KR101303708B1 - Hand of robot for transferring wafer having sealed cover - Google Patents

Hand of robot for transferring wafer having sealed cover Download PDF

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Publication number
KR101303708B1
KR101303708B1 KR1020130043399A KR20130043399A KR101303708B1 KR 101303708 B1 KR101303708 B1 KR 101303708B1 KR 1020130043399 A KR1020130043399 A KR 1020130043399A KR 20130043399 A KR20130043399 A KR 20130043399A KR 101303708 B1 KR101303708 B1 KR 101303708B1
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KR
South Korea
Prior art keywords
wafer
blocking cover
air
intake hole
body portion
Prior art date
Application number
KR1020130043399A
Other languages
Korean (ko)
Inventor
박기현
최삼규
임성재
Original Assignee
(주)메티스
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Publication date
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Priority to KR1020130043399A priority Critical patent/KR101303708B1/en
Application granted granted Critical
Publication of KR101303708B1 publication Critical patent/KR101303708B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer transfer robot hand provided with a blocking cover, the lower part of which is generally open and has an upper body formed with an air outlet on one side of the upper surface, and the upper part of the upper body, which is coupled to the lower portion of the upper body and is generally open at the bottom center. The intake hole is formed and is installed on the upper portion of the intake hole of the body portion including the lower body and the lower body formed around the bottom of the bottom around the periphery, by injecting air supplied from the outside through the air injection port formed on one side of the bottom surface A Bernoulli chuck for generating a negative pressure near the intake hole and a blocking cover slidably coupled to an outer surface of the body portion, and interposed between the blocking cover and the body portion to apply an elastic force to the blocking cover in a downward direction. It includes an elastic member.
According to the present invention as described above, by blocking the foreign matter, such as dust flowing between the body portion and the wafer by the blocking cover during the adsorption of the wafer to prevent contamination of the conveyed wafer can reduce the defect rate of the wafer There is.
In addition, the blocking cover supports the satellite when the wafer is absorbed by the elastic member interposed between the body portion and the blocking cover to apply elastic force to the blocking cover in the lower direction of the body, thereby easily absorbing the expanded wafer through the heating process. You can do it.
In addition, a groove is formed in the bottom surface of the lower body to communicate with the intake hole, the outside air is continuously introduced through the groove in the process of adsorbing and transporting the wafer, the flow of the internal air is not stagnant, such as dust contained in the internal air It is possible to prevent the foreign matter from falling to the top of the wafer to be seated in the subsequent process.

Description

Hand of robot for transferring wafer having sealed cover

The present invention relates to a wafer transfer robot hand provided with a blocking cover, and more particularly, to absorb a wafer made of a semiconductor device through a plurality of processes to prevent the inflow of foreign substances such as dust during transfer to each process. It relates to a wafer transfer robot hand is formed with a blocking cover for.

In general, a semiconductor device fabrication process involves fabricating a silicon wafer, subjecting it to oxidation-etching-diffusion-etching-metalization, and then cutting it into a die of a predetermined size.

Since the wafers used in the manufacture of the above semiconductor devices go through a number of processes, a wafer transfer robot hand is mounted on the tip of a robot composed of multiple axes to move in multiple directions to transfer wafers in each process. By using the wafer transfer robot hand, the wafer is absorbed and transferred to each process.

1 is a cross-sectional view of a conventional wafer transfer robot hand, which is installed at the end of the robot arm 100 and has an inner tube 600 having a cavity 200 in a central portion thereof, and a plurality of discharge holes 301 around its outer periphery. The chamber plate 300 and the cavity 200 are formed on the upper part of the cavity 200 and the discharge hose 400 connected to the suction pump and the guide protrusion 500 for holding the position of the wafer W adsorbed to the chamber 302. Air discharged through the discharge hole 301 through the inner tube 600 in which the air discharged through the discharge hole 301 by the suction force of the suction pump connected to the discharge hose 400 is formed in the cavity 200. The wafer W is adsorbed due to the pressure difference of air generated by suction at 400.

The robot hand for wafer transfer as described above generates a rapid flow of external air between the edge of the wafer W and the guide protrusion 500 on which the wafer W is seated in the process of adsorbing the wafer W. Since foreign substances such as dust contained in the metal are introduced into the inside of the wafer transfer robot hand together with the external air to contaminate the surface of the wafer, a cleaning process must be added before the subsequent process, which increases manufacturing time and cost. Occurs.

In addition, before adsorbing the wafer (W) is discharged through the discharge hole 301 and the outside air flows into the air sucked into the discharge hose 400 through the inner tube 600 to adsorb the wafer (W). When the air flowed in from the outside is blocked, the amount of air introduced from the outside is reduced, so that the flow rate of the air discharged through the discharge hole 301 and sucked into the discharge hose 400 through the inner tube 600 is relatively Will decrease.

For this reason, foreign matters such as dust introduced together with external air through the gap between the guide protrusion 500 and the wafer W in the process of adsorbing the wafer W adsorb the wafer, resulting in a relatively reduced flow rate of the internal air. Air sucked into the discharge hose 400 and stagnated in the cavity 200 formed in the inner tube 600 without being discharged to the outside, and is supplied through the discharge hole 301 to seat the wafer W in a subsequent process. Blocking the foreign matters such as dust, which is stagnant in the cavity 200, drops to the upper portion of the wafer W, and the processed wafer is completed because the foreign matter such as dust is disposed on the upper portion of the wafer W. Problems that cause the malfunction and failure of the will occur.

In addition, the wafer is often subjected to a heating process due to its processing characteristics. Therefore, when the wafer is seated on the seating portion of the satellite and adsorbs the expanded wafer W, the satellite on which the wafer W is seated is adsorbed together with the wafer W and the satellite is adsorbed. The problem of separation from the device will arise.

The present invention has been made to solve the above problems, the sliding cover is slidably coupled to the outer surface of the body portion is provided with a blocking cover to block foreign substances such as dust flowing between the body portion and the wafer instantaneously when the wafer is adsorbed. It is to provide a robot hand for conveying wafers.

The present invention also provides a wafer transfer robot hand having a blocking cover interposed between a body portion and a blocking cover and providing an elastic member to the blocking cover to apply an elastic force in a downward direction of the body portion.

The present invention also provides a wafer transfer robot hand having a blocking cover having grooves communicating with an intake hole in an inward direction from an outer side of a lower surface of a lower body.

According to the present invention for achieving the above object, the lower body is open as usual, the upper body is formed with an air outlet on one side of the upper side and the upper side is open to the lower body of the upper body and the intake hole is formed in the center of the bottom and the bottom is outside A body portion including a lower body formed around the periphery and the upper portion of the inside of the body portion is installed on the intake hole, the air pressure is injected from the outside through the air injection port formed on one side of the bottom negative pressure near the intake hole It comprises a Bernoulli chuck and a blocking cover slidably coupled to the outer surface of the body portion and an elastic member interposed between the blocking cover and the body portion to apply an elastic force to the blocking cover in the lower direction of the body portion. Provided is a robot hand for wafer transfer provided with a blocking cover.

In addition, it is located between the outer surface of the upper body and the blocking cover, the stopper member disposed on the upper end of the lower body and coupled to one side of the upper end of the blocking cover is accompanied by the lifting and lowering of the blocking cover, the stopper when descending It is preferable to further include a departure preventing portion that is supported on the top of the member to prevent the blocking cover is separated from the lower portion of the body portion.

In addition, the upper body is formed with a guide groove along the height direction on one side of the outer surface, the separation prevention portion is coupled to one end of the upper end of the blocking cover and coupled to one end of the support bolt and the support bolt supported on the stopper member More preferably, the nut is formed at the other end of the support bolt and the friction reducing member is seated in the guide groove.

In addition, the friction reducing member is more preferably formed of a ball plunger.

In addition, it is preferable that at least one groove is formed on the bottom of the lower body to communicate with the intake hole from the outside to the inside.

According to the present invention as described above, by blocking the foreign matter, such as dust flowing between the body portion and the wafer by the blocking cover during the adsorption of the wafer to prevent contamination of the conveyed wafer can reduce the defect rate of the wafer There is.

In addition, the blocking cover supports the satellite when the wafer is absorbed by the elastic member interposed between the body portion and the blocking cover to apply elastic force to the blocking cover in the lower direction of the body, thereby easily absorbing the expanded wafer through the heating process. You can do it.

In addition, a groove is formed in the bottom surface of the lower body to communicate with the intake hole, the outside air is continuously introduced through the groove in the process of adsorbing and transporting the wafer, the flow of the internal air is not stagnant, such as dust contained in the internal air It is possible to prevent the foreign matter from falling to the top of the wafer to be seated in the subsequent process.

1 is a cross-sectional view of a conventional wafer transfer robot hand.
Figure 2 is a perspective view showing the working state of the wafer transfer robot hand with a blocking cover according to the present invention.
Figure 3 is a cross-sectional view of the wafer transfer robot hand with a blocking cover according to the present invention.
Figure 4 is a bottom view of the wafer transfer robot hand with a blocking cover according to the present invention.
5 is a cross-sectional view showing a state before the adsorption of the wafer transfer robot hand with a blocking cover according to the present invention.
Figure 6 is a cross-sectional view showing a state after the adsorption of the robot carrier for wafer transfer with a blocking cover according to the present invention.
Figure 7 is a cross-sectional view showing the internal air flow in the transport state after the adsorption of the wafer transfer robot hand with a blocking cover according to the present invention.

Hereinafter, with reference to the drawings will be described the present invention in more detail. It should be noted that the same elements in the figures are denoted by the same reference numerals wherever possible. In the following description, well-known functions or constructions that may unnecessarily obscure the gist of the invention will not be described in detail.

Figure 2 is a perspective view showing the working state of the wafer transfer robot hand with a blocking cover according to the present invention, Figure 3 is a cross-sectional view of the wafer transfer robot hand with a blocking cover according to the present invention, Figure 4 Bottom view of a wafer transfer robot hand with a blocking cover according to the invention.

2 to 4, the wafer transfer robot hand 1 with a blocking cover according to the present invention is mounted and rotated on a multi-axis joint robot 70 composed of a robot body 71 and a robot arm 72. The wafer W seated on the satellite 80 is absorbed and transferred to a subsequent process.

Here, the satellite 80 has a disc shape, which is detachably connected to a rotating shaft formed at a lower center thereof, and rotates, and a plurality of satellite seats formed with a satellite guide 81 are formed along the upper circumference thereof to form a wafer. (W) is seated.

The wafer transfer robot hand 1 having a blocking cover installed at the end of the multi-axis joint robot 70 includes a body portion 10, a Bernoulli chuck 30, a blocking cover 40, and a stopper member 90. , The separation prevention unit 50 and the elastic member 60 is formed.

The body portion 10 is a cylindrical shape having an open lower portion, the upper body 10a having an air outlet 11 formed on one side of the upper surface, and an upper portion having a larger diameter than the diameter of the upper body 10a. Intake hole 12 is formed in the center portion, and comprises a lower body (10b) coupled to the lower portion of the upper body (10a).

As above, the air outlet 11 formed in the upper body (10a) provides a discharge path of the air flowing into the interior of the upper body (10a), the intake hole (12) formed in the lower body (10b) is the lower body ( It serves to provide a suction path of the air sucked into the interior of (10b).

In addition, the upper surface of the lower body (10b) is formed with a first air induction plane inclined downward in the inward direction to provide a flow path of air injected through the air injector 31 to be described later.

In addition, the lower body 10b is provided with a space portion at one side of the outer surface of the lower body, thereby providing an installation space for the elastic member 60 to be described later, and a rounded jaw 13 is formed along the periphery of the bottom surface to adsorb the wafer W. When the upper surface of the wafer (W) is not in contact with the entire bottom surface of the bottom body 10b, only the edge of the wafer (W) is contacted by the annulus 13, it is possible to minimize the damage of the absorbed wafer (W).

In addition, a support protrusion 16 supported by the satellite guide 81 is formed at one side of the bottom surface of the round bar 23 to support the lower body 10b when the wafer W is attracted to the satellite guide 81. Play a role.

Here, the diameter of the lower body (10b) is formed larger than the diameter of the upper body (10a) is to provide an arrangement space of the stopper member 90 to be described later on the upper end of the lower body (10b).

The stopper member 90 has a cylindrical shape with an upper and lower portion open and is positioned at the upper end of the lower body 10b through the upper body 10a, and is described later on the outer surface of the upper body 10a in which the stopper member 90 is not located. The guide groove 14 is formed along the height direction of the upper body 10a at a position corresponding to the separation preventing part 50.

The stopper member 90 and the guide groove 14 will be described in detail together with the separation preventing unit 50 to be described later.

Bernoulli chuck 30 is a cylindrical shape is coupled to one side of the inner surface of the body portion 10 through a separate bracket is installed on the upper side of the intake hole 12, the air sprayer 31 is connected to the external air supply device on one side of the upper surface It is installed, the groove 32 of the fan-shaped cross-sectional shape is formed along the periphery on one side of the bottom surface corresponding to the periphery of the intake hole (12).

In addition, an air injection hole 33 connected to the air injector 31 is formed in a straight portion of the groove 32 of the fan-shaped cross-sectional shape to direct air injected through the air injector 31 toward the first air induction plane 17. It serves to spray at an angle.

In addition, an air induction part 20 having a second air induction plane 21 inclined upward from one side of the bottom part is formed around the bottom of the Bernoulli chuck 30.

The air induction part 20 forms a passage between the second air induction plane 21 and the first air induction plane 17 formed in the lower body 10b, thereby allowing a flow path of air to be ejected through the air injection port 33. At the same time serves to increase the flow rate of air flowing into the passage to generate a negative pressure on the intake hole 12 side formed in the lower body (10b).

As described above, when the bottom surface of the body portion 10 approaches the wafer W to adsorb the wafer W due to the negative pressure generated near the intake hole 12, the positive pressure may be applied to the bottom surface of the wafer W. Generated, and the wafer W is attracted to the bottom surface of the body portion 10.

The blocking cover 40 has a cylindrical shape in which the upper and lower portions are open, and is slidably coupled to the outer surfaces of the stopper member 20 and the lower body 10b, and the bottom surface is located below the lower surface of the body portion 10, thereby providing a wafer ( In the case of adsorbing W), the upper surface of the satellite 80 is in close contact with the bottom surface of the body 10 to prevent foreign substances such as dust contained in the outside air from entering the interior of the blocking cover 40. do.

In addition, the lower end portion is bent in two stages inwardly to provide a seating surface of the elastic member 60 to be described later on the upper surface of the bent portion is bent by one stage.

The separation prevention part 50 is coupled to one side of the upper end of the blocking cover 40 to be lifted up and down when the blocking cover 40 is lifted, and is supported on the top of the stopper member 20 when the blocking cover 40 is lowered. It serves to prevent the departure from the lower portion 10.

The separation prevention part 50 is a nut 52 coupled to one end of the support bolt 51 and the support bolt coupled to one side of the upper end of the blocking cover 40 corresponding to the guide groove 14 of the upper body 10a. And a friction reducing member 53 formed at the other end of the support bolt and seated in the guide groove 14 of the upper body 10a.

Here, the friction reducing member 53 is formed of a known ball plunger, is seated in the guide groove 14 of the upper body (10a) to prevent the side flow of the blocking cover 40 and the blocking cover 40 is When moving up and down, as the slide moves along the guide groove 14 of the upper body (10a), the friction is reduced, so that the blocking cover 40 can be raised and lowered smoothly as well as the repeated rising and falling of the blocking cover 40 Due to this, friction between the upper body 10a and the separation prevention part 50 is generated, which serves to prevent the upper body 10a from being worn.

The elastic member 60 is interposed on the bottom surface of the lower body 10b formed with the upper surface of the bent portion bent and the space portion of the blocking cover 40 to apply an elastic force to the blocking cover 40 downward.

Therefore, even when the wafer W is expanded in volume through the heating process, the bottom surface of the blocking cover 40 presses the upper surface of the satellite 80 by the restoring force of the elastic member 60, thereby undergoing the heating process. Even when the volume W of the expanded wafer W is adsorbed, only the wafer W can be easily adsorbed without accompanying the satellite 80 along with the adsorbed wafer W.

Figure 5 is a cross-sectional view showing a state before the adsorption of the wafer transfer robot hand with a blocking cover according to the present invention, Figure 6 is a cross-sectional view showing a state after the adsorption of the wafer transfer robot hand with a blocking cover according to the present invention. to be.

5 to 6, in the wafer transfer robot hand 1 having the blocking cover according to the present invention, the bottom surface of the blocking cover 40 is disposed on the upper surface of the satellite 80 before the wafer W is attracted. By contacting in advance, foreign matters such as dust existing in the outside air are blocked.

In addition, when the bottom surface of the body portion 10 is brought close to the wafer W in order to adsorb the wafer W, the wafer W is brought into close contact with the annulus 13 formed on the bottom surface of the body portion 10 and adsorbed. The elastic member 60 interposed between the bottom surface and the cover of the part 10 is contracted so that the restoring force of the contracted elastic member 60 acts on the cover so that the bottom surface of the cover presses the upper surface of the wafer W.

As described above, the bottom surface of the cover pressurizes the upper surface of the wafer W during the adsorption of the wafer W, and thus the satellite W 80 is adsorbed even when the wafer W is adsorbed through the heating process. ) Can be easily adsorbed only the wafer (W) without accompanying.

Figure 7 is a cross-sectional view showing the internal air flow in the transport state after the adsorption of the wafer transfer robot hand with a blocking cover according to the present invention.

On the other hand, in the process of adsorbing the wafer (W), even if the blocking cover 40 is in close contact with the upper surface of the satellite 80 to block the inflow of foreign substances such as dust, some may be introduced, such as some introduced dust Foreign matter may be introduced into the body portion 10 during the wafer (W) adsorption process.

As described above, foreign matters such as dust introduced into the body part 10 through the intake hole 12 in the adsorption process are absorbed and transferred to the wafer W, and the upper surface of the wafer W and the bottom of the body part 10. Since the air flowing from the outside is blocked by being closely adhered to the annulus 13 formed at the inside, the air flow inside is relatively stagnant, so that the internal air flows smoothly through the air outlet 11 formed on the upper surface of the body part 10. It is not discharged to occur a phenomenon that the stagnation inside the body portion 10 occurs.

As a result, when the air injected through the air injector 31 is blocked in order to transfer and seat the wafer W in a subsequent process, foreign substances such as dust, which are stagnant in the body part 10, are disposed on the upper surface of the wafer W. FIG. Since it falls on the wafer W and is processed together with the wafer W, it causes a malfunction and defect of the wafer W.

For this reason, even during the process of adsorbing and transporting the wafer W, the body part maintains the flow of internal air discharged to the air outlet 11 so that foreign substances such as dust can be smoothly discharged through the air outlet 11. A groove 15 communicating with the intake hole 12 is formed on the bottom surface of the bottom including the annulus 13 of FIG. 10. As shown in FIG. 7, the process of absorbing and transporting the wafer W is performed. Even during the groove 15, the external air is continuously introduced to maintain the flow of the internal air to smoothly discharge foreign substances such as dust through the air outlet (11).

If the groove 15 is formed such that the depth is too large, the positive pressure formed on the bottom surface of the wafer W is reduced, so that the adsorption force of the wafer W is reduced. If the groove 15 is formed too small, the inflow of external air does not occur. Since the flow of internal air cannot be maintained continuously, it is preferable to form 0.5 to 2mm.

Although the present invention has been described above in connection with the preferred embodiments, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. It is, therefore, to be understood that the appended claims will include all such modifications and changes as fall within the true spirit of the invention.

1: Wafer transfer robot hand with blocking cover
10: body portion 10a: upper body
10b: lower body 11: air outlet
12 intake hole 13: round jaw
14: guide groove 15: groove
16: support protrusion 17: the first air induction plane
20: air induction part 21: second air induction plane
30 Bernoulli Chuck 31
32: groove 33: air injection port
40: blocking cover 50: separation prevention part
51: support bolt 52: nut
53: friction reducing member 60: elastic member
70: multi-axis joint robot 71: robot body
72: robot arm 80: satellite
81: satellite guide 90: stopper member
W: Wafer

Claims (5)

In the wafer hand robot hand is provided at the end of the multi-axis joint robot to transfer the wafer,
An upper body having an air outlet formed on one side of the upper surface as an open side, and a lower body having an intake hole formed in a central portion of the bottom surface and having an annulus formed around the lower side of the lower side, Body portion comprising;
A Bernoulli chuck installed in an upper portion of the intake hole in the body part and injecting air supplied from the outside through an air injection hole formed at one side of the bottom surface to generate a negative pressure in the vicinity of the intake hole;
A blocking cover slidably coupled to the outer surface of the body part;
And an elastic member interposed between the blocking cover and the body portion to apply an elastic force to the blocking cover in a downward direction of the body portion.
The method of claim 1,
A stopper member disposed between an outer surface of the upper body and the blocking cover and disposed at an upper end of the lower body;
It is coupled to one side of the upper end of the blocking cover is accompanied by the lifting when the blocking cover ascends, and is supported by the upper end of the stopper member when descending to prevent the blocking cover is separated from the lower portion of the body portion further includes: Robot hand for wafer transfer provided with a blocking cover, characterized in that.
3. The method of claim 2,
The upper body is formed with a guide groove along the height direction on one side of the outer surface,
The release preventing part is coupled to one side of the upper end of the blocking cover and formed on the other end of the support bolt and the support bolt is supported on the top of the stopper member and one end of the support bolt and the support bolt, seated in the guide groove Robot hand for wafer transfer with a blocking cover, characterized in that comprises a reducing member.
The method of claim 3, wherein
The friction reducing member is a wafer transfer robot hand having a blocking cover, characterized in that formed by a ball plunger.
The method of claim 1,
At least one groove is formed on the bottom surface of the lower body in communication with the intake hole from the outside to the inward direction is provided with a wafer cover robot hand with a blocking cover.
KR1020130043399A 2013-04-19 2013-04-19 Hand of robot for transferring wafer having sealed cover KR101303708B1 (en)

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Citations (4)

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Publication number Priority date Publication date Assignee Title
KR20020022447A (en) * 2000-09-20 2002-03-27 김광교 Spin etcher and etching method
KR20110055691A (en) * 2008-08-28 2011-05-25 코닝 인코포레이티드 Non-contact manipulating devices and methods
KR101056705B1 (en) 2011-05-09 2011-08-12 한국뉴매틱(주) Vacuum gripper device
KR101177926B1 (en) 2011-05-13 2012-08-29 정수철 Vacuum sticking device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020022447A (en) * 2000-09-20 2002-03-27 김광교 Spin etcher and etching method
KR20110055691A (en) * 2008-08-28 2011-05-25 코닝 인코포레이티드 Non-contact manipulating devices and methods
KR101056705B1 (en) 2011-05-09 2011-08-12 한국뉴매틱(주) Vacuum gripper device
KR101177926B1 (en) 2011-05-13 2012-08-29 정수철 Vacuum sticking device

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