CN103824849A - Multi-LED chip packaging device having reinforced light extraction structure and manufacturing methods thereof - Google Patents
Multi-LED chip packaging device having reinforced light extraction structure and manufacturing methods thereof Download PDFInfo
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- CN103824849A CN103824849A CN201410040941.8A CN201410040941A CN103824849A CN 103824849 A CN103824849 A CN 103824849A CN 201410040941 A CN201410040941 A CN 201410040941A CN 103824849 A CN103824849 A CN 103824849A
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Abstract
The invention discloses a multi-LED chip packaging device having reinforced light extraction structure. The multi-LED chip packaging device comprises a substrate and a lens; and the substrate and the lens are connected and forms a space for placing LED chips. A plurality of grooves or a plurality of recessed holes are formed in the end surface of the lens; and when the plurality of grooves are formed in the end surface of the lens, the grooves include a plurality of annular groove units, wherein center lines of the plurality of annular groove units are superposed with the center line of the lens and diameters of the annular groove units gradually increase outwardly from the center line of the lens. When the plurality of recessed holes are formed in the end surface of the lens, the recessed holes are distributed in a radiation or array mode at the center line of the lens. In addition, the invention also provides two kinds of manufacturing methods of the multi-LED chip packaging device having the reinforced light extraction structure. According to the invention, the provided multi-LED chip packaging device has advantages of good light extraction effect, long service life and low processing cost.
Description
Technical field
The present invention relates to LED technical field, be specifically related to a kind of many LED chips packaging and manufacture method thereof with strengthening light emitting structures.
Background technology
Due to LED(light-emitting diode) light fixture has that luminance is high, energy-conserving and environment-protective, and the efficient high life, various features such as response grade is paid close attention to by people day by day fast.Single LEDs chipware light efficiency is high, but the brightness of single LEDs chip can not meet the required brightness requirement of lighting field, for example automobile front, need 3000lm(lumen) more than, for another example, street lamp, more than needing 4000lm, also only have about 120lm but commercialization list LEDs device is the highest, completely can not practical requirement.COB encapsulation has high packaging density, exceeds the features such as optical density, can meet lighting field requirement.Adopt COB(chip on board encapsulation technology), mainly encapsulating many pieces of LED chips by the packaging forming of lens and substrate.Use plurality of LEDs chip not only can improve brightness, also contribute to realize the reasonable disposition of LED chip, reduce the input current amount of single led chip to guarantee long-life and high efficiency.But the sunken light situation of COB encapsulated layer allows of no optimist at present, and total reflection occurs quite a few light in lens, and this causes the light extraction efficiency of the lens for encapsulating low.And the light of total reflection occurs can be absorbed by LED chip, be converted into heat, so that high-power LED chip heating is serious, and the luminous efficiency of LED chip is caused to serious impact, meanwhile, also cause the life-span of LED chip to reduce.
Summary of the invention
The object of the invention is the deficiency existing in order to overcome above prior art, provide a kind of simple and reasonable for structure, light emission rate is high, reduces high many LED chips packaging with strengthening light emitting structures of LED chip heating and life-span.The present invention simultaneously also provides the manufacture method of two kinds of above-mentioned many LED chips packagings with strengthening light emitting structures.
Object of the present invention realizes by following technical scheme: originally have many LED chips packaging of strengthening light emitting structures, comprise substrate and lens, described substrate is connected with lens, and forms the space of placing LED chip; The end face of described lens is provided with many grooves or multiple shrinkage pool, in the time that the end face of described lens is provided with many grooves, described groove includes many ring-shaped grooves, the center line of many described ring-shaped grooves all overlaps with the center line of lens, and the diameter of many described ring-shaped grooves outwards increases gradually from the center line of lens; In the time that the end face of described lens is provided with multiple shrinkage pool, described multiple shrinkage pools in the center line of lens radially or array distribution.
Light effect and reduce the total reflection of light for further strengthening, described groove also includes many straight shape grooves, and many described straight shape grooves radially or array distribution.The described ring-shaped groove that both can only arrange, also can only arrange straight shape groove, and ring-shaped groove and the directly combination of shape groove also can be set simultaneously.
Concrete, the distance between adjacent 2 described ring-shaped grooves is 2.5mm～6mm; The aperture of described shrinkage pool is 1mm～1.5mm, and the degree of depth of shrinkage pool is 1mm～1.5mm.
