CN1038491C - 集成电路元件托盘 - Google Patents

集成电路元件托盘 Download PDF

Info

Publication number
CN1038491C
CN1038491C CN95117664A CN95117664A CN1038491C CN 1038491 C CN1038491 C CN 1038491C CN 95117664 A CN95117664 A CN 95117664A CN 95117664 A CN95117664 A CN 95117664A CN 1038491 C CN1038491 C CN 1038491C
Authority
CN
China
Prior art keywords
pallet
chip
tray
base
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95117664A
Other languages
English (en)
Chinese (zh)
Other versions
CN1126688A (zh
Inventor
罗德尼·E·克里斯普
特里·W·戴维斯
斯蒂芬·B·范欧格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of CN1126688A publication Critical patent/CN1126688A/zh
Application granted granted Critical
Publication of CN1038491C publication Critical patent/CN1038491C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
CN95117664A 1994-10-27 1995-10-26 集成电路元件托盘 Expired - Fee Related CN1038491C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US330029 1994-10-27
US08/330,029 US5636745A (en) 1994-10-27 1994-10-27 Tray for a component and an apparatus for accurately placing a component within the tray

Publications (2)

Publication Number Publication Date
CN1126688A CN1126688A (zh) 1996-07-17
CN1038491C true CN1038491C (zh) 1998-05-27

Family

ID=23288001

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95117664A Expired - Fee Related CN1038491C (zh) 1994-10-27 1995-10-26 集成电路元件托盘

Country Status (8)

Country Link
US (1) US5636745A (enExample)
EP (1) EP0714231A3 (enExample)
JP (1) JPH08236607A (enExample)
KR (1) KR0184913B1 (enExample)
CN (1) CN1038491C (enExample)
CA (1) CA2159560C (enExample)
SG (1) SG65535A1 (enExample)
TW (1) TW290728B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5890599A (en) * 1990-09-25 1999-04-06 R.H. Murphy Company Tray for integrated circuits
US6527998B1 (en) * 1994-02-25 2003-03-04 Xilinx, Inc. Method of fabricating integrated circuit pack trays using modules
DE19635082C1 (de) * 1996-08-30 1998-03-05 Mci Computer Gmbh Stapelbarer Träger (Tray) für elektronische Bausteine, insbesondere IC-Bausteine
US5794783A (en) * 1996-12-31 1998-08-18 Intel Corporation Die-level burn-in and test flipping tray
DE19741350A1 (de) * 1997-09-19 1999-03-25 Mci Computer Gmbh Tray für IC-Bauelemente
US5848703A (en) * 1997-10-20 1998-12-15 R. H. Murphy Co., Inc. Tray for integrated circuits
US6029427A (en) * 1999-04-05 2000-02-29 Lucent Technologies, Inc. Method and apparatus for handling semiconductor chips
US6021904A (en) * 1999-06-08 2000-02-08 International Business Machines Corporation Chip carrier processing and shipping array and method of manufacture thereof
US6474475B1 (en) * 2000-02-22 2002-11-05 Micron Technology, Inc. Apparatus for handling stacked integrated circuit devices
US6476629B1 (en) * 2000-02-23 2002-11-05 Micron Technology, Inc. In-tray burn-in board for testing integrated circuit devices in situ on processing trays
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US7337522B2 (en) 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
CN100369536C (zh) 2001-03-14 2008-02-13 莱格西电子股份有限公司 制造具有三维半导体芯片阵列安装面的电路板的方法和装置
US6474477B1 (en) * 2001-05-02 2002-11-05 Ching T. Chang Carrier assembly for semiconductor IC (integrated circuit) packages
KR100447394B1 (ko) * 2001-11-02 2004-09-04 엘지전자 주식회사 통신시스템의 메시지처리방법
KR100566821B1 (ko) * 2002-11-20 2006-04-03 미래산업 주식회사 트레이 이송장치
DE102004052339B4 (de) * 2004-10-27 2006-12-07 Zlb Behring Gmbh Verfahren zur Herstellung einer Stapelhilfe für kastenförmige Behälter
WO2006076381A2 (en) 2005-01-12 2006-07-20 Legacy Electronics, Inc. Radial circuit board, system, and methods
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
US10601216B2 (en) * 2016-12-15 2020-03-24 International Business Machines Corporation Distributed environment analog multiplexor with high-voltage protection
JP6847729B2 (ja) * 2017-03-28 2021-03-24 株式会社ディスコ 切削装置
CN111776379A (zh) * 2020-06-23 2020-10-16 安徽三优光电科技有限公司 一种自动剥料机及其工作方法
CN113066773B (zh) * 2021-03-19 2022-04-01 深圳群芯微电子有限责任公司 一种集成电路的多芯片封装定位装置及其工作方法
CN114884478A (zh) * 2022-07-01 2022-08-09 成都泰美克晶体技术有限公司 一种光刻石英晶片及其电极的设计方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2264696A (en) * 1992-02-28 1993-09-08 Murphy R H Co Inc Tray for integrated circuits

