CN103871931B - 分割装置以及分割方法 - Google Patents
分割装置以及分割方法 Download PDFInfo
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- CN103871931B CN103871931B CN201310655965.XA CN201310655965A CN103871931B CN 103871931 B CN103871931 B CN 103871931B CN 201310655965 A CN201310655965 A CN 201310655965A CN 103871931 B CN103871931 B CN 103871931B
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000011218 segmentation Effects 0.000 claims abstract description 184
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- 230000014759 maintenance of location Effects 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
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- 230000033228 biological regulation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
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- 239000012530 fluid Substances 0.000 description 1
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- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012272203A JP6047392B2 (ja) | 2012-12-13 | 2012-12-13 | 分割装置および分割方法 |
| JP2012-272203 | 2012-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103871931A CN103871931A (zh) | 2014-06-18 |
| CN103871931B true CN103871931B (zh) | 2018-02-13 |
Family
ID=50910336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310655965.XA Active CN103871931B (zh) | 2012-12-13 | 2013-12-06 | 分割装置以及分割方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6047392B2 (ja) |
| CN (1) | CN103871931B (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140182B (zh) * | 2015-04-28 | 2018-10-30 | 苏州镭明激光科技有限公司 | 晶圆劈裂机 |
| JP2017112265A (ja) * | 2015-12-17 | 2017-06-22 | 株式会社ディスコ | ウエーハの加工方法 |
| JP7015668B2 (ja) * | 2017-10-11 | 2022-02-03 | 株式会社ディスコ | 板状物の分割装置 |
| JP7032954B2 (ja) | 2018-02-27 | 2022-03-09 | 京セラ株式会社 | ヒータ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049815A (zh) * | 2009-10-30 | 2011-05-11 | 三星钻石工业股份有限公司 | 断开装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4447392B2 (ja) * | 2004-07-23 | 2010-04-07 | 株式会社ディスコ | ウエーハの分割方法および分割装置 |
| JP2006128211A (ja) * | 2004-10-26 | 2006-05-18 | Disco Abrasive Syst Ltd | ウエーハの分割装置 |
| JP4721997B2 (ja) * | 2006-09-14 | 2011-07-13 | 株式会社ディスコ | ウエーハの分割装置およびウエーハの分割方法 |
| JP5310278B2 (ja) * | 2009-06-05 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | ブレイクバー |
-
2012
- 2012-12-13 JP JP2012272203A patent/JP6047392B2/ja active Active
-
2013
- 2013-12-06 CN CN201310655965.XA patent/CN103871931B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049815A (zh) * | 2009-10-30 | 2011-05-11 | 三星钻石工业股份有限公司 | 断开装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103871931A (zh) | 2014-06-18 |
| JP2014120508A (ja) | 2014-06-30 |
| JP6047392B2 (ja) | 2016-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |