CN103797351B - 掠射角铣削 - Google Patents

掠射角铣削 Download PDF

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Publication number
CN103797351B
CN103797351B CN201280044122.XA CN201280044122A CN103797351B CN 103797351 B CN103797351 B CN 103797351B CN 201280044122 A CN201280044122 A CN 201280044122A CN 103797351 B CN103797351 B CN 103797351B
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China
Prior art keywords
sample
ion beam
milling
angle
image
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CN201280044122.XA
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English (en)
Chinese (zh)
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CN103797351A (zh
Inventor
M.施米德特
C.巴格
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FEI Co
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FEI Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3005—Observing the objects or the point of impact on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2873—Cutting or cleaving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
CN201280044122.XA 2011-09-12 2012-09-11 掠射角铣削 Active CN103797351B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161533769P 2011-09-12 2011-09-12
US61/533769 2011-09-12
PCT/US2012/054626 WO2013039891A1 (en) 2011-09-12 2012-09-11 Glancing angle mill

Publications (2)

Publication Number Publication Date
CN103797351A CN103797351A (zh) 2014-05-14
CN103797351B true CN103797351B (zh) 2019-11-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280044122.XA Active CN103797351B (zh) 2011-09-12 2012-09-11 掠射角铣削

Country Status (6)

Country Link
US (2) US9941096B2 (enExample)
EP (1) EP2756282A4 (enExample)
JP (1) JP6174584B2 (enExample)
KR (1) KR101967853B1 (enExample)
CN (1) CN103797351B (enExample)
WO (1) WO2013039891A1 (enExample)

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TWI612551B (zh) 2012-10-05 2018-01-21 Fei公司 在帶電粒子束樣品的製備減少屏幕效應之方法及系統
CN105264635B (zh) 2012-12-31 2018-11-20 Fei 公司 用于利用带电粒子束的倾斜或掠射研磨操作的基准设计
US9064811B2 (en) * 2013-05-28 2015-06-23 Fei Company Precursor for planar deprocessing of semiconductor devices using a focused ion beam
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JP6165643B2 (ja) * 2014-01-23 2017-07-19 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置、荷電粒子ビーム装置の制御方法及び断面加工観察装置
EP2899744A1 (en) * 2014-01-24 2015-07-29 Carl Zeiss Microscopy GmbH Method for preparing and analyzing an object as well as particle beam device for performing the method
WO2016002341A1 (ja) * 2014-06-30 2016-01-07 株式会社 日立ハイテクノロジーズ パターン測定方法、及びパターン測定装置
US9378927B2 (en) * 2014-09-11 2016-06-28 Fei Company AutoSlice and view undercut method
WO2016103432A1 (ja) * 2014-12-26 2016-06-30 株式会社 日立ハイテクノロジーズ 複合荷電粒子線装置およびその制御方法
KR102410666B1 (ko) 2015-01-09 2022-06-20 삼성전자주식회사 반도체 소자의 계측 방법, 및 이를 이용한 반도체 소자의 제조방법
CN106226134A (zh) * 2016-07-29 2016-12-14 上海华力微电子有限公司 制备透射电子显微镜样品的方法
JP6867015B2 (ja) * 2017-03-27 2021-04-28 株式会社日立ハイテクサイエンス 自動加工装置
JP6925522B2 (ja) * 2018-05-25 2021-08-25 三菱電機株式会社 透過型電子顕微鏡試料の作製方法
WO2020100179A1 (ja) * 2018-11-12 2020-05-22 株式会社日立ハイテク 画像形成方法及び画像形成システム
US11573156B2 (en) * 2019-01-15 2023-02-07 Westinghouse Electric Company Llc Minimally invasive microsampler for intact removal of surface deposits and substrates
US11158487B2 (en) * 2019-03-29 2021-10-26 Fei Company Diagonal compound mill
EP3809447A1 (en) * 2019-10-18 2021-04-21 FEI Company Method for large-area 3d analysis of samples using glancing incidence fib milling
KR102828411B1 (ko) 2020-03-13 2025-07-02 칼 짜이스 에스엠티 게엠베하 웨이퍼의 검사 볼륨을 단면 이미징하는 방법
US11355313B2 (en) * 2020-06-30 2022-06-07 Fei Company Line-based endpoint detection
US11280749B1 (en) * 2020-10-23 2022-03-22 Applied Materials Israel Ltd. Holes tilt angle measurement using FIB diagonal cut
CN114689630B (zh) * 2020-12-30 2025-12-02 Fei公司 用于对三维特征进行成像的方法和系统
US12456186B2 (en) * 2022-05-13 2025-10-28 Fei Company Method and system for preparing wedged lamella

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Also Published As

Publication number Publication date
CN103797351A (zh) 2014-05-14
US20130186747A1 (en) 2013-07-25
EP2756282A4 (en) 2015-01-21
EP2756282A1 (en) 2014-07-23
KR101967853B1 (ko) 2019-04-10
KR20140088074A (ko) 2014-07-09
WO2013039891A4 (en) 2013-05-16
US9941096B2 (en) 2018-04-10
JP6174584B2 (ja) 2017-08-02
WO2013039891A1 (en) 2013-03-21
US20180247793A1 (en) 2018-08-30
JP2014530346A (ja) 2014-11-17

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