CN103811572B - 光电装置及其制造方法 - Google Patents
光电装置及其制造方法 Download PDFInfo
- Publication number
- CN103811572B CN103811572B CN201310560386.7A CN201310560386A CN103811572B CN 103811572 B CN103811572 B CN 103811572B CN 201310560386 A CN201310560386 A CN 201310560386A CN 103811572 B CN103811572 B CN 103811572B
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- Prior art keywords
- layer
- semiconductor
- semiconductor substrate
- semiconductor layer
- insulating layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 title claims description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 273
- 239000000758 substrate Substances 0.000 claims abstract description 147
- 239000002019 doping agent Substances 0.000 claims abstract description 51
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 27
- 230000005693 optoelectronics Effects 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims description 41
- 230000004888 barrier function Effects 0.000 claims description 16
- 238000009792 diffusion process Methods 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 14
- 238000005468 ion implantation Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 10
- 150000002500 ions Chemical class 0.000 claims description 9
- 238000002161 passivation Methods 0.000 claims description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- -1 oxygen ions Chemical class 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000000969 carrier Substances 0.000 description 18
- 230000007547 defect Effects 0.000 description 9
- 238000005215 recombination Methods 0.000 description 9
- 230000006798 recombination Effects 0.000 description 9
- 239000002585 base Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/13—Photovoltaic cells having absorbing layers comprising graded bandgaps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
- H10F10/146—Back-junction photovoltaic cells, e.g. having interdigitated base-emitter regions on the back side
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/122—Active materials comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/219—Arrangements for electrodes of back-contact photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
- H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261725437P | 2012-11-12 | 2012-11-12 | |
| US61/725,437 | 2012-11-12 | ||
| US13/949,147 | 2013-07-23 | ||
| US13/949,147 US20140130854A1 (en) | 2012-11-12 | 2013-07-23 | Photoelectric device and the manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103811572A CN103811572A (zh) | 2014-05-21 |
| CN103811572B true CN103811572B (zh) | 2017-12-12 |
Family
ID=49123763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310560386.7A Active CN103811572B (zh) | 2012-11-12 | 2013-11-12 | 光电装置及其制造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20140130854A1 (https=) |
| EP (1) | EP2731146B1 (https=) |
| JP (1) | JP6363335B2 (https=) |
| KR (1) | KR102148427B1 (https=) |
| CN (1) | CN103811572B (https=) |
| IN (1) | IN2013MU03516A (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104009114B (zh) * | 2013-05-22 | 2016-08-10 | 江苏爱多光伏科技有限公司 | 准单晶硅太阳能电池片的制造方法 |
| US9559236B2 (en) * | 2014-09-24 | 2017-01-31 | Sunpower Corporation | Solar cell fabricated by simplified deposition process |
| CN106784069A (zh) * | 2015-11-20 | 2017-05-31 | 上海神舟新能源发展有限公司 | 背表面隧道氧化钝化交指式背结背接触电池制作方法 |
| CN105390555A (zh) * | 2015-12-25 | 2016-03-09 | 常州天合光能有限公司 | 全背极太阳电池结构及其制备方法 |
| US9871150B1 (en) * | 2016-07-01 | 2018-01-16 | Sunpower Corporation | Protective region for metallization of solar cells |
| CN117352591A (zh) * | 2016-10-25 | 2024-01-05 | 信越化学工业株式会社 | 太阳能电池的制造方法 |
| CN116666468B (zh) | 2023-08-02 | 2023-10-27 | 天合光能股份有限公司 | 背接触电池及太阳电池组件 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6998288B1 (en) * | 2003-10-03 | 2006-02-14 | Sunpower Corporation | Use of doped silicon dioxide in the fabrication of solar cells |
