CN103794537B - 一种半导体自动排片设备的抓料机械手 - Google Patents

一种半导体自动排片设备的抓料机械手 Download PDF

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CN103794537B
CN103794537B CN201410073511.6A CN201410073511A CN103794537B CN 103794537 B CN103794537 B CN 103794537B CN 201410073511 A CN201410073511 A CN 201410073511A CN 103794537 B CN103794537 B CN 103794537B
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hent claw
suction disk
material grabbing
mechanical arm
pawl arm
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CN103794537A (zh
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谢亚辉
肖建英
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SHENZHEN HUALONG PRECISE MOLD CO Ltd
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SHENZHEN HUALONG PRECISE MOLD CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
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Abstract

本发明公开了一种半导体自动排片设备的抓料机械手,包括抓料爪、吸料盘、驱动模块，所述驱动模块下方左右两侧分别安装有抓料架爪，抓料爪用于抓取引线框架A；所述驱动模块上还连接有吸料盘，所述吸料盘分别设置在抓料爪两侧，吸料盘用于吸取引线框架B。本发明在正常生产中，适当提高机械手每次抓取料片的数量，在一定程度可以大幅提高设备的工作效率；同时抓取数量多、成品率高、排模周期短、生产产量高、高效、适合多重载有芯片的引线框架复合式排片塑封。

Description

一种半导体自动排片设备的抓料机械手
技术领域
本发明涉及半导体自动排片设备领域，具体涉及一种半导体自动排片设备的抓料机械手。
背景技术
随着电子行业的迅速发展，对电子元器件的封装要求越来越高，以及国内劳动力成本不断攀升，尤其是电子产品也向着体积微小、集成度高、功能强大、安装可靠等趋势发展，产品生产时注塑固化时间缩短，多重载有芯片的引线框架符合塑封等，传统的抓料式自动排片设备已经无法满足生产企业的需求，生产元器件的厂家也不断需要低成本、产量高、精度高、质量高的半导体自动排片设备。
工作效率低、抓取料数量少，成品率低、排模周期长，无法多重载有芯片的引线框架复合式排片塑封。
发明内容
针对上述问题，本发明旨在提供一种高效率多重载的半导体自动排片设备的抓料机械手。
为实现该技术目的，本发明的方案是：一种半导体自动排片设备的抓料机械手,包括抓料爪、吸料盘、驱动模块、横向滑轨、纵向滑轨，所述驱动模块可沿纵向滑轨前后活动，抓料爪和吸料盘可沿横向滑轨左右滑动，所述驱动模块下方左右两侧分别设置有抓料爪，所述抓料爪为h型结构；所述抓料爪包括L型结构的内侧爪臂和垂直结构的外侧爪臂，其中两侧抓料爪的内侧爪臂相互交叉，其中一侧抓料爪的内侧爪臂与另一侧抓料爪的外侧爪臂配合用于抓取引线框架A；所述驱动模块上还连接有吸料盘，所述吸料盘分别设置在抓料爪两侧，吸料盘用于吸取引线框架B。
作为优选，所述吸料盘口表面为多孔结构。
作为优选，所述吸料盘口上覆盖硅胶层。
作为优选，所述驱动模块内设置有伸缩气缸。
本发明的有益效果，半导体自动排片设备在正常生产中，适当提高机械手每次抓取料片的数量，在一定程度可以大幅提高设备的工作效率；同时该设备抓取数量多、成品率高、排模周期短、生产产量高、高效、适合多重载有芯片的引线框架复合式排片塑封。
附图说明
图1为本发明的结构示意图。
具体实施方式
下面结合附图和具体实施例对本发明做进一步详细说明。
如图1所示，本发明所述的具体实施例为一种半导体自动排片设备的抓料机械手,包括抓料爪2、吸料盘3、驱动模块6、横向滑轨8、纵向滑轨7，所述驱动模块3可沿纵向滑轨7前后活动，抓料爪2和吸料盘3可沿横向滑轨8左右滑动，所述驱动模块6下方左右两侧分别设置有抓料爪2，所述抓料爪2为h型结构；所述抓料爪2包括L型结构的内侧爪臂10和垂直结构的外侧爪臂9，其中两侧抓料爪2的内侧爪臂10相互交叉，其中一侧抓料爪2的内侧爪臂10与另一侧抓料爪2的外侧爪臂9配合用于抓取引线框架A5；所述驱动模块6上还连接有吸料盘3，所述吸料盘3分别设置在抓料爪2两侧，吸料盘3用于吸取引线框架B4。
H型结构的抓料爪能够增加爪的间距，使得抓料爪能够抓取大件的引线框架，采用两组抓料爪配置可以同时进行多个引线框架的抓取抓取动作。吸料盘和抓料爪可以协同抓取复合引线框架，通过驱动模块驱动吸料盘与抓料爪在横向滑轨上的间距，然后使用吸料盘吸取引线框架B，使用抓料爪抓取引线框架A，能够有效避免复合引线框架间由于拉扯而导致连接引线脱落或者断裂。
为了使得吸料盘更好的吸住而不损伤引线框架，同时防止大的零件进入风机堵塞风机。所述吸料盘口表面为多孔结构，所述吸料盘口上覆盖硅胶层。多孔结构可以保证有吸力的同时，大号零件无法进行，硅胶能够起到较好的缓冲作用，防止吸力过强而导致吸料盘磨损零件。
为了使得抓料爪2和吸料盘3可以进行垂直升降取料，所述驱动模块6内设置有伸缩气缸1。
以上所述，仅为本发明的较佳实施例，并不用以限制本发明，凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同替换和改进，均应包含在本发明技术方案的保护范围之内。

Claims (4)

1.一种半导体自动排片设备的抓料机械手,包括抓料爪、吸料盘、驱动模块、横向滑轨、纵向滑轨，所述驱动模块可沿纵向滑轨前后活动，抓料爪和吸料盘可沿横向滑轨左右滑动，其特征在于：所述驱动模块下方左右两侧分别设置有抓料爪，所述抓料爪为h型结构；所述抓料爪包括L型结构的内侧爪臂和垂直结构的外侧爪臂，其中两侧抓料爪的内侧爪臂相互交叉，其中一侧抓料爪的内侧爪臂与另一侧抓料爪的外侧爪臂配合用于抓取引线框架A；所述驱动模块上还连接有吸料盘，所述吸料盘分别设置在抓料爪两侧，吸料盘用于吸取引线框架B。
2.根据权利要求1所述的半导体自动排片设备的抓料机械手,其特征在于：吸料盘口表面为多孔结构。
3.根据权利要求2所述的半导体自动排片设备的抓料机械手,其特征在于：所述吸料盘口上覆盖硅胶层。
4.根据权利要求1所述的半导体自动排片设备的抓料机械手,其特征在于：所述驱动模块内设置有伸缩气缸。
CN201410073511.6A 2014-02-28 2014-02-28 一种半导体自动排片设备的抓料机械手 Active CN103794537B (zh)

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CN113644019B (zh) * 2021-08-09 2024-03-19 恩纳基智能科技无锡有限公司 一种半导体贴片机的复合上料装置
CN115632023B (zh) * 2022-12-22 2023-08-04 河北博特半导体设备科技有限公司 一种双臂晶圆传输装置

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KR0164038B1 (ko) * 1995-12-30 1999-02-01 김광호 위치 결정 핀을 갖는 리드 프레임 스트립 이송 장치
JP2002100645A (ja) * 2000-09-26 2002-04-05 Nec Kansai Ltd リードフレーム供給装置
CN2699472Y (zh) * 2004-05-26 2005-05-11 铜陵三佳模具股份有限公司 一种引线框架排片装置
CN101386170A (zh) * 2007-09-13 2009-03-18 铜陵三佳科技股份有限公司 一种引线框架抓取机械手
CN201573205U (zh) * 2010-01-12 2010-09-08 铜陵三佳科技股份有限公司 气爪机械手
CN202259228U (zh) * 2011-08-29 2012-05-30 江阴康强电子有限公司 引线框架抓取结构
CN203721696U (zh) * 2014-02-28 2014-07-16 深圳市华龙精密模具有限公司 一种半导体自动排片设备的抓料机械手

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0164038B1 (ko) * 1995-12-30 1999-02-01 김광호 위치 결정 핀을 갖는 리드 프레임 스트립 이송 장치
JP2002100645A (ja) * 2000-09-26 2002-04-05 Nec Kansai Ltd リードフレーム供給装置
CN2699472Y (zh) * 2004-05-26 2005-05-11 铜陵三佳模具股份有限公司 一种引线框架排片装置
CN101386170A (zh) * 2007-09-13 2009-03-18 铜陵三佳科技股份有限公司 一种引线框架抓取机械手
CN201573205U (zh) * 2010-01-12 2010-09-08 铜陵三佳科技股份有限公司 气爪机械手
CN202259228U (zh) * 2011-08-29 2012-05-30 江阴康强电子有限公司 引线框架抓取结构
CN203721696U (zh) * 2014-02-28 2014-07-16 深圳市华龙精密模具有限公司 一种半导体自动排片设备的抓料机械手

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