Preferred as one, the cross section of described groove is V-shaped, and the corner dimension between two groove faces of described groove is 45 °～135 °, and the groove depth of described groove is 1mm～1.5mm.
Preferred as one, the cross section semicircular in shape of described groove, and the diameter of described groove is 1mm～2mm.
Preferred as one, the cross section of described groove is isosceles trapezoid, and the bottom land width of described groove is 0.5mm～0.8mmm; The degree of depth of described groove is 1mm～1.5mm; The crossing corner dimension of 2 ramps of described groove is 60 °～150 °.
The end face of described lens is plane or curved surface.The end face of lens, i.e. exiting surface, all has the good light effect that goes out during for plane or curved surface, and the material of described lens is epoxy resin or silicones.
Preferred as one, the manufacture method of described many LED chips packaging with strengthening light emitting structures, comprises the following steps:
A. silica gel deaeration degasification: silica gel is placed in to vacuum environment and carries out deaeration, thereby obtain packing colloid;
B. separation agent spraying: dilution separation agent, the separation agent having diluted is in right amount sprayed to impressing mould, described impressing mould comprises the cylinder of the body of round pie and corresponding with shrinkage pool and big or small coupling, described cylinder is fixed on body; The described release agent having diluted is sprayed at impressing mould; The impressing mould that has sprayed release agent is placed at the temperature of 75 ℃～85 ℃ and roasts 10min～15min;
C point glue: fixed L ED chip on substrate, and the box dam mating with lens size is set on substrate, described LED chip is positioned at box dam, then substrate is carried out to the pre-heat treatment, then appropriate packing colloid is injected in box dam;
D, compacting shrinkage pool: make the temperature of the silica gel in box dam remain on 120 °～125 °, and then impressing mould is impressed on the packing colloid in box dam, make cylinder insert the packing colloid in circle dam, colloid to be packaged solidifies after 10min～15min, impressing mould is separated with silica gel, now the silica gel in box dam and substrate form semi-finished product together with fixing, semi-finished product are again placed under the environment of 150 °～170 ° and toast 2 hours～3 hours, thereby make many LED chips packaging with strengthening light emitting structures.
Preferred as one, the manufacture method of described many LED chips packaging with strengthening light emitting structures, comprises the following steps:
A, sampling clamping: choose LED chip, and these LED chips are put in injection mold; Described injection mold comprises patrix, bed die and nozzle, and described patrix and bed die coordinate formation injection moulding space, the form fit in the shape that described substrate and lens link together and injection moulding space; The face that described patrix is relative with bed die is provided with many projections of mating with groove size, and described patrix is connected with bed die, and the face that described patrix deviates from bed die is provided with installing hole, and the bottom of described installing hole is provided with through hole, and described through hole is communicated with installing hole and injection moulding space; Described nozzle inserts installing hole, and described nozzle is communicated with installing hole;
B, preheating injection mold: by injection mold heating, the temperature of heating is 70 ℃～90 ℃;
C, injection moulding: the packing colloid of fusing is injected to injection moulding space from nozzle, in the time that packing colloid is full of injection moulding space, stop injection moulding; After the packing colloid cooling curing in injection moulding space, form many LED chips packaging with strengthening light emitting structures.
The present invention has advantages of as follows with respect to prior art: originally have many LED chips packaging of strengthening light emitting structures by the end face at lens, it is exiting surface, be provided with groove, thereby prevent light generation total reflection, improve the light emission rate of lens, simultaneously LED chip can be because the light that sucks total reflection generates heat, therefore in improving the luminous efficiency of LED chip, the useful life of also having improved LED chip; Originally have many LED chips packaging simple in structure of strengthening light emitting structures, make conveniently, cost is low, can produce in enormous quantities; The manufacture method originally with many LED chips packaging of strengthening light emitting structures has two kinds, and a kind of use mold injection system is manufactured, and another kind is impression manufacture, and the processing technology of these two kinds of manufacture methods is simple and convenient, and low cost of manufacture.
Accompanying drawing explanation
Fig. 1 is the structural representation of many LED chips packaging with strengthening light emitting structures of embodiment 1.
Fig. 2 is the end view of many LED chips packaging with strengthening light emitting structures of embodiment 1.
Fig. 3 is the structural representation of the manufacture of embodiment 1 injection mold of using while having many LED chips packaging of strengthening light emitting structures.Wherein projection does not draw.
Fig. 4 is the structural representation of many LED chips packaging with strengthening light emitting structures of embodiment 2.
Fig. 5 is the front view of many LED chips packaging with strengthening light emitting structures of embodiment 2.
Fig. 6 is the structural representation of many LED chips packaging with strengthening light emitting structures of embodiment 3.
Fig. 7 is the structural representation of the manufacture of embodiment 3 impressing mould of using while having many LED chips packaging of strengthening light emitting structures.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
This as depicted in figs. 1 and 2, described in have strengthening light emitting structures many LED chips packaging, comprise substrate 1 and lens 2, described substrate 1 is connected with lens 2, and form placement LED chip 4 space; The end face of described lens 2 is provided with many grooves or multiple shrinkage pool 12, in the time that the end face of described lens 2 is provided with many grooves, described groove includes many ring-shaped grooves 3, the center line of many described ring-shaped grooves 3 all overlaps with the center line of lens 2, and the diameter of many described ring-shaped grooves 3 outwards increases gradually from the center line of lens 2; In the time that the end face of described lens 2 is provided with multiple shrinkage pool 12, described multiple shrinkage pools 12 in the center line of lens radially or array distribution.
Concrete, the distance between adjacent 2 described ring-shaped grooves 3 is 4mm; The aperture of described shrinkage pool 12 is 1.2mm, and the degree of depth of shrinkage pool 12 is 1.2mm.
Preferred as one, the cross section of described groove is V-shaped, and the corner dimension between two groove faces of described groove is 90 °, and the groove depth of described groove is 1.2mm.
The end face of described lens 2 is plane or curved surface.The end face of lens 2, i.e. exiting surface, all has the good light effect that goes out during for plane or curved surface, and is curved surface when the end face of lens 2, and while being in particular dome shape, it is better that the exiting surface of lens 2 goes out light effect, and this is not easy to occur total reflection.
The material of described lens 2 is epoxy resin or silicones.
Preferred as one, the manufacture method of described many LED chips packaging with strengthening light emitting structures, comprises the following steps:
A, sampling clamping: choose LED chip, and these LED chips are put in injection mold; As shown in Figure 3, described injection mold comprises patrix 6, bed die 7 and nozzle 9, and described patrix and bed die coordinate formation injection moulding space 8, the shape that described substrate 1 and lens 2 link together and the form fit in injection moulding space 8; Described patrix 6 face relative with bed die 7 is provided with many projections of mating with groove size, described patrix 6 is connected with bed die 7, the face that described patrix 6 deviates from bed die 7 is provided with installing hole, and the bottom of described installing hole is provided with through hole 11, and described through hole 11 is communicated with installing hole and injection moulding space 8; Described nozzle 9 inserts installing hole, and described nozzle 9 is communicated with installing hole;
B, preheating injection mold: by injection mold heating, the temperature of heating is 80 ℃; In order to make pre-heat effect better, injection mold can be kept to 10min at 80 ℃;
C, injection moulding: the packing colloid of fusing is injected into injection moulding space 8 from nozzle 9, in the time that packing colloid is full of injection moulding space 8, stop injection moulding; After the packing colloid cooling curing in injection moulding space 8, form many LED chips packaging with strengthening light emitting structures.
Adopt injection moulding manufacture originally to have the mode of many LED chips packaging of strengthening light emitting structures, simple to operate, conveniently, and cost is low.
Originally have strengthening light emitting structures many LED chips packaging on embodiment 1 basis again increase below technical characterictic: as shown in Figure 4 and Figure 5, for further strengthening the total reflection that light effect and reduce light, described groove includes many straight shape grooves 5, many described straight shape groove 5 radial distribution.
Originally have strengthening many LED chips packaging of light emitting structures and manufacture method thereof except following technical characterictic with embodiment 1: as shown in Figure 6, described many LED chips packaging with strengthening light emitting structures, comprise substrate 1 and lens 2, described substrate 1 is connected with lens 2, and forms the space of placing LED chip; The end face of described lens 2 is provided with multiple shrinkage pools 12, and described multiple shrinkage pools 12 distribute radially in the center line of lens.
Preferred as one, the manufacture method of described many LED chips packaging with strengthening light emitting structures, comprises the following steps:
A. silica gel deaeration degasification: silica gel is placed in to vacuum environment and carries out deaeration, thereby obtain packing colloid; Utilize alcohol to clean beaker, and dry up beaker with air gun, the silica gel that proportioning is good is placed in beaker, then stirs, and this prevents that silica gel is mixed with impurity.
B. separation agent spraying: dilution separation agent, the separation agent having diluted is in right amount sprayed to impressing mould, as shown in Figure 7, described impressing mould comprises the body 13 of round pie and the cylinder 14 of corresponding with shrinkage pool 12 and big or small coupling, and described cylinder 14 is fixed on body 13; Body 13 and cylinder 14 are integrally formed, and impressing mould is an entirety.The described release agent having diluted is sprayed at impressing mould; The impressing mould that has sprayed release agent is placed at the temperature of 80 ℃ and roasts 10min; Separation agent herein can directly be bought from market;
C point glue: fixed L ED chip on substrate 1, and the box dam mating with lens 2 sizes is set on substrate 1, and described LED chip is positioned at box dam, then substrate 1 is carried out to the pre-heat treatment, and this is beneficial to flowing of packing colloid, reduces gap hiding bubbles; Then appropriate packing colloid is injected in box dam; For accurately controlling the amount of packing colloid, first can use syringe to inject packing colloid, then use point gum machine to inject packing colloid, carry out drop filling;
D, compacting shrinkage pool: make the temperature of the silica gel in box dam remain on 120 °, and then impressing mould is impressed on the packing colloid in box dam, make cylinder 14 insert the packing colloid in circle dam, colloid to be packaged solidifies after 10min, impressing mould is separated with silica gel, now the silica gel in box dam and substrate form semi-finished product together with fixing, semi-finished product are again placed under the environment of 160 ° and toast 2 hours, thereby make many LED chips packaging with strengthening light emitting structures.
The method manufacture that the present embodiment adopts impression to manufacture has many LED chips packaging of strengthening light emitting structures, and the method is simple to operation, cost is low.
Many LED chips packaging originally with strengthening light emitting structures except following technical characterictic with embodiment 1: preferred as one, the cross section semicircular in shape of described groove, and the diameter of described groove is 1.5mm.Adopt design, can reduce the total reflection of light in package lens, improve the light emission rate of lens.Meanwhile, this design is easy to process, and manufacture difficulty is low.
Embodiment 5:
Originally have strengthening light emitting structures many LED chips packaging except following technical characterictic with embodiment 3: preferred as one, the cross section of described groove is isosceles trapezoid, and the bottom land width of described groove is 0.6mmm; The degree of depth of described groove is 1.2mm; The crossing corner dimension of 2 ramps of described groove is 90 °.
Above-mentioned embodiment is the preferred embodiments of the present invention, can not limit the present invention, and other any change or other equivalent substitute mode that does not deviate from technical scheme of the present invention and make, within being included in protection scope of the present invention.
Claims (10)
1. many LED chips packaging with strengthening light emitting structures, comprises substrate and lens, and described substrate is connected with lens, and forms the space of placing LED chip; It is characterized in that: the end face of described lens is provided with many grooves or multiple shrinkage pool, in the time that the end face of described lens is provided with many grooves, described groove includes many ring-shaped grooves, the center line of many described ring-shaped grooves all overlaps with the center line of lens, and the diameter of many described ring-shaped grooves outwards increases gradually from the center line of lens; In the time that the end face of described lens is provided with multiple shrinkage pool, described multiple shrinkage pools in the center line of lens radially or array distribution.
2. many LED chips packaging with strengthening light emitting structures according to claim 1, is characterized in that: described groove also includes many straight shape grooves, and many described straight shape grooves radially or array distribution.
3. many LED chips packaging with strengthening light emitting structures according to claim 1, is characterized in that: the distance between adjacent 2 described ring-shaped grooves is 2.5mm～6mm; The aperture of described shrinkage pool is 1mm～1.5mm, and the degree of depth of shrinkage pool is 1mm～1.5mm.
4. many LED chips packaging with strengthening light emitting structures according to claim 1, it is characterized in that: the cross section of described groove is V-shaped, corner dimension between two groove faces of described groove is 45 °～135 °, and the groove depth of described groove is 1mm～1.5mm.
5. many LED chips packaging with strengthening light emitting structures according to claim 1, is characterized in that: the cross section semicircular in shape of described groove, and the diameter of described groove is 1mm～2mm.
6. many LED chips packaging with strengthening light emitting structures according to claim 1, is characterized in that: the cross section of described groove is isosceles trapezoid, and the bottom land width of described groove is 0.5mm～0.8mmm; The degree of depth of described groove is 1mm～1.5mm; The crossing corner dimension of 2 ramps of described groove is 60 °～150 °.
7. many LED chips packaging with strengthening light emitting structures according to claim 1, is characterized in that: the end face of described lens is plane or curved surface.
8. many LED chips packaging with strengthening light emitting structures according to claim 1, is characterized in that: the material of described lens is epoxy resin or silicones.
9. according to the manufacture method of the many LED chips packaging with strengthening light emitting structures described in any one in claim 1 to 8, it is characterized in that, comprise the following steps:
A. silica gel deaeration degasification: silica gel is placed in to vacuum environment and carries out deaeration, thereby obtain packing colloid;
B. separation agent spraying: dilution separation agent, the separation agent having diluted is in right amount sprayed to impressing mould, described impressing mould comprises the cylinder of the body of round pie and corresponding with shrinkage pool and big or small coupling, described cylinder is fixed on body; The described release agent having diluted is sprayed at impressing mould; The impressing mould that has sprayed release agent is placed at the temperature of 75 ℃～85 ℃ and roasts 10min～15min;
C point glue: fixed L ED chip on substrate, and the box dam mating with lens size is set on substrate, described LED chip is positioned at box dam, then substrate is carried out to the pre-heat treatment, then appropriate packing colloid is injected in box dam;
D, compacting shrinkage pool: make the temperature of the silica gel in box dam remain on 120 °～125 °, and then impressing mould is impressed on the packing colloid in box dam, make cylinder insert the packing colloid in circle dam, colloid to be packaged solidifies after 10min～15min, impressing mould is separated with silica gel, now the silica gel in box dam and substrate form semi-finished product together with fixing, semi-finished product are again placed under the environment of 150 °～170 ° and toast 2 hours～3 hours, thereby make many LED chips packaging with strengthening light emitting structures.
10. according to the manufacture method of the many LED chips packaging with strengthening light emitting structures described in any one in claim 1 to 8, it is characterized in that, comprise the following steps:
A, sampling clamping: choose LED chip, and these LED chips are put in injection mold; Described injection mold comprises patrix, bed die and nozzle, and described patrix and bed die coordinate formation injection moulding space, the form fit in the shape that described substrate and lens link together and injection moulding space; The face that described patrix is relative with bed die is provided with many projections of mating with groove size, and described patrix is connected with bed die, and the face that described patrix deviates from bed die is provided with installing hole, and the bottom of described installing hole is provided with through hole, and described through hole is communicated with installing hole and injection moulding space; Described nozzle inserts installing hole, and described nozzle is communicated with installing hole;
B, preheating injection mold: by injection mold heating, the temperature of heating is 70 ℃～90 ℃;
C, injection moulding: the packing colloid of fusing is injected to injection moulding space from nozzle, in the time that packing colloid is full of injection moulding space, stop injection moulding; After the packing colloid cooling curing in injection moulding space, form many LED chips packaging with strengthening light emitting structures.
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Cited By (6)
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| CN105470246A (en) * | 2015-12-21 | 2016-04-06 | 福建中科芯源光电科技有限公司 | Double-channel heat-conduction packaging structure and method for solid phosphor integrated light source |
| CN106409167A (en) * | 2016-11-11 | 2017-02-15 | 华南理工大学 | Injection-molded hidden type LED display screen and preparation method thereof |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN109817534A (en) * | 2018-05-10 | 2019-05-28 | 严宗周 | A kind of electromagnetism interference novel diode preparation method |
| CN110364613A (en) * | 2019-06-06 | 2019-10-22 | 佛山市中昊光电科技有限公司 | A kind of COB light source and its manufacturing method |
| WO2022013174A1 (en) * | 2020-07-17 | 2022-01-20 | Signify Holding B.V. | A lens plate and a lighting unit which includes the lens plate |
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| CN103824849B (en) | 2017-01-11 |
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