| CN101889348A (zh) * | 2007-11-19 | 2010-11-17 | 应用材料股份有限公司 | 使用图案化蚀刻剂物质以形成太阳能电池接点的工艺 |
| CN202307920U (zh) * | 2008-06-12 | 2012-07-04 | 太阳能公司 | 具有多晶硅掺杂区域的背面接触太阳能电池结构 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3762144B2 (ja) * | 1998-06-18 | 2006-04-05 | キヤノン株式会社 | Ｓｏｉ基板の作製方法 |
| DE10127217B4 (de) * | 2001-06-05 | 2005-09-15 | Infineon Technologies Ag | Verfahren zur Herstellung lagegenauer großflächiger Membranmasken |
| US7468485B1 (en) * | 2005-08-11 | 2008-12-23 | Sunpower Corporation | Back side contact solar cell with doped polysilicon regions |
| US7737357B2 (en) * | 2006-05-04 | 2010-06-15 | Sunpower Corporation | Solar cell having doped semiconductor heterojunction contacts |
| JP2009152222A (ja) * | 2006-10-27 | 2009-07-09 | Kyocera Corp | 太陽電池素子の製造方法 |
| US20080173347A1 (en) * | 2007-01-23 | 2008-07-24 | General Electric Company | Method And Apparatus For A Semiconductor Structure |
| JP5226255B2 (ja) * | 2007-07-13 | 2013-07-03 | シャープ株式会社 | 太陽電池の製造方法 |
| JP2008085374A (ja) * | 2007-12-19 | 2008-04-10 | Sanyo Electric Co Ltd | 光起電力素子 |
| US20110000532A1 (en) * | 2008-01-30 | 2011-01-06 | Kyocera Corporation | Solar Cell Device and Method of Manufacturing Solar Cell Device |
| US8207444B2 (en) * | 2008-07-01 | 2012-06-26 | Sunpower Corporation | Front contact solar cell with formed electrically conducting layers on the front side and backside |
| US8790957B2 (en) * | 2010-03-04 | 2014-07-29 | Sunpower Corporation | Method of fabricating a back-contact solar cell and device thereof |
| US8686283B2 (en) * | 2010-05-04 | 2014-04-01 | Silevo, Inc. | Solar cell with oxide tunneling junctions |
| KR101702982B1 (ko) * | 2010-07-19 | 2017-02-06 | 삼성에스디아이 주식회사 | 태양 전지 및 그 제조 방법 |
| US20120060904A1 (en) * | 2010-09-13 | 2012-03-15 | Smith David D | Fabrication Of Solar Cells With Silicon Nano-Particles |
| US20120073650A1 (en) * | 2010-09-24 | 2012-03-29 | David Smith | Method of fabricating an emitter region of a solar cell |
| US8492253B2 (en) * | 2010-12-02 | 2013-07-23 | Sunpower Corporation | Method of forming contacts for a back-contact solar cell |
| JP2012186229A (ja) * | 2011-03-03 | 2012-09-27 | Univ Of Tokyo | 単結晶シリコン薄膜の製造方法、単結晶シリコン薄膜デバイスの製造方法及び太陽電池デバイスの製造方法並びに単結晶シリコン薄膜及びそれを用いた単結晶シリコン薄膜デバイス及び太陽電池デバイス |
-
2013
- 2013-07-23 US US13/949,147 patent/US20140130854A1/en not_active Abandoned
- 2013-09-10 EP EP13183814.6A patent/EP2731146B1/en active Active
- 2013-09-13 KR KR1020130110611A patent/KR102148427B1/ko active Active
- 2013-09-25 JP JP2013197748A patent/JP6363335B2/ja active Active
- 2013-11-08 IN IN3516MU2013 patent/IN2013MU03516A/en unknown
- 2013-11-12 CN CN201310560386.7A patent/CN103811572B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6998288B1 (en) * | 2003-10-03 | 2006-02-14 | Sunpower Corporation | Use of doped silicon dioxide in the fabrication of solar cells |
| CN101889348A (zh) * | 2007-11-19 | 2010-11-17 | 应用材料股份有限公司 | 使用图案化蚀刻剂物质以形成太阳能电池接点的工艺 |
| CN202307920U (zh) * | 2008-06-12 | 2012-07-04 | 太阳能公司 | 具有多晶硅掺杂区域的背面接触太阳能电池结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014096574A (ja) | 2014-05-22 |
| IN2013MU03516A (https=) | 2015-07-31 |
| EP2731146A3 (en) | 2014-09-03 |
| KR20140061953A (ko) | 2014-05-22 |
| EP2731146B1 (en) | 2018-04-11 |
| CN103811572A (zh) | 2014-05-21 |
| KR102148427B1 (ko) | 2020-08-26 |
| US20140130854A1 (en) | 2014-05-15 |
| EP2731146A2 (en) | 2014-05-14 |
| JP6363335B2 (ja) | 2018-07-25 |
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| C06 | Publication | ||
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Owner name: ZHIJI SHIDUN TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20150617 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20150617 Address after: Virginia Applicant after: Seiko Epson Corp. Address before: South Korea Gyeonggi Do Yongin Applicant before: Samsung SDI Co., Ltd. |
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