CN112103239B - Device for clamping silicon wafer in visual detection process of silicon wafer - Google Patents
Device for clamping silicon wafer in visual detection process of silicon wafer Download PDFInfo
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- CN112103239B CN112103239B CN202011321225.9A CN202011321225A CN112103239B CN 112103239 B CN112103239 B CN 112103239B CN 202011321225 A CN202011321225 A CN 202011321225A CN 112103239 B CN112103239 B CN 112103239B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The embodiment of the invention discloses a device for clamping a silicon wafer in the visual detection process of the silicon wafer, which comprises: the silicon wafer clamping device comprises at least two clamping jaw pairs arranged in the directions of different diameters of a silicon wafer, wherein each clamping jaw pair can move between a clamping position and a loosening position; a holder for holding the jaw pair; when the claw pair is in the loosening position, the elastic resetting component generates elastic restoring force for resetting the claw pair to the clamping position; a cam having a major axis and a minor axis; a drive mechanism for producing relative rotational movement between the at least two pairs of jaws and the cam such that the pairs of jaws can assume a first relative position aligned with the long axis of the cam in which the cam holds the pairs of jaws in the release position against the elastic restoring force produced by the elastic return member, and a second relative position aligned with the short axis of the cam in which the cam does not act on the pairs of jaws.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a device for clamping a silicon wafer in a visual detection process of the silicon wafer.
Background
With the rapid development of the information age, the demand of society for electronic chips is rapidly increasing, and meanwhile, the quality requirements of people for raw material silicon wafers for manufacturing chips are higher and higher.
Defects including edge breakage, scratches, cracks and the like can be generated on the silicon wafer in the production and manufacturing process of the silicon wafer, and the defects bring great risks to further downstream production and utilization, so that the silicon wafer is very important for carrying out all-around inspection on the silicon wafer. Visual inspection is an important defect detection method for 300mm silicon wafers, and the method is characterized in that light beams generated by a high-intensity lamp are irradiated to the surfaces of the silicon wafers, and meanwhile, human eyes are visually inspected on areas, which are illuminated by the light beams, of the surfaces and the edge parts of the silicon wafers to intercept the defective silicon wafers.
In the process of visual inspection by human eyes, a silicon wafer needs to be clamped by a clamping device. However, the existing clamping device has the following disadvantages: the clamping jaw of the clamping device is in contact with the periphery of the silicon wafer to realize clamping, and the part of the clamping jaw adjacent to the periphery of the silicon wafer can shield the sight of visual detection personnel, so that a detection blind area can be generated, and the phenomenon of missed detection of a clamping area can be caused; and on the other hand, light beams generated by the powerful light lamp inevitably irradiate on the clamping jaws contacted with the silicon wafer, so that strong reflection is formed, and the judgment of visual detection personnel on the defects is influenced. These conditions can cause the defective silicon wafers to enter downstream production processes, which in turn results in greater production losses.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention desirably provide a device for clamping a silicon wafer during a visual inspection process of the silicon wafer, which can avoid formation of a detection blind area and achieve detection of a peripheral portion of the silicon wafer without a dead angle.
The technical scheme of the invention is realized as follows:
the embodiment of the invention provides a device for clamping a silicon wafer in the visual detection process of the silicon wafer, which comprises:
at least two jaw pairs disposed in different diameter directions of the silicon wafer, each jaw pair being movable between a clamping position contacting a peripheral edge of the silicon wafer to clamp the silicon wafer and a releasing position spaced apart from the peripheral edge of the silicon wafer to release the silicon wafer;
a holder for holding the at least two jaw pairs, the holder being provided with a movement guide for guiding the jaw pairs to move between the clamping position and the release position;
a resilient return member for each jaw pair, the resilient return member producing a resilient return force that returns the jaw pair to the clamped position when the jaw pair is in the undamped position;
the cam is coaxially arranged with the central axis of the silicon chip, the central axis is vertical to the plane where the silicon chip is located, and the cam is provided with a long axis and a short axis;
a drive mechanism for producing relative rotational movement between the at least two pairs of jaws and the cam about the central axis such that each pair of jaws is able to assume a first relative position aligned with the long axis of the cam in which the cam holds the pair of jaws in the release position against the resilient return force produced by the resilient return member and a second relative position aligned with the short axis of the cam in which the cam does not act on the pair of jaws,
wherein when one of the at least two jaw pairs is in the undamped position, the other jaw pairs are in the clamped position.
The embodiment of the invention provides a device for clamping a silicon wafer in the visual detection process of the silicon wafer, which can realize that at least two claw pairs alternately or sequentially clamp or loosen the silicon wafer, and because the at least two claw pairs are arranged in the different diameter directions of the silicon wafer, the clamping can be realized by contacting different parts in the periphery of the silicon wafer, so that when one claw pair contacts with a first part in the edge of the silicon wafer to generate a detection blind area or reflects light beams generated by a strong light lamp to form strong reflection, the other claw pair contacts with a second part in the edge of the silicon wafer to clamp the silicon wafer, and the one claw pair can be far away from the edge of the silicon wafer to eliminate the detection blind area generated by the other claw pair and ensure that the silicon wafer does not form strong reflection any more.
Drawings
FIG. 1 is a schematic top view of an apparatus for holding a silicon wafer during visual inspection of the wafer according to an embodiment of the present invention;
FIG. 2 is a schematic front view of an apparatus for holding a silicon wafer during visual inspection of the silicon wafer according to an embodiment of the present invention;
FIG. 3 is a schematic view of the operation of an apparatus for holding a silicon wafer during visual inspection of the wafer according to an embodiment of the present invention, wherein the cam is rotated from the position shown in FIG. 1 to the position shown in the drawing;
FIG. 4 is a schematic view of the operation of an apparatus for holding a silicon wafer during visual inspection of the wafer according to an embodiment of the present invention, wherein the cam is rotated from the position shown in FIG. 3 to the position shown in the drawing;
FIG. 5 is a schematic view of the operation of an apparatus for holding a silicon wafer during visual inspection of the wafer according to an embodiment of the present invention, wherein the cam is rotated from the position shown in FIG. 4 to the position shown in the drawing;
FIG. 6 is a schematic view of the operation of an apparatus for holding a silicon wafer during visual inspection of the wafer according to an embodiment of the present invention, wherein the cam is rotated from the position shown in FIG. 5 to the position shown in the drawings;
FIG. 7 is a schematic view of the operation of an apparatus for holding a silicon wafer during visual inspection of the wafer according to an embodiment of the present invention, wherein the cam is rotated from the position shown in FIG. 6 to the position shown in the drawings;
FIG. 8 is a schematic view of the position relationship between the long axis of the cam of the device for holding the silicon wafer during the visual inspection of the silicon wafer and the illumination area of the light beam according to the embodiment of the invention;
FIG. 9 is a schematic top view of another apparatus for holding a silicon wafer during visual inspection of the wafer in accordance with an embodiment of the present invention;
FIG. 10 is a schematic front view of an apparatus for holding a silicon wafer during visual inspection of the wafer according to an embodiment of the present invention, showing the stem portions and the abutment portions of the jaw halves in detail.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to FIGS. 1 and 2, an embodiment of the present invention provides an apparatus 100 for holding a wafer W during a visual inspection of the wafer W, which is schematically illustrated in FIG. 1 by a dotted circle, the apparatus 100 may include:
at least two jaw pairs 110 disposed in different diameter directions of the silicon wafer W, wherein three jaw pairs 110, i.e., a first jaw pair 110-1, a second jaw pair 110-2 and a third jaw pair 110-3 are exemplarily shown in fig. 1, the first jaw pair 110-1 includes two jaw halves 110-1A and 110-1B, the second jaw pair 110-2 includes two jaw halves 110-2A and 110-2B, the third jaw pair 110-3 includes two jaw halves 110-3A and 110-3B, as shown in fig. 1, each jaw pair 110 is movable between a clamping position contacting a peripheral edge of the silicon wafer W to clamp the silicon wafer W and a releasing position leaving the peripheral edge of the silicon wafer W to release the silicon wafer W, as shown in fig. 1, the first jaw pair 110-1 is in the release position, while the second jaw pair 110-2 and the third jaw pair 110-3 are in the gripping position;
a holder 120 for holding the at least two jaw pairs 110, the holder 120 being provided with a movement guide 121 for guiding the jaw pairs 110 between the clamping position and the release position, wherein the movement guide 121 for guiding the jaw half 110-1A is only schematically shown in fig. 1, it being understood that the movement guide 121 may be, for example, a through hole or a groove formed in the holder 120;
a resilient return member 130 for each jaw pair 110, the resilient return member 130 generating a resilient return force that returns the jaw pair 110 to the clamped position when the jaw pair 110 is in the undamped position;
a cam 140 coaxially disposed with a central axis X of the silicon wafer W, the central axis X being perpendicular to a plane on which the silicon wafer W is located, the cam 140 having a major axis L and a minor axis S, as shown by a chain line in fig. 1;
a drive mechanism 150 as shown in fig. 2, said drive mechanism 150 being adapted to produce a relative rotational movement between said at least two jaw pairs 110 and said cam 140 about said central axis X, such that each jaw pair 110 can assume a first relative position aligned with the long axis L of said cam 140, in which the long axis L of the cam 140 is aligned with a jaw pair 110, and a second relative position aligned with the short axis S of said cam 140, in which the short axis S of the cam 140 is aligned with a jaw pair 110, in fig. 1, said cam 140 holds said jaw pair 110 in said release position against an elastic restoring force produced by said elastic return member 130, and in which said cam 140 does not act on said jaw pair 110.
The operation of the device 100 will be described in detail below by way of example of the clockwise rotation of the cam 140 to produce the relative rotational movement between the at least two jaw pairs 110 and the cam 140.
Referring to fig. 3, the cam 140 is rotated from the position shown in fig. 2 (shown by the dashed lines) to the position shown in fig. 3 (shown by the solid lines). In the process, the long axis L of the cam 140 is gradually deviated from the jaw pair 110-1, whereby the jaw pair 110-1 is moved in a radially inward direction by the elastic restoring force generated from the elastic restoring member 130 until abutting against a portion of the cam 140 aligned with the jaw pair 110-1.
Referring to fig. 4, the cam 140 continues to rotate from the position shown in fig. 3 (shown by the dashed lines) to the position shown in fig. 4 (shown by the solid lines). In this process, the jaw pair 110-1 is further moved in a radially inward direction by the elastic restoring force generated from the elastic restoring member 130 until it is brought into contact with the peripheral edge of the silicon wafer W to be in a clamping position in which the jaw pair 110-1 still abuts against the cam 140.
Referring to fig. 5, the cam 140 continues to rotate from the position shown in fig. 4 (shown by dashed lines) to the position shown in fig. 5 (shown by solid lines), i.e., the minor axis S of the cam 140 is aligned with the jaw pair 110-1. In this process, the jaw pair 110-1 cannot be further moved radially inward due to contact with the peripheral edge of the silicon wafer W, and the distance between the portion of the cam 140 aligned with the jaw pair 110-1 and the jaw pair 110-1 gradually increases, or the cam 140 does not act on the jaw pair 110-1.
Referring to fig. 6, cam 140 continues to rotate from the position shown in fig. 5 (shown by dashed lines) to the position shown in fig. 6 (shown by solid lines), i.e., just abutting jaw pair 110-1 again, during which jaw pair 110-1 is not yet acted upon by cam 140 and therefore is always in the clamped position or is not moved in the radial direction.
Referring to fig. 7, the cam 140 continues to rotate from the position shown in fig. 6 (shown by the dashed lines) to the position shown in fig. 7 (shown by the solid lines). In this process, the long axis L of the cam 140 is gradually brought close to the jaw pair 110-1, whereby the cam 140 moves the jaw pair 110-1 in a radially outward direction against the elastic restoring force generated by the elastic restoring member 130.
Finally, the cam 140 is rotated from the position shown in fig. 7 to the position shown in fig. 1, during which the jaw pair 110-1 is moved further in a radially outward direction until it is aligned with the long axis L of the cam 140, as shown in fig. 1.
In summary, the pair of jaws 110-1 can clamp and unclamp the wafer W during one rotation of the cam 140, and on the other hand, since at least two pairs of jaws 110 are disposed in different diameter directions of the wafer W, it can be understood that the at least two pairs of jaws 110 can also clamp and unclamp the wafer W. Thus, it is possible to alternately or sequentially clamp or unclamp the silicon wafer W by the at least two jaw pairs 110, and since the at least two jaw pairs 110 are disposed in different diameter directions of the silicon wafer W, clamping can be performed by contacting different portions in the periphery of the silicon wafer W, so that, when one jaw pair 110 generates a dead zone due to contact with a first portion of the edge of the silicon wafer W or forms strong reflection light due to reflection of a beam generated by a powerful lamp, the silicon wafer W can be clamped by contacting a second portion of the edge of the silicon wafer W by the other jaw pair 110, and the one jaw pair 110 can be spaced apart from the edge of the silicon wafer W, thereby eliminating the dead zone generated by the same and making it no longer form strong reflection light.
Regarding the shape of the cam 140 in the apparatus 100, referring to fig. 1, in a preferred embodiment of the present invention, the cam 140 may have an elliptical cross-section in a plane parallel to the silicon wafer W. The oval shape has a major axis and a minor axis and the curve forming the oval shape is smooth or slippery, thereby allowing the jaw pair 110 to move smoothly in the radial direction or not causing abrupt speed changes in the jaw pair 110 moving in the radial direction.
In a preferred embodiment of the present invention, the at least two jaw pairs 110 may be uniformly distributed in the circumferential direction of the wafer W. For example, in the case of three jaw pairs 110 shown in fig. 1, the angle between two adjacent jaw pairs 110 in the circumferential direction of the wafer W may be 60 degrees, and for example, in the case where the apparatus 100 includes four jaw pairs 110 (not shown in the drawings), the angle between two adjacent jaw pairs 110 in the circumferential direction of the wafer W may be 45 degrees, and so on. The evenly distributed jaw pairs enable a more stable clamping of the silicon wafer W than non-evenly distributed jaw pairs.
In a preferred embodiment of the present invention, when one of the at least two jaw pairs 110 is in the release position, the other jaw pair 110 is in the gripping position. In other words, during the relative rotational movement between the at least two pairs of fingers 110 and the cam 140, only one pair of fingers 110 is in the release position, so that the silicon wafer can be clamped by as many finger pairs 110 as possible, which is beneficial to the stability of clamping. It will be appreciated that the above scheme can be easily implemented by appropriately selecting the lengths of the major axis L and the minor axis S of the cam 140 and the length of the jaw pair 110 in the radial direction of the silicon wafer W according to the diameter of the silicon wafer W. As can be seen, for example, in fig. 3 and 6, the lengths of the major axis L and the minor axis S of the cam 140 and the lengths of the jaw pairs 110 in the radial direction of the silicon wafer W are plotted to achieve the above-described solution. More specifically, as shown in fig. 3 and 6, when the cam 140 abuts against the first jaw pair 110-1, a gap exists between both the second jaw pair 110-2 and the third jaw pair 110-3 and the cam 140.
With regard to the implementation of the relative rotational movement between the at least two jaw pairs 110 and the cam 140, in one example of the invention, the at least two jaw pairs 110 are stationary, while the drive mechanism 150 drives the cam 140 to rotate about the central axis X relative to the at least two jaw pairs 110, thereby implementing the relative rotational movement between the at least two jaw pairs 110 and the cam 140 in a simple manner.
In practice, the beam of light generated by the powerful lamp used for visual inspection of the silicon wafer will illuminate only a part of the area of the silicon wafer, but not all, whereas the powerful lamp is generally stationary or the beam of light generated by the powerful lamp is not moving, and therefore, it is necessary to rotate the silicon wafer to enable the beam of light to illuminate the entire area of the silicon wafer, and therefore, in the preferred embodiment of the present invention, the cam 140 is stationary, and the drive mechanism 150 drives the at least two jaw pairs 110 to rotate about the central axis X relative to the cam 140. Thus, the wafer W held by the pair of grippers 110 is rotated together, so that the entire area of the wafer W can be illuminated by the light beam.
In the case where the pair of claws 110 rotates together with the silicon wafer W, it is desirable that, as shown in fig. 8, when the claw half 110-1A rotates clockwise into an area (shown by hatching) illuminated by a light beam generated by a floodlight, the first pair of claws 110-1 is in the release position to inspect a portion of the periphery of the silicon wafer W corresponding to the claw half 110-1A or to make the claw half 110-1A not to generate reflection, and therefore, in a preferred embodiment of the present invention, referring to fig. 8, an extended long line of the long axis L of the cam 140 intersects with the light beam illuminating the periphery of the silicon wafer W.