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2944722A (en) * 1958-06-09 1960-07-12 Keystone Steel & Wire Co Crate stacker
US3549018A (en) * 1968-11-08 1970-12-22 Banner Metals Inc Plastic tray
US3623634A (en) * 1969-11-03 1971-11-30 Johanness Norgard Modular container
US3907111A (en) * 1973-06-14 1975-09-23 Rockwell International Corp Self-cleaning stackable container
US3946864A (en) * 1974-07-01 1976-03-30 Hutson Jearld L Semiconductor chip package
US4483441A (en) * 1981-03-26 1984-11-20 Tokyo Shibaura Denki Kabushiki Kaisha Flat-type semiconductor device and packing thereof
US4379505A (en) * 1981-10-20 1983-04-12 Gibson-Egan Company Integrated circuit carrier
US4444309A (en) * 1982-02-19 1984-04-24 Bourns, Inc. Carrier for a leadless integrated circuit chip
JPS61278159A (ja) * 1985-06-03 1986-12-09 Yamaichi Electric Mfg Co Ltd Ｉｃパツケ−ジ用キヤリア
US5103976A (en) * 1990-09-25 1992-04-14 R. H. Murphy Company, Inc. Tray for integrated circuits with supporting ribs
US5203452A (en) * 1992-03-13 1993-04-20 Illinois Tool Works, Inc. Shipping tray
US5186479A (en) * 1992-03-20 1993-02-16 Flowers Henry C Multi-function cart
US5413224A (en) * 1993-07-23 1995-05-09 Ply Mar Inc. Stackable pallet packaging
US5400904C1 (en) * 1993-10-15 2001-01-16 Murphy R H Co Inc Tray for ball terminal integrated circuits
US5492223A (en) * 1994-02-04 1996-02-20 Motorola, Inc. Interlocking and invertible semiconductor device tray and test contactor mating thereto
US5450959A (en) * 1994-08-30 1995-09-19 Paragon Electric Company, Inc. Apparatus for use in separating parts from a panel array of parts

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2264696A (en) * 1992-02-28 1993-09-08 Murphy R H Co Inc Tray for integrated circuits

Also Published As

Publication number Publication date
SG65535A1 (en) 1999-06-22
JPH08236607A (ja) 1996-09-13
CA2159560C (en) 1999-06-15
TW290728B (enExample) 1996-11-11
KR960015862A (ko) 1996-05-22
CN1126688A (zh) 1996-07-17
EP0714231A2 (en) 1996-05-29
EP0714231A3 (en) 1996-07-17
KR0184913B1 (ko) 1999-03-20
CA2159560A1 (en) 1996-04-28
US5636745A (en) 1997-06-10

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CI01 Publication of corrected invention patent application

Correction item: Priority

Correct: [32]1994.10.27 [33]US [31]330,029

Number: 29

Page: 1

Volume: 12

ERR Gazette correction

Free format text: CORRECT: PRIORITY; [32]4.10.27[33]US[31]330,029

C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee