CN103871945B - 基板的剥离装置和剥离方法以及电子器件的制造方法 - Google Patents

基板的剥离装置和剥离方法以及电子器件的制造方法 Download PDF

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Publication number
CN103871945B
CN103871945B CN201310698272.9A CN201310698272A CN103871945B CN 103871945 B CN103871945 B CN 103871945B CN 201310698272 A CN201310698272 A CN 201310698272A CN 103871945 B CN103871945 B CN 103871945B
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CN
China
Prior art keywords
mentioned
stripping
substrate
plate
adsorption plane
Prior art date
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Active
Application number
CN201310698272.9A
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English (en)
Chinese (zh)
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CN103871945A (zh
Inventor
伊藤泰则
宇津木洋
泷内圭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN103871945A publication Critical patent/CN103871945A/zh
Application granted granted Critical
Publication of CN103871945B publication Critical patent/CN103871945B/zh
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54—Article strippers, e.g. for stripping from advancing elements
    • B65H29/56—Article strippers, e.g. for stripping from advancing elements for stripping from elements or machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201310698272.9A 2012-12-18 2013-12-18 基板的剥离装置和剥离方法以及电子器件的制造方法 Active CN103871945B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-275538 2012-12-18
JP2012275538A JP6016108B2 (ja) 2012-12-18 2012-12-18 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
CN103871945A CN103871945A (zh) 2014-06-18
CN103871945B true CN103871945B (zh) 2017-04-12

Family

ID=50910350

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310698272.9A Active CN103871945B (zh) 2012-12-18 2013-12-18 基板的剥离装置和剥离方法以及电子器件的制造方法

Country Status (4)

Country Link
JP (1) JP6016108B2 (ja)
KR (1) KR102054699B1 (ja)
CN (1) CN103871945B (ja)
TW (1) TWI601682B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102165162B1 (ko) * 2014-03-12 2020-10-14 삼성디스플레이 주식회사 기판 박리 장치 및 이를 이용한 소자 제조 방법
JP6547403B2 (ja) * 2014-06-05 2019-07-24 Ａｇｃ株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6873986B2 (ja) 2015-10-30 2021-05-19 コーニング インコーポレイテッド 第２基板に接合された第１基板を加工する方法
KR102073743B1 (ko) * 2017-12-19 2020-02-05 성진세미텍주식회사 필름 분리장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0925888A1 (en) * 1997-12-26 1999-06-30 Canon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacture method
JP2000084844A (ja) * 1998-09-17 2000-03-28 Asahi Glass Co Ltd 板状体の剥離方法及びその装置
CN1582221A (zh) * 2001-04-10 2005-02-16 硅绝缘技术公司 基片层切割设备及相关方法
CN101333079A (zh) * 2008-08-06 2008-12-31 友达光电股份有限公司 贴膜撕离装置及方法
CN102202994A (zh) * 2009-08-31 2011-09-28 旭硝子株式会社 剥离装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0925888A1 (en) * 1997-12-26 1999-06-30 Canon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacture method
JP2000084844A (ja) * 1998-09-17 2000-03-28 Asahi Glass Co Ltd 板状体の剥離方法及びその装置
CN1582221A (zh) * 2001-04-10 2005-02-16 硅绝缘技术公司 基片层切割设备及相关方法
CN101333079A (zh) * 2008-08-06 2008-12-31 友达光电股份有限公司 贴膜撕离装置及方法
CN102202994A (zh) * 2009-08-31 2011-09-28 旭硝子株式会社 剥离装置

Also Published As

Publication number Publication date
KR20140079310A (ko) 2014-06-26
KR102054699B1 (ko) 2019-12-11
JP6016108B2 (ja) 2016-10-26
TW201429854A (zh) 2014-08-01
CN103871945A (zh) 2014-06-18
TWI601682B (zh) 2017-10-11
JP2014118276A (ja) 2014-06-30

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Address after: Tokyo, Japan, Japan

Patentee after: AGC Corporation

Address before: Tokyo, Japan, Japan

Patentee before: Asahi Glass Co., Ltd.

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