It will be appreciated that there are many implementations for the resilient return member 130 described above, for example the resilient return member 130 may be a coil spring, for example in tension, disposed between the two jaw halves of the jaw pair 110, however, in a preferred embodiment of the invention, referring to fig. 1, the resilient return member 130 comprises a coil spring for each jaw half of each jaw pair 110, a first end of the coil spring being fixedly connected to the cage 120 and a second end of the coil spring being fixedly connected to the jaw half. With this arrangement, it is possible to bring not only the jaw pair 110 as a whole into the gripping and release positions, but also each jaw half into the gripping and release positions.
In order for the jaw pairs 110 to slide along the surface of the cam 140 when moving between the release position and the clamping position, in a preferred embodiment of the invention, see fig. 9, each jaw half 110-1A, 110-1B, 110-2A, 110-2B, 110-3A, 110-3B of each jaw pair 110-1, 110-2 and 110-3 is provided with a roller follower 111, see fig. 9, which roller follower 111 is configured to roll on the surface of the cam 140 during the relative rotational movement of the at least two jaw pairs 110 and the cam 140.
While the jaw halves described above can be achieved in a number of ways, in a preferred embodiment of the invention, each jaw half of each jaw pair 110, see fig. 10, includes a stem portion 112 and an abutment portion 113, the stem portion 112 extending parallel to the silicon wafer W, the abutment portion 113 being disposed at a radially outward end of the stem portion 112 and extending perpendicular to the stem portion 112 to contact the edge of the silicon wafer W when the jaw pair 110 is in the clamping position.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. An apparatus for holding a silicon wafer during visual inspection of the wafer, the apparatus comprising:
at least two jaw pairs disposed in different diameter directions of the silicon wafer, each jaw pair being movable between a clamping position contacting a peripheral edge of the silicon wafer to clamp the silicon wafer and a releasing position spaced apart from the peripheral edge of the silicon wafer to release the silicon wafer;
a holder for holding the at least two jaw pairs, the holder being provided with a movement guide for guiding the jaw pairs to move between the clamping position and the release position;
a resilient return member for each jaw pair, the resilient return member producing a resilient return force that returns the jaw pair to the clamped position when the jaw pair is in the undamped position;
the cam is coaxially arranged with the central axis of the silicon chip, the central axis is vertical to the plane where the silicon chip is located, and the cam is provided with a long axis and a short axis;
a drive mechanism for producing relative rotational movement between the at least two pairs of jaws and the cam about the central axis such that each pair of jaws is able to assume a first relative position aligned with the long axis of the cam in which the cam holds the pair of jaws in the release position against the resilient return force produced by the resilient return member and a second relative position aligned with the short axis of the cam in which the cam does not act on the pair of jaws,
wherein when one of the at least two jaw pairs is in the undamped position, the other jaw pairs are in the clamped position.
2. The apparatus of claim 1, wherein the cam has an elliptical cross-section in a plane parallel to the silicon wafer.
3. The apparatus according to claim 1 or 2, wherein the at least two jaw pairs are uniformly distributed in the circumferential direction of the silicon wafer.
4. A device according to claim 1 or 2, wherein the at least two jaw pairs are stationary and the drive mechanism drives the cam for rotation about the central axis relative to the at least two jaws.
5. The device of claim 1 or 2, wherein the cam is stationary and the drive mechanism drives the at least two jaw pairs to rotate about the central axis relative to the cam.
6. The apparatus of claim 5, wherein the extended long line of the long axis of the cam intersects the light beam illuminating the periphery of the silicon wafer.
7. A device according to claim 1 or 2, characterised in that the resilient return member comprises a helical spring for each jaw half of each jaw pair, a first end of the helical spring being fixedly connected to the holder and a second end of the helical spring being fixedly connected to the jaw half.
8. The device of claim 1 or 2, wherein each jaw half of each jaw pair is provided with a roller follower configured to roll on a surface of the cam during relative rotational movement of the at least two jaw pairs and the cam.
9. The device of claim 1 or 2, wherein each jaw half of each jaw pair comprises a stem portion extending parallel to the silicon wafer and an abutment portion disposed at a radially outward end of the stem portion and extending perpendicular to the stem portion to contact an edge of the silicon wafer when the jaw pair is in the clamped position.
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| CN202011321225.9A CN112103239B (en) | 2020-11-23 | 2020-11-23 | Device for clamping silicon wafer in visual detection process of silicon wafer |
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| CN202011321225.9A CN112103239B (en) | 2020-11-23 | 2020-11-23 | Device for clamping silicon wafer in visual detection process of silicon wafer |
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