に該洗浄液の飛散を防止する飛散防止カバーと、該飛散防止カバーを上下に移動させる上下動作手段とから少なくとも構成される洗浄装置であって、
該クランプ手段は、該回転軸に連結されるクランプベースと、該回転軸を中心として均等な角度で該クランプベースに少なくとも３つ配置され支点と力点と作用点とを備える該クランプアームと、該クランプベースに板状ワークの外周下面を支持して仮置きさせる仮置き部とから構成され、
該クランプアームは、中央部を支点として回転可能に支持され、該支点より上方の一端が作用点となり板状ワークの外周をクランプする保持部と、他端が外力を受ける力点となり該保持部を開閉させる作用部と、該クランプアームに付勢されるバネ力によって該保持部に板状ワークの外周をクランプさせるバネ部と、で構成され、
該飛散防止カバーは、該クランプ手段を囲繞するリング状の飛散防止部と、該上下動作手段によって下げられた時に該クランプアームの該作用部を押し下げる押下げ部と、を備え、
板状ワークの洗浄開始時は、該飛散防止カバーを上昇させ、該クランプアームは、該仮置き部に仮置きされる板状ワークの外周を該バネ部の付勢によって該保持部においてクランプして保持し、洗浄終了後は、該飛散防止カバーを下降させ、該押下げ部が該作用部を押し下げることによって該保持部が板状ワークの外周側に移動し板状ワークを開放するとともに該板状ワークを該仮置き部に仮置きする洗浄装置。 Clamping means for clamping and holding the outer periphery of a disk-shaped plate-shaped workpiece, and rotating means for rotating the plate-shaped workpiece held by the clamping means about a rotation axis passing through the center of the plate-shaped workpiece, and rotating Cleaning means for spraying cleaning liquid onto the plate-like workpiece to clean the plate-like workpiece, anti-scattering cover for preventing scattering of the cleaning liquid when the plate-like workpiece is cleaned by the cleaning means, and the anti-scattering cover A cleaning device composed of at least an up-and-down movement means for moving up and down,
The clamp means includes a clamp base coupled to the rotation shaft, at least three clamp arms arranged at an equal angle around the rotation shaft, the fulcrum, a force point, and an action point. It is composed of a temporary placement part that temporarily places the clamp-like workpiece by supporting the lower surface of the outer periphery of the plate-like workpiece,
The clamp arm is rotatably supported with a central portion as a fulcrum, and one end above the fulcrum serves as a point of action to clamp the outer periphery of the plate-like workpiece, and the other end serves as a force point for receiving external force. An action part that opens and closes, and a spring part that clamps the outer periphery of the plate-like workpiece on the holding part by a spring force biased by the clamp arm,
The scattering prevention cover includes a ring-shaped scattering prevention portion that surrounds the clamp means, and a push-down portion that pushes down the action portion of the clamp arm when lowered by the vertical movement means,
At the start of cleaning of the plate-like workpiece, the scattering prevention cover is raised, and the clamp arm clamps the outer periphery of the plate-like workpiece temporarily placed on the temporary placement portion at the holding portion by the bias of the spring portion. After the cleaning is completed, the scattering prevention cover is lowered, and the pressing part pushes down the action part, so that the holding part moves to the outer peripheral side of the plate-like work and opens the plate-like work. A cleaning device for temporarily placing a plate-like workpiece on the temporary placement portion. 前記クランプ手段を構成するすべての部品が導電性部材で形成される
請求項１に記載の洗浄装置。 The cleaning apparatus according to claim 1, wherein all parts constituting the clamping means are formed of a conductive member. 前記洗浄手段は、前記クランプ手段によって保持される板状ワークの上面に洗浄液を噴射する第１の洗浄ノズルと、該板状ワークの下面に洗浄液を噴射する第２の洗浄ノズルとを含んで構成される
請求項１に記載の洗浄装置。 The cleaning means includes a first cleaning nozzle that injects a cleaning liquid onto the upper surface of the plate-like workpiece held by the clamp means, and a second cleaning nozzle that injects a cleaning liquid onto the lower surface of the plate-like workpiece. The cleaning apparatus according to claim 1